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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
P2020PSN2NFB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		16			GRID ARRAY	BGA689,29X29,40	1 V	125 Cel	7			BOTTOM	2.46 mm		31 mm		YES	64	100 MHz			31 mm	CMOS		1.05 V	4			1 mm	FIXED POINT	S-PBGA-B689			1333 rpm	NO
P5020NSN1VNB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.53 mm		37.5 mm		YES	64	166 MHz	30	245	37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295	3		2000 rpm	YES	e1
935339744551	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	364	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	8	0	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA364,20X20,32	.9 V	85 Cel	0	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	1572864	17 mm		YES	0	24 MHz	40	260	17 mm	CMOS	850 mA	1 V	32	7		.8 mm	FLOATING POINT	S-PBGA-B364	3		500 rpm	YES	e1
P5021NXE7TMC	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY		1.05 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64		30	245	37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295	3		1800 rpm	YES	e1
P5021PXE1TMC	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY		1.05 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64				37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295			1800 rpm	YES	e1
P5021PSN12QC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V		16			GRID ARRAY		1.17 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64				37.5 mm	CMOS		1.2 V				1 mm	FIXED POINT	S-PBGA-B1295			2200 rpm	YES	e1
PPC7448HX800ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V		0	32		GRID ARRAY		.95 V	105 Cel		0 Cel		BOTTOM	2.8 mm		25 mm		NO	0	800 MHz			25 mm	CMOS		1 V				1.27 mm	FIXED POINT	S-CBGA-B360		Not Qualified	800 rpm	YES
SCIMX6D5EYM12CC	NXP Semiconductors	MICROPROCESSOR		BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.4 V					BOTTOM	1.6 mm		21 mm		YES	64		NOT SPECIFIED	NOT SPECIFIED	21 mm	CMOS						.8 mm	FIXED POINT	S-PBGA-B624			1200 rpm	YES
P4040NSN7MMC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32	1	GRID ARRAY, HEAT SINK/SLUG	BGA1295,36X36,40	.95 V				TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64	133.3 MHz	30	245	37.5 mm	CMOS		1 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B1295	3	Not Qualified	1200 rpm	YES	e1
SCF5250LPV100	NXP Semiconductors	MICROPROCESSOR	OTHER	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		24	32		FLATPACK, LOW PROFILE, FINE PITCH		1.08 V	70 Cel		-20 Cel		QUAD	1.6 mm		20 mm		YES	16	33.86 MHz			20 mm	CMOS		1.2 V				.5 mm	FIXED POINT	S-PQFP-G144			100 rpm	YES
PPC8568CVTAUJJA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1023	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V		0	32		GRID ARRAY		1.045 V				TIN SILVER	BOTTOM	2.75 mm		33 mm		YES	0	166 MHz			33 mm	CMOS		1.1 V				1 mm	FLOATING POINT	S-PBGA-B1023		Not Qualified	1333 rpm	YES	e2
P5021NSE12QC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V		16			GRID ARRAY		1.17 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64				37.5 mm	CMOS		1.2 V				1 mm	FIXED POINT	S-PBGA-B1295			2200 rpm	YES	e1
SCIMX6Q5EYM12CD	NXP Semiconductors	MICROPROCESSOR		BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.4 V					BOTTOM	1.6 mm		21 mm		YES	64		NOT SPECIFIED	NOT SPECIFIED	21 mm	CMOS						.8 mm	FIXED POINT	S-PBGA-B624			1200 rpm	YES
P2020PSE2KHA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		16			GRID ARRAY	BGA689,29X29,40	1 V	125 Cel	7			BOTTOM	2.46 mm		31 mm		YES	64	100 MHz			31 mm	CMOS		1.05 V	4			1 mm	FIXED POINT	S-PBGA-B689			1000 rpm	NO
P5010NXN1TNB,557	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY		1.05 V					BOTTOM	3.53 mm		37.5 mm		YES	64	166 MHz			37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295			1800 rpm	YES
