LFBGA Multi-functional Peripherals 108

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

MCIMX6G3DVM05AB

NXP Semiconductors

MULTIFUNCTION PERIPHERAL

OTHER

BALL

289

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.3 V

26

GRID ARRAY, LOW PROFILE, FINE PITCH

1.15 V

95 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.32 mm

14 mm

YES

16

40

260

14 mm

CMOS

.8 mm

FIXED POINT

S-PBGA-B289

3

528 rpm

YES

e1

MCIMX503CVK8B

NXP Semiconductors

COMMERCIAL

BALL

416

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.95 V

70 Cel

0 Cel

BOTTOM

1.52 mm

13 mm

13 mm

CMOS

1.05 V

.5 mm

S-PBGA-B416

3

MCIMX27LMOP4AR2

NXP Semiconductors

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

BALL

473

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.52 V

26

32

GRID ARRAY, LOW PROFILE, FINE PITCH

1.38 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.54 mm

19 mm

ALSO OPERATES 1.3V AT 266MHZ; UNAVAILABLE FOR IMPORT OR SALE IN US

YES

16

26 MHz

40

260

19 mm

CMOS

1.45 V

.8 mm

FIXED POINT

S-PBGA-B473

3

400 rpm

YES

e1

MCIMX6G2DVK05AA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL

BALL

272

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.5 V

16

GRID ARRAY, LOW PROFILE, FINE PITCH

1.275 V

BOTTOM

1.23 mm

9 mm

YES

16

40

260

9 mm

CMOS

.5 mm

FIXED POINT

S-PBGA-B272

3

528 rpm

YES

MCIMX27MJP4AR2

NXP Semiconductors

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

BALL

473

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.52 V

26

32

GRID ARRAY, LOW PROFILE, FINE PITCH

1.38 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.54 mm

19 mm

ALSO OPERATES 1.3V AT 266MHZ

YES

32

32 MHz

40

260

19 mm

CMOS

1.45 V

.8 mm

FIXED POINT

S-PBGA-B473

3

400 rpm

YES

e1

MCIMX356AJQ

NXP Semiconductors

INDUSTRIAL

BALL

400

LFBGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY, LOW PROFILE, FINE PITCH

TIN SILVER COPPER

BOTTOM

1.6 mm

17 mm

17 mm

.8 mm

S-PBGA-B400

3

e1

MCIMX6G1AVM07AB

NXP Semiconductors

MULTIFUNCTION PERIPHERAL

AUTOMOTIVE

BALL

289

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.3 V

26

GRID ARRAY, LOW PROFILE, FINE PITCH

1.25 V

125 Cel

-40 Cel

TIN SILVER

BOTTOM

1.32 mm

14 mm

YES

16

40

260

14 mm

CMOS

.8 mm

FIXED POINT

S-PBGA-B289

3

696 rpm

YES

e2

MCIMX6G3DVK05AA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL

BALL

272

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.5 V

16

GRID ARRAY, LOW PROFILE, FINE PITCH

1.275 V

BOTTOM

1.23 mm

9 mm

YES

16

40

260

9 mm

CMOS

.5 mm

FIXED POINT

S-PBGA-B272

3

528 rpm

YES

MCIMX6G1AVM05AB

NXP Semiconductors

MULTIFUNCTION PERIPHERAL

AUTOMOTIVE

BALL

289

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.3 V

26

GRID ARRAY, LOW PROFILE, FINE PITCH

1.15 V

125 Cel

-40 Cel

TIN SILVER

BOTTOM

1.32 mm

14 mm

YES

16

40

260

14 mm

CMOS

.8 mm

FIXED POINT

S-PBGA-B289

3

528 rpm

YES

e2

MCIMX27MOP4AR2

NXP Semiconductors

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

BALL

473

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.52 V

26

32

GRID ARRAY, LOW PROFILE, FINE PITCH

1.38 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.54 mm

19 mm

ALSO OPERATES 1.3V AT 266MHZ

YES

32

32 MHz

40

260

19 mm

CMOS

1.45 V

.8 mm

FIXED POINT

S-PBGA-B473

3

400 rpm

YES

e1

MCIMX6G0DVM05AB

NXP Semiconductors

MULTIFUNCTION PERIPHERAL

OTHER

BALL

289

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.3 V

26

GRID ARRAY, LOW PROFILE, FINE PITCH

1.15 V

95 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.32 mm

14 mm

YES

16

40

260

14 mm

CMOS

.8 mm

FIXED POINT

S-PBGA-B289

3

528 rpm

YES

e1

MCIMX6G3DVK05AB

NXP Semiconductors

MULTIFUNCTION PERIPHERAL

OTHER

BALL

272

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.3 V

26

GRID ARRAY, LOW PROFILE, FINE PITCH

1.15 V

95 Cel

0 Cel

BOTTOM

1.23 mm

9 mm

YES

16

40

260

9 mm

CMOS

.5 mm

FIXED POINT

S-PBGA-B272

3

528 rpm

YES

Multi-functional Peripherals

Multi-functional peripherals (MFPs) are devices that combine several different functions, such as printing, scanning, copying, and faxing, into a single piece of equipment. These devices are often used in office settings to streamline workflows and reduce the need for multiple pieces of equipment.

MFPs typically come with a range of features and capabilities, including high-quality printing and scanning, fast copying and faxing, and the ability to handle large volumes of documents. They may also offer additional features, such as double-sided printing, wireless connectivity, and cloud-based printing and scanning.

One of the key benefits of MFPs is their ability to save space and reduce clutter in an office environment. By combining several different functions into a single device, MFPs eliminate the need for separate printers, scanners, copiers, and fax machines, freeing up valuable space and reducing costs.

In addition to their space-saving benefits, MFPs also offer enhanced efficiency and productivity. With the ability to print, scan, copy, and fax all from a single device, users can complete tasks quickly and easily, without the need to switch between different pieces of equipment.