Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Intel |
MICROPROCESSOR |
BALL |
479 |
BGA |
UNSPECIFIED |
PLASTIC/EPOXY |
YES |
YES |
0 |
64 |
GRID ARRAY |
BOTTOM |
NO |
0 |
CMOS |
FIXED POINT |
X-PBGA-B479 |
2160 rpm |
YES |
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Texas Instruments |
MICROPROCESSOR |
MILITARY |
UNSPECIFIED |
CERAMIC, METAL-SEALED COFIRED |
NO |
5.5 V |
16 |
8 |
4.5 V |
125 Cel |
-55 Cel |
NO |
8 |
CMOS |
5 V |
FIXED POINT |
4 rpm |
YES |
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Texas Instruments |
MICROPROCESSOR, RISC |
AUTOMOTIVE |
BALL |
625 |
BGA |
UNSPECIFIED |
PLASTIC/EPOXY |
NO |
YES |
1.2 V |
AEC-Q100 |
16 |
32 |
GRID ARRAY |
1.11 V |
125 Cel |
-40 Cel |
BOTTOM |
YES |
32 |
38.4 MHz |
CMOS |
1.15 V |
FLOATING POINT |
X-PBGA-B625 |
1176 rpm |
YES |
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Texas Instruments |
MICROPROCESSOR |
GULL WING |
208 |
QFP |
UNSPECIFIED |
CERAMIC, METAL-SEALED COFIRED |
YES |
YES |
0 |
32 |
32 |
FLATPACK |
3 |
QUAD |
0 |
NO |
32 |
66 MHz |
CMOS |
3.45 V |
0 |
0 |
FLOATING POINT |
X-CQFP-G208 |
Not Qualified |
66 rpm |
YES |
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Texas Instruments |
MICROPROCESSOR, RISC |
AUTOMOTIVE |
BALL |
625 |
BGA |
UNSPECIFIED |
PLASTIC/EPOXY |
NO |
YES |
1.2 V |
AEC-Q100 |
16 |
32 |
GRID ARRAY |
1.11 V |
125 Cel |
-40 Cel |
BOTTOM |
YES |
32 |
38.4 MHz |
CMOS |
1.15 V |
FLOATING POINT |
X-PBGA-B625 |
500 rpm |
YES |
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Texas Instruments |
MICROPROCESSOR, RISC |
AUTOMOTIVE |
BALL |
625 |
BGA |
UNSPECIFIED |
PLASTIC/EPOXY |
NO |
YES |
1.2 V |
AEC-Q100 |
16 |
32 |
GRID ARRAY |
1.11 V |
125 Cel |
-40 Cel |
BOTTOM |
YES |
32 |
38.4 MHz |
CMOS |
1.15 V |
FLOATING POINT |
X-PBGA-B625 |
500 rpm |
YES |
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Texas Instruments |
MICROPROCESSOR, RISC |
INDUSTRIAL |
UNSPECIFIED |
UNSPECIFIED |
UNSPECIFIED |
NO |
2.75 V |
16 |
2.25 V |
85 Cel |
-40 Cel |
UNSPECIFIED |
12 MHz |
CMOS |
2.5 V |
FIXED POINT |
24 rpm |
YES |
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Texas Instruments |
MICROPROCESSOR, RISC |
AUTOMOTIVE |
BALL |
625 |
BGA |
UNSPECIFIED |
PLASTIC/EPOXY |
NO |
YES |
1.2 V |
AEC-Q100 |
16 |
32 |
GRID ARRAY |
1.11 V |
125 Cel |
-40 Cel |
BOTTOM |
YES |
32 |
38.4 MHz |
CMOS |
1.15 V |
FLOATING POINT |
X-PBGA-B625 |
750 rpm |
YES |
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Texas Instruments |
MICROPROCESSOR, RISC |
AUTOMOTIVE |
BALL |
625 |
BGA |
UNSPECIFIED |
PLASTIC/EPOXY |
NO |
YES |
1.2 V |
AEC-Q100 |
16 |
32 |
GRID ARRAY |
1.11 V |
125 Cel |
-40 Cel |
BOTTOM |
YES |
