COMMERCIAL Multi-functional Peripherals 137

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Manufacturers
    • Analog Devices
    • Broadcom
    • Cypress Semiconductor
    • Digi International
    • Freescale Semiconductor
    • IXYS Corporation
    • Infineon Technologies
    • Intel
    • M/a-com Technology Solutions
    • Maxim Integrated
    • Microchip Technology
    • Motorola
    • NXP Semiconductors
    • National Semiconductor
    • Nuvoton Technology
    • Onsemi
    • Renesas Electronics
    • Rochester Electronics
    • STMicroelectronics
    • Silicon Labs
    • Teledyne E2v (Uk)
    • Texas Instruments
    • Toshiba
    • Xilinx
    • Xmos
Peripheral IC Type
    • MICROPROCESSOR, RISC
    • MULTIFUNCTION PERIPHERAL
    • SYSTEM ON CHIP
    • SoC
Temperature Grade (1)
    • COMMERCIAL
    • AUTOMOTIVE
    • COMMERCIAL EXTENDED
    • INDUSTRIAL
    • MILITARY
    • OTHER
Terminal Form
    • BALL
    • FLAT
    • GULL WING
    • J BEND
    • NO LEAD
    • PIN/PEG
    • THROUGH-HOLE
    • UNSPECIFIED
No. of Terminals
    • 100
    • 1020
    • 1071
    • 124
    • 128
    • 1284
    • 1313
    • 132
    • 144
    • 1517
    • 16
    • 20
    • 208
    • 21
    • 24
    • 256
    • 272
    • 28
    • 286
    • 289
    • 30
    • 316
    • 32
    • 338
    • 35
    • 36
    • 367
    • 372
    • 373
    • 387
    • 388
    • 40
    • 400
    • 404
    • 416
    • 417
    • 42
    • 421
    • 423
    • 44
    • 448
    • 45
    • 473
    • 48
    • 486
    • 503
    • 515
    • 516
    • 52
    • 529
    • 538
    • 541
    • 548
    • 552
    • 56
    • 569
    • 609
    • 621
    • 624
    • 625
    • 64
    • 652
    • 676
    • 68
    • 689
    • 72
    • 76
    • 760
    • 780
    • 784
    • 8
    • 80
    • 84
    • 989
    • 99
Package Code
    • BGA
    • DIP
    • FBGA
    • FQFP
    • HBGA
    • HQCCN
    • HTFQFP
    • HVQCCN
    • LBGA
    • LFBGA
    • LFQFP
    • LQFP
    • LSOP
    • LSSOP
    • PGA
    • QCCJ
    • QCCN
    • QFF
    • QFP
    • SOP
    • SSOP
    • TFBGA
    • TFQFP
    • TQFP
    • VFBGA
    • VQCCN
    • WQCCJ
Package Shape
    • RECTANGULAR
    • SQUARE
    • UNSPECIFIED
Package Body Material
    • CERAMIC
    • CERAMIC, METAL-SEALED COFIRED
    • PLASTIC/EPOXY
    • UNSPECIFIED
Integrated Cache
    • NO
    • YES
Surface Mount
    • NO
    • YES
Maximum Supply Voltage
    • .9 V
    • .93 V
    • .945 V
    • 1 V
    • 1.03 V
    • 1.05 V
    • 1.08 V
    • 1.1 V
    • 1.11 V
    • 1.15 V
    • 1.155 V
    • 1.164 V
    • 1.2 V
    • 1.26 V
    • 1.3 V
    • 1.32 V
    • 1.365 V
    • 1.4 V
    • 1.4175 V
    • 1.5 V
    • 1.52 V
    • 1.55 V
    • 1.575 V
    • 1.89 V
    • 1.98 V
    • 2.625 V
    • 2.7 V
    • 2.75 V
    • 3.465 V
    • 3.6 V
    • 3.63 V
    • 3.75 V
    • 3.8 V
    • 5.25 V
    • 5.5 V
On Chip Data RAM Width
    • 32
    • 8
Screening Level
    • 38535Q/M;38534H;883B
    • 38535V;38534K;883S
    • AEC-Q100
    • TS 16949
Address Bus Width
    • 0
    • 13
    • 14
    • 15
    • 16
    • 24
    • 26
    • 27
    • 32
    • 36
    • 4
    • 5
    • 64
DAC Channels
    • NO
    • YES
Bit Size
    • 16
    • 32
    • 64
    • 8
Power Supplies (V)
    • 1.05,1.5,1.8,3.3,5
    • 1.05,1.5,3.3,5
    • 1.3,1.8/3.3
    • 1.8,3.3
    • 1.8/3.3
    • 1.8/5
    • 1.8/5.5
    • 2.4/3.6
    • 2.5,3.3
    • 2.5/5
    • 2.7/5
    • 2/5
    • 3.3
    • 3.3,3.3/5,5
    • 3.3,5
    • 3.3/5
    • 3/3.3,5
    • 3/5
    • 3/5,5
    • 5
Package Style (Meter)
    • CHIP CARRIER
    • CHIP CARRIER, HEAT SINK/SLUG
    • CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
