SQUARE Multi-functional Peripherals 1,100

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

CY8C5888LTQ-LP097T

Infineon Technologies

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

105 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

1 mm

32768

8 mm

YES

0

33 MHz

30

260

8 mm

CMOS

3.3 V

I2C; I2S; LIN; PS/2; SPI; UART; USB; CAN; SIO; IDE; SMBUS

.4 mm

S-XQCC-N68

3

e4

38

CY8C5666AXI-LP001T

Infineon Technologies

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

0

FLATPACK, LOW PROFILE, FINE PITCH

1.71 V

85 Cel

-40 Cel

QUAD

1.6 mm

8192

14 mm

YES

0

33 MHz

14 mm

CMOS

3.3 V

I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART

.5 mm

S-PQFP-G100

62

CY8C4248BZI-L479

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

BALL

124

VFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA124,13X13,25

1.8 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1 mm

16384

9 mm

NO

48 MHz

9 mm

CMOS

14.5 mA

I2C; IRDA; LIN; SPI; UART; USB

.65 mm

S-PBGA-B124

3

e1

98

CY8C20246A-24LKXIT

Infineon Technologies

INDUSTRIAL

NO LEAD

16

VQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

8

1.8/5

CHIP CARRIER, VERY THIN PROFILE

LCC16,.12SQ,20

1.71 V

85 Cel

M8C

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

.6 mm

16384

1024

3 mm

NO

0

25.2 MHz

20

260

3 mm

2048

CMOS

4 mA

3 V

Microcontrollers

FLASH

USB

.5 mm

S-XQCC-N16

3

Not Qualified

25.2 rpm

e4

13

CY8C4126AZI-M445

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

1.8 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1.6 mm

4096

10 mm

NO

48 MHz

10 mm

CMOS

7.2 mA

7

I2C; IRDA; LIN; SPI; UART

.5 mm

S-PQFP-G64

3

e4

51

CY8C5466LTI-LP085

Infineon Technologies

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

2/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

BGA99,9X11,20

1.71 V

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

N

QUAD

1 mm

8192

8 mm

YES

33 MHz

30

260

8 mm

524288 Bits

CMOS

1.8 V

Other uPs/uCs/Peripheral ICs

I2C; USB; PS/2

.4 mm

S-XQCC-N68

3

Not Qualified

e4

48

CY8C5265AXI-LP056T

Infineon Technologies

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

0

FLATPACK, LOW PROFILE, FINE PITCH

1.71 V

85 Cel

-40 Cel

QUAD

1.6 mm

4096

14 mm

YES

0

33 MHz

14 mm

CMOS

3.3 V

I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART; USB

.5 mm

S-PQFP-G100

62

CY8C20334-12LFXC

Infineon Technologies

COMMERCIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

5.25 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

4.75 V

70 Cel

-20 Cel

Matte Tin (Sn)

