Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Ultraviolet Erasable | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | ROM Bits Size | No. of Timers | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | JESD-609 Code | Maximum Standby Current | On Chip Program ROM Width | No. of I/O Lines | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.25 V |
0 |
8 |
3.3/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.31SQ,20 |
4.75 V |
85 Cel |
M8C |
-40 Cel |
MATTE TIN |
QUAD |
1 mm |
16384 |
512 |
8 mm |
IT ALSO OPERATES AT 3 V MINIMUM SUPPLY |
NO |
0 |
24 MHz |
20 |
260 |
8 mm |
1024 |
CMOS |
27 mA |
5 V |
Microcontrollers |
FLASH |
I2C; USB |
.5 mm |
S-XQCC-N56 |
3 |
Not Qualified |
24.96 rpm |
e3 |
50 |
||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.25 V |
0 |
8 |
3.3/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.31SQ,20 |
4.75 V |
85 Cel |
M8C |
-40 Cel |
MATTE TIN |
QUAD |
1 mm |
16384 |
512 |
8 mm |
IT ALSO OPERATES AT 3 V MINIMUM SUPPLY |
NO |
0 |
24 MHz |
20 |
260 |
8 mm |
1024 |
CMOS |
27 mA |
5 V |
Microcontrollers |
FLASH |
I2C; USB |
.5 mm |
S-XQCC-N56 |
3 |
Not Qualified |
24.96 rpm |
e3 |
50 |
||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
56 |
HQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG |
1.71 V |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1.6 mm |
2048 |
10 mm |
NO |
0 |
24 MHz |
10 mm |
CMOS |
1.8 V |
I2C; SPI; UART |
.8 mm |
S-XQCC-N56 |
3 |
e4 |
34 |
||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.25 V |
0 |
8 |
3.3/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.31SQ,20 |
4.75 V |
85 Cel |
M8C |
-40 Cel |
MATTE TIN |
QUAD |
1 mm |
16384 |
512 |
8 mm |
IT ALSO OPERATES AT 3 V MINIMUM SUPPLY |
NO |
0 |
24 MHz |
20 |
260 |
8 mm |
1024 |
CMOS |
27 mA |
5 V |
Microcontrollers |
FLASH |
I2C; USB |
.5 mm |
S-XQCC-N56 |
3 |
Not Qualified |
24.96 rpm |
e3 |
50 |
||||||||||||||||||||||||
|
Cypress Semiconductor |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.25 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
4.75 V |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
1 mm |
512 |
8 mm |
IT ALSO OPERATES 93KHZ AT 3 V |
NO |
0 |
24 MHz |
8 mm |
CMOS |
5 V |
USB |
.5 mm |
S-XQCC-N56 |
3 |
Not Qualified |
e3 |
49 |
||||||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
QUAD |
.6 mm |
8192 |
7 mm |
YES |
48 MHz |
7 mm |
CMOS |
1.8 V |
I2C |
.4 mm |
S-XQCC-N56 |
36 |
|||||||||||||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.6 mm |
8192 |
7 mm |
YES |
48 MHz |
7 mm |
CMOS |
1.8 V |
I2C |
.4 mm |
S-XQCC-N56 |
3 |
e4 |
36 |
||||||||||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
QUAD |
.6 mm |
8192 |
7 mm |
YES |
48 MHz |
7 mm |
CMOS |
1.8 V |
I2C |
.4 mm |
S-XQCC-N56 |
36 |
|||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
PURE TIN |
QUAD |
.6 mm |
16384 |
7 mm |
NO |
0 |
48 MHz |
7 mm |
CMOS |
3.3 V |
I2C; I2S; SPI; UART; IRDA; LIN; IDE |
.4 mm |
S-XQCC-N56 |
3 |
36 |
|||||||||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
QUAD |
.6 mm |
8192 |
7 mm |
YES |
48 MHz |
7 mm |
CMOS |
1.8 V |
I2C |
.4 mm |
S-XQCC-N56 |
36 |
|||||||||||||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
QUAD |
.6 mm |
16384 |
7 mm |
NO |
0 |
48 MHz |
7 mm |
CMOS |
3.3 V |
I2C; I2S; IDE; IRDA; LIN; SPI; UART |
.4 mm |
S-XQCC-N56 |
36 |
|||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
MATTE TIN |
QUAD |
1 mm |
8 mm |
NO |
8 mm |
CMOS |
3.3 V |
PCI; ISA |
.5 mm |
S-XQCC-N56 |
e3 |
13 |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
