68 Multi-functional Peripherals 228

Reset All
Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

CY8C5668LTI-LP014T

Infineon Technologies

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

85 Cel

-40 Cel

QUAD

1 mm

32768

8 mm

YES

0

33 MHz

8 mm

CMOS

3.3 V

I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART; USB

.4 mm

S-XQCC-N68

38

CY8C5265LTI-LP050T

Infineon Technologies

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

85 Cel

-40 Cel

QUAD

1 mm

4096

8 mm

YES

0

33 MHz

8 mm

CMOS

3.3 V

I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART; USB

.4 mm

S-XQCC-N68

38

CY8C3865LTI-014

Infineon Technologies

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

2/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC68,.3SQ,40

1.71 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

N

QUAD

1 mm

2048

8 mm

YES

0

67 MHz

30

260

8 mm

32768 Bits

CMOS

3.3 V

Other uPs/uCs/Peripheral ICs

.4 mm

S-XQCC-N68

3

Not Qualified

e4

48

CY8C5888LTI-LP097T

Infineon Technologies

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1 mm

32768

8 mm

YES

0

33 MHz

30

260

8 mm

CMOS

3.3 V

I2C; I2S; LIN; PS/2; SPI; UART; USB; CAN; SIO; IDE; SMBUS

.4 mm

S-XQCC-N68

3

e4

38

CY8C5867LTI-LP028T

Infineon Technologies

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

1 mm

16384

8 mm

YES

0

33 MHz

30

260

8 mm

CMOS

3.3 V

I2C; I2S; LIN; PS/2; SPI; UART; USB; SIO; IDE; SMBUS

.4 mm

S-XQCC-N68

3

e4

38

CY8C5667LTI-LP008

Infineon Technologies

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

2/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC68,.32SQ,16

1.71 V

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

N

QUAD

1 mm

16384

8 mm

YES

33 MHz

30

260

8 mm

1048576 Bits

CMOS

1.8 V

Other uPs/uCs/Peripheral ICs

I2C; USB; PS/2

.4 mm

S-XQCC-N68

3

Not Qualified

e4

48

CY8C5467LTI-LP003T

Infineon Technologies

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

85 Cel

-40 Cel

QUAD

1 mm

16384

8 mm

YES

0

33 MHz

8 mm

CMOS

3.3 V

I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART; USB

.4 mm

S-XQCC-N68

38

CY8C4247FNI-BL473T

Infineon Technologies

INDUSTRIAL

BALL

68

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1.89 V

0

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.71 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