    • CHIP CARRIER, VERY THIN PROFILE
    • CHIP CARRIER, WINDOW
    • FLATPACK
    • FLATPACK, FINE PITCH
    • FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
    • FLATPACK, LOW PROFILE
    • FLATPACK, LOW PROFILE, FINE PITCH
    • FLATPACK, THIN PROFILE
    • FLATPACK, THIN PROFILE, FINE PITCH
    • GRID ARRAY
    • GRID ARRAY, FINE PITCH
    • GRID ARRAY, HEAT SINK/SLUG
    • GRID ARRAY, LOW PROFILE
    • GRID ARRAY, LOW PROFILE, FINE PITCH
    • GRID ARRAY, THIN PROFILE, FINE PITCH
    • GRID ARRAY, VERY THIN PROFILE, FINE PITCH
    • IN-LINE
    • MICROELECTRONIC ASSEMBLY
    • SMALL OUTLINE
    • SMALL OUTLINE, LOW PROFILE
    • SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
    • SMALL OUTLINE, SHRINK PITCH
Package Equivalence Code
    • BGA(UNSPEC)
    • BGA124,13X13,25
    • BGA16,4X4,14
    • BGA16,4X4,16
    • BGA30,5X6,14
    • BGA35,5X7,16
    • BGA367,22X22,25
    • BGA372,24X24,25
    • BGA373,23X23,20
    • BGA388,26X26,40
    • BGA388,26X26,50
    • BGA417,29X29,32
    • BGA448,30X30,30
    • BGA45,9X5,15
    • BGA486,27X27,20
    • BGA516,26X26,50
    • BGA529,23X23,32
    • BGA548,29X29,20
    • BGA609,35X35,32
    • BGA624,25X25,32
    • BGA625,25X25,32
    • BGA652,28X28,40
    • BGA676,29X29,40
    • BGA68,8X9,16
    • BGA72,8X9,20
    • BGA989(UNSPEC)
    • BGA99,9X11,20
    • DIP20,.3
    • DIP28,.3
    • DIP48,.6
    • DIP8,.3
    • LCC16,.12SQ,20
    • LCC24,.16SQ,20
    • LCC32,.16SQ,16
    • LCC32,.2SQ,20
    • LCC40,.24SQ,20
    • LCC40,.2X.28,20
    • LCC44,.28SQ,20
    • LCC48,.24SQ,16
    • LCC48,.27SQ,20
    • LCC48,.28SQ,20
    • LCC56,.31SQ,20
    • LCC64,.35SQ,20
    • LCC68,.32SQ,16
    • LCC68,.3SQ,40
    • LDCC52,.8SQ
    • LDCC68,1.0SQ
    • PGA144,15X15
    • QFL144,1.1SQ,25
    • QFP100,.55X0.79
    • QFP100,.63SQ,20
    • QFP128,.67X.93,20
    • QFP144,.87SQ,20
    • QFP208,1.2SQ,20
    • QFP44,.47SQ,32
    • QFP48,.28SQ,20
    • QFP48,.35SQ,20
    • QFP64(UNSPEC)
    • QFP64,.47SQ,20
    • QFP64,.63SQ,32
    • QFP80,.64SQ
    • SOP16,.25
    • SOP20,.4
    • SOP28,.4
    • SOP8,.25
    • SSOP20,.3
    • SSOP28,.3
    • SSOP48,.4
    • SSOP56,.4
    • TQFP100,.63SQ
    • TQFP128,.63SQ,16
    • TQFP44,.47SQ,32
Minimum Supply Voltage
    • .805 V
    • .855 V
    • .87 V
    • .9 V
    • .95 V
    • .97 V
    • .998 V
    • 1 V
    • 1.02 V
    • 1.045 V
    • 1.05 V
    • 1.08 V
    • 1.096 V
    • 1.11 V
    • 1.14 V
    • 1.15 V
    • 1.2 V
    • 1.235 V
    • 1.25 V
    • 1.275 V
    • 1.2825 V
    • 1.3 V
    • 1.35 V
    • 1.38 V
    • 1.425 V
    • 1.7 V
    • 1.71 V
    • 1.8 V
    • 2.1 V
    • 2.25 V
    • 2.375 V
    • 2.4 V
    • 2.45 V
    • 2.7 V
    • 2.97 V
    • 3 V
    • 3.135 V
    • 3.15 V
    • 4.5 V
    • 4.75 V
Maximum Operating Temperature
    • 100 Cel
    • 105 Cel
    • 115 Cel
    • 125 Cel
    • 45 Cel
    • 70 Cel
    • 85 Cel
    • 90 Cel
    • 95 Cel
CPU Family
    • 8051
    • CORTEX-M0
    • M8C
No. of External Interrupts
    • 8
Minimum Operating Temperature
    • -10 Cel
    • -20 Cel
    • -30 Cel
    • -40 Cel
    • -55 Cel
    • 0 Cel
    • 5 Cel
Terminal Finish
    • MATTE TIN
    • Matte Tin (Sn)
    • NICKEL PALLADIUM GOLD
    • NICKEL PALLADIUM GOLD SILVER
    • Nickel/Palladium/Gold (Ni/Pd/Au)
    • PURE TIN
    • TIN
    • TIN LEAD
    • TIN LEAD SILVER
    • TIN SILVER
    • TIN SILVER BISMUTH
    • TIN SILVER COPPER
    • TIN SILVER COPPER NICKEL
    • Tin (Sn)
    • Tin/Bismuth (Sn/Bi)
    • Tin/Lead (Sn/Pb)
    • Tin/Silver (Sn/Ag)
    • Tin/Silver/Copper (Sn/Ag/Cu)