QUAD |
.6 mm |
16384 |
7 mm |
NO |
0 |
48 MHz |
7 mm |
CMOS |
3.3 V |
I2C; I2S; IDE; IRDA; LIN; SPI; UART |
.4 mm |
S-XQCC-N56 |
36 |
|||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
QUAD |
.6 mm |
16384 |
7 mm |
NO |
0 |
48 MHz |
7 mm |
CMOS |
3.3 V |
I2C; IDE; IRDA; LIN; SPI; UART |
.4 mm |
S-XQCC-N56 |
36 |
|||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
QUAD |
.6 mm |
16384 |
7 mm |
NO |
0 |
48 MHz |
7 mm |
CMOS |
3.3 V |
I2C; IDE; IRDA; LIN; SPI; UART |
.4 mm |
S-XQCC-N56 |
36 |
|||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
QUAD |
.6 mm |
16384 |
7 mm |
NO |
0 |
48 MHz |
7 mm |
CMOS |
3.3 V |
I2C; IDE; IRDA; LIN; SPI; UART |
.4 mm |
S-XQCC-N56 |
36 |
|||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
QUAD |
.6 mm |
16384 |
7 mm |
NO |
0 |
48 MHz |
7 mm |
CMOS |
3.3 V |
I2C; IDE; IRDA; LIN; SPI; UART |
.4 mm |
S-XQCC-N56 |
36 |
|||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
QUAD |
.6 mm |
16384 |
7 mm |
NO |
0 |
48 MHz |
7 mm |
CMOS |
3.3 V |
I2C; IDE; IRDA; LIN; SPI; UART |
.4 mm |
S-XQCC-N56 |
36 |
||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
QUAD |
.6 mm |
16384 |
7 mm |
NO |
0 |
48 MHz |
7 mm |
CMOS |
3.3 V |
I2C; I2S; IDE; IRDA; LIN; SPI; UART |
.4 mm |
S-XQCC-N56 |
36 |
|||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
QUAD |
.6 mm |
16384 |
7 mm |
NO |
0 |
48 MHz |
7 mm |
CMOS |
3.3 V |
I2C; IDE; IRDA; LIN; SPI; UART |
.4 mm |
S-XQCC-N56 |
36 |
||||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
QUAD |
.6 mm |
16384 |
7 mm |
NO |
0 |
48 MHz |
7 mm |
CMOS |
3.3 V |
I2C; IDE; IRDA; LIN; SPI; UART |
.4 mm |
S-XQCC-N56 |
36 |
||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
QUAD |
.6 mm |
16384 |
7 mm |
NO |
0 |
48 MHz |
7 mm |
CMOS |
3.3 V |
I2C; I2S; IDE; IRDA; LIN; SPI; UART |
.4 mm |
S-XQCC-N56 |
36 |
|||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
QUAD |
.6 mm |
16384 |
7 mm |
NO |
0 |
48 MHz |
7 mm |
CMOS |
3.3 V |
I2C; I2S; IDE; IRDA; LIN; SPI; UART |
.4 mm |
S-XQCC-N56 |
36 |
|||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
QUAD |
.6 mm |
16384 |
7 mm |
NO |
0 |
48 MHz |
7 mm |
CMOS |
3.3 V |
I2C; IDE; IRDA; LIN; SPI; UART |
.4 mm |
S-XQCC-N56 |
36 |
||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
QUAD |
.6 mm |
16384 |
7 mm |
NO |
0 |
48 MHz |
7 mm |
CMOS |
3.3 V |
I2C; IDE; IRDA; LIN; SPI; UART |
.4 mm |
S-XQCC-N56 |
36 |
|||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
105 Cel |
-40 Cel |
QUAD |
.6 mm |
16384 |
7 mm |
NO |
0 |
48 MHz |
7 mm |
CMOS |
3.3 V |
I2C; I2S; IDE; IRDA; LIN; SPI; UART |
.4 mm |
S-XQCC-N56 |
36 |
|||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
QUAD |
.6 mm |
16384 |
7 mm |
NO |
0 |
48 MHz |
7 mm |
CMOS |
3.3 V |
I2C; I2S; IDE; IRDA; LIN; SPI; UART |
.4 mm |
S-XQCC-N56 |
36 |
||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
QUAD |
.6 mm |
16384 |
7 mm |
NO |
0 |
48 MHz |
7 mm |
CMOS |
3.3 V |
I2C; IDE; IRDA; LIN; SPI; UART |
.4 mm |
S-XQCC-N56 |
36 |
|||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
QUAD |
.6 mm |
16384 |
7 mm |
NO |
0 |
48 MHz |
7 mm |
CMOS |
3.3 V |
I2C; IDE; IRDA; LIN; SPI; UART |
.4 mm |
S-XQCC-N56 |
36 |
|||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
QUAD |
.6 mm |
16384 |
7 mm |
NO |
0 |
48 MHz |
7 mm |
CMOS |
3.3 V |
I2C; I2S; IDE; IRDA; LIN; SPI; UART |
.4 mm |
S-XQCC-N56 |
36 |
|||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
QUAD |
.6 mm |
16384 |
7 mm |
NO |
0 |
48 MHz |
7 mm |
CMOS |
3.3 V |
I2C; I2S; IDE; IRDA; LIN; SPI; UART |
