MULTIFUNCTION PERIPHERAL Multi-functional Peripherals 669

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of Serial I/Os	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code	No. of I/O Lines
STA1295EUA	STMicroelectronics	MULTIFUNCTION PERIPHERAL
STPCC5HEBC	STMicroelectronics	MULTIFUNCTION PERIPHERAL	OTHER	BALL	388	BGA	SQUARE	PLASTIC/EPOXY		YES	2.7 V	32		3.3	GRID ARRAY	BGA388,26X26,40	2.45 V	85 Cel	0 Cel	TIN LEAD	BOTTOM	2.38 mm		35 mm		YES	32	14.318 MHz			35 mm	CMOS		2.5 V		Multifunction Peripherals	PCI; ISA	1.27 mm		S-PBGA-B388		Not Qualified			e0
ST2100TR	STMicroelectronics	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	373	TFBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V	15			GRID ARRAY, THIN PROFILE, FINE PITCH	BGA373,23X23,20	1.08 V	85 Cel	-40 Cel		BOTTOM	1.2 mm	8192	12 mm		YES	16		NOT SPECIFIED	NOT SPECIFIED	12 mm	CMOS		1.2 V	4		CAN; ETHERNET; I2C; I2S; IRDA; PCI; SPI; UART; USB	.5 mm		S-PBGA-B373						40
STPCC0180BTI3	STMicroelectronics	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V	32	32	3.3	GRID ARRAY	BGA388,26X26,50	3 V	85 Cel	-40 Cel	TIN LEAD	BOTTOM	2.38 mm		35 mm		NO	32	14.318 MHz			35 mm	CMOS		3.3 V		Microprocessors	PCI; ISA	1.27 mm		S-PBGA-B388		Not Qualified	80 rpm		e0
STA2065P	STMicroelectronics	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	372	TFBGA	SQUARE	PLASTIC/EPOXY		YES	1.3 V				GRID ARRAY, THIN PROFILE, FINE PITCH	BGA372,24X24,25	1.2 V	85 Cel	-40 Cel		BOTTOM	1.2 mm	32K	16 mm		YES					16 mm	CMOS		1.25 V			CAN, I2C, I2S, SPI, SSP, UART USB	.65 mm		S-PBGA-B372
STPCC0375BTC3	STMicroelectronics	MULTIFUNCTION PERIPHERAL	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY		YES	3.75 V	32	32	3.3	GRID ARRAY	BGA388,26X26,50	3.15 V	70 Cel	0 Cel	TIN LEAD	BOTTOM	2.38 mm		35 mm	0 TO 100 OPERATING CASE TEMPERATURE	NO	32	14.318 MHz			35 mm	CMOS		3.45 V		Microprocessors	PCI; ISA	1.27 mm		S-PBGA-B388		Not Qualified	75 rpm		e0	0
STA1275ELA	STMicroelectronics	MULTIFUNCTION PERIPHERAL
STA2064N2	STMicroelectronics	MULTIFUNCTION PERIPHERAL
STPCC0166BTC3	STMicroelectronics	MULTIFUNCTION PERIPHERAL	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V	32	32	3.3	GRID ARRAY	BGA388,26X26,50	3 V	70 Cel	0 Cel	TIN LEAD	BOTTOM	2.38 mm		35 mm		NO	32	14.318 MHz			35 mm	CMOS		3.3 V		Microprocessors	PCI; ISA	1.27 mm		S-PBGA-B388		Not Qualified	66 rpm		e0
STPCE1HDBC	STMicroelectronics	MULTIFUNCTION PERIPHERAL	COMMERCIAL EXTENDED	BALL	388	BGA	SQUARE	PLASTIC/EPOXY		YES	2.7 V	32	32	2.5,3.3	GRID ARRAY	BGA388,26X26,50	2.45 V	85 Cel	0 Cel	TIN LEAD	BOTTOM	2.38 mm		35 mm		YES	32	14.318 MHz			35 mm	CMOS		2.5 V		Microprocessors	PCI; ISA	1.27 mm		S-PBGA-B388		Not Qualified	133 rpm		e0	16
STA1295ELA	STMicroelectronics	MULTIFUNCTION PERIPHERAL
STPCI0180BTC3	STMicroelectronics	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V	32	32	3.3	GRID ARRAY	BGA388,26X26,50	3 V	115 Cel	-40 Cel	TIN LEAD	BOTTOM	2.38 mm		35 mm	0 TO 100 OPERATING CASE TEMPERATURE	NO	32	14.318 MHz			35 mm	CMOS		3.3 V		Microprocessors	PCI; ISA; CARDBUS; PCMCIA; PC-AT; PS/2	1.27 mm		S-PBGA-B388		Not Qualified	80 rpm		e0	8
STA1275EUA	STMicroelectronics	MULTIFUNCTION PERIPHERAL
STPCE1EEBC	STMicroelectronics	MULTIFUNCTION PERIPHERAL	COMMERCIAL EXTENDED	BALL	388	BGA	SQUARE	PLASTIC/EPOXY		YES	2.7 V	32	32	2.5,3.3	GRID ARRAY	BGA388,26X26,50	2.45 V	85 Cel	0 Cel	TIN LEAD	BOTTOM	2.38 mm		35 mm		YES	32	14.318 MHz			35 mm	CMOS		2.5 V		Microprocessors	PCI; ISA	1.27 mm		S-PBGA-B388		Not Qualified	100 rpm		e0	16