QUAD

1 mm

512

4 mm

ALSO OPERATES AT 2.7V AND 3V SUPPLY

NO

0

12.6 MHz

20

260

4 mm

CMOS

5 V

.5 mm

S-XQCC-N24

3

Not Qualified

e3

20

CY8C4128LQI-BL593T

Infineon Technologies

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

85 Cel

-40 Cel

PURE TIN

QUAD

.6 mm

16384

7 mm

NO

0

48 MHz

7 mm

CMOS

3.3 V

I2C; SPI; UART; IRDA; IDE; LIN

.4 mm

S-XQCC-N56

3

36

CY8C20334-12LKXI

Infineon Technologies

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

5.25 V

0

8

2.7/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.16SQ,20

2.4 V

85 Cel

M8C

-40 Cel

MATTE TIN

QUAD

.6 mm

8192

512

4 mm

NO

0

12 MHz

20

260

4 mm

512

CMOS

2.5 mA

3 V

Microcontrollers

FLASH

USB

.5 mm

S-XQCC-N24

3

Not Qualified

12 rpm

e3

CY8C20466A-24LQXI

Infineon Technologies

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

8

1.8/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

1.71 V

85 Cel

M8C

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

.6 mm

32768

1024

5 mm

NO

0

25.2 MHz

40

260

5 mm

2048

CMOS

4 mA

3 V

Microcontrollers

FLASH

USB

.5 mm

S-XQCC-N32

3

Not Qualified

25.2 rpm

e4

28

CY8C5866LTI-LP022T

Infineon Technologies

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

1 mm

8192

8 mm

YES

0

33 MHz

30

260

8 mm

CMOS

3.3 V

I2C; I2S; LIN; PS/2; SPI; UART; USB; SIO; IDE; SMBUS

.4 mm

S-XQCC-N68

3

e4

38

CY8C20324-12LQXI

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

5.25 V

0

8

2.7/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.16SQ,20

4.75 V

85 Cel

M8C

-40 Cel

MATTE TIN

QUAD

.6 mm

8192

512

4 mm

ALSO OPERATES AT 750 KHZ WITH 2.4 V

NO

0

12 MHz

20

260

4 mm

512

CMOS

2.5 mA

5 V

Microcontrollers

FLASH

I2C; USB

.5 mm

S-XQCC-N24

3

Not Qualified

12.6 rpm

e3

20

CY8C20366-24LQXIT

Infineon Technologies

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

8

1.8/5.5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.16SQ,20

1.71 V

85 Cel

M8C

-40 Cel

Matte Tin (Sn)

