8 Multi-functional Peripherals 15

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	ROM Words	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	ROM Bits Size	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	ROM Programmability	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	Maximum Standby Current	No. of I/O Lines
CY8C4013SXI-410	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	GULL WING	8	LSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V				SMALL OUTLINE, LOW PROFILE	SOP8,.25	1.8 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		DUAL	1.727 mm		1024	3.89 mm		NO		16 MHz	30	260	4.889 mm			CMOS	4.5 mA	3.3 V			I2C	1.27 mm	R-PDSO-G8	3			e4		5
CY8C24123A-24SXI	Infineon Technologies		INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V	0	8	2.7/5	SMALL OUTLINE	SOP8,.25	4.75 V	85 Cel	M8C	-40 Cel	MATTE TIN		DUAL	1.727 mm	4096	256	3.8985 mm	ALSO OPERATES AT 2.7V AND 3.3V SUPPLY	NO	0	24.6 MHz	20	260	4.889 mm		256	CMOS	8 mA	5 V	Microcontrollers	FLASH	USB	1.27 mm	R-PDSO-G8	3	Not Qualified	24 rpm	e3		6
CY8C24123A-24PXI	Infineon Technologies		INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.25 V	0	8	2.7/5	IN-LINE	DIP8,.3	4.75 V	85 Cel	M8C	-40 Cel	MATTE TIN		DUAL	4.572 mm	4096	256	7.62 mm	ALSO OPERATES AT 2.7V AND 3.3V SUPPLY	NO	0	24.6 MHz		260	9.779 mm		256	CMOS	8 mA	5 V	Microcontrollers	FLASH	USB	2.54 mm	R-PDIP-T8	1	Not Qualified	24 rpm	e3		6
CY8C4014SXI-420	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V				SMALL OUTLINE	SOP8,.25	1.8 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		DUAL	1.727 mm		2K	3.8985 mm		NO		16 MHz	30	260	4.978 mm			CMOS	4.5 mA	3.3 V			I2C; USB	1.27 mm	R-PDSO-G8	3			e4		5
CY8C4013SXI-400	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	GULL WING	8	LSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V				SMALL OUTLINE, LOW PROFILE	SOP8,.25	1.8 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		DUAL	1.727 mm		1024	3.89 mm		NO		16 MHz	30	260	4.889 mm			CMOS	4.5 mA	3.3 V			I2C	1.27 mm	R-PDSO-G8	3			e4		5
CY8C24123A-24SXIT	Infineon Technologies		INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V	0	8	2.7/5	SMALL OUTLINE	SOP8,.25	4.75 V	85 Cel	M8C	-40 Cel	MATTE TIN		DUAL	1.727 mm	4096	256	3.8985 mm	ALSO OPERATES AT 2.7V AND 3.3V SUPPLY	NO	0	24.6 MHz	20	260	4.889 mm		256	CMOS	8 mA	5 V	Microcontrollers	FLASH	USB	1.27 mm	R-PDSO-G8	3	Not Qualified	24 rpm	e3		6
CY8C27143-24PXI	Cypress Semiconductor		INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.25 V	0	8	3.3/5	IN-LINE	DIP8,.3	4.75 V	85 Cel	M8C	-40 Cel	MATTE TIN		DUAL	4.572 mm	16384	256	7.62 mm	ALSO OPERATES AT 3V WITH 93KHZ	NO	0	24 MHz		260	9.779 mm		256	CMOS	8 mA	5 V	Microcontrollers	FLASH	I2C; USB	2.54 mm	R-PDIP-T8	1	Not Qualified	24 rpm	e3		6
CY8C25122-24PI	Cypress Semiconductor		INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.25 V	0		3.3/5	IN-LINE	DIP8,.3	3 V	85 Cel		-40 Cel	TIN LEAD	N	DUAL	4.572 mm		256	7.62 mm		NO	0	.032768 MHz			9.779 mm	4096 Bits		CMOS		3.3 V	Other Microprocessor ICs			2.54 mm	R-PDIP-T8		Not Qualified		e0	.000005 Amp	6
CY8C4014SXI-420T	Infineon Technologies		INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	0			SMALL OUTLINE		1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		DUAL	1.727 mm		1024	3.8985 mm		NO	0	16 MHz			4.889 mm			CMOS		3.3 V			I2C	1.27 mm	R-PDSO-G8	3			e4		5
CY8C22113A-24SXI	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES			8	2.5/5	SMALL OUTLINE	SOP8,.25		85 Cel	M8C	-40 Cel	MATTE TIN		DUAL		2048							20	260			256	CMOS	8 mA		Microcontrollers	FLASH		1.27 mm	R-PDSO-G8	3	Not Qualified	24 rpm	e3
CY8C22113-24PXI	Infineon Technologies		INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.25 V	0			IN-LINE		4.75 V	85 Cel		-40 Cel			DUAL	4.572 mm		256	7.62 mm		NO	0	24.24 MHz	NOT SPECIFIED	NOT SPECIFIED	9.779 mm			CMOS		5 V				2.54 mm	R-PDIP-T8		Not Qualified				6
CY8C22113A-24PXI	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO			8	2.5/5	IN-LINE	DIP8,.3		85 Cel	M8C	-40 Cel	MATTE TIN		DUAL		2048								260			256	CMOS	8 mA		Microcontrollers	FLASH		2.54 mm	R-PDIP-T8		Not Qualified	24 rpm	e3
CY8C4013SXI-410T	Infineon Technologies		INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	0			SMALL OUTLINE		1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		DUAL	1.727 mm		1024	3.8985 mm		NO	0	16 MHz			4.889 mm			CMOS		3.3 V			I2C	1.27 mm	R-PDSO-G8	3			e4		5
CY8C22113A-24SXIT	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES			8	2.5/5	SMALL OUTLINE	SOP8,.25		85 Cel	M8C	-40 Cel	MATTE TIN		DUAL		2048							20	260			256	CMOS	8 mA		Microcontrollers	FLASH		1.27 mm	R-PDSO-G8	3	Not Qualified	24 rpm	e3
CY8C22113-24SXI	Infineon Technologies		INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V	0			SMALL OUTLINE		4.75 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		DUAL	1.727 mm		256	3.8985 mm		NO	0	24.24 MHz			4.889 mm			CMOS		5 V				1.27 mm	R-PDSO-G8	3	Not Qualified		e4		6

Multi-functional Peripherals

Multi-functional peripherals (MFPs) are devices that combine several different functions, such as printing, scanning, copying, and faxing, into a single piece of equipment. These devices are often used in office settings to streamline workflows and reduce the need for multiple pieces of equipment.

MFPs typically come with a range of features and capabilities, including high-quality printing and scanning, fast copying and faxing, and the ability to handle large volumes of documents. They may also offer additional features, such as double-sided printing, wireless connectivity, and cloud-based printing and scanning.

One of the key benefits of MFPs is their ability to save space and reduce clutter in an office environment. By combining several different functions into a single device, MFPs eliminate the need for separate printers, scanners, copiers, and fax machines, freeing up valuable space and reducing costs.

In addition to their space-saving benefits, MFPs also offer enhanced efficiency and productivity. With the ability to print, scan, copy, and fax all from a single device, users can complete tasks quickly and easily, without the need to switch between different pieces of equipment.