STA1295ELATR	STMicroelectronics	MULTIFUNCTION PERIPHERAL
STA2065A	STMicroelectronics	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	372	TFBGA	SQUARE	PLASTIC/EPOXY		YES	1.3 V				GRID ARRAY, THIN PROFILE, FINE PITCH	BGA372,24X24,25	1.2 V	85 Cel	-40 Cel		BOTTOM	1.2 mm	32K	16 mm		YES					16 mm	CMOS		1.25 V			CAN, I2C, I2S, SPI, SSP, UART USB	.65 mm		S-PBGA-B372
STPCI0166BTI3	STMicroelectronics	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V	32	32	3.3	GRID ARRAY	BGA388,26X26,50	3 V	115 Cel	-40 Cel	TIN LEAD	BOTTOM	2.38 mm		35 mm	-40 TO 100 OPERATING CASE TEMPERATURE	NO	32	14.318 MHz			35 mm	CMOS		3.3 V		Microprocessors	PCI; ISA; CARDBUS; PCMCIA; PC-AT; PS/2	1.27 mm		S-PBGA-B388		Not Qualified	66 rpm		e0	8
STPCI0180BTI3	STMicroelectronics	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V	32	32	3.3	GRID ARRAY	BGA388,26X26,50	3 V	115 Cel	-40 Cel	TIN LEAD	BOTTOM	2.38 mm		35 mm	-40 TO 100 OPERATING CASE TEMPERATURE	NO	32	14.318 MHz			35 mm	CMOS		3.3 V		Microprocessors	PCI; ISA; CARDBUS; PCMCIA; PC-AT; PS/2	1.27 mm		S-PBGA-B388		Not Qualified	80 rpm		e0	8
STA2064Y2	STMicroelectronics	MULTIFUNCTION PERIPHERAL
STPCE1HDBI	STMicroelectronics	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY		YES	2.7 V	32	32	2.5,3.3	GRID ARRAY	BGA388,26X26,50	2.45 V	85 Cel	-40 Cel	TIN LEAD	BOTTOM	2.38 mm		35 mm	-40 TO 115 C OPERATING CASE TEMPERATURE	YES	32	14.318 MHz			35 mm	CMOS		2.5 V		Microprocessors	PCI; ISA	1.27 mm		S-PBGA-B388		Not Qualified	133 rpm		e0	16
STPCC0390BTC3	STMicroelectronics	MULTIFUNCTION PERIPHERAL	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY		YES	3.75 V	32	32	3.3	GRID ARRAY	BGA388,26X26,50	3.15 V	70 Cel	0 Cel	TIN LEAD	BOTTOM	2.38 mm		35 mm	0 TO 100 OPERATING CASE TEMPERATURE	NO	32	14.318 MHz			35 mm	CMOS		3.45 V		Microprocessors	PCI; ISA	1.27 mm		S-PBGA-B388		Not Qualified	90 rpm		e0	0
STA1275EOA	STMicroelectronics	MULTIFUNCTION PERIPHERAL
STA1295EOATR	STMicroelectronics	MULTIFUNCTION PERIPHERAL
STPCC0310BTC3	STMicroelectronics	MULTIFUNCTION PERIPHERAL	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V	32	32	3.3	GRID ARRAY	BGA388,26X26,50	3 V	70 Cel	0 Cel	TIN LEAD	BOTTOM	2.38 mm		35 mm	0 TO 100 OPERATING CASE TEMPERATURE	NO	32	100 MHz			35 mm	CMOS		3.3 V		Microprocessors	PCI; ISA	1.27 mm		S-PBGA-B388		Not Qualified	100 rpm		e0
STPCI0166BTC3	STMicroelectronics	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V	32	32	3.3	GRID ARRAY	BGA388,26X26,50	3 V	115 Cel	-40 Cel	TIN LEAD	BOTTOM	2.38 mm		35 mm	0 TO 100 OPERATING CASE TEMPERATURE	NO	32	14.318 MHz			35 mm	CMOS		3.3 V		Microprocessors	PCI; ISA; CARDBUS; PCMCIA; PC-AT; PS/2	1.27 mm		S-PBGA-B388		Not Qualified	66 rpm		e0	8
STA2064Z2	STMicroelectronics	MULTIFUNCTION PERIPHERAL
STA2064X2	STMicroelectronics	MULTIFUNCTION PERIPHERAL
STA2064P2	STMicroelectronics	MULTIFUNCTION PERIPHERAL
STPCC0180BTC3	STMicroelectronics	MULTIFUNCTION PERIPHERAL	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V	32	32	3.3	GRID ARRAY	BGA388,26X26,50	3 V	70 Cel	0 Cel	TIN LEAD	BOTTOM	2.38 mm		35 mm		NO	32	14.318 MHz			35 mm	CMOS		3.3 V		Microprocessors	PCI; ISA	1.27 mm		S-PBGA-B388		Not Qualified	80 rpm		e0
