MULTIFUNCTION PERIPHERAL Multi-functional Peripherals 669

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

CY8C4127AZI-S445

Infineon Technologies

MULTIFUNCTION PERIPHERAL

PURE TIN

3

CY8C4125AZA-M443T

Infineon Technologies

MULTIFUNCTION PERIPHERAL

PURE TIN

3

CY8C4147AZI-S465

Infineon Technologies

MULTIFUNCTION PERIPHERAL

PURE TIN

3

CY8C4247AZA-M475T

Infineon Technologies

MULTIFUNCTION PERIPHERAL

PURE TIN

3

CY8C4246AZA-M443T

Infineon Technologies

MULTIFUNCTION PERIPHERAL

PURE TIN

3

CY8C4147AZQ-S465

Infineon Technologies

MULTIFUNCTION PERIPHERAL

PURE TIN

3

CY8C20524-12PVXIT

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

0

8

2.7/5

SMALL OUTLINE, SHRINK PITCH

SSOP28,.3

4.75 V

85 Cel

M8C

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

2 mm

8192

512

5.3 mm

ALSO OPERATES AT 750 KHZ WITH 2.4 V

NO

0

12 MHz

20

260

10.2 mm

512

CMOS

2.5 mA

5 V

Microcontrollers

FLASH

I2C; USB

.65 mm

R-PDSO-G28

3

Not Qualified

12.6 rpm

e4

24

CY8C4125FNI-483

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

BALL

35

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA35,5X7,16

1.71 V

85 Cel

-40 Cel

BOTTOM

.55 mm

2048

2.1 mm

NO

0

24 MHz

3.23 mm

CMOS

7.2 mA

1.8 V

0

I2C, I2S, SPI, UART

.4 mm

R-PBGA-B35

31

CY8C4146AZI-S455

Infineon Technologies

MULTIFUNCTION PERIPHERAL

PURE TIN

3

CY8C4147AZI-S463

Infineon Technologies

MULTIFUNCTION PERIPHERAL

PURE TIN

3

CY8C4127AZQ-S455

Infineon Technologies

MULTIFUNCTION PERIPHERAL

PURE TIN

3

CY8C4125PVQ-482

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE, SHRINK PITCH

SSOP28,.3

1.71 V

105 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

2 mm

2048

5.3 mm

NO

0

24 MHz

10.2 mm

CMOS

7.2 mA

1.8 V

0

I2C, I2S, SPI, UART

.65 mm

R-PDSO-G28

3

e4

24

CY8C4126AZA-M445T

Infineon Technologies

MULTIFUNCTION PERIPHERAL

PURE TIN

3

CY8C4126AXI-S445

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

GULL WING

64

LQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

0

FLATPACK, LOW PROFILE

1.71 V

85 Cel

-40 Cel

PURE TIN

QUAD

1.6 mm

4096

14 mm

NO

0

48 MHz

14 mm

CMOS

3.3 V

I2C; SPI; UART

.8 mm

S-PQFP-G64

3

54

CY8C4125AXI-M445

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

GULL WING

64

LQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

FLATPACK, LOW PROFILE

QFP64,.63SQ,32

1.8 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1.6 mm

2048

14 mm

NO

48 MHz

14 mm

CMOS

7.2 mA

7

I2C; IRDA; LIN; SPI; UART

.8 mm

S-PQFP-G64

3

e4

51

CY8C4245AZS-M445T

Infineon Technologies

MULTIFUNCTION PERIPHERAL

PURE TIN

3

CY8C4014FNI-421A

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

BALL

16

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA16,4X4,14

1.8 V

85 Cel

-40 Cel

BOTTOM

.42 mm

1024

1.472 mm

NO

16 MHz

1.579 mm

CMOS

4.5 mA

3.3 V

I2C

.35 mm

R-PBGA-B16

12

CY8C4245AXQ-483

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

GULL WING

44

LQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

FLATPACK, LOW PROFILE

QFP44,.47SQ,32

1.71 V

105 Cel

-40 Cel

PURE TIN

QUAD

1.6 mm

2048

10 mm

NO

48 MHz

10 mm

CMOS

13.8 mA

3.3 V

3

I2C; IDE; IRDA; LIN; SPI; UART

.8 mm

S-PQFP-G44

3

36

CY8C4247LTQ-M475

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

NO LEAD

68

HQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

CHIP CARRIER, HEAT SINK/SLUG

LCC68,.32SQ,16

1.71 V

105 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1 mm

8192

8 mm

NO

48 MHz

8 mm

CMOS

13.8 mA

11

I2C; SPI; UART; IRDA; IDE; LIN

.4 mm

S-XQCC-N68

3

e4

55

CY8C4248BZI-L469