BSC9131NLE1KHKB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel		0 Cel		BOTTOM	1.97 mm		21 mm		YES	32				21 mm	CMOS		1 V				.8 mm	FIXED POINT	S-PBGA-B520			1000 rpm	YES
P2020PSN2KHC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		16			GRID ARRAY	BGA689,29X29,40	1 V	125 Cel	7			BOTTOM	2.46 mm		31 mm		YES	64	100 MHz			31 mm	CMOS		1.05 V	4			1 mm	FIXED POINT	S-PBGA-B689			1000 rpm	NO
P5021PXN12QB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V		16			GRID ARRAY		1.17 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64				37.5 mm	CMOS		1.2 V				1 mm	FIXED POINT	S-PBGA-B1295			2200 rpm	YES	e1
P5021PSN7VNC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY		1.05 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64				37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295			2000 rpm	YES	e1
P2020PSE2MZB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		16			GRID ARRAY	BGA689,29X29,40	1 V	125 Cel	7	0 Cel		BOTTOM	2.46 mm		31 mm		YES	64				31 mm	CMOS		1.05 V	4			1 mm	FIXED POINT	S-PBGA-B689			1200 rpm	YES
XPC755BRX350TE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.1 V		32	32	2,2.5/3.3	GRID ARRAY	BGA360,19X19,50	1.9 V				TIN LEAD	BOTTOM	3.2 mm		25 mm		YES	64	100 MHz			25 mm	CMOS		2 V			Microprocessors	1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	350 rpm	YES	e0
XPC755BRX400TE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.1 V		32	32	2,2.5/3.3	GRID ARRAY	BGA360,19X19,50	1.9 V				TIN LEAD	BOTTOM	3.2 mm		25 mm		YES	64	100 MHz			25 mm	CMOS		2 V			Microprocessors	1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	400 rpm	YES	e0
PPC7448VU1420LD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.25 V		36	32		GRID ARRAY		1.15 V	105 Cel		0 Cel		BOTTOM	2.4 mm		25 mm		YES	64	200 MHz			25 mm	CMOS		1.2 V				1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1420 rpm	YES
SVF511R3K1CMK4	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	364	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		3 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		17 mm		YES	16		40	260	17 mm	CMOS		3.3 V				.8 mm	FLOATING POINT	S-PBGA-B364	3		400 rpm	YES	e1
SCF5235F4CVM150	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		17 mm	LOW POWER MODE TAKEN FROM LOW POWER MODE	YES	32	75 MHz	40	260	17 mm	CMOS		1.5 V				1 mm	FIXED POINT	S-PBGA-B256	3		150 rpm	YES	e1
BSC9131CJN1HHKB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel		-40 Cel		BOTTOM	1.97 mm		21 mm		YES	32				21 mm	CMOS		1 V				.8 mm	FIXED POINT	S-PBGA-B520			800 rpm	YES
P5020NXE1QMB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64	166 MHz	30	245	37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295	3		1600 rpm	YES	e1
XPC850SRZT50BU	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V		26	32		GRID ARRAY		3.135 V	95 Cel		0 Cel		BOTTOM	2.35 mm		23 mm		YES	32				23 mm	CMOS		3.3 V				1.27 mm	FIXED POINT	S-PBGA-B256			50 rpm	YES
P5040PXE12QB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V		16			GRID ARRAY, HEAT SINK/SLUG		1.17 V				TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64	166 MHz			37.5 mm	CMOS		1.2 V				1 mm	FIXED POINT	S-PBGA-B1295			2200 rpm	YES	e1
XPC850ZT80BU	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V		26	32		GRID ARRAY		3.135 V	95 Cel		0 Cel		BOTTOM	2.35 mm		23 mm		YES	32				23 mm	CMOS		3.3 V				1.27 mm	FIXED POINT	S-PBGA-B256			80 rpm	YES
P2020PXE2HHC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		16			GRID ARRAY	BGA689,29X29,40	1 V	125 Cel	7			BOTTOM	2.46 mm		31 mm		YES	64	100 MHz			31 mm	CMOS		1.05 V	4			1 mm	FIXED POINT	S-PBGA-B689			800 rpm	NO
P2020PXN2KFC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		16			GRID ARRAY	BGA689,29X29,40	1 V	125 Cel	7			BOTTOM	2.46 mm		31 mm		YES	64	100 MHz			31 mm	CMOS		1.05 V	4			1 mm	FIXED POINT	S-PBGA-B689			1000 rpm	NO