STPCC5HEBI	STMicroelectronics	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY		YES	2.7 V	32		3.3	GRID ARRAY	BGA388,26X26,40	2.45 V	85 Cel	-40 Cel	TIN LEAD	BOTTOM	2.38 mm		35 mm		YES	32	14.318 MHz			35 mm	CMOS		2.5 V		Multifunction Peripherals	PCI; ISA	1.27 mm		S-PBGA-B388		Not Qualified			e0
STA1275EOATR	STMicroelectronics	MULTIFUNCTION PERIPHERAL
STA2064A2	STMicroelectronics	MULTIFUNCTION PERIPHERAL
STA1295EUATR	STMicroelectronics	MULTIFUNCTION PERIPHERAL
SCIMX6S5DVM10CC	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	26			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel	0 Cel		BOTTOM	1.6 mm	147456	21 mm		YES	32	24 MHz			21 mm	CMOS	1320 mA		4		CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B624			1000 rpm	YES		14
SCIMX6U5DVM10CB	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	26			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel	0 Cel		BOTTOM	1.6 mm	147456	21 mm		YES	64	24 MHz			21 mm	CMOS	2200 mA		4		CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B624			1000 rpm	YES		14
SCIMX6S5DVM10CD	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V	26			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel	0 Cel		BOTTOM	1.6 mm	147456	21 mm		YES	32	24 MHz			21 mm	CMOS	1320 mA		4		CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB	.8 mm		S-PBGA-B624						14
SCIMX6U5DVM10CD	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V	26			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel	0 Cel		BOTTOM	1.6 mm	147456	21 mm		YES	64	24 MHz			21 mm	CMOS	2200 mA		4		CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB	.8 mm		S-PBGA-B624						14
SCIMX6U5DVM10CC	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	26			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel	0 Cel		BOTTOM	1.6 mm	147456	21 mm		YES	64	24 MHz			21 mm	CMOS	2200 mA		4		CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B624			1000 rpm	YES		14
SCIMX6S5DVM10CB	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	26			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel	0 Cel		BOTTOM	1.6 mm	147456	21 mm		YES	32	24 MHz			21 mm	CMOS	1320 mA		4		CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B624			1000 rpm	YES		14
LH75411	NXP Semiconductors	MULTIFUNCTION PERIPHERAL		GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.98 V	24		1.8,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	1.7 V	85 Cel	-40 Cel		QUAD	1.4 mm	32768	20 mm	ALSO REQUIRES 3.3 V SUPPLY	YES	16	20 MHz			20 mm	CMOS		1.8 V	5	Microprocessors	CAN, SSP, UART(3)	.5 mm		S-PQFP-G144		Not Qualified				76
LH75401N0M100	NXP Semiconductors	MULTIFUNCTION PERIPHERAL		GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY		YES		24		1.8,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20		85 Cel	-40 Cel		QUAD	1.6 mm	32768	20 mm	ALSO REQUIRES 3.3 V SUPPLY	YES	16	20 MHz			20 mm	CMOS		1.8 V	5	Microprocessors	CAN, SSP, UART(3)	.5 mm		S-PQFP-G144		Not Qualified				76
LH75401N0Q100C0	NXP Semiconductors	MULTIFUNCTION PERIPHERAL		GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.98 V	24			FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	1.7 V	85 Cel	-40 Cel	TIN	QUAD	1.6 mm	32768	20 mm	ALSO REQUIRES 3.3 V SUPPLY	YES	16	20 MHz			20 mm	CMOS	70 mA	1.8 V	5		CAN, SSP, UART(3)	.5 mm		S-PQFP-G144	3	Not Qualified			e3	76