ADC Channels
    • NO
    • YES
Ultraviolet Erasable
    • N
    • Y
Terminal Position
    • BOTTOM
    • DUAL
    • PERPENDICULAR
    • QUAD
    • UNSPECIFIED
DMA Channels
    • NO
Maximum Seated Height
    • .33 mm
    • .4 mm
    • .41 mm
    • .42 mm
    • .482 mm
    • .55 mm
    • .6 mm
    • .8 mm
    • .9 mm
    • 1 mm
    • 1.2 mm
    • 1.23 mm
    • 1.25 mm
    • 1.298 mm
    • 1.32 mm
    • 1.4 mm
    • 1.45 mm
    • 1.481 mm
    • 1.52 mm
    • 1.54 mm
    • 1.56 mm
    • 1.6 mm
    • 1.63 mm
    • 1.7 mm
    • 1.72 mm
    • 1.721 mm
    • 1.727 mm
    • 1.85 mm
    • 2 mm
    • 2.16 mm
    • 2.18 mm
    • 2.205 mm
    • 2.358 mm
    • 2.38 mm
    • 2.46 mm
    • 2.48 mm
    • 2.49 mm
    • 2.52 mm
    • 2.59 mm
    • 2.61 mm
    • 2.65 mm
    • 2.667 mm
    • 2.67 mm
    • 2.73 mm
    • 2.75 mm
    • 2.794 mm
    • 2.82 mm
    • 2.93 mm
    • 2.96 mm
    • 3.15 mm
    • 3.21 mm
    • 3.3 mm
    • 3.4 mm
    • 3.62 mm
    • 4.064 mm
    • 4.1 mm
    • 4.45 mm
    • 4.57 mm
    • 4.572 mm
    • 4.8 mm
    • 4.82 mm
    • 4.826 mm
    • 5.08 mm
    • 5.588 mm
ROM Words
    • 16384
    • 2048
    • 32768
    • 4096
    • 65536
    • 8192
    • 81920
RAM Words
    • 1024
    • 128
    • 128M
    • 139264
    • 147456
    • 16384
    • 16K
    • 1K
    • 1M
    • 2.5M
    • 2048
    • 229376
    • 256
    • 256K
    • 262144
    • 288K
    • 2K
    • 32768
    • 32K
    • 4096
    • 4K
    • 512
    • 512K
    • 524288
    • 64K
    • 65536
    • 6M
    • 73728
    • 8192
    • 81920
    • 888832
    • 8K
    • 98304
Width
    • 1.452 mm
    • 1.472 mm
    • 1.849 mm
    • 1.975 mm
    • 1.986 mm
    • 10 mm
    • 12 mm
    • 13 mm
    • 14 mm
    • 15 mm
    • 15.24 mm
    • 16 mm
    • 17 mm
    • 19 mm
    • 19.1262 mm
    • 2.097 mm
    • 2.1 mm
    • 2.2 mm
    • 20 mm
    • 21 mm
    • 23 mm
    • 24.105 mm
    • 24.18 mm
    • 24.1808 mm
    • 25 mm
    • 27 mm
    • 28 mm
    • 29 mm
    • 29.3116 mm
    • 3 mm
    • 3.52 mm
    • 3.87 mm
    • 3.89 mm
    • 3.898 mm
    • 3.8985 mm
    • 31 mm
    • 33 mm
    • 35 mm
    • 36 mm
    • 36.802 mm
    • 4 mm
    • 4.25 mm
    • 4.87 mm
    • 4.907 mm
    • 40 mm
    • 5 mm
    • 5.192 mm
    • 5.3 mm
    • 6 mm
    • 7 mm
    • 7.5 mm
    • 7.505 mm
    • 7.5057 mm
    • 7.6 mm
    • 7.62 mm
    • 7.8 mm
    • 8 mm
    • 8.3 mm
    • 9 mm
Data EEPROM Size
    • 0
Additional Features
    • -40 TO 100 OPERATING CASE TEMPERATURE
    • -40 TO 115 C OPERATING CASE TEMPERATURE
    • -40 TO 115 OPERATING CASE TEMPERATURE
    • 0 TO 100 OPERATING CASE TEMPERATURE
    • 0.9 V NOMINAL ALSO AVAILABLE @800MHZ
    • 0.9 V NOMINAL ALSO AVAILABLE @800MHZ,DRAM_AC (39) AND DRAM_DQ(32) NVCC_DRAM AVAILABLE
    • 128K X 8 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD
    • 16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD
    • 24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE
    • 24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE;EACH GPIO MODULE SUPPORTS 32 BITS OF I/O
    • 24MHZ NOM CRYSTAL FREQ AVAILABLE
    • 24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE
    • 32K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD
    • 32K X 8 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD
    • 37.4 MHZ CRYSTAL FREQUENCY AVAILABLE
    • 64K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD
    • 64K X 8 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD
    • ALSO OPERATES 1.3V AT 266MHZ
    • ALSO OPERATES 1.3V AT 266MHZ; UNAVAILABLE FOR IMPORT OR SALE IN US
    • ALSO OPERATES @ 0.9-1V SUPPLY IN OVERDRIVE MODE