.4 mm |
S-XQCC-N56 |
36 |
||||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
QUAD |
.6 mm |
16384 |
7 mm |
NO |
0 |
48 MHz |
7 mm |
CMOS |
3.3 V |
I2C; IDE; IRDA; LIN; SPI; UART |
.4 mm |
S-XQCC-N56 |
36 |
||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
105 Cel |
-40 Cel |
QUAD |
.6 mm |
8192 |
7 mm |
YES |
0 |
48 MHz |
7 mm |
CMOS |
3.3 V |
I2C, I2S, SPI, UART |
.4 mm |
S-XQCC-N56 |
36 |
|||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
QUAD |
.6 mm |
16384 |
7 mm |
NO |
0 |
48 MHz |
7 mm |
CMOS |
3.3 V |
I2C; I2S; IDE; IRDA; LIN; SPI; UART |
.4 mm |
S-XQCC-N56 |
36 |
||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
QUAD |
.6 mm |
16384 |
7 mm |
NO |
0 |
48 MHz |
7 mm |
CMOS |
3.3 V |
I2C; I2S; IDE; IRDA; LIN; SPI; UART |
.4 mm |
S-XQCC-N56 |
36 |
|||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
GULL WING |
56 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.25 V |
0 |
8 |
3.3/5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP56,.4 |
4.75 V |
85 Cel |
M8C |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2.794 mm |
16384 |
512 |
7.505 mm |
ALSO OPERATES AT 3V MINIMUM SUPPLY |
NO |
0 |
24 MHz |
30 |
260 |
18.415 mm |
1024 |
CMOS |
14 mA |
5 V |
Microcontrollers |
FLASH |
USB |
.635 mm |
R-PDSO-G56 |
3 |
Not Qualified |
24 rpm |
e4 |
44 |
||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.6 mm |
16384 |
7 mm |
NO |
0 |
48 MHz |
7 mm |
CMOS |
3.3 V |
I2C; I2S; SPI; UART; IRDA; LIN; IDE |
.4 mm |
S-XQCC-N56 |
3 |
e4 |
36 |
||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
PURE TIN |
QUAD |
.6 mm |
16384 |
7 mm |
NO |
0 |
48 MHz |
7 mm |
CMOS |
1.8 V |
I2C; SPI; UART |
.4 mm |
S-XQCC-N56 |
3 |
36 |
|||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.25 V |
0 |
8 |
3.3/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.31SQ,20 |
4.75 V |
85 Cel |
M8C |
-40 Cel |
MATTE TIN |
QUAD |
1 mm |
16384 |
512 |
8 mm |
IT ALSO OPERATES AT 3 V MINIMUM SUPPLY |
NO |
0 |
24 MHz |
20 |
260 |
8 mm |
1024 |
CMOS |
27 mA |
5 V |
Microcontrollers |
FLASH |
I2C; USB |
.5 mm |
S-XQCC-N56 |
3 |
Not Qualified |
24.96 rpm |
e3 |
50 |
||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
PURE TIN |
QUAD |
.6 mm |
16384 |
7 mm |
NO |
0 |
48 MHz |
7 mm |
CMOS |
3.3 V |
I2C; SPI; UART; IRDA; IDE; LIN |
.4 mm |
S-XQCC-N56 |
3 |
36 |
Multi-functional peripherals (MFPs) are devices that combine several different functions, such as printing, scanning, copying, and faxing, into a single piece of equipment. These devices are often used in office settings to streamline workflows and reduce the need for multiple pieces of equipment.
MFPs typically come with a range of features and capabilities, including high-quality printing and scanning, fast copying and faxing, and the ability to handle large volumes of documents. They may also offer additional features, such as double-sided printing, wireless connectivity, and cloud-based printing and scanning.
One of the key benefits of MFPs is their ability to save space and reduce clutter in an office environment. By combining several different functions into a single device, MFPs eliminate the need for separate printers, scanners, copiers, and fax machines, freeing up valuable space and reducing costs.
In addition to their space-saving benefits, MFPs also offer enhanced efficiency and productivity. With the ability to print, scan, copy, and fax all from a single device, users can complete tasks quickly and easily, without the need to switch between different pieces of equipment.