QUAD

.6 mm

32768

1024

4 mm

NO

25.2 MHz

20

260

4 mm

2048

CMOS

4 mA

3 V

Microcontrollers

FLASH

I2C; USB

.5 mm

S-XQCC-N24

3

Not Qualified

24 rpm

e3

20

CY8C5688LTI-LP086T

Infineon Technologies

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

85 Cel

-40 Cel

QUAD

1 mm

32768

8 mm

YES

0

33 MHz

8 mm

CMOS

3.3 V

I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART; USB

.4 mm

S-XQCC-N68

38

CY8C20646AS-24LTXIT

Infineon Technologies

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

8

1.8/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

1.71 V

85 Cel

M8C

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1 mm

16384

1024

7 mm

NO

0

25.2 MHz

7 mm

2048

CMOS

4 mA

3 V

Microcontrollers

FLASH

I2C; USB

.5 mm

S-XQCC-N48

3

Not Qualified

24 rpm

e4

36

CY8C5266AXI-LP033T

Infineon Technologies

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

0

FLATPACK, LOW PROFILE, FINE PITCH

1.71 V

85 Cel

-40 Cel

QUAD

1.6 mm

8192

14 mm

YES

0

33 MHz

14 mm

CMOS

3.3 V

I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART; USB

.5 mm

S-PQFP-G100

62

CY8C20266-24LKXIT

Infineon Technologies

INDUSTRIAL

NO LEAD

16

VQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

8

1.8/5.5

CHIP CARRIER, VERY THIN PROFILE

LCC16,.12SQ,20

1.71 V

85 Cel

M8C

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

.6 mm

32768

1024

3 mm

NO

25.2 MHz

20

260

3 mm

2048

CMOS

4 mA

3 V

Microcontrollers

FLASH

I2C; USB

.5 mm

S-XQCC-N16

3

Not Qualified

24 rpm

e4

13

CY8C4014LQI-SLT1

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.8 V

85 Cel

-40 Cel

QUAD

.6 mm

1024

3 mm

NO

16 MHz

NOT SPECIFIED

NOT SPECIFIED

3 mm

CMOS

3.3 V

I2C; USB

.5 mm

S-XQCC-N16

12

CY8C4014LQI-SLT2

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.8 V

85 Cel

-40 Cel

QUAD

.6 mm

1024

4 mm

NO

16 MHz

NOT SPECIFIED

NOT SPECIFIED

4 mm

CMOS

3.3 V

I2C; USB

.5 mm

S-XQCC-N24

20

CY8C4124AXI-443T

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

GULL WING

44

LQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

FLATPACK, LOW PROFILE

QFP44,.47SQ,32

1.71 V

85 Cel

-40 Cel

QUAD

1.6 mm

2048

10 mm

NO

0

24 MHz

NOT SPECIFIED

NOT SPECIFIED

10 mm

CMOS

7.2 mA

1.8 V

0

I2C, I2S, SPI, UART

.8 mm

S-PQFP-G44

Not Qualified

36

73S1215F-44IMR/F

Maxim Integrated

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

NO LEAD

44

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

3/3.3,5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC44,.28SQ,20

2.7 V

85 Cel

-40 Cel

QUAD

.8 mm

1024

7 mm

OPERATES BETWEEN 3 TO 3.6 V WHEN USB IS USED

NO

24 MHz

7 mm

CMOS

35 mA

3 V

Other Microprocessor ICs

I2C; USB

.5 mm

S-XQCC-N44

3

Not Qualified

73S1217F-68IM/F

Maxim Integrated

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

3/5,5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC68,.32SQ,16

3 V

85 Cel

-40 Cel

QUAD

.8 mm

1024

8 mm

NO

24 MHz

NOT SPECIFIED

NOT SPECIFIED

8 mm

CMOS

78 mA

3.3 V

Other Microprocessor ICs

I2C; USB

.4 mm

S-XQCC-N68

Not Qualified

18

73S1215F-68IMR/F

Maxim Integrated

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

3/3.3,5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC68,.32SQ,16

2.7 V

85 Cel

-40 Cel

QUAD

.8 mm

1024

8 mm

OPERATES BETWEEN 3 TO 3.6 V WHEN USB IS USED

NO

24 MHz

NOT SPECIFIED

NOT SPECIFIED

8 mm

CMOS

35 mA

3 V

Other Microprocessor ICs

I2C; USB

.4 mm

S-XQCC-N68

Not Qualified

73S1215F-68IM/F

Maxim Integrated

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

3/3.3,5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC68,.32SQ,16

2.7 V

85 Cel

-40 Cel

QUAD

.8 mm

1024

8 mm

OPERATES BETWEEN 3 TO 3.6 V WHEN USB IS USED

NO

24 MHz

NOT SPECIFIED

NOT SPECIFIED

8 mm

CMOS

35 mA

3 V

Other Microprocessor ICs

I2C; USB

.4 mm

S-XQCC-N68

Not Qualified

73S1215F-44IM/F

Maxim Integrated

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

NO LEAD

44

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

3/3.3,5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC44,.28SQ,20

2.7 V

85 Cel

-40 Cel

QUAD

.8 mm

1024

7 mm

OPERATES BETWEEN 3 TO 3.6 V WHEN USB IS USED

NO

24 MHz

7 mm

CMOS

35 mA

3 V

Other Microprocessor ICs

I2C; USB

.5 mm

S-XQCC-N44

3

Not Qualified

TC6358TB

Toshiba

COMMERCIAL

BALL

552

LBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

13

3.3,3.3/5,5

GRID ARRAY, LOW PROFILE

BGA(UNSPEC)