    • ALSO OPERATES AT 2.7V AND 3.3V SUPPLY
    • ALSO OPERATES AT 2.7V AND 3V SUPPLY
    • ALSO OPERATES AT 3V MINIMUM SUPPLY
    • ALSO OPERATES AT 3V SUPPLY
    • ALSO OPERATES AT 3V WITH 93KHZ
    • ALSO OPERATES AT 750 KHZ WITH 2.4 V
    • ALSO REQUIRES 3.3 V I/O SUPPLY
    • ALSO REQUIRES 3.3 V SUPPLY
    • ALSO REQUIRES 3.3V SUPPLY
    • IT ALSO OPERATES 93KHZ AT 3 V
    • IT ALSO OPERATES AT 2.4V AT 93KHZ
    • IT ALSO OPERATES AT 3 V MINIMUM SUPPLY
    • IT ALSO OPERATES AT 3V AT 93KHZ
    • IT ALSO OPERATES MINIMUM SUPPLY 2.4 V AT 750 KHZ
    • IT ALSO REQUIRES 1.62V-2.1V ANALOG SUPPLY
    • ITS ALSO HAVING 576KB SRAM FOR THE WIRELESS LAN SUBSYSTEM
    • MULTIPROTOCOL PARALLEL PORT TYPE
    • OPERATES BETWEEN 3 TO 3.6 V WHEN USB IS USED
    • PITCH_MINI
    • SEATED HGT-CALCULATED
    • SEATED HGT-NOM
    • SEATED HT-CALCULATED
    • lsio contains 8 GPIO lines
Boundary Scan
    • NO
    • YES
Peripherals
    • BROWN-OUT DETECT, COMPARATOR(2), POR, TIMER(5), WDT
    • TIMER, WDT
External Data Bus Width
    • 0
    • 128
    • 16
    • 32
    • 4
    • 64
    • 8
Maximum Clock Frequency
    • .032768 MHz
    • 10 MHz
    • 100 MHz
    • 12 MHz
    • 12.06 MHz
    • 12.6 MHz
    • 1200 MHz
    • 133.333 MHz
    • 14.318 MHz
    • 14.31818 MHz
    • 1400 MHz
    • 16 MHz
    • 20 MHz
    • 22 MHz
    • 24 MHz
    • 24.24 MHz
    • 24.6 MHz
    • 25 MHz
    • 25.2 MHz
    • 26 MHz
    • 27 MHz
    • 30 MHz
    • 32 MHz
    • 33 MHz
    • 33.33 MHz
    • 34.48 MHz
    • 35 MHz
    • 36 MHz
    • 38.4 MHz
    • 4 MHz
    • 40 MHz
    • 48 MHz
    • 5 MHz
    • 50 MHz
    • 52 MHz
    • 650 MHz
    • 66 MHz
    • 67 MHz
    • 75 MHz
    • 8 MHz
    • 80 MHz
    • 83.33 MHz
    • 900 MHz
Maximum Time At Peak Reflow Temperature (s)
    • 20
    • 30
    • 40
    • NOT SPECIFIED
Peak Reflow Temperature (C)
    • 220
    • 245
    • 250
    • 260
    • NOT SPECIFIED
Length
    • 1.559 mm
    • 1.579 mm
    • 10 mm
    • 10.2 mm
    • 12 mm
    • 12.8 mm
    • 12.8265 mm
    • 13 mm
    • 14 mm
    • 15 mm
    • 15.875 mm
    • 16 mm
    • 17 mm
    • 17.905 mm
    • 18.415 mm
    • 19 mm
    • 19.1262 mm
    • 2.309 mm
    • 2.32 mm
    • 2.582 mm
    • 20 mm
    • 21 mm
    • 23 mm
    • 24.105 mm
    • 24.18 mm
    • 24.1808 mm
    • 25 mm
    • 25.527 mm
    • 27 mm
    • 28 mm
    • 29 mm
    • 29.3116 mm
    • 3 mm
    • 3.23 mm
    • 3.68 mm
    • 3.691 mm
    • 3.91 mm
    • 31 mm
    • 33 mm
    • 34.67 mm
    • 35 mm
    • 36 mm
    • 36.802 mm
    • 4 mm
    • 4.04 mm
    • 4.889 mm
    • 4.978 mm
    • 4.98 mm
    • 40 mm
    • 5 mm
    • 5.413 mm
    • 5.848 mm
    • 5.94 mm
    • 6 mm
    • 60.96 mm
    • 61.04 mm
    • 62.1 mm
    • 62.103 mm
    • 7 mm
    • 7.2 mm
    • 8 mm
    • 8.3 mm
    • 9 mm
    • 9.779 mm
    • 9.891 mm
    • 9.893 mm
ROM Bits Size
    • 1024 Bits
    • 1048576 Bits
    • 131072 Bits
    • 2097152 Bits
    • 256 Bits
    • 262144 Bits
    • 32768 Bits
    • 4096 Bits
    • 512 Bits
    • 524288 Bits
    • 65536 Bits
    • 8192 Bits
No. of Timers
    • 5
RAM Bytes
    • 1024
    • 2048
    • 256
    • 262144
    • 4096
    • 512
    • 8192
Technology
    • CHMOS
    • CMOS
    • HCMOS
    • MOS
    • NMOS
Analog To Digital Convertors
    • 1-Ch 12-Bit
Maximum Supply Current
    • .008 mA
    • .01 mA
    • .0255 mA
    • 1 mA
    • 12 mA
    • 1200 mA
    • 13.8 mA
    • 1320 mA
    • 14 mA
    • 14.5 mA
    • 1400 mA
    • 15 mA
    • 1500 mA
    • 18.5 mA
    • 180 mA
    • 2 mA
    • 2.5 mA
    • 200 mA
    • 2200 mA
    • 25 mA
    • 27 mA