32 |
38.4 MHz |
CMOS |
1.15 V |
FLOATING POINT |
X-PBGA-B625 |
650 rpm |
YES |
||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR, RISC |
AUTOMOTIVE |
BALL |
625 |
BGA |
UNSPECIFIED |
PLASTIC/EPOXY |
NO |
YES |
1.2 V |
AEC-Q100 |
16 |
32 |
GRID ARRAY |
1.11 V |
125 Cel |
-40 Cel |
BOTTOM |
YES |
32 |
38.4 MHz |
CMOS |
1.15 V |
FLOATING POINT |
X-PBGA-B625 |
500 rpm |
YES |
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Texas Instruments |
MICROPROCESSOR |
GULL WING |
208 |
QFP |
UNSPECIFIED |
CERAMIC, METAL-SEALED COFIRED |
YES |
YES |
0 |
32 |
32 |
FLATPACK |
3 |
QUAD |
0 |
NO |
32 |
80 MHz |
CMOS |
3.45 V |
0 |
0 |
FLOATING POINT |
X-CQFP-G208 |
Not Qualified |
80 rpm |
YES |
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STMicroelectronics |
MICROPROCESSOR |
OTHER |
GULL WING |
100 |
BQFP |
UNSPECIFIED |
PLASTIC/EPOXY |
YES |
YES |
5.25 V |
0 |
23 |
32 |
FLATPACK, BUMPER |
4.75 V |
100 Cel |
3 |
0 Cel |
QUAD |
0 |
SYSTEM MANAGEMENT MODE; ADVANCED POWER MANAGEMENT FOR NOTEBOOK AND BATTERY-POWERED SYSTEMS |
NO |
16 |
66 MHz |
CMOS |
615 mA |
5 V |
0 |
0 |
FIXED POINT |
X-PQFP-G100 |
Not Qualified |
33 rpm |
YES |
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STMicroelectronics |
MICROPROCESSOR |
OTHER |
GULL WING |
100 |
BQFP |
UNSPECIFIED |
PLASTIC/EPOXY |
YES |
YES |
3.6 V |
0 |
23 |
32 |
FLATPACK, BUMPER |
3 V |
85 Cel |
3 |
0 Cel |
QUAD |
0 |
SYSTEM MANAGEMENT MODE; ADVANCED POWER MANAGEMENT FOR NOTEBOOK AND BATTERY-POWERED SYSTEMS |
NO |
16 |
40 MHz |
CMOS |
235 mA |
3 V |
0 |
0 |
FIXED POINT |
X-PQFP-G100 |
Not Qualified |
20 rpm |
YES |
|||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR |
OTHER |
GULL WING |
100 |
BQFP |
UNSPECIFIED |
PLASTIC/EPOXY |
YES |
YES |
5.5 V |
0 |
23 |
32 |
FLATPACK, BUMPER |
4.5 V |
100 Cel |
3 |
0 Cel |
QUAD |
0 |
SYSTEM MANAGEMENT MODE; ADVANCED POWER MANAGEMENT FOR NOTEBOOK AND BATTERY-POWERED SYSTEMS |
NO |
16 |
50 MHz |
CMOS |
495 mA |
5 V |
0 |
0 |
FIXED POINT |
X-PQFP-G100 |
Not Qualified |
25 rpm |
YES |
|||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR |
OTHER |
GULL WING |
100 |
BQFP |
UNSPECIFIED |
PLASTIC/EPOXY |
YES |
YES |
3.6 V |
0 |
23 |
32 |
FLATPACK, BUMPER |
3 V |
85 Cel |
3 |
0 Cel |
QUAD |
0 |
SYSTEM MANAGEMENT MODE; ADVANCED POWER MANAGEMENT FOR NOTEBOOK AND BATTERY-POWERED SYSTEMS |
NO |
16 |
50 MHz |
CMOS |
285 mA |
3 V |
0 |
0 |
FIXED POINT |
X-PQFP-G100 |
Not Qualified |
25 rpm |
YES |
|||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR |
OTHER |
GULL WING |
100 |
BQFP |
UNSPECIFIED |
PLASTIC/EPOXY |
YES |
YES |
5.5 V |
0 |
23 |
32 |
FLATPACK, BUMPER |
4.5 V |
100 Cel |
3 |
0 Cel |
QUAD |
0 |