LH75400NOM100	NXP Semiconductors	MULTIFUNCTION PERIPHERAL		GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY		YES		24		1.8,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20		85 Cel	-40 Cel		QUAD	1.6 mm	32768	20 mm	ALSO REQUIRES 3.3 V SUPPLY	YES	16	20 MHz			20 mm	CMOS		1.8 V	5	Microprocessors	CAN, SSP, UART(3)	.5 mm		S-PQFP-G144		Not Qualified				76
LH75401	NXP Semiconductors	MULTIFUNCTION PERIPHERAL		GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.98 V	24		1.8,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	1.7 V	85 Cel	-40 Cel		QUAD	1.4 mm	32768	20 mm	ALSO REQUIRES 3.3 V SUPPLY	YES	16	20 MHz			20 mm	CMOS		1.8 V	5	Microprocessors	CAN, SSP, UART(3)	.5 mm		S-PQFP-G144		Not Qualified				76
LH75400NOQ100	NXP Semiconductors	MULTIFUNCTION PERIPHERAL		GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY		YES		24		1.8,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20		85 Cel	-40 Cel		QUAD	1.6 mm	32768	20 mm	ALSO REQUIRES 3.3 V SUPPLY	YES	16	20 MHz			20 mm	CMOS		1.8 V	5	Microprocessors	CAN, SSP, UART(3)	.5 mm		S-PQFP-G144		Not Qualified				76
LH75411N0M100	NXP Semiconductors	MULTIFUNCTION PERIPHERAL		GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY		YES		24		1.8,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20		85 Cel	-40 Cel		QUAD	1.6 mm	32768	20 mm	ALSO REQUIRES 3.3 V SUPPLY	YES	16	20 MHz			20 mm	CMOS		1.8 V	5	Microprocessors	CAN, SSP, UART(3)	.5 mm		S-PQFP-G144		Not Qualified				76
LH75400	NXP Semiconductors	MULTIFUNCTION PERIPHERAL		GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.98 V	24		1.8,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	1.7 V	85 Cel	-40 Cel		QUAD	1.4 mm	32768	20 mm	ALSO REQUIRES 3.3 V SUPPLY	YES	16	20 MHz			20 mm	CMOS		1.8 V	5	Microprocessors	CAN, SSP, UART(3)	.5 mm		S-PQFP-G144		Not Qualified				76
LH75410N0M100	NXP Semiconductors	MULTIFUNCTION PERIPHERAL		GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY		YES		24		1.8,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20		85 Cel	-40 Cel		QUAD	1.6 mm	32768	20 mm	ALSO REQUIRES 3.3 V SUPPLY	YES	16	20 MHz			20 mm	CMOS		1.8 V	5	Microprocessors	CAN, SSP, UART(3)	.5 mm		S-PQFP-G144		Not Qualified				76

Multi-functional Peripherals

Multi-functional peripherals (MFPs) are devices that combine several different functions, such as printing, scanning, copying, and faxing, into a single piece of equipment. These devices are often used in office settings to streamline workflows and reduce the need for multiple pieces of equipment.

MFPs typically come with a range of features and capabilities, including high-quality printing and scanning, fast copying and faxing, and the ability to handle large volumes of documents. They may also offer additional features, such as double-sided printing, wireless connectivity, and cloud-based printing and scanning.

One of the key benefits of MFPs is their ability to save space and reduce clutter in an office environment. By combining several different functions into a single device, MFPs eliminate the need for separate printers, scanners, copiers, and fax machines, freeing up valuable space and reducing costs.

In addition to their space-saving benefits, MFPs also offer enhanced efficiency and productivity. With the ability to print, scan, copy, and fax all from a single device, users can complete tasks quickly and easily, without the need to switch between different pieces of equipment.