    • 3.5 mA
    • 35 mA
    • 4 mA
    • 4.5 mA
    • 50 mA
    • 5000 mA
    • 6 mA
    • 6.85 mA
    • 7.2 mA
    • 70 mA
    • 78 mA
    • 8 mA
Nominal Supply Voltage
    • .85 V
    • .9 V
    • .95 V
    • 1 V
    • 1.05 V
    • 1.06 V
    • 1.1 V
    • 1.13 V
    • 1.15 V
    • 1.2 V
    • 1.25 V
    • 1.3 V
    • 1.35 V
    • 1.4 V
    • 1.45 V
    • 1.5 V
    • 1.8 V
    • 2.5 V
    • 2.7 V
    • 3 V
    • 3.3 V
    • 3.45 V
    • 4.75 V
    • 5 V
No. of DMA Channels
    • 1
PWM Channels
    • YES
No. of Serial I/Os
    • 0
    • 1
    • 11
    • 13
    • 16
    • 2
    • 3
    • 4
    • 5
    • 7
    • 8
Sub-Category
    • Bus Controllers
    • Digital Signal Processors
    • Microcontrollers
    • Microprocessors
    • Multifunction Peripherals
    • Other Microprocessor ICs
    • Other uPs/uCs/Peripheral ICs
Connectivity
    • I2C(2), SPI(2), UART(2)
ROM Programmability
    • FLASH
Bus Compatibility
    • 68000
    • 680X0; 88XXX; 80X86; SPARC; R4000; AXP
    • 8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340
    • 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8
    • 80386
    • 8042; IBM PC-XT; IBM PC-AT; IRDA; PCI; SMBUS
    • 8051; CAN; I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART
    • 8051; I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART
    • 8051; I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART; USB
    • CAN(2), I2C(2), QSPI, SPI(4), UART(3)
    • CAN(3), SAI(4), SPI(4), UART(6)
    • CAN, I2C, I2S, SPI, SSP, UART USB
    • CAN, SSP, UART(3)
    • CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB
    • CAN; ETHERNET; I2C; I2S; IRDA; PCI; SPI; UART; USB
    • CAN; ETHERNET; I2C; I2S; IRDA; RS-485; RS-232; SPI; UART; USB
    • CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB
    • CAN; ETHERNET; I2C; PCI; SPI; UART; USB
    • CAN; ETHERNET; I2C; SPI; UART; USB
    • CAN; I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART; USB
    • CAN; I2C; IRDA; PCI; SPI; UART; USB
    • ETHERNET, I2C, I2S, PCI, SPI, UART, USB
    • ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB
    • ETHERNET; I2C; PCI; SPI; UART; USB
    • I2C
    • I2C, I2S, IDE, SPI, UART
    • I2C, I2S, IRDA, SPI, UART, USART
    • I2C, I2S, SPI, UART
    • I2C, IDE, ISA, PCI, USB, VGA
    • I2C, IRDA, SPI, UART, USB
    • I2C, PCI, SPI, UART, USB
    • I2C, SAI, SPI, UART
    • I2C, SPI, UART
    • I2C, USB
    • I2C; I2S, LIN; PS/2; SPI, USB
    • I2C; I2S; IDE; IRDA; LIN; SPI; UART
    • I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART
    • I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART; USB
    • I2C; I2S; LIN; PS/2; SPI; UART; USB; CAN; SIO; IDE; SMBUS
    • I2C; I2S; LIN; PS/2; SPI; UART; USB; SIO; IDE; SMBUS
    • I2C; I2S; SPI; UART
    • I2C; I2S; SPI; UART; IRDA; LIN; IDE
    • I2C; I2S; UART; SPI; USB; ETHERNET
    • I2C; IDE; IRDA; LIN; SPI; UART
    • I2C; IRDA; LIN; SPI; UART
    • I2C; IRDA; LIN; SPI; UART; USB
    • I2C; IRDA; PCI; PS/2; SMBUS; SPI; UART
    • I2C; SPI; UART
    • I2C; SPI; UART; IRDA; IDE; CAN; LIN
    • I2C; SPI; UART; IRDA; IDE; LIN
    • I2C; SPI; UART; LPC; LIN; IRDA; IDE
    • I2C; SPI; UART; USB
    • I2C; USB
    • I2C; USB; LPC
    • I2C; USB; PS/2
    • I2C; USB; PS/2; 8051
    • IRDA, PC-AT, PC-XT, PS/2, PCI
    • LPC
    • MC68000
    • PC-AT; ISA; PS/2
    • PCI
    • PCI; I2C; 60X PROCESSOR
    • PCI; ISA
    • PCI; ISA; CARDBUS; PCMCIA; PC-AT; PS/2
    • PCI; RC32364; RC32134
    • PCI; SATA; SMBUS; UART; USB
    • PCI; USB; LPC
    • SPI, UART
    • SPI, USB
    • TX3922; ISA; PCMCIA; USB
