Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Ultraviolet Erasable | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | ROM Bits Size | No. of Timers | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | JESD-609 Code | Maximum Standby Current | On Chip Program ROM Width | No. of I/O Lines | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
QUAD |
1 mm |
32768 |
8 mm |
YES |
0 |
33 MHz |
8 mm |
CMOS |
3.3 V |
I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART; USB |
.4 mm |
S-XQCC-N68 |
38 |
||||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
QUAD |
1 mm |
4096 |
8 mm |
YES |
0 |
33 MHz |
8 mm |
CMOS |
3.3 V |
I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART; USB |
.4 mm |
S-XQCC-N68 |
38 |
||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
2/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC68,.3SQ,40 |
1.71 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
N |
QUAD |
1 mm |
2048 |
8 mm |
YES |
0 |
67 MHz |
30 |
260 |
8 mm |
32768 Bits |
CMOS |
3.3 V |
Other uPs/uCs/Peripheral ICs |
.4 mm |
S-XQCC-N68 |
3 |
Not Qualified |
e4 |
48 |
|||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
32768 |
8 mm |
YES |
0 |
33 MHz |
30 |
260 |
8 mm |
CMOS |
3.3 V |
I2C; I2S; LIN; PS/2; SPI; UART; USB; CAN; SIO; IDE; SMBUS |
.4 mm |
S-XQCC-N68 |
3 |
e4 |
38 |
||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
1 mm |
16384 |
8 mm |
YES |
0 |
33 MHz |
30 |
260 |
8 mm |
CMOS |
3.3 V |
I2C; I2S; LIN; PS/2; SPI; UART; USB; SIO; IDE; SMBUS |
.4 mm |
S-XQCC-N68 |
3 |
e4 |
38 |
||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
2/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC68,.32SQ,16 |
1.71 V |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
N |
QUAD |
1 mm |
16384 |
8 mm |
YES |
33 MHz |
30 |
260 |
8 mm |
1048576 Bits |
CMOS |
1.8 V |
Other uPs/uCs/Peripheral ICs |
I2C; USB; PS/2 |
.4 mm |
S-XQCC-N68 |
3 |
Not Qualified |
e4 |
48 |
||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
QUAD |
1 mm |
16384 |
8 mm |
YES |
0 |
33 MHz |
8 mm |
CMOS |
3.3 V |
I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART; USB |
.4 mm |
S-XQCC-N68 |
38 |
|||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
BALL |
68 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1.89 V |
0 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.71 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
.55 mm |
8192 |
3.52 mm |
NO |
0 |
48 MHz |
30 |
260 |
3.91 mm |
CMOS |
1.8 V |
I2C; I2S; SPI; UART |
.4 mm |
R-PBGA-B68 |
1 |
e1 |
36 |
||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
MULTIFUNCTION PERIPHERAL |
INDUSTRIAL |
NO LEAD |
68 |
HQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
CHIP CARRIER, HEAT SINK/SLUG |
LCC68,.32SQ,16 |
1.71 V |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
8192 |
8 mm |
NO |
48 MHz |
8 mm |
CMOS |
13.8 mA |
11 |
I2C; SPI; UART; IRDA; IDE; LIN |
.4 mm |
S-XQCC-N68 |
3 |
e4 |
55 |
|||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
8K |
8 mm |
NO |
0 |
48 MHz |
8 mm |
CMOS |
3.3 V |
I2C; SPI; UART; IRDA; IDE; LIN |
.4 mm |
S-XQCC-N68 |
3 |
e4 |
55 |
||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
QUAD |
1 mm |
8192 |
8 mm |
YES |
0 |
33 MHz |
8 mm |
CMOS |
3.3 V |
I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART |
.4 mm |
S-XQCC-N68 |
38 |
||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
MULTIFUNCTION PERIPHERAL |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC68,.32SQ,16 |
1.8 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
8192 |
8 mm |
NO |
48 MHz |
8 mm |
CMOS |
14.5 mA |
I2C; IRDA; LIN; SPI; UART; USB |
.4 mm |
S-XQCC-N68 |
3 |
e4 |
57 |
||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
QUAD |
1 mm |
16384 |
8 mm |
YES |
0 |
33 MHz |
8 mm |
CMOS |
3.3 V |
I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART; USB |
.4 mm |
S-XQCC-N68 |
38 |
||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
32768 |
8 mm |
YES |
0 |
33 MHz |
30 |
260 |
8 mm |
CMOS |
3.3 V |
I2C; I2S; LIN; PS/2; SPI; UART; USB; CAN; SIO; IDE; SMBUS |
.4 mm |
S-XQCC-N68 |
3 |
e4 |
38 |
