Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Ultraviolet Erasable | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | ROM Bits Size | No. of Timers | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | JESD-609 Code | Maximum Standby Current | On Chip Program ROM Width | No. of I/O Lines | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Infineon Technologies |
INDUSTRIAL |
GULL WING |
48 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
AEC-Q100 |
1.8/5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP48,.4 |
1.71 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
N |
DUAL |
2.794 mm |
2048 |
7.5057 mm |
YES |
33 MHz |
15.875 mm |
262144 Bits |
CMOS |
3.3 V |
Other uPs/uCs/Peripheral ICs |
I2C; USB; PS/2; 8051 |
.635 mm |
R-PDSO-G48 |
3 |
Not Qualified |
e4 |
31 |
|||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
1.8/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.28SQ,20 |
1.71 V |
85 Cel |
-40 Cel |
PURE TIN |
N |
QUAD |
1 mm |
2048 |
7 mm |
YES |
0 |
33 MHz |
7 mm |
262144 Bits |
CMOS |
3.3 V |
Other uPs/uCs/Peripheral ICs |
8051; I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART; USB |
.5 mm |
S-XQCC-N48 |
3 |
Not Qualified |
25 |
|||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
8 |
1.8/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
1.71 V |
85 Cel |
M8C |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.6 mm |
8192 |
512 |
6 mm |
NO |
0 |
25.2 MHz |
30 |
260 |
6 mm |
1024 |
CMOS |
4 mA |
3 V |
Microcontrollers |
FLASH |
I2C; USB |
.5 mm |
S-XQCC-N48 |
3 |
Not Qualified |
25.2 rpm |
e4 |
36 |
|||||||||||||||||||||||||
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
QUAD |
.6 mm |
2048 |
6 mm |
NO |
0 |
16 MHz |
6 mm |
CMOS |
3.3 V |
I2C; SPI; UART; LPC; LIN; IRDA; IDE |
.4 mm |
S-XQCC-N48 |
38 |
||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
AUTOMOTIVE |
GULL WING |
48 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
SMALL OUTLINE, SHRINK PITCH |
1.71 V |
125 Cel |
-40 Cel |
Matte Tin (Sn) |
DUAL |
2.794 mm |
4096 |
7.5057 mm |
YES |
33 MHz |
30 |
260 |
15.875 mm |
CMOS |
3.3 V |
I2C; USB; PS/2; 8051 |
.635 mm |
R-PDSO-G48 |
3 |
e3 |
29 |
||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
8 |
1.8/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
1.71 V |
85 Cel |
M8C |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
16384 |
1024 |
7 mm |
NO |
0 |
25.2 MHz |
20 |
260 |
7 mm |
2048 |
CMOS |
4 mA |
3.3 V |
Microcontrollers |
FLASH |
USB |
.5 mm |
S-XQCC-N48 |
3 |
Not Qualified |
25.2 rpm |
e4 |
36 |
|||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
8 |
2/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
1.71 V |
85 Cel |
8051 |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
65536 |
4096 |
7 mm |
YES |
0 |
67 MHz |
260 |
7 mm |
8192 |
CMOS |
3.3 V |
Microcontrollers |
FLASH |
I2C; USB |
.5 mm |
S-XQCC-N48 |
3 |
Not Qualified |
67 rpm |
e4 |
25 |
|||||||||||||||||||||||||||
|
Infineon Technologies |
AUTOMOTIVE |
GULL WING |
48 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
AEC-Q100 |
1.8/5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP48,.4 |
1.71 V |
125 Cel |
-40 Cel |
MATTE TIN |
N |
DUAL |
2.794 mm |
4096 |
7.5057 mm |
YES |
33 MHz |
15.875 mm |
524288 Bits |
CMOS |
3.3 V |
Other uPs/uCs/Peripheral ICs |
I2C; USB; PS/2; 8051 |
.635 mm |
R-PDSO-G48 |
3 |
Not Qualified |
e3 |
29 |
|||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
GULL WING |
48 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
AEC-Q100 |
1.8/5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP48,.4 |
1.71 V |
85 Cel |
-40 Cel |
MATTE TIN |
N |
DUAL |
2.794 mm |
2048 |
7.5057 mm |
YES |
33 MHz |
15.875 mm |
262144 Bits |
CMOS |
3.3 V |
Other uPs/uCs/Peripheral ICs |
I2C; USB; PS/2; 8051 |
.635 mm |
R-PDSO-G48 |
3 |
Not Qualified |
e3 |
29 |
|||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
GULL WING |
48 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
AEC-Q100 |
1.8/5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP48,.4 |
1.71 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
N |
DUAL |
2.794 mm |
2048 |
7.5057 mm |
YES |
33 MHz |
15.875 mm |
262144 Bits |
CMOS |
3.3 V |
Other uPs/uCs/Peripheral ICs |
I2C; USB; PS/2; 8051 |
.635 mm |
R-PDSO-G48 |
3 |
Not Qualified |
e4 |
29 |
|||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
GULL WING |
48 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
AEC-Q100 |
1.8/5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP48,.4 |
1.71 V |
85 Cel |
-40 Cel |
MATTE TIN |
N |
DUAL |
2.794 mm |
4096 |
7.5057 mm |
YES |
33 MHz |
15.875 mm |
524288 Bits |
CMOS |
3.3 V |
Other uPs/uCs/Peripheral ICs |
I2C; USB; PS/2; 8051 |
.635 mm |
R-PDSO-G48 |
3 |
Not Qualified |
e3 |
32 |
|||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
2/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
1.71 V |
85 Cel |
-40 Cel |
PURE TIN |
N |
QUAD |
1 mm |
4096 |
7 mm |
YES |
0 |
33 MHz |
7 mm |
524288 Bits |
CMOS |
3.3 V |
Other uPs/uCs/Peripheral ICs |
8051; I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART; USB |
.5 mm |
S-XQCC-N48 |
3 |
Not Qualified |
25 |
|||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
GULL WING |
48 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
SMALL OUTLINE, SHRINK PITCH |
1.71 V |
85 Cel |
-40 Cel |
Matte Tin (Sn) |
DUAL |
2.794 mm |
2048 |
7.5057 mm |
YES |
33 MHz |
30 |
260 |
15.875 mm |
CMOS |
3.3 V |
I2C; USB; PS/2; 8051 |
.635 mm |
R-PDSO-G48 |
3 |
e3 |
31 |
||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
8 |
1.8/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
1.71 V |
85 Cel |
M8C |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
16384 |
1024 |
7 mm |
NO |
0 |
25.2 MHz |
20 |
260 |
7 mm |
2048 |
CMOS |
4 mA |
3.3 V |
Microcontrollers |
FLASH |
USB |
.5 mm |
S-XQCC-N48 |
3 |
Not Qualified |
25.2 rpm |
e4 |
36 |
|||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
GULL WING |
48 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
0 |
1.8/5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP48,.4 |
1.71 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
N |
DUAL |
2.794 mm |
1024 |
7.505 mm |
YES |
0 |
33 MHz |
15.875 mm |
131072 Bits |
CMOS |
3.3 V |
Other uPs/uCs/Peripheral ICs |
8051; I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART |
.635 mm |
R-PDSO-G48 |
3 |
Not Qualified |
e4 |
25 |
||||||||||||||||||||||||||||||||
|
Infineon Technologies |
AUTOMOTIVE |
GULL WING |
48 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
AEC-Q100 |
1.8/5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP48,.4 |
1.71 V |
125 Cel |
-40 Cel |
MATTE TIN |
N |
DUAL |
2.794 mm |
1024 |
7.5057 mm |
YES |
33 MHz |
15.875 mm |
131072 Bits |
CMOS |
3.3 V |
Other uPs/uCs/Peripheral ICs |
I2C; USB; PS/2; 8051 |
.635 mm |
R-PDSO-G48 |
3 |
Not Qualified |
e3 |
29 |
|||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
GULL WING |
48 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
SMALL OUTLINE, SHRINK PITCH |
1.71 V |
85 Cel |
-40 Cel |
Matte Tin (Sn) |
DUAL |
2.794 mm |
2048 |
7.5057 mm |
YES |
33 MHz |
30 |
260 |
15.875 mm |
CMOS |
3.3 V |
I2C; USB; PS/2; 8051 |
.635 mm |
R-PDSO-G48 |
3 |
e3 |
29 |
||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
MULTIFUNCTION PERIPHERAL |
INDUSTRIAL |
GULL WING |
48 |
LSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
0 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
1.71 V |
85 Cel |
-40 Cel |
PURE TIN |
DUAL |
1.6 mm |
2048 |
7 mm |
NO |
0 |
16 MHz |
7 mm |
CMOS |
2.7 V |
I2C; SPI; UART |
.5 mm |
S-PDSO-G48 |
3 |
38 |
||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
GULL WING |
48 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
AEC-Q100 |
1.8/5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP48,.4 |
1.71 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
N |
DUAL |
2.794 mm |
4096 |
7.5057 mm |
YES |
33 MHz |
15.875 mm |
524288 Bits |
CMOS |
3.3 V |
Other uPs/uCs/Peripheral ICs |
I2C; USB; PS/2; 8051 |
.635 mm |
R-PDSO-G48 |
3 |
Not Qualified |
e4 |
31 |
|||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
GULL WING |
48 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
0 |
8 |
1.8/5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP48,.4 |
1.71 V |
85 Cel |
M8C |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2.794 mm |
16384 |
1024 |
7.505 mm |
NO |
0 |
25.2 MHz |
20 |
260 |
15.875 mm |
2048 |
CMOS |
4 mA |
3 V |
Microcontrollers |
FLASH |
USB |
.635 mm |
R-PDSO-G48 |
3 |
Not Qualified |
25.2 rpm |
e4 |
34 |
|||||||||||||||||||||||||
|
Infineon Technologies |
MULTIFUNCTION PERIPHERAL |
INDUSTRIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
1.71 V |
85 Cel |
-40 Cel |
PURE TIN |
QUAD |
1.6 mm |
2048 |
7 mm |
NO |
48 MHz |
7 mm |
CMOS |
13.8 mA |
11 |
I2C; SPI; UART; IRDA; IDE; LIN |
.5 mm |
S-PQFP-G48 |
3 |
38 |
||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
1.8/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.28SQ,20 |
1.71 V |
85 Cel |
-40 Cel |
PURE TIN |
N |
QUAD |
1 mm |
4096 |
7 mm |
YES |
0 |
33 MHz |
7 mm |
524288 Bits |
CMOS |
3.3 V |
Other uPs/uCs/Peripheral ICs |
8051; I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART |
.5 mm |
S-XQCC-N48 |
3 |
Not Qualified |
25 |
|||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
8 |
1.8/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
1.71 V |
85 Cel |
M8C |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
32768 |
1024 |
7 mm |
NO |
0 |
25.2 MHz |
7 mm |
2048 |
CMOS |
4 mA |
3 V |
Microcontrollers |
FLASH |
I2C; USB |
.5 mm |
S-XQCC-N48 |
3 |
Not Qualified |
24 rpm |
e4 |
36 |
|||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
1.8/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.28SQ,20 |
1.71 V |
85 Cel |
-40 Cel |
PURE TIN |
N |
QUAD |
1 mm |
1024 |
7 mm |
YES |
0 |
33 MHz |
7 mm |
131072 Bits |
CMOS |
3.3 V |
Other uPs/uCs/Peripheral ICs |
8051; I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART |
.5 mm |
S-XQCC-N48 |
3 |
Not Qualified |
25 |
|||||||||||||||||||||||||||||||||
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
QUAD |
.6 mm |
2048 |
6 mm |
NO |
0 |
16 MHz |
6 mm |
CMOS |
3.3 V |
I2C; SPI; UART; LPC; LIN; IRDA; IDE |
.4 mm |
S-XQCC-N48 |
38 |
||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
8 |
1.8/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
1.71 V |
85 Cel |
M8C |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.6 mm |
8192 |
512 |
6 mm |
NO |
0 |
25.2 MHz |
30 |
260 |
6 mm |
1024 |
CMOS |
4 mA |
3 V |
Microcontrollers |
FLASH |
I2C; USB |
.5 mm |
S-XQCC-N48 |
3 |
Not Qualified |
25.2 rpm |
e4 |
36 |
|||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.25 V |
0 |
8 |
2.7/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
3 V |
85 Cel |
M8C |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
8192 |
512 |
7 mm |
IT ALSO OPERATES MINIMUM SUPPLY 2.4 V AT 750 KHZ |
NO |
0 |
12 MHz |
20 |
260 |
7 mm |
512 |
CMOS |
2.5 mA |
4.75 V |
Microcontrollers |
FLASH |
USB |
.5 mm |
S-XQCC-N48 |
3 |
Not Qualified |
12 rpm |
e4 |
28 |
||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
GULL WING |