    • USB
    • USB; PCI; I2C
    • USB; PCI; I2C; LPC; PS/2
    • USB; PCI; ISA
    • USB; PCI; ISA; PCMCIA
    • VR4100
    • Z84C00
Terminal Pitch
    • .35 mm
    • .37 mm
    • .38 mm
    • .4 mm
    • .5 mm
    • .6 mm
    • .635 mm
    • .65 mm
    • .75 mm
    • .76 mm
    • .8 mm
    • 1 mm
    • 1.27 mm
    • 2.54 mm
Format
    • FIXED POINT
    • FLOATING POINT
JESD-30 Code
    • R-CDIP-T48
    • R-PBGA-B1071
    • R-PBGA-B16
    • R-PBGA-B286
    • R-PBGA-B30
    • R-PBGA-B316
    • R-PBGA-B35
    • R-PBGA-B45
    • R-PBGA-B68
    • R-PBGA-B72
    • R-PBGA-B76
    • R-PBGA-B99
    • R-PDIP-T20
    • R-PDIP-T28
    • R-PDIP-T48
    • R-PDIP-T8
    • R-PDSO-G16
    • R-PDSO-G20
    • R-PDSO-G28
    • R-PDSO-G36
    • R-PDSO-G48
    • R-PDSO-G56
    • R-PDSO-G8
    • R-PQFP-G100
    • R-PQFP-G128
    • R-XQCC-N40
    • S-CPGA-P132
    • S-CQCC-J68
    • S-CQFP-F256
    • S-PBGA-B1020
    • S-PBGA-B124
    • S-PBGA-B1284
    • S-PBGA-B1313
    • S-PBGA-B1517
    • S-PBGA-B16
    • S-PBGA-B272
    • S-PBGA-B289
    • S-PBGA-B338
    • S-PBGA-B367
    • S-PBGA-B372
    • S-PBGA-B373
    • S-PBGA-B387
    • S-PBGA-B388
    • S-PBGA-B400
    • S-PBGA-B404
    • S-PBGA-B416
    • S-PBGA-B417
    • S-PBGA-B421
    • S-PBGA-B423
    • S-PBGA-B448
    • S-PBGA-B473
    • S-PBGA-B486
    • S-PBGA-B503
    • S-PBGA-B515
    • S-PBGA-B516
    • S-PBGA-B529
    • S-PBGA-B538
    • S-PBGA-B541
    • S-PBGA-B548
    • S-PBGA-B552
    • S-PBGA-B569
    • S-PBGA-B609
    • S-PBGA-B621
    • S-PBGA-B624
    • S-PBGA-B625
    • S-PBGA-B652
    • S-PBGA-B676
    • S-PBGA-B689
    • S-PBGA-B760
    • S-PBGA-B780
    • S-PBGA-B784
    • S-PBGA-B989
    • S-PDSO-G48
    • S-PQCC-J52
    • S-PQCC-J68
    • S-PQCC-J84
    • S-PQCC-N32
    • S-PQCC-N36
    • S-PQCC-N42
    • S-PQCC-N64
    • S-PQFP-G100
    • S-PQFP-G128
    • S-PQFP-G144
    • S-PQFP-G208
    • S-PQFP-G44
    • S-PQFP-G48
    • S-PQFP-G64
    • S-PQFP-G80
    • S-XPGA-P144
    • S-XQCC-N16
    • S-XQCC-N24
    • S-XQCC-N32
    • S-XQCC-N36
    • S-XQCC-N40
    • S-XQCC-N44
    • S-XQCC-N48
    • S-XQCC-N56
    • S-XQCC-N68
    • S-XQFP-F144
    • S-XXMA-N21
Moisture Sensitivity Level (MSL)
    • 1
    • 2A
    • 3
    • 4
Qualification
    • Not Qualified
Speed
    • 100 rpm
    • 1000 rpm
    • 1176 rpm
    • 12 rpm
    • 12.6 rpm
    • 1200 rpm
    • 133 rpm
    • 1500 rpm
    • 1800 rpm
    • 24 rpm
    • 24.6 rpm
    • 24.96 rpm
    • 25.2 rpm
    • 300 rpm
    • 400 rpm
    • 454 rpm
    • 48 rpm
    • 500 rpm
    • 528 rpm
    • 60 rpm
    • 600 rpm
    • 650 rpm
    • 66 rpm
    • 67 rpm
    • 696 rpm
    • 720 rpm
    • 75 rpm
    • 750 rpm
    • 80 rpm
    • 800 rpm
    • 90 rpm
Low Power Mode
    • YES
JESD-609 Code
    • e0
    • e1
    • e2
    • e3
    • e4
    • e6
Maximum Standby Current
    • .000005 Amp
    • .00002 Amp
On Chip Program ROM Width
    • 8
No. of I/O Lines
    • 0
    • 1
    • 12
    • 126
    • 13
    • 136
    • 14
    • 16
    • 160
    • 17
    • 18
    • 186
    • 188
    • 19
    • 20
    • 21
    • 212
    • 215
    • 24
    • 247
    • 25
    • 27
    • 28
    • 29
    • 30
    • 31
    • 32
    • 33
    • 34
    • 36
    • 37
    • 38
    • 4
    • 40
    • 44
    • 45
    • 46
    • 48
    • 49
    • 5
    • 50
    • 51
    • 53
    • 54
    • 55
    • 57
    • 6
    • 62
    • 64
    • 68
    • 70
    • 72
    • 75
    • 76
    • 8
    • 98
    • 99
Maximum Access Time
    • .00000007 ns
    • .00000009 ns
    • .00000015 ns
Reset All
Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