||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
2/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC68,.32SQ,16 |
1.71 V |
85 Cel |
-40 Cel |
PURE TIN |
N |
QUAD |
1 mm |
2048 |
8 mm |
YES |
0 |
33 MHz |
8 mm |
262144 Bits |
CMOS |
3.3 V |
Other uPs/uCs/Peripheral ICs |
8051; I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART; USB |
.4 mm |
S-XQCC-N68 |
3 |
Not Qualified |
38 |
|||||||||||||||||||||||||||||||||
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
QUAD |
1 mm |
32768 |
8 mm |
YES |
0 |
33 MHz |
8 mm |
CMOS |
3.3 V |
I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART; USB |
.4 mm |
S-XQCC-N68 |
38 |
||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
1 mm |
16384 |
8 mm |
YES |
0 |
33 MHz |
30 |
260 |
8 mm |
CMOS |
3.3 V |
I2C; I2S; LIN; PS/2; SPI; UART; USB; CAN; SIO; IDE; SMBUS |
.4 mm |
S-XQCC-N68 |
3 |
e4 |
38 |
||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
QUAD |
1 mm |
8192 |
8 mm |
YES |
0 |
33 MHz |
8 mm |
CMOS |
3.3 V |
I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART |
.4 mm |
S-XQCC-N68 |
38 |
|||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1.8/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC68,.32SQ,16 |
1.71 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
N |
QUAD |
1 mm |
4096 |
8 mm |
YES |
33 MHz |
30 |
260 |
8 mm |
524288 Bits |
CMOS |
3.3 V |
Other uPs/uCs/Peripheral ICs |
I2C; USB; PS/2; 8051 |
.4 mm |
S-XQCC-N68 |
3 |
Not Qualified |
e4 |
48 |
||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
2/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC68,.32SQ,16 |
1.71 V |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
N |
QUAD |
1 mm |
32768 |
8 mm |
YES |
33 MHz |
30 |
260 |
8 mm |
2097152 Bits |
CMOS |
1.8 V |
Other uPs/uCs/Peripheral ICs |
I2C; USB; PS/2 |
.4 mm |
S-XQCC-N68 |
3 |
Not Qualified |
e4 |
46 |
||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
BALL |
68 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
0 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.71 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
.55 mm |
8192 |
3.52 mm |
NO |
0 |
24 MHz |
3.91 mm |
CMOS |
1.8 V |
I2C; SPI; UART |
.4 mm |
R-PBGA-B68 |
1 |
e1 |
36 |
||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
QUAD |
1 mm |
32768 |
8 mm |
YES |
0 |
33 MHz |
8 mm |
CMOS |
3.3 V |
I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART; USB |
.4 mm |
S-XQCC-N68 |
38 |
||||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
QUAD |
1 mm |
32768 |
8 mm |
YES |
25 MHz |
8 mm |
CMOS |
1.8 V |
I2C; USB |
.4 mm |
S-XQCC-N68 |
48 |
||||||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
QUAD |
1 mm |
8192 |
8 mm |
YES |
0 |
33 MHz |
8 mm |
CMOS |
3.3 V |
I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART; USB |
.4 mm |
S-XQCC-N68 |
38 |
||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
1.8/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC68,.32SQ,16 |
1.71 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
N |
QUAD |
1 mm |
4096 |
8 mm |
YES |
0 |
33 MHz |
8 mm |
524288 Bits |
CMOS |
3.3 V |
Other uPs/uCs/Peripheral ICs |
8051; I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART |
.4 mm |
S-XQCC-N68 |
3 |
Not Qualified |
e4 |
38 |
||||||||||||||||||||||||||||||||
|
Infineon Technologies |
MULTIFUNCTION PERIPHERAL |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
8192 |
8 mm |
NO |
0 |
48 MHz |
8 mm |
CMOS |
1.8 V |
I2C; SPI; UART; USB |
.4 mm |
S-XQCC-N68 |
3 |
e4 |
57 |
|||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
2/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC68,.32SQ,16 |
1.71 V |
85 Cel |
-40 Cel |
PURE TIN |
N |
QUAD |
1 mm |
2048 |
8 mm |
YES |
0 |
67 MHz |
8 mm |
262144 Bits |
CMOS |
3.3 V |
Other uPs/uCs/Peripheral ICs |
I2C; USB; PS/2; 8051 |
.4 mm |
S-XQCC-N68 |
3 |
Not Qualified |
48 |
|||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
QUAD |
1 mm |
8192 |
8 mm |
YES |
0 |
33 MHz |
8 mm |
CMOS |
3.3 V |
I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART; USB |
.4 mm |
S-XQCC-N68 |
38 |