48 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
SMALL OUTLINE, SHRINK PITCH |
1.71 V |
85 Cel |
-40 Cel |
Matte Tin (Sn) |
DUAL |
2.794 mm |
4096 |
7.5057 mm |
YES |
33 MHz |
30 |
260 |
15.875 mm |
CMOS |
3.3 V |
I2C; USB; PS/2; 8051 |
.635 mm |
R-PDSO-G48 |
3 |
e3 |
29 |
||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
8 |
1.8/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
1.71 V |
85 Cel |
M8C |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
32768 |
1024 |
7 mm |
NO |
0 |
25.2 MHz |
7 mm |
2048 |
CMOS |
4 mA |
3 V |
Microcontrollers |
FLASH |
I2C; USB |
.5 mm |
S-XQCC-N48 |
3 |
Not Qualified |
24 rpm |
e4 |
36 |
|||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
GULL WING |
48 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
0 |
8 |
1.8/5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP48,.4 |
1.71 V |
85 Cel |
M8C |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
2.794 mm |
8192 |
512 |
7.505 mm |
NO |
0 |
25.2 MHz |
20 |
260 |
15.875 mm |
1024 |
CMOS |
4 mA |
3.3 V |
Microcontrollers |
FLASH |
USB |
.635 mm |
R-PDSO-G48 |
3 |
Not Qualified |
25.2 rpm |
e4 |
34 |
|||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
GULL WING |
48 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.25 V |
0 |
8 |
3.3/5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP48,.4 |
4.75 V |
85 Cel |
M8C |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2.794 mm |
32768 |
1024 |
7.505 mm |
ALSO OPERATES AT 3V SUPPLY |
NO |
0 |
24 MHz |
20 |
260 |
15.875 mm |
2048 |
CMOS |
14 mA |
5 V |
Microcontrollers |
FLASH |
.635 mm |
R-PDSO-G48 |
3 |
Not Qualified |
24 rpm |
e4 |
44 |
|||||||||||||||||||||||||
|
Infineon Technologies |
AUTOMOTIVE |
GULL WING |
48 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
AEC-Q100 |
1.8/5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP48,.4 |
1.71 V |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
N |
DUAL |
2.794 mm |
2048 |
7.5057 mm |
YES |
33 MHz |
30 |
260 |
15.875 mm |
262144 Bits |
CMOS |
3.3 V |
Other uPs/uCs/Peripheral ICs |
I2C; USB; PS/2; 8051 |
.635 mm |
R-PDSO-G48 |
3 |
Not Qualified |
e4 |
29 |
|||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
8 |
1.8/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
1.71 V |
85 Cel |
M8C |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
16384 |
1024 |
7 mm |
NO |
0 |
25.2 MHz |
7 mm |
2048 |
CMOS |
4 mA |
3 V |
Microcontrollers |
FLASH |
I2C; USB |
.5 mm |
S-XQCC-N48 |
3 |
Not Qualified |
24 rpm |
e4 |
36 |
Multi-functional peripherals (MFPs) are devices that combine several different functions, such as printing, scanning, copying, and faxing, into a single piece of equipment. These devices are often used in office settings to streamline workflows and reduce the need for multiple pieces of equipment.
MFPs typically come with a range of features and capabilities, including high-quality printing and scanning, fast copying and faxing, and the ability to handle large volumes of documents. They may also offer additional features, such as double-sided printing, wireless connectivity, and cloud-based printing and scanning.
One of the key benefits of MFPs is their ability to save space and reduce clutter in an office environment. By combining several different functions into a single device, MFPs eliminate the need for separate printers, scanners, copiers, and fax machines, freeing up valuable space and reducing costs.
In addition to their space-saving benefits, MFPs also offer enhanced efficiency and productivity. With the ability to print, scan, copy, and fax all from a single device, users can complete tasks quickly and easily, without the need to switch between different pieces of equipment.