Z84C9008VSG

IXYS Corporation

COMMERCIAL

J BEND

84

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5.5 V

4

CHIP CARRIER

4.5 V

70 Cel

0 Cel

Matte Tin (Sn)

QUAD

4.57 mm

29.3116 mm

NO

8

8 MHz

40

260

29.3116 mm

CMOS

5 V

Z84C00

1.27 mm

S-PQCC-J84

Not Qualified

e3

24

LS1024ASN7JLA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL

COMMERCIAL

BALL

625

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.155 V

26

GRID ARRAY, FINE PITCH

BGA625,25X25,32

1.045 V

70 Cel

-10 Cel

BOTTOM

2.67 mm

21 mm

YES

0

900 MHz

30

250

21 mm

CMOS

1400 mA

1.1 V

.8 mm

S-PBGA-B625

3

MCIMX233DAG4B

Freescale Semiconductor

MULTIFUNCTION PERIPHERAL

COMMERCIAL

GULL WING

128

LFQFP

SQUARE

PLASTIC/EPOXY

YES

YES

1.55 V

13

FLATPACK, LOW PROFILE, FINE PITCH

1 V

70 Cel

-10 Cel

Matte Tin (Sn)

QUAD

1.6 mm

14 mm

IT ALSO REQUIRES 1.62V-2.1V ANALOG SUPPLY

YES

16

24 MHz

40

260

14 mm

CMOS

1.35 V

.4 mm

FIXED POINT

S-PQFP-G128

3

454 rpm

YES

e3

CY7C60323-LTXC

Cypress Semiconductor

COMMERCIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

0

8

2.4/3.6

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

2.7 V

70 Cel

M8C

0 Cel

NICKEL PALLADIUM GOLD

QUAD

1 mm

8192

512

5 mm

IT ALSO OPERATES AT 2.4V AT 93KHZ

NO

0

12 MHz

40

260

5 mm

512

CMOS

2 mA

3 V

Microcontrollers

FLASH

I2C; USB

.5 mm

S-XQCC-N32

3

Not Qualified

24.6 rpm

e4

28

SCH3116-NU

Microchip Technology

MULTIFUNCTION PERIPHERAL

COMMERCIAL

GULL WING

128

TQFP

SQUARE

PLASTIC/EPOXY

YES

3.63 V

4

3.3

FLATPACK, THIN PROFILE

TQFP128,.63SQ,16

2.97 V

70 Cel

0 Cel

MATTE TIN

QUAD

1.2 mm

256

14 mm

NO

4

14 mm

CMOS

1 mA

3.3 V

Other uPs/uCs/Peripheral ICs

LPC

.4 mm

S-PQFP-G128

Not Qualified

e3

46

XS1-L4A-64-TQ48-C4

Xmos

COMMERCIAL

GULL WING

48

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1.05 V

0

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

.95 V

70 Cel

0 Cel

QUAD

1.2 mm

32768

7 mm

YES

0

100 MHz

7 mm

CMOS

1 V

SPI, USB

.5 mm

S-PQFP-G48

28

SCH3114-NU

Microchip Technology

MULTIFUNCTION PERIPHERAL

COMMERCIAL

GULL WING

128

TQFP

SQUARE

PLASTIC/EPOXY

YES

3.63 V

4

3.3

FLATPACK, THIN PROFILE

TQFP128,.63SQ,16

2.97 V

70 Cel

0 Cel

MATTE TIN

QUAD

1.2 mm

256

14 mm

NO

4

40

260

14 mm

CMOS

1 mA

3.3 V

Other uPs/uCs/Peripheral ICs

LPC

.4 mm

S-PQFP-G128

3

Not Qualified

e3

46

MC68901FN

Motorola

COMMERCIAL

J BEND

52

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5.5 V

5

CHIP CARRIER

4.5 V

70 Cel

0 Cel

TIN LEAD

QUAD

4.57 mm

19.1262 mm

NO

8

4 MHz

19.1262 mm

MOS

180 mA

5 V

1

MC68000

1.27 mm

S-PQCC-J52

Not Qualified

e0

8

PC87351-IBW/VLA

National Semiconductor

COMMERCIAL

GULL WING

128

FQFP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

16

5

FLATPACK, FINE PITCH

QFP128,.67X.93,20

4.5 V

70 Cel

0 Cel

TIN LEAD

QUAD

3.15 mm

256

14 mm

NO

8

48 MHz

30

220

20 mm

CMOS

50 mA

5 V

Other Microprocessor ICs

PC-AT; ISA; PS/2

.5 mm

R-PQFP-G128

2A

Not Qualified

e0

8

LPC47M112-MW

Microchip Technology

MULTIFUNCTION PERIPHERAL

COMMERCIAL

GULL WING

100

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

3.63 V

TS 16949

FLATPACK

QFP100,.55X0.79

2.97 V

70 Cel

0 Cel

MATTE TIN

QUAD

3.4 mm

256

14 mm

NO

0

20 mm

CMOS

15 mA

3.3 V

2

IRDA, PC-AT, PC-XT, PS/2, PCI

.65 mm

R-PQFP-G100

Not Qualified

e3

45

SCH5027E-NW

Microchip Technology

COMMERCIAL

GULL WING

128

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

FLATPACK

70 Cel

0 Cel

QUAD

NO

NOT SPECIFIED

NOT SPECIFIED

CMOS

8042; IBM PC-XT; IBM PC-AT; IRDA; PCI; SMBUS

R-PQFP-G128

25

X66AK2G12ABY60

Texas Instruments

MULTIFUNCTION PERIPHERAL

COMMERCIAL

BALL

625

LFBGA

SQUARE

PLASTIC/EPOXY

YES

.945 V

16

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA625,25X25,32

.855 V

70 Cel

0 Cel

BOTTOM

1.56 mm

1M

21 mm

YES

32

21 mm

CMOS

.9 V

CAN; ETHERNET; I2C; PCI; SPI; UART; USB

.8 mm

S-PBGA-B625

212

X66AK2G12ABY100

Texas Instruments

MULTIFUNCTION PERIPHERAL

COMMERCIAL

BALL

625

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

16

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA625,25X25,32

.95 V

70 Cel

0 Cel

BOTTOM

1.56 mm

1M

21 mm

YES

32

21 mm

CMOS

1 V

CAN; ETHERNET; I2C; PCI; SPI; UART; USB

.8 mm

S-PBGA-B625

212

MAXQ617V-L000+T

Analog Devices

MULTIFUNCTION PERIPHERAL

COMMERCIAL

BALL

16

FBGA

SQUARE

PLASTIC/EPOXY

YES

16

1.8/3.3

GRID ARRAY, FINE PITCH

BGA16,4X4,16

70 Cel

-20 Cel

TIN SILVER COPPER NICKEL

BOTTOM

81920

30

260

4096

3.5 mA

Microcontrollers

FLASH

.4 mm

S-PBGA-B16

1

Not Qualified

12 rpm

e2

ZPSD501B1-15L

STMicroelectronics

COMMERCIAL

J BEND

68

WQCCJ

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

5.5 V

16

CHIP CARRIER, WINDOW

4.5 V

70 Cel

0 Cel

QUAD

4.57 mm

512

24.105 mm

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

NO

16

34.48 MHz

24.105 mm

CMOS

5 V

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

1.27 mm

S-CQCC-J68

Not Qualified

40

PSD512B0-15U

STMicroelectronics

COMMERCIAL

GULL WING

80

LQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

16

FLATPACK, LOW PROFILE

4.5 V

70 Cel

0 Cel

QUAD

1.6 mm

14 mm