BSC9131CSE1KHHB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel		0 Cel		BOTTOM	1.97 mm		21 mm		YES	32				21 mm	CMOS		1 V				.8 mm	FIXED POINT	S-PBGA-B520			1000 rpm	YES
PS32V234CMN0AVUB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			64		GRID ARRAY, FINE PITCH		.95 V	105 Cel		-40 Cel		BOTTOM	2.44 mm		17 mm		YES					17 mm	CMOS		1 V				.65 mm	FLOATING POINT	S-PBGA-B621			1000 rpm	YES
P2020NSE2KHB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		16			GRID ARRAY	BGA689,29X29,40	1 V		7		TIN SILVER	BOTTOM	2.46 mm		31 mm		YES	64	100 MHz	40	260	31 mm	CMOS		1.05 V	4			1 mm	FIXED POINT	S-PBGA-B689			1000 rpm	NO	e2
PPC7448VS1250NC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.15 V		0	32		GRID ARRAY		1.05 V	105 Cel		0 Cel		BOTTOM	2.8 mm		25 mm		NO	0	1250 MHz			25 mm	CMOS		1.1 V				1.27 mm	FIXED POINT	S-CBGA-N360		Not Qualified	1250 rpm	YES
MPE603EFE133TX	NXP Semiconductors	MICROPROCESSOR, RISC		GULL WING	240	FQFP	SQUARE	CERAMIC, GLASS-SEALED	YES	YES	3.465 V		32	32		FLATPACK, FINE PITCH		3.135 V					QUAD	4.15 mm		31.305 mm		YES	64	66.67 MHz			31.305 mm	CMOS		3.3 V				.5 mm	FLOATING POINT	S-GQFP-G240		Not Qualified	133.33 rpm	YES
P2020NSN2MHC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		16		1.05	GRID ARRAY	BGA689,29X29,40	1 V		7		TIN SILVER	BOTTOM	2.46 mm		31 mm		YES	64		40	260	31 mm	CMOS		1.05 V	4		Microprocessors	1 mm	FIXED POINT	S-PBGA-B689	3	Not Qualified	1200 rpm	NO	e2
P5010NSE1TNB,557	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY		1.05 V					BOTTOM	3.53 mm		37.5 mm		YES	64	166 MHz			37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295			1800 rpm	YES
BSC9132NLE7PNMB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		32	32		GRID ARRAY, FINE PITCH		.97 V					BOTTOM	2.53 mm		23 mm		YES	64	100 MHz			23 mm	CMOS		1 V				.8 mm	FLOATING POINT	S-PBGA-B780			1400 rpm	YES
P5021PSN1TMB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY		1.05 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64				37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295			1800 rpm	YES	e1
PPC8567ECVTAQGGA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1023	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V		0	32		GRID ARRAY		1.045 V				TIN SILVER	BOTTOM	2.75 mm		33 mm		YES	0	166 MHz			33 mm	CMOS		1.1 V				1 mm	FLOATING POINT	S-PBGA-B1023		Not Qualified	1000 rpm	YES	e2
BSC9132NXN7KNMB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		32	32		GRID ARRAY, FINE PITCH		.97 V					BOTTOM	2.53 mm		23 mm		YES	64	100 MHz			23 mm	CMOS		1 V				.8 mm	FLOATING POINT	S-PBGA-B780			1000 rpm	YES
P5040NXN1VNC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64	166 MHz			37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295			2000 rpm	YES	e1
XPC850SEZT40	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES				32	3.3	GRID ARRAY	BGA256,16X16,50		70 Cel		0 Cel		BOTTOM											CMOS		3.3 V			Microprocessors	1.27 mm		S-PBGA-B256		Not Qualified	40 rpm
MVF60NN152CMK50R	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	364	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	8	0	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA364,20X20,32	.9 V	85 Cel	0	-40 Cel		BOTTOM	1.5 mm	1572864	17 mm		YES	0	24 MHz			17 mm	CMOS	850 mA	1 V	32	7		.8 mm	FLOATING POINT	S-PBGA-B364			500 rpm	YES
XPC823ZT81A	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES				32		GRID ARRAY			70 Cel		0 Cel		BOTTOM					YES						CMOS		2.5 V					FIXED POINT	S-PBGA-B256			81 rpm	YES
S9S08RN48W1MLF	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	8	0	8		FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	2.7 V	125 Cel	16	-40 Cel	MATTE TIN	QUAD	1.6 mm	4096	7 mm		NO	0	20 MHz	40	260	7 mm	CMOS	14.8 mA	3 V		3		.5 mm	FIXED POINT	S-PQFP-G48	3		20 rpm	YES	e3

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.