.55 mm

8192

3.52 mm

NO

0

48 MHz

30

260

3.91 mm

CMOS

1.8 V

I2C; I2S; SPI; UART

.4 mm

R-PBGA-B68

1

e1

36

CY8C4247LTQ-M475

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

NO LEAD

68

HQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

CHIP CARRIER, HEAT SINK/SLUG

LCC68,.32SQ,16

1.71 V

105 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1 mm

8192

8 mm

NO

48 MHz

8 mm

CMOS

13.8 mA

11

I2C; SPI; UART; IRDA; IDE; LIN

.4 mm

S-XQCC-N68

3

e4

55

CY8C4246LTI-DM405

Infineon Technologies

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1 mm

8K

8 mm

NO

0

48 MHz

8 mm

CMOS

3.3 V

I2C; SPI; UART; IRDA; IDE; LIN

.4 mm

S-XQCC-N68

3

e4

55

CY8C5266LTI-LP150T

Infineon Technologies

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

85 Cel

-40 Cel

QUAD

1 mm

8192

8 mm

YES

0

33 MHz

8 mm

CMOS

3.3 V

I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART

.4 mm

S-XQCC-N68

38

CY8C4247LTI-L445

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC68,.32SQ,16

1.8 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1 mm

8192

8 mm

NO

48 MHz

8 mm

CMOS

14.5 mA

I2C; IRDA; LIN; SPI; UART; USB

.4 mm

S-XQCC-N68

3

e4

57

CY8C5267LTI-LP089T

Infineon Technologies

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

85 Cel

-40 Cel

QUAD

1 mm

16384

8 mm

YES

0

33 MHz

8 mm

CMOS

3.3 V

I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART; USB

.4 mm

S-XQCC-N68

38

CY8C5868LTI-LP039T

Infineon Technologies

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1 mm

32768

8 mm

YES

0

33 MHz

30

260

8 mm

CMOS

3.3 V

I2C; I2S; LIN; PS/2; SPI; UART; USB; CAN; SIO; IDE; SMBUS

.4 mm

S-XQCC-N68

3

e4

38

CY8C3665LTI-044T

Infineon Technologies

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

2/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC68,.32SQ,16

1.71 V

85 Cel

-40 Cel

PURE TIN

N

QUAD

1 mm

2048

8 mm

YES

0

33 MHz

8 mm

262144 Bits

CMOS

3.3 V

Other uPs/uCs/Peripheral ICs

8051; I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART; USB

.4 mm

S-XQCC-N68

3

Not Qualified

38

CY8C5288LTI-LP090T

Infineon Technologies

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

85 Cel

-40 Cel

QUAD

1 mm

32768

8 mm

YES

0

33 MHz

8 mm

CMOS

3.3 V

I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART; USB

.4 mm

S-XQCC-N68

38

CY8C5867LTI-LP025T

Infineon Technologies

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

1 mm

16384

8 mm

YES

0

33 MHz

30

260

8 mm

CMOS

3.3 V

I2C; I2S; LIN; PS/2; SPI; UART; USB; CAN; SIO; IDE; SMBUS

.4 mm

S-XQCC-N68

3

e4

38

CY8C5466LTI-LP072T

Infineon Technologies

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

85 Cel

-40 Cel

QUAD

1 mm

8192

8 mm

YES

0

33 MHz

8 mm

CMOS

3.3 V

I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART

.4 mm

S-XQCC-N68

38

CY8C3866LTI-207

Infineon Technologies

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

1.8/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC68,.32SQ,16

1.71 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

N

QUAD

1 mm

4096

8 mm

YES

33 MHz

30

260

8 mm

524288 Bits

CMOS

3.3 V

Other uPs/uCs/Peripheral ICs

I2C; USB; PS/2; 8051

.4 mm

S-XQCC-N68

3

Not Qualified

e4

48

CY8C5868LTI-LP036

Infineon Technologies

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

2/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC68,.32SQ,16

1.71 V

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

N

QUAD

1 mm

32768

8 mm

YES

33 MHz

30

260

8 mm

2097152 Bits

CMOS

1.8 V

Other uPs/uCs/Peripheral ICs

I2C; USB; PS/2

.4 mm

S-XQCC-N68

3

Not Qualified

e4

46

CY8C4245FNI-483T

Infineon Technologies

INDUSTRIAL

BALL

68

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

0

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.71 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