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

NO

8

22 MHz

14 mm

CMOS

5 V

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

.65 mm

S-PQFP-G80

Not Qualified

40

ZPSD513B1-15L

STMicroelectronics

COMMERCIAL

J BEND

68

WQCCJ

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

5.5 V

16

CHIP CARRIER, WINDOW

4.5 V

70 Cel

0 Cel

QUAD

4.57 mm

1024

24.105 mm

128K X 8 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

NO

8

34.48 MHz

24.105 mm

CMOS

5 V

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

1.27 mm

S-CQCC-J68

Not Qualified

40

ZPSD512B0-70U

STMicroelectronics

COMMERCIAL

GULL WING

80

LQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

16

FLATPACK, LOW PROFILE

4.5 V

70 Cel

0 Cel

QUAD

1.6 mm

14 mm

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

NO

8

36 MHz

14 mm

CMOS

5 V

8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

.65 mm

S-PQFP-G80

Not Qualified

40

STPCD0175BTC3

STMicroelectronics

MULTIFUNCTION PERIPHERAL

COMMERCIAL

BALL

388

BGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

32

32

3.3

GRID ARRAY

BGA388,26X26,50

3 V

70 Cel

0 Cel

TIN LEAD

BOTTOM

2.38 mm

35 mm

0 TO 100 OPERATING CASE TEMPERATURE

NO

32

14.318 MHz

35 mm

CMOS

3.3 V

Microprocessors

PCI; ISA

1.27 mm

S-PBGA-B388

Not Qualified

75 rpm

e0

ZPSD513B1-70L

STMicroelectronics

COMMERCIAL

J BEND

68

WQCCJ

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

5.5 V

16

CHIP CARRIER, WINDOW

4.5 V

70 Cel

0 Cel

QUAD

4.57 mm

1024

24.105 mm

128K X 8 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

NO

8

50 MHz

24.105 mm

CMOS

5 V

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

1.27 mm

S-CQCC-J68

Not Qualified

40

ZPSD503B1-15J

STMicroelectronics

COMMERCIAL

J BEND

68

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5.5 V

16

5

CHIP CARRIER

LDCC68,1.0SQ

4.5 V

70 Cel

0 Cel

TIN LEAD

N

QUAD

4.57 mm

512

24.18 mm

64K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

NO

16

34.48 MHz

24.18 mm

1024 Bits

CMOS

5 V

Other Microprocessor ICs

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

1.27 mm

S-PQCC-J68

Not Qualified

e0

.00002 Amp

40

.00000015 ns

MK68901N04

STMicroelectronics

COMMERCIAL

THROUGH-HOLE

48

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5.25 V

5

5

IN-LINE

DIP48,.6

4.75 V

70 Cel

0 Cel

TIN LEAD

DUAL

5.588 mm

15.24 mm

NO

8

4 MHz

62.103 mm

NMOS

180 mA

5 V

1

Other Microprocessor ICs

68000

2.54 mm

R-PDIP-T48

Not Qualified

e0

8

ZPSD512B1-70L

STMicroelectronics

COMMERCIAL

J BEND

68

WQCCJ

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

5.5 V

16

CHIP CARRIER, WINDOW

4.5 V

70 Cel

0 Cel

QUAD

4.57 mm

1024

24.105 mm

64K X 8 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

NO

8

50 MHz

24.105 mm

CMOS

5 V

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

1.27 mm

S-CQCC-J68

Not Qualified

40

MK68901Q04

STMicroelectronics

COMMERCIAL

J BEND

52

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5.25 V

5

5

CHIP CARRIER

LDCC52,.8SQ

4.75 V

70 Cel

0 Cel

TIN LEAD

QUAD

4.57 mm

19.1262 mm

NO

8

4 MHz

19.1262 mm

NMOS

180 mA

5 V

1

Other Microprocessor ICs

68000

1.27 mm

S-PQCC-J52

Not Qualified

e0

8

PSD511B1-15U

STMicroelectronics

COMMERCIAL

GULL WING

80

LQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

16

5

FLATPACK, LOW PROFILE

QFP80,.64SQ

4.5 V

70 Cel

0 Cel

TIN LEAD

N

QUAD

1.6 mm

1024

14 mm

32K X 8 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

NO

8

34.48 MHz

14 mm

256 Bits

CMOS

5 V

Other Microprocessor ICs

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

.65 mm

S-PQFP-G80

Not Qualified

e0

.00002 Amp

40

.00000015 ns

PSD503B1-70U

STMicroelectronics

COMMERCIAL

GULL WING

80

LQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

16

5

FLATPACK, LOW PROFILE

QFP80,.64SQ

4.5 V

70 Cel

0 Cel

TIN LEAD

N

QUAD

1.6 mm

512

14 mm

64K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

NO

16

50 MHz

14 mm

1024 Bits

CMOS

5 V

Other Microprocessor ICs

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

.65 mm

S-PQFP-G80

Not Qualified

e0

.00002 Amp

40

.00000007 ns

ZPSD511B1-70L

STMicroelectronics

COMMERCIAL

J BEND

68

WQCCJ

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

5.5 V

16

CHIP CARRIER, WINDOW

4.5 V

70 Cel

0 Cel

QUAD

4.57 mm

1024

24.105 mm

32K X 8 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

NO

8

50 MHz

24.105 mm

CMOS

5 V

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

1.27 mm

S-CQCC-J68

Not Qualified

40

PSD512B1-70U

STMicroelectronics

COMMERCIAL

GULL WING

80

LQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

16

5

FLATPACK, LOW PROFILE

QFP80,.64SQ

4.5 V

70 Cel

0 Cel

TIN LEAD

N

QUAD

1.6 mm

1024

14 mm

64K X 8 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

NO

8

50 MHz

14 mm

512 Bits

CMOS

5 V

Other Microprocessor ICs

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

.65 mm

S-PQFP-G80

Not Qualified

e0

.00002 Amp

40

.00000007 ns

ZPSD511B1-15U

STMicroelectronics

COMMERCIAL

GULL WING

80

LQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

16

5

FLATPACK, LOW PROFILE

QFP80,.64SQ

4.5 V

70 Cel

0 Cel

TIN LEAD

N

QUAