56 Multi-functional Peripherals 40

Reset All
Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

CY8C24894-24LTXI

Infineon Technologies

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

5.25 V

0

8

3.3/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC56,.31SQ,20

4.75 V

85 Cel

M8C

-40 Cel

MATTE TIN

QUAD

1 mm

16384

512

8 mm

IT ALSO OPERATES AT 3 V MINIMUM SUPPLY

NO

0

24 MHz

20

260

8 mm

1024

CMOS

27 mA

5 V

Microcontrollers

FLASH

I2C; USB

.5 mm

S-XQCC-N56

3

Not Qualified

24.96 rpm

e3

50

CY8C24894-24LTXIT

Infineon Technologies

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

5.25 V

0

8

3.3/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC56,.31SQ,20

4.75 V

85 Cel

M8C

-40 Cel

MATTE TIN

QUAD

1 mm

16384

512

8 mm

IT ALSO OPERATES AT 3 V MINIMUM SUPPLY

NO

0

24 MHz

20

260

8 mm

1024

CMOS

27 mA

5 V

Microcontrollers

FLASH

I2C; USB

.5 mm

S-XQCC-N56

3

Not Qualified

24.96 rpm

e3

50

CY8C4124LQI-443T

Infineon Technologies

INDUSTRIAL

NO LEAD

56

HQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

CHIP CARRIER, HEAT SINK/SLUG

1.71 V

105 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1.6 mm

2048

10 mm

NO

0

24 MHz

10 mm

CMOS

1.8 V

I2C; SPI; UART

.8 mm

S-XQCC-N56

3

e4

34

CY8C24794-24LTXI

Infineon Technologies

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

5.25 V

0

8

3.3/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC56,.31SQ,20

4.75 V

85 Cel

M8C

-40 Cel

MATTE TIN

QUAD

1 mm

16384

512

8 mm

IT ALSO OPERATES AT 3 V MINIMUM SUPPLY

NO

0

24 MHz

20

260

8 mm

1024

CMOS

27 mA

5 V

Microcontrollers

FLASH

I2C; USB

.5 mm

S-XQCC-N56

3

Not Qualified

24.96 rpm

e3

50

CY8CTMA120-56LFXA

Cypress Semiconductor

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

5.25 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

4.75 V

85 Cel

-40 Cel

MATTE TIN

QUAD

1 mm

512

8 mm

IT ALSO OPERATES 93KHZ AT 3 V

NO

0

24 MHz

8 mm

CMOS

5 V

USB

.5 mm

S-XQCC-N56

3

Not Qualified

e3

49

CYBL10462-56LQXI

Cypress Semiconductor

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

85 Cel

-40 Cel

QUAD

.6 mm

8192

7 mm

YES

48 MHz

7 mm

CMOS

1.8 V

I2C

.4 mm

S-XQCC-N56

36

CYBL10162-56LQXI

Cypress Semiconductor

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

.6 mm

8192

7 mm

YES

48 MHz

7 mm

CMOS

1.8 V

I2C

.4 mm

S-XQCC-N56

3

e4

36

CYBL10563-56LQXI

Cypress Semiconductor

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

85 Cel

-40 Cel

QUAD

.6 mm

8192

7 mm

YES

48 MHz

7 mm

CMOS

1.8 V

I2C

.4 mm

S-XQCC-N56

36

CY8C4248LQI-BL563T

Infineon Technologies

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

85 Cel

-40 Cel

PURE TIN

QUAD

.6 mm

16384

7 mm

NO

0

48 MHz

7 mm

CMOS

3.3 V

I2C; I2S; SPI; UART; IRDA; LIN; IDE

.4 mm

S-XQCC-N56

3

36

CYBL10561-56LQXI

Cypress Semiconductor

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

85 Cel

-40 Cel

QUAD

.6 mm

8192

7 mm

YES

48 MHz

7 mm

CMOS

1.8 V

I2C

.4 mm

S-XQCC-N56

36

CYBL10573-56LQXI

Cypress Semiconductor

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

85 Cel

-40 Cel

QUAD

.6 mm

16384

7 mm

NO

0

48 MHz

7 mm

CMOS

3.3 V

I2C; I2S; IDE; IRDA; LIN; SPI; UART

.4 mm

S-XQCC-N56

36

LPC47N217N-ABZJ

Microchip Technology

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

MATTE TIN

QUAD

1 mm

8 mm

NO

8 mm

CMOS

3.3 V

PCI; ISA

.5 mm

S-XQCC-N56

e3

13

CYBL11173-56LQXI

Infineon Technologies

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

85 Cel

-40 Cel

QUAD

.6 mm

16384

7 mm

NO

0

48 MHz

7 mm

CMOS

3.3 V

I2C; I2S; IDE; IRDA; LIN; SPI; UART

.4 mm

S-XQCC-N56

36

CYBL10473-56LQXI

Infineon Technologies

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

85 Cel

-40 Cel

QUAD

.6 mm

16384

7 mm

NO

0

48 MHz

7 mm