.55 mm

8192

3.52 mm

NO

0

24 MHz

3.91 mm

CMOS

1.8 V

I2C; SPI; UART

.4 mm

R-PBGA-B68

1

e1

36

CY8C5268LTI-LP030T

Infineon Technologies

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

85 Cel

-40 Cel

QUAD

1 mm

32768

8 mm

YES

0

33 MHz

8 mm

CMOS

3.3 V

I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART; USB

.4 mm

S-XQCC-N68

38

CY8C5288LTI-LP089

Infineon Technologies

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

85 Cel

-40 Cel

QUAD

1 mm

32768

8 mm

YES

25 MHz

8 mm

CMOS

1.8 V

I2C; USB

.4 mm

S-XQCC-N68

48

CY8C5666LTI-LP005T

Infineon Technologies

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

85 Cel

-40 Cel

QUAD

1 mm

8192

8 mm

YES

0

33 MHz

8 mm

CMOS

3.3 V

I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART; USB

.4 mm

S-XQCC-N68

38

CY8C3246LTI-149T

Infineon Technologies

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

1.8/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC68,.32SQ,16

1.71 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

N

QUAD

1 mm

4096

8 mm

YES

0

33 MHz

8 mm

524288 Bits

CMOS

3.3 V

Other uPs/uCs/Peripheral ICs

8051; I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART

.4 mm

S-XQCC-N68

3

Not Qualified

e4

38

CY8C4247LTQ-L485

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1 mm

8192

8 mm

NO

0

48 MHz

8 mm

CMOS

1.8 V

I2C; SPI; UART; USB

.4 mm

S-XQCC-N68

3

e4

57

CY8C3865LTI-014T

Infineon Technologies

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

2/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC68,.32SQ,16

1.71 V

85 Cel

-40 Cel

PURE TIN

N

QUAD

1 mm

2048

8 mm

YES

0

67 MHz

8 mm

262144 Bits

CMOS

3.3 V

Other uPs/uCs/Peripheral ICs

I2C; USB; PS/2; 8051

.4 mm

S-XQCC-N68

3

Not Qualified

48

CY8C5466LTI-LP085T

Infineon Technologies

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

85 Cel

-40 Cel

QUAD

1 mm

8192

8 mm

YES

0

33 MHz

8 mm

CMOS

3.3 V

I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART; USB

.4 mm

S-XQCC-N68

38

CY8C3866LTI-030T

Infineon Technologies

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

2/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC68,.3SQ,40

1.71 V

85 Cel

-40 Cel

PURE TIN

N

QUAD

1 mm

4096

8 mm

YES

0

67 MHz

8 mm

65536 Bits

CMOS

3.3 V

Other uPs/uCs/Peripheral ICs

I2C; USB; PS/2; 8051

.4 mm

S-XQCC-N68

3

Not Qualified

48

CY8C5888LTQ-LP097T

Infineon Technologies

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

105 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

1 mm

32768

8 mm

YES

0

33 MHz

30

260

8 mm

CMOS

3.3 V

I2C; I2S; LIN; PS/2; SPI; UART; USB; CAN; SIO; IDE; SMBUS

.4 mm

S-XQCC-N68

3

e4

38

CY8C5466LTI-LP085

Infineon Technologies

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

2/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

BGA99,9X11,20

1.71 V

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

N

QUAD

1 mm

8192

8 mm

YES

33 MHz

30

260

8 mm

524288 Bits

CMOS

1.8 V

Other uPs/uCs/Peripheral ICs

I2C; USB; PS/2

.4 mm

S-XQCC-N68

3

Not Qualified

e4

48

CY8C5866LTI-LP022T

Infineon Technologies

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

1 mm

8192

8 mm

YES

0

33 MHz

30

260

8 mm

CMOS

3.3 V

I2C; I2S; LIN; PS/2; SPI; UART; USB; SIO; IDE; SMBUS

.4 mm

S-XQCC-N68

3

e4

38

CY8C5688LTI-LP086T

Infineon Technologies

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

85 Cel

-40 Cel

QUAD

1 mm

32768

8 mm

YES

0

33 MHz

8 mm

CMOS

3.3 V

I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART; USB

.4 mm

S-XQCC-N68

38

73S1217F-68IM/F

Maxim Integrated

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

3/5,5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC68,.32SQ,16

3 V

85 Cel

-40 Cel

QUAD

.8 mm

1024

8 mm

NO

24 MHz

NOT SPECIFIED

NOT SPECIFIED

8 mm

CMOS

78 mA

3.3 V

Other Microprocessor ICs

I2C; USB

.4 mm

S-XQCC-N68

Not Qualified

18

73S1215F-68IMR/F

Maxim Integrated

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

3/3.3,5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC68,.32SQ,16

2.7 V

85 Cel

-40 Cel

QUAD

.8 mm

1024

8 mm

OPERATES BETWEEN 3 TO 3.6 V WHEN USB IS USED

NO

24 MHz

NOT SPECIFIED

NOT SPECIFIED

8 mm

CMOS

35 mA

3 V

Other Microprocessor ICs

I2C; USB

.4 mm

S-XQCC-N68

Not Qualified

73S1215F-68IM/F

Maxim Integrated

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

3/3.3,5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC68,.32SQ,16

2.7 V

85 Cel

-40 Cel

QUAD

.8 mm

1024

8 mm

OPERATES BETWEEN 3 TO 3.6 V WHEN USB IS USED

NO

24 MHz

NOT SPECIFIED

NOT SPECIFIED

8 mm

CMOS

35 mA

3 V

Other Microprocessor ICs

I2C; USB

.4 mm

S-XQCC-N68

Not Qualified

Multi-functional Peripherals

Multi-functional peripherals (MFPs) are devices that combine several different functions, such as printing, scanning, copying, and faxing, into a single piece of equipment. These devices are often used in office settings to streamline workflows and reduce the need for multiple pieces of equipment.

MFPs typically come with a range of features and capabilities, including high-quality printing and scanning, fast copying and faxing, and the ability to handle large volumes of documents. They may also offer additional features, such as double-sided printing, wireless connectivity, and cloud-based printing and scanning.

One of the key benefits of MFPs is their ability to save space and reduce clutter in an office environment. By combining several different functions into a single device, MFPs eliminate the need for separate printers, scanners, copiers, and fax machines, freeing up valuable space and reducing costs.

In addition to their space-saving benefits, MFPs also offer enhanced efficiency and productivity. With the ability to print, scan, copy, and fax all from a single device, users can complete tasks quickly and easily, without the need to switch between different pieces of equipment.