HQCCN Multi-functional Peripherals 19

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Address Bus Width	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of Serial I/Os	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code	No. of I/O Lines
CY8C4124LQI-443	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	NO LEAD	40	HQCCN	SQUARE	UNSPECIFIED	YES	5.5 V		CHIP CARRIER, HEAT SINK/SLUG	LCC40,.24SQ,20	1.71 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.6 mm	2048	6 mm		NO	0	24 MHz			6 mm	CMOS	7.2 mA	1.8 V	0	I2C, I2S, SPI, UART	.5 mm	S-XQCC-N40	3	Not Qualified	e4	34
CY8C4014LQI-421	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	UNSPECIFIED	YES	5.5 V		CHIP CARRIER, HEAT SINK/SLUG	LCC16,.12SQ,20	1.8 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	.6 mm	1024	3 mm		NO		16 MHz	30	260	3 mm	CMOS	4.5 mA	3.3 V		I2C	.5 mm	S-XQCC-N16	3		e4	12
CY8C4247LTI-M475	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	NO LEAD	68	HQCCN	SQUARE	UNSPECIFIED	YES	5.5 V		CHIP CARRIER, HEAT SINK/SLUG	LCC68,.32SQ,16	1.71 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1 mm	8192	8 mm		NO		48 MHz			8 mm	CMOS	13.8 mA		11	I2C; SPI; UART; IRDA; IDE; LIN	.4 mm	S-XQCC-N68	3	Not Qualified	e4	55
CY8C4014LQI-422	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	NO LEAD	24	HQCCN	SQUARE	UNSPECIFIED	YES	5.5 V		CHIP CARRIER, HEAT SINK/SLUG	LCC24,.16SQ,20	1.8 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	.55 mm	1024	4 mm		NO		16 MHz	30	260	4 mm	CMOS	4.5 mA	3.3 V		I2C	.5 mm	S-XQCC-N24	3		e4	20
CY8C4125LQI-483	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	NO LEAD	40	HQCCN	SQUARE	UNSPECIFIED	YES	5.5 V		CHIP CARRIER, HEAT SINK/SLUG	LCC40,.24SQ,20	1.71 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.6 mm	2048	6 mm		NO	0	24 MHz			6 mm	CMOS	7.2 mA	1.8 V	0	I2C, I2S, SPI, UART	.5 mm	S-XQCC-N40	3	Not Qualified	e4	34
CY8C4125LTI-M445	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	NO LEAD	68	HQCCN	SQUARE	UNSPECIFIED	YES	5.5 V		CHIP CARRIER, HEAT SINK/SLUG	LCC68,.32SQ,16	1.8 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1 mm	2048	8 mm		NO		48 MHz			8 mm	CMOS	7.2 mA		7	I2C; IRDA; LIN; SPI; UART	.4 mm	S-XQCC-N68	3		e4	55
CY8C4014LQI-412	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	NO LEAD	24	HQCCN	SQUARE	UNSPECIFIED	YES	5.5 V		CHIP CARRIER, HEAT SINK/SLUG	LCC24,.16SQ,20	1.8 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	.55 mm	1024	4 mm		NO		16 MHz	30	260	4 mm	CMOS	4.5 mA	3.3 V		I2C	.5 mm	S-XQCC-N24	3		e4	20
CY8C4124LQI-443T	Infineon Technologies		INDUSTRIAL	NO LEAD	56	HQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	0	CHIP CARRIER, HEAT SINK/SLUG		1.71 V	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1.6 mm	2048	10 mm		NO	0	24 MHz			10 mm	CMOS		1.8 V		I2C; SPI; UART	.8 mm	S-XQCC-N56	3		e4	34
CYONS2101-LBXC	Cypress Semiconductor		OTHER	NO LEAD	42	HQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG		2.7 V	45 Cel	5 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	2.46 mm	1024	8.3 mm	SEATED HT-CALCULATED	NO		25.2 MHz	20	260	8.3 mm	CMOS		3.3 V		I2C; USB	.5 mm	S-PQCC-N42	3	Not Qualified	e4	28
CY8C4013LQI-411	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	UNSPECIFIED	YES	5.5 V		CHIP CARRIER, HEAT SINK/SLUG	LCC16,.12SQ,20	1.8 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.6 mm	1024	3 mm		NO		16 MHz	30	260	3 mm	CMOS	4.5 mA	3.3 V		I2C	.5 mm	S-XQCC-N16	3		e4	12
CY8C4126LTI-M445	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	NO LEAD	68	HQCCN	SQUARE	UNSPECIFIED	YES	5.5 V		CHIP CARRIER, HEAT SINK/SLUG	LCC68,.32SQ,16	1.8 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1 mm	4096	8 mm		NO		48 MHz			8 mm	CMOS	7.2 mA		7	I2C; IRDA; LIN; SPI; UART	.4 mm	S-XQCC-N68	3		e4	55