CMOS

3.3 V

I2C; IDE; IRDA; LIN; SPI; UART

.4 mm

S-XQCC-N56

36

CYBL10171-56LQXI

Infineon Technologies

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

85 Cel

-40 Cel

QUAD

.6 mm

16384

7 mm

NO

0

48 MHz

7 mm

CMOS

3.3 V

I2C; IDE; IRDA; LIN; SPI; UART

.4 mm

S-XQCC-N56

36

CYBL11571-56LQXI

Infineon Technologies

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

85 Cel

-40 Cel

QUAD

.6 mm

16384

7 mm

NO

0

48 MHz

7 mm

CMOS

3.3 V

I2C; IDE; IRDA; LIN; SPI; UART

.4 mm

S-XQCC-N56

36

CYBL10471-56LQXI

Infineon Technologies

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

85 Cel

-40 Cel

QUAD

.6 mm

16384

7 mm

NO

0

48 MHz

7 mm

CMOS

3.3 V

I2C; IDE; IRDA; LIN; SPI; UART

.4 mm

S-XQCC-N56

36

CYBL10171-56LQXIT

Infineon Technologies

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

85 Cel

-40 Cel

QUAD

.6 mm

16384

7 mm

NO

0

48 MHz

7 mm

CMOS

3.3 V

I2C; IDE; IRDA; LIN; SPI; UART

.4 mm

S-XQCC-N56

36

CYBL11472-56LQXI

Infineon Technologies

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

85 Cel

-40 Cel

QUAD

.6 mm

16384

7 mm

NO

0

48 MHz

7 mm

CMOS

3.3 V

I2C; I2S; IDE; IRDA; LIN; SPI; UART

.4 mm

S-XQCC-N56

36

CYBL10473-56LQXIT

Infineon Technologies

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

85 Cel

-40 Cel

QUAD

.6 mm

16384

7 mm

NO

0

48 MHz

7 mm

CMOS

3.3 V

I2C; IDE; IRDA; LIN; SPI; UART

.4 mm

S-XQCC-N56

36

CYBL10172-56LQXIT

Infineon Technologies

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

85 Cel

-40 Cel

QUAD

.6 mm

16384

7 mm

NO

0

48 MHz

7 mm

CMOS

3.3 V

I2C; IDE; IRDA; LIN; SPI; UART

.4 mm

S-XQCC-N56

36

CYBL11572-56LQXI

Infineon Technologies

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

85 Cel

-40 Cel

QUAD

.6 mm

16384

7 mm

NO

0

48 MHz

7 mm

CMOS

3.3 V

I2C; I2S; IDE; IRDA; LIN; SPI; UART

.4 mm

S-XQCC-N56

36

CYBL10173-56LQXI

Infineon Technologies

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

85 Cel

-40 Cel

QUAD

.6 mm

16384

7 mm

NO

0

48 MHz

7 mm

CMOS

3.3 V

I2C; I2S; IDE; IRDA; LIN; SPI; UART

.4 mm

S-XQCC-N56

36

CYBL10471-56LQXIT

Infineon Technologies

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

85 Cel

-40 Cel

QUAD

.6 mm

16384

7 mm

NO

0

48 MHz

7 mm

CMOS

3.3 V

I2C; IDE; IRDA; LIN; SPI; UART

.4 mm

S-XQCC-N56

36

CYBL10571-56LQXI

Infineon Technologies

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

85 Cel

-40 Cel

QUAD

.6 mm

16384

7 mm

NO

0

48 MHz

7 mm

CMOS

3.3 V

I2C; IDE; IRDA; LIN; SPI; UART

.4 mm

S-XQCC-N56

36

CYBL11573-56LQXQ

Infineon Technologies

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

105 Cel

-40 Cel

QUAD

.6 mm

16384

7 mm

NO

0

48 MHz

7 mm

CMOS

3.3 V

I2C; I2S; IDE; IRDA; LIN; SPI; UART

.4 mm

S-XQCC-N56

36

CYBL10572-56LQXIT

Infineon Technologies

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

85 Cel

-40 Cel

QUAD

.6 mm

16384

7 mm

NO

0

48 MHz

7 mm

CMOS

3.3 V

I2C; I2S; IDE; IRDA; LIN; SPI; UART

.4 mm

S-XQCC-N56

36

CYBL10172-56LQXI

Infineon Technologies

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

85 Cel

-40 Cel

QUAD

.6 mm

16384

7 mm

NO

0

48 MHz

7 mm

CMOS

3.3 V

I2C; IDE; IRDA; LIN; SPI; UART

.4 mm

S-XQCC-N56

36

CYBL11471-56LQXI

Infineon Technologies

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

85 Cel

-40 Cel

QUAD

.6 mm

16384

7 mm

NO

0

48 MHz

7 mm

CMOS

3.3 V

I2C; IDE; IRDA; LIN; SPI; UART

.4 mm

S-XQCC-N56

36

CYBL10472-56LQXI

Infineon Technologies

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

85 Cel

-40 Cel

QUAD

.6 mm

16384

7 mm

NO

0

48 MHz

7 mm

CMOS

3.3 V

I2C; I2S; IDE; IRDA; LIN; SPI; UART

.4 mm

S-XQCC-N56

36

CYBL10472-56LQXIT

Infineon Technologies

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

85 Cel

-40 Cel

QUAD

.6 mm

16384

7 mm