|||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
2/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC68,.3SQ,40 |
1.71 V |
85 Cel |
-40 Cel |
PURE TIN |
N |
QUAD |
1 mm |
4096 |
8 mm |
YES |
0 |
67 MHz |
8 mm |
65536 Bits |
CMOS |
3.3 V |
Other uPs/uCs/Peripheral ICs |
I2C; USB; PS/2; 8051 |
.4 mm |
S-XQCC-N68 |
3 |
Not Qualified |
48 |
|||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
105 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
1 mm |
32768 |
8 mm |
YES |
0 |
33 MHz |
30 |
260 |
8 mm |
CMOS |
3.3 V |
I2C; I2S; LIN; PS/2; SPI; UART; USB; CAN; SIO; IDE; SMBUS |
.4 mm |
S-XQCC-N68 |
3 |
e4 |
38 |
||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
2/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
BGA99,9X11,20 |
1.71 V |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
N |
QUAD |
1 mm |
8192 |
8 mm |
YES |
33 MHz |
30 |
260 |
8 mm |
524288 Bits |
CMOS |
1.8 V |
Other uPs/uCs/Peripheral ICs |
I2C; USB; PS/2 |
.4 mm |
S-XQCC-N68 |
3 |
Not Qualified |
e4 |
48 |
||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
1 mm |
8192 |
8 mm |
YES |
0 |
33 MHz |
30 |
260 |
8 mm |
CMOS |
3.3 V |
I2C; I2S; LIN; PS/2; SPI; UART; USB; SIO; IDE; SMBUS |
.4 mm |
S-XQCC-N68 |
3 |
e4 |
38 |
||||||||||||||||||||||||||||||||||||
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
QUAD |
1 mm |
32768 |
8 mm |
YES |
0 |
33 MHz |
8 mm |
CMOS |
3.3 V |
I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART; USB |
.4 mm |
S-XQCC-N68 |
38 |
||||||||||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
MULTIFUNCTION PERIPHERAL |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
3/5,5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC68,.32SQ,16 |
3 V |
85 Cel |
-40 Cel |
QUAD |
.8 mm |
1024 |
8 mm |
NO |
24 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
8 mm |
CMOS |
78 mA |
3.3 V |
Other Microprocessor ICs |
I2C; USB |
.4 mm |
S-XQCC-N68 |
Not Qualified |
18 |
|||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
MULTIFUNCTION PERIPHERAL |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
3/3.3,5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC68,.32SQ,16 |
2.7 V |
85 Cel |
-40 Cel |
QUAD |
.8 mm |
1024 |
8 mm |
OPERATES BETWEEN 3 TO 3.6 V WHEN USB IS USED |
NO |
24 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
8 mm |
CMOS |
35 mA |
3 V |
Other Microprocessor ICs |
I2C; USB |
.4 mm |
S-XQCC-N68 |
Not Qualified |
|||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
MULTIFUNCTION PERIPHERAL |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
3/3.3,5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC68,.32SQ,16 |
2.7 V |
85 Cel |
-40 Cel |
QUAD |
.8 mm |
1024 |
8 mm |
OPERATES BETWEEN 3 TO 3.6 V WHEN USB IS USED |
NO |
24 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
8 mm |
CMOS |
35 mA |
3 V |
Other Microprocessor ICs |
I2C; USB |
.4 mm |
S-XQCC-N68 |
Not Qualified |
Multi-functional peripherals (MFPs) are devices that combine several different functions, such as printing, scanning, copying, and faxing, into a single piece of equipment. These devices are often used in office settings to streamline workflows and reduce the need for multiple pieces of equipment.
MFPs typically come with a range of features and capabilities, including high-quality printing and scanning, fast copying and faxing, and the ability to handle large volumes of documents. They may also offer additional features, such as double-sided printing, wireless connectivity, and cloud-based printing and scanning.
One of the key benefits of MFPs is their ability to save space and reduce clutter in an office environment. By combining several different functions into a single device, MFPs eliminate the need for separate printers, scanners, copiers, and fax machines, freeing up valuable space and reducing costs.
In addition to their space-saving benefits, MFPs also offer enhanced efficiency and productivity. With the ability to print, scan, copy, and fax all from a single device, users can complete tasks quickly and easily, without the need to switch between different pieces of equipment.