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

BALL

124

VFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA124,13X13,25

1.8 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1 mm

16384

9 mm

NO

48 MHz

9 mm

CMOS

14.5 mA

I2C; IRDA; LIN; SPI; UART; USB

.65 mm

S-PBGA-B124

3

e1

98

CY8C4247LWS-M484T

Infineon Technologies

MULTIFUNCTION PERIPHERAL

NICKEL PALLADIUM GOLD SILVER

30

260

3

e4

CY8C28643-24LTXIT

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

5.25 V

0

8

3.3/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

4.75 V

85 Cel

M8C

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1 mm

16384

1024

7 mm

ALSO OPERATES AT 3V MINIMUM SUPPLY

NO

0

24 MHz

20

260

7 mm

1024

CMOS

14 mA

5 V

Microcontrollers

FLASH

I2C, IRDA, SPI, UART, USB

.5 mm

S-XQCC-N48

3

Not Qualified

24 rpm

e4

44

CY8C20534-12PVXA

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

8

2.7/5

SMALL OUTLINE, SHRINK PITCH

SSOP28,.3

85 Cel

M8C

-40 Cel

DUAL

8192

512

CMOS

2.5 mA

Microcontrollers

FLASH

.635 mm

R-PDSO-G28

Not Qualified

12 rpm

CY8C4A45FNI-483

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

BALL

45

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

0

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA45,9X5,15

1.71 V

85 Cel

-40 Cel

BOTTOM

.482 mm

4096

1.986 mm

NO

0

48 MHz

3.691 mm

CMOS

25 mA

3.3 V

I2C; IDE; IRDA; LIN; SPI; UART

.38 mm

R-PBGA-B45

37

CY8C4A45LQI-483

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.24SQ,16

1.71 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

.6 mm

4096

6 mm

NO

0

48 MHz

6 mm

CMOS

25 mA

3.3 V

I2C; IDE; IRDA; LIN; SPI; UART

.4 mm

S-XQCC-N48

3

e4

38

CY8C4247LTI-L445

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC68,.32SQ,16

1.8 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1 mm

8192

8 mm

NO

48 MHz

8 mm

CMOS

14.5 mA

I2C; IRDA; LIN; SPI; UART; USB

.4 mm

S-XQCC-N68

3

e4

57

CY8C4247BZI-L489

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

BALL

124

VFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA124,13X13,25

1.8 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1 mm

8192

9 mm

NO

48 MHz

9 mm

CMOS

14.5 mA

I2C; IRDA; LIN; SPI; UART; USB

.65 mm

S-PBGA-B124

3

e1

98

CY8C22213A-24SXIT

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

8

2.5/5

SMALL OUTLINE

SOP20,.4

85 Cel

M8C

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

2048

20

260

256

CMOS

8 mA

Microcontrollers

FLASH

1.27 mm

R-PDSO-G20

3

Not Qualified

24 rpm

e4

CY8C27466-24SXI

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

8

3.3,5

SMALL OUTLINE

SOP28,.4

85 Cel

M8C

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

32768

20

260

1024

CMOS

14 mA

Microcontrollers

FLASH

1.27 mm

R-PDSO-G28

3

Not Qualified

24 rpm

e4

CY8C4145FNI-PS433

Infineon Technologies

MULTIFUNCTION PERIPHERAL

CY8C4145FNI-PS423

Infineon Technologies

MULTIFUNCTION PERIPHERAL

CY8C4244LQQ-443

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

NO LEAD

40

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.24SQ,20

1.71 V

105 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

.6 mm

2048

6 mm

NO

48 MHz

6 mm

CMOS

13.8 mA

3.3 V

3

I2C; IDE; IRDA; LIN; SPI; UART

.5 mm

S-XQCC-N40

3

e4

34

CY8C4244PVI-442

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE, SHRINK PITCH

SSOP28,.3

1.71 V

105 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

2 mm

2048

5.3 mm

NO

48 MHz

30

260

10.2 mm

CMOS

13.8 mA

3.3 V

2

I2C; IDE; IRDA; LIN; SPI; UART

.65 mm

R-PDSO-G28

3

Not Qualified

e4

24

CY8C4145AZI-PS423

Infineon Technologies