NO

0

48 MHz

7 mm

CMOS

3.3 V

I2C; I2S; IDE; IRDA; LIN; SPI; UART

.4 mm

S-XQCC-N56

36

CYBL10571-56LQXIT

Infineon Technologies

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

85 Cel

-40 Cel

QUAD

.6 mm

16384

7 mm

NO

0

48 MHz

7 mm

CMOS

3.3 V

I2C; IDE; IRDA; LIN; SPI; UART

.4 mm

S-XQCC-N56

36

CYBL10563-56LQXQ

Infineon Technologies

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

105 Cel

-40 Cel

QUAD

.6 mm

8192

7 mm

YES

0

48 MHz

7 mm

CMOS

3.3 V

I2C, I2S, SPI, UART

.4 mm

S-XQCC-N56

36

CYBL10173-56LQXIT

Infineon Technologies

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

85 Cel

-40 Cel

QUAD

.6 mm

16384

7 mm

NO

0

48 MHz

7 mm

CMOS

3.3 V

I2C; I2S; IDE; IRDA; LIN; SPI; UART

.4 mm

S-XQCC-N56

36

CYBL10572-56LQXI

Infineon Technologies

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

85 Cel

-40 Cel

QUAD

.6 mm

16384

7 mm

NO

0

48 MHz

7 mm

CMOS

3.3 V

I2C; I2S; IDE; IRDA; LIN; SPI; UART

.4 mm

S-XQCC-N56

36

CY8C28000-24PVXI

Infineon Technologies

INDUSTRIAL

GULL WING

56

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

0

8

3.3/5

SMALL OUTLINE, SHRINK PITCH

SSOP56,.4

4.75 V

85 Cel

M8C

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

2.794 mm

16384

512

7.505 mm

ALSO OPERATES AT 3V MINIMUM SUPPLY

NO

0

24 MHz

30

260

18.415 mm

1024

CMOS

14 mA

5 V

Microcontrollers

FLASH

USB

.635 mm

R-PDSO-G56

3

Not Qualified

24 rpm

e4

44

CY8C4248LQQ-BL583T

Infineon Technologies

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

105 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

.6 mm

16384

7 mm

NO

0

48 MHz

7 mm

CMOS

3.3 V

I2C; I2S; SPI; UART; IRDA; LIN; IDE

.4 mm

S-XQCC-N56

3

e4

36

CY8C4128LQI-BL553T

Infineon Technologies

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

85 Cel

-40 Cel

PURE TIN

QUAD

.6 mm

16384

7 mm

NO

0

48 MHz

7 mm

CMOS

1.8 V

I2C; SPI; UART

.4 mm

S-XQCC-N56

3

36

CY8C24794-24LTXIT

Infineon Technologies

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

5.25 V

0

8

3.3/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC56,.31SQ,20

4.75 V

85 Cel

M8C

-40 Cel

MATTE TIN

QUAD

1 mm

16384

512

8 mm

IT ALSO OPERATES AT 3 V MINIMUM SUPPLY

NO

0

24 MHz

20

260

8 mm

1024

CMOS

27 mA

5 V

Microcontrollers

FLASH

I2C; USB

.5 mm

S-XQCC-N56

3

Not Qualified

24.96 rpm

e3

50

CY8C4128LQI-BL593T

Infineon Technologies

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

85 Cel

-40 Cel

PURE TIN

QUAD

.6 mm

16384

7 mm

NO

0

48 MHz

7 mm

CMOS

3.3 V

I2C; SPI; UART; IRDA; IDE; LIN

.4 mm

S-XQCC-N56

3

36

Multi-functional Peripherals

Multi-functional peripherals (MFPs) are devices that combine several different functions, such as printing, scanning, copying, and faxing, into a single piece of equipment. These devices are often used in office settings to streamline workflows and reduce the need for multiple pieces of equipment.

MFPs typically come with a range of features and capabilities, including high-quality printing and scanning, fast copying and faxing, and the ability to handle large volumes of documents. They may also offer additional features, such as double-sided printing, wireless connectivity, and cloud-based printing and scanning.

One of the key benefits of MFPs is their ability to save space and reduce clutter in an office environment. By combining several different functions into a single device, MFPs eliminate the need for separate printers, scanners, copiers, and fax machines, freeing up valuable space and reducing costs.

In addition to their space-saving benefits, MFPs also offer enhanced efficiency and productivity. With the ability to print, scan, copy, and fax all from a single device, users can complete tasks quickly and easily, without the need to switch between different pieces of equipment.