3 V

70 Cel

0 Cel

TIN LEAD

BOTTOM

1.45 mm

31 mm

YES

32

83.33 MHz

31 mm

CMOS

3.3 V

Other Microprocessor ICs

TX3922; ISA; PCMCIA; USB

1 mm

S-PBGA-B552

Not Qualified

e0

TMPR3916F

Toshiba

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

GULL WING

208

FQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

27

32

3.3

FLATPACK, FINE PITCH

QFP208,1.2SQ,20

3 V

85 Cel

-40 Cel

QUAD

4.45 mm

28 mm

NO

32

10 MHz

NOT SPECIFIED

NOT SPECIFIED

28 mm

CMOS

3.3 V

Microprocessors

.5 mm

S-PQFP-G208

Not Qualified

60 rpm

30

79RC32V134DSG

Renesas Electronics

COMMERCIAL

GULL WING

208

FQFP

SQUARE

PLASTIC/EPOXY

YES

3.465 V

32

FLATPACK, FINE PITCH

3.135 V

70 Cel

0 Cel

MATTE TIN

QUAD

4.1 mm

28 mm

YES

32

75 MHz

28 mm

CMOS

3.3 V

PCI; RC32364; RC32134

.5 mm

S-PQFP-G208

Not Qualified

e3

12

HD64465BP

Renesas Electronics

BALL

387

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

TIN SILVER COPPER

BOTTOM

2.48 mm

35 mm

35 mm

CMOS

1.27 mm

S-PBGA-B387

Not Qualified

e1

VRC4171A

Renesas Electronics

COMMERCIAL

GULL WING

208

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.465 V

26

3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP208,1.2SQ,20

3.135 V

70 Cel

0 Cel

QUAD

1.7 mm

256

28 mm

NO

16

80 MHz

28 mm

CMOS

3.3 V

Bus Controllers

VR4100

.5 mm

S-PQFP-G208

Not Qualified

79RC32V134DSGI

Renesas Electronics

INDUSTRIAL

GULL WING

208

FQFP

SQUARE

PLASTIC/EPOXY

YES

3.465 V

32

FLATPACK, FINE PITCH

3.135 V

85 Cel

-40 Cel

MATTE TIN

QUAD

4.1 mm

28 mm

YES

32

75 MHz

28 mm

CMOS

3.3 V

PCI; RC32364; RC32134

.5 mm

S-PQFP-G208

Not Qualified

e3

12

HD64465BQ

Renesas Electronics

BALL

387

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

TIN SILVER COPPER

BOTTOM

2.48 mm

27 mm

27 mm

CMOS

1.27 mm

S-PBGA-B387

Not Qualified

e1

IDT79RC32V134DSG

Renesas Electronics

COMMERCIAL

GULL WING

208

FQFP

SQUARE

PLASTIC/EPOXY

YES

3.465 V

32

FLATPACK, FINE PITCH

3.135 V

70 Cel

0 Cel

MATTE TIN

QUAD

4.1 mm

28 mm

YES

32

75 MHz

28 mm

CMOS

3.3 V

PCI; RC32364; RC32134

.5 mm

S-PQFP-G208

Not Qualified

e3

12

HD64463

Renesas Electronics

BALL

387

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

TIN SILVER COPPER

BOTTOM

2.48 mm

35 mm

35 mm

CMOS

1.27 mm

S-PBGA-B387

Not Qualified

e1

IDT79RC32V134DSGI

Renesas Electronics

INDUSTRIAL

GULL WING

208

FQFP

SQUARE

PLASTIC/EPOXY

YES

3.465 V

32

FLATPACK, FINE PITCH

3.135 V

85 Cel

-40 Cel

MATTE TIN

QUAD

4.1 mm

28 mm

YES

32

75 MHz

28 mm

CMOS

3.3 V

PCI; RC32364; RC32134

.5 mm

S-PQFP-G208

Not Qualified

e3

12

L64550AGM

Broadcom

MULTIFUNCTION PERIPHERAL

MILITARY

PIN/PEG

144

PGA

SQUARE

CERAMIC

NO

5

GRID ARRAY

PGA144,15X15

125 Cel

-55 Cel

Tin/Lead (Sn/Pb)

PERPENDICULAR

CMOS

200 mA

5 V

Multifunction Peripherals

2.54 mm

S-XPGA-P144

Not Qualified

e0

L64550BGM

Broadcom

MULTIFUNCTION PERIPHERAL

MILITARY

PIN/PEG

144

PGA

SQUARE

CERAMIC

NO

5

GRID ARRAY

PGA144,15X15

125 Cel

-55 Cel

Tin/Lead (Sn/Pb)

PERPENDICULAR

CMOS

200 mA

5 V

Multifunction Peripherals

2.54 mm

S-XPGA-P144

Not Qualified

e0

L64551GS-25

Broadcom

MULTIFUNCTION PERIPHERAL

MILITARY

PIN/PEG

144

PGA

SQUARE

CERAMIC

NO

38535V;38534K;883S

5

GRID ARRAY

PGA144,15X15

125 Cel

-55 Cel

Tin/Lead (Sn/Pb)

PERPENDICULAR

CMOS

5 V

Multifunction Peripherals

2.54 mm

S-XPGA-P144

Not Qualified

e0

L64550GM

Broadcom

MULTIFUNCTION PERIPHERAL

MILITARY

PIN/PEG

144

PGA

SQUARE

CERAMIC

NO

5

GRID ARRAY

PGA144,15X15

125 Cel

-55 Cel

Tin/Lead (Sn/Pb)

PERPENDICULAR

CMOS

200 mA

5 V

Multifunction Peripherals

2.54 mm

S-XPGA-P144

Not Qualified

e0

L64551GM-25

Broadcom

MULTIFUNCTION PERIPHERAL

MILITARY

PIN/PEG

144

PGA

SQUARE

CERAMIC

NO

38535Q/M;38534H;883B

5

GRID ARRAY

PGA144,15X15

125 Cel

-55 Cel

Tin/Lead (Sn/Pb)

PERPENDICULAR

CMOS

5 V

Multifunction Peripherals

2.54 mm

S-XPGA-P144

Not Qualified

e0

L64550AGMB

Broadcom

MULTIFUNCTION PERIPHERAL

MILITARY

PIN/PEG

144

PGA

SQUARE

CERAMIC

NO

38535Q/M;38534H;883B

5

GRID ARRAY

PGA144,15X15

125 Cel

-55 Cel

Tin/Lead (Sn/Pb)

PERPENDICULAR

CMOS

200 mA

5 V

Multifunction Peripherals

2.54 mm

S-XPGA-P144

Not Qualified

e0

L64551LS-25

Broadcom

MULTIFUNCTION PERIPHERAL

MILITARY

FLAT

144

QFF

SQUARE

CERAMIC

YES

38535V;38534K;883S

5

FLATPACK

QFL144,1.1SQ,25

125 Cel

-55 Cel

Tin/Lead (Sn/Pb)

QUAD

CMOS

5 V

Multifunction Peripherals

.635 mm

S-XQFP-F144

Not Qualified

e0

L64551LM-25

Broadcom

MULTIFUNCTION PERIPHERAL

MILITARY

FLAT

144

QFF

SQUARE

CERAMIC

YES

38535Q/M;38534H;883B

5

FLATPACK

QFL144,1.1SQ,25

125 Cel

-55 Cel

Tin/Lead (Sn/Pb)

QUAD

CMOS

5 V

Multifunction Peripherals

.635 mm

S-XQFP-F144

Not Qualified

e0

Multi-functional Peripherals

Multi-functional peripherals (MFPs) are devices that combine several different functions, such as printing, scanning, copying, and faxing, into a single piece of equipment. These devices are often used in office settings to streamline workflows and reduce the need for multiple pieces of equipment.

MFPs typically come with a range of features and capabilities, including high-quality printing and scanning, fast copying and faxing, and the ability to handle large volumes of documents. They may also offer additional features, such as double-sided printing, wireless connectivity, and cloud-based printing and scanning.

One of the key benefits of MFPs is their ability to save space and reduce clutter in an office environment. By combining several different functions into a single device, MFPs eliminate the need for separate printers, scanners, copiers, and fax machines, freeing up valuable space and reducing costs.

In addition to their space-saving benefits, MFPs also offer enhanced efficiency and productivity. With the ability to print, scan, copy, and fax all from a single device, users can complete tasks quickly and easily, without the need to switch between different pieces of equipment.