CY8C4245LTI-M445	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	NO LEAD	68	HQCCN	SQUARE	UNSPECIFIED	YES	5.5 V		CHIP CARRIER, HEAT SINK/SLUG	LCC68,.32SQ,16	1.71 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1 mm	2048	8 mm		NO		48 MHz			8 mm	CMOS	13.8 mA		11	I2C; SPI; UART; IRDA; IDE; LIN	.4 mm	S-XQCC-N68	3		e4	55
CY8C4246LTI-M445	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	NO LEAD	68	HQCCN	SQUARE	UNSPECIFIED	YES	5.5 V		CHIP CARRIER, HEAT SINK/SLUG	LCC68,.32SQ,16	1.71 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1 mm	4096	8 mm		NO		48 MHz			8 mm	CMOS	13.8 mA		11	I2C; SPI; UART; IRDA; IDE; LIN	.4 mm	S-XQCC-N68	3		e4	55
CY8C4246LTI-M475	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	NO LEAD	68	HQCCN	SQUARE	UNSPECIFIED	YES	5.5 V		CHIP CARRIER, HEAT SINK/SLUG	LCC68,.32SQ,16	1.71 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1 mm	4096	8 mm		NO		48 MHz			8 mm	CMOS	13.8 mA		11	I2C; SPI; UART; IRDA; IDE; LIN	.4 mm	S-XQCC-N68	3		e4	55
CY8C4127LTI-M475	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	NO LEAD	68	HQCCN	SQUARE	UNSPECIFIED	YES	5.5 V		CHIP CARRIER, HEAT SINK/SLUG	LCC68,.32SQ,16	1.8 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1 mm	8192	8 mm		NO		48 MHz			8 mm	CMOS	7.2 mA		7	I2C; IRDA; LIN; SPI; UART	.4 mm	S-XQCC-N68	3		e4	55
CY8C4248LTQ-L485	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	NO LEAD	68	HQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	0	CHIP CARRIER, HEAT SINK/SLUG		1.71 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1.6 mm	32K	10 mm		NO	0	48 MHz	30	260	10 mm	CMOS		1.8 V		I2C; SPI; UART; USB	.5 mm	S-XQCC-N68	3		e4	57
CY8C4126LTI-M475	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	NO LEAD	68	HQCCN	SQUARE	UNSPECIFIED	YES	5.5 V		CHIP CARRIER, HEAT SINK/SLUG	LCC68,.32SQ,16	1.8 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1 mm	4096	8 mm		NO		48 MHz			8 mm	CMOS	7.2 mA		7	I2C; IRDA; LIN; SPI; UART	.4 mm	S-XQCC-N68	3		e4	55
CY8C4247LTQ-M475	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	NO LEAD	68	HQCCN	SQUARE	UNSPECIFIED	YES	5.5 V		CHIP CARRIER, HEAT SINK/SLUG	LCC68,.32SQ,16	1.71 V	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1 mm	8192	8 mm		NO		48 MHz			8 mm	CMOS	13.8 mA		11	I2C; SPI; UART; IRDA; IDE; LIN	.4 mm	S-XQCC-N68	3		e4	55
CY8C4124LQQ-443	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	NO LEAD	40	HQCCN	SQUARE	UNSPECIFIED	YES	5.5 V		CHIP CARRIER, HEAT SINK/SLUG	LCC40,.24SQ,20	1.71 V	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.6 mm	2048	6 mm		NO	0	24 MHz	30	260	6 mm	CMOS	7.2 mA	1.8 V	0	I2C, I2S, SPI, UART	.5 mm	S-XQCC-N40	3		e4	34

Multi-functional Peripherals

Multi-functional peripherals (MFPs) are devices that combine several different functions, such as printing, scanning, copying, and faxing, into a single piece of equipment. These devices are often used in office settings to streamline workflows and reduce the need for multiple pieces of equipment.

MFPs typically come with a range of features and capabilities, including high-quality printing and scanning, fast copying and faxing, and the ability to handle large volumes of documents. They may also offer additional features, such as double-sided printing, wireless connectivity, and cloud-based printing and scanning.

One of the key benefits of MFPs is their ability to save space and reduce clutter in an office environment. By combining several different functions into a single device, MFPs eliminate the need for separate printers, scanners, copiers, and fax machines, freeing up valuable space and reducing costs.

In addition to their space-saving benefits, MFPs also offer enhanced efficiency and productivity. With the ability to print, scan, copy, and fax all from a single device, users can complete tasks quickly and easily, without the need to switch between different pieces of equipment.