SYSTEM MANAGEMENT MODE; ADVANCED POWER MANAGEMENT FOR NOTEBOOK AND BATTERY-POWERED SYSTEMS |
NO |
16 |
25 MHz |
CMOS |
720 mA |
5 V |
0 |
0 |
FIXED POINT |
X-PQFP-G100 |
Not Qualified |
50 rpm |
YES |
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NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
BALL |
BGA |
UNSPECIFIED |
PLASTIC/EPOXY |
YES |
1.15 V |
GRID ARRAY |
1.05 V |
105 Cel |
0 Cel |
BOTTOM |
CMOS |
1.1 V |
X-PBGA-B |
867 rpm |
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NXP Semiconductors |
MICROPROCESSOR, RISC |
BALL |
BGA |
UNSPECIFIED |
CERAMIC, METAL-SEALED COFIRED |
YES |
YES |
2.05 V |
GRID ARRAY |
1.95 V |
BOTTOM |
YES |
CMOS |
2 V |
FIXED POINT |
X-CBGA-B |
450 rpm |
YES |
|||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
BALL |
BGA |
UNSPECIFIED |
CERAMIC, METAL-SEALED COFIRED |
YES |
YES |
2.05 V |
GRID ARRAY |
1.95 V |
BOTTOM |
YES |
CMOS |
2 V |
FIXED POINT |
X-CBGA-B |
550 rpm |
YES |
|||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
BALL |
BGA |
UNSPECIFIED |
PLASTIC/EPOXY |
YES |
1.15 V |
GRID ARRAY |
1.05 V |
105 Cel |
0 Cel |
BOTTOM |
CMOS |
1.1 V |
X-PBGA-B |
1000 rpm |
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NXP Semiconductors |
MICROPROCESSOR, RISC |
BALL |
BGA |
UNSPECIFIED |
CERAMIC, METAL-SEALED COFIRED |
YES |
YES |
2.05 V |
GRID ARRAY |
1.95 V |
BOTTOM |
YES |
CMOS |
2 V |
FIXED POINT |
X-CBGA-B |
500 rpm |
YES |
|||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
BALL |
BGA |
UNSPECIFIED |
CERAMIC, METAL-SEALED COFIRED |
YES |
YES |
2.05 V |
GRID ARRAY |
1.95 V |
BOTTOM |
YES |
CMOS |
2 V |
FIXED POINT |
X-CBGA-B |
400 rpm |
YES |
|||||||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
BALL |
224 |
BGA |
UNSPECIFIED |
PLASTIC/EPOXY |
YES |
YES |
3.6 V |
64 |
64 |
GRID ARRAY |
3 V |
BOTTOM |
NO |
32 |
66 MHz |
CMOS |
3.3 V |
FIXED POINT |
X-PBGA-B224 |
Not Qualified |
66 rpm |
YES |
|||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
GULL WING |
216 |
QFP |
UNSPECIFIED |
PLASTIC/EPOXY |
YES |
YES |
3.6 V |
64 |
64 |
FLATPACK |
3 V |
QUAD |
NO |
32 |
66 MHz |
CMOS |
3.3 V |
FIXED POINT |
X-PQFP-G216 |
Not Qualified |
66 rpm |
YES |
|||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR |
NO LEAD |
40 |
DIE |
UNSPECIFIED |
UNSPECIFIED |
NO |
YES |
5.25 V |
20 |
16 |
UNCASED CHIP |
4.75 V |
TIN LEAD |
UPPER |
NO |
16 |
5 MHz |
CMOS |
5 V |
FIXED POINT |
X-XUUC-N40 |
Not Qualified |
5 rpm |
YES |
e0 |
A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.
Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.
Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.
One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.