SoC Microprocessors 8

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Package Style (Meter)	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Speed	Low Power Mode	JESD-609 Code
LS1043ASE8PQB	NXP Semiconductors	SoC	OTHER	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.93 V	14	64	GRID ARRAY, FINE PITCH	.87 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm	ALSO OPERATES AT 1V NOMINAL SUPPLY	YES	32		30	250	23 mm	CMOS	.9 V	.8 mm	FIXED POINT	S-PBGA-B780	3	1400 rpm	YES	e1
LS1043ASE7PQB	NXP Semiconductors	SoC	OTHER	BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.93 V	16	64	GRID ARRAY, FINE PITCH	.87 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	21 mm	ALSO OPERATES AT 1V NOMINAL SUPPLY	YES	32		30	250	21 mm	CMOS	.9 V	.8 mm	FIXED POINT	S-PBGA-B621	3	1400 rpm	YES	e1
LS1043ASE8MQB	NXP Semiconductors	SoC	OTHER	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.93 V	14	64	GRID ARRAY, FINE PITCH	.87 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm	ALSO OPERATES AT 1V NOMINAL SUPPLY	YES	32		30	250	23 mm	CMOS	.9 V	.8 mm	FIXED POINT	S-PBGA-B780	3	1200 rpm	YES	e1
LS1043AXE7QQB	NXP Semiconductors	SoC	INDUSTRIAL	BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.93 V	16	64	GRID ARRAY, FINE PITCH	.87 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	21 mm	ALSO OPERATES AT 1V NOMINAL SUPPLY	YES	32		30	250	21 mm	CMOS	.9 V	.8 mm	FIXED POINT	S-PBGA-B621	3	1600 rpm	YES	e1
LS1043ASE7QQB	NXP Semiconductors	SoC	OTHER	BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.93 V	16	64	GRID ARRAY, FINE PITCH	.87 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	21 mm	ALSO OPERATES AT 1V NOMINAL SUPPLY	YES	32		30	250	21 mm	CMOS	.9 V	.8 mm	FIXED POINT	S-PBGA-B621	3	1600 rpm	YES	e1
LS1043ASE7KQB	NXP Semiconductors	SoC	OTHER	BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.93 V	16	64	GRID ARRAY, FINE PITCH	.87 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	21 mm	ALSO OPERATES AT 1V NOMINAL SUPPLY	YES	32		30	250	21 mm	CMOS	.9 V	.8 mm	FIXED POINT	S-PBGA-B621	3	1000 rpm	YES	e1
LS1043ASN8QQA	NXP Semiconductors	SoC		BALL	780	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	32	GRID ARRAY, HEAT SINK/SLUG	.97 V			TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm		YES	32	100 MHz	30	250	23 mm	CMOS	1 V	.8 mm	FIXED POINT	S-PBGA-B780	3	1600 rpm	YES	e1
LS1043ASN8MQB	NXP Semiconductors	SoC	OTHER	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.93 V	14	64	GRID ARRAY, FINE PITCH	.87 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm	ALSO OPERATES AT 1V NOMINAL SUPPLY	YES	32		30	250	23 mm	CMOS	.9 V	.8 mm	FIXED POINT	S-PBGA-B780	3	1200 rpm	YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.