MULTIFUNCTION PERIPHERAL

PURE TIN

3

CY8C4126AXI-S455

Infineon Technologies

MULTIFUNCTION PERIPHERAL

PURE TIN

3

CY8C4125AZS-M443T

Infineon Technologies

MULTIFUNCTION PERIPHERAL

PURE TIN

3

CY8C4246AZA-M445T

Infineon Technologies

MULTIFUNCTION PERIPHERAL

PURE TIN

3

CY8C4124LQQ-443

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

NO LEAD

40

HQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

CHIP CARRIER, HEAT SINK/SLUG

LCC40,.24SQ,20

1.71 V

105 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

.6 mm

2048

6 mm

NO

0

24 MHz

30

260

6 mm

CMOS

7.2 mA

1.8 V

0

I2C, I2S, SPI, UART

.5 mm

S-XQCC-N40

3

e4

34

CY8C4146AZI-S443

Infineon Technologies

MULTIFUNCTION PERIPHERAL

PURE TIN

3

CY8C4013SXI-411

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

GULL WING

16

LSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE, LOW PROFILE

SOP16,.25

1.8 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD SILVER

DUAL

1.721 mm

1024

3.898 mm

NO

16 MHz

30

260

9.893 mm

CMOS

4.5 mA

3.3 V

I2C

1.27 mm

R-PDSO-G16

3

e4

13

CY8C4125AZI-PS423

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

GULL WING

48

LSSOP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

0

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

1.71 V

85 Cel

-40 Cel

PURE TIN

DUAL

1.6 mm

2048

7 mm

NO

0

16 MHz

7 mm

CMOS

2.7 V

I2C; SPI; UART

.5 mm

S-PDSO-G48

3

38

CY8C4147AZQ-S455

Infineon Technologies

MULTIFUNCTION PERIPHERAL

PURE TIN

3

CY8C4124FNI-443

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

BALL

35

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA35,5X7,16

1.71 V

85 Cel

-40 Cel

BOTTOM

.55 mm

2048

2.1 mm

NO

0

24 MHz

3.23 mm

CMOS

7.2 mA

1.8 V

0

I2C, I2S, SPI, UART

.4 mm

R-PBGA-B35

31

CY8C4146AZI-S445

Infineon Technologies

MULTIFUNCTION PERIPHERAL

PURE TIN

3

CY8C4147AXI-S453

Infineon Technologies

MULTIFUNCTION PERIPHERAL

PURE TIN

3

CY8C4245AZI-M433

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

1.71 V

85 Cel

-40 Cel

PURE TIN

QUAD

1.6 mm

2048

7 mm

NO

48 MHz

7 mm

CMOS

13.8 mA

11

I2C; SPI; UART; IRDA; IDE; LIN

.5 mm

S-PQFP-G48

3

38

CY8C4247LTQ-L485

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1 mm

8192

8 mm

NO

0

48 MHz

8 mm

CMOS

1.8 V

I2C; SPI; UART; USB

.4 mm

S-XQCC-N68

3

e4

57

CY8C4245AZA-M445T

Infineon Technologies

MULTIFUNCTION PERIPHERAL

PURE TIN

3

Multi-functional Peripherals

Multi-functional peripherals (MFPs) are devices that combine several different functions, such as printing, scanning, copying, and faxing, into a single piece of equipment. These devices are often used in office settings to streamline workflows and reduce the need for multiple pieces of equipment.

MFPs typically come with a range of features and capabilities, including high-quality printing and scanning, fast copying and faxing, and the ability to handle large volumes of documents. They may also offer additional features, such as double-sided printing, wireless connectivity, and cloud-based printing and scanning.

One of the key benefits of MFPs is their ability to save space and reduce clutter in an office environment. By combining several different functions into a single device, MFPs eliminate the need for separate printers, scanners, copiers, and fax machines, freeing up valuable space and reducing costs.

In addition to their space-saving benefits, MFPs also offer enhanced efficiency and productivity. With the ability to print, scan, copy, and fax all from a single device, users can complete tasks quickly and easily, without the need to switch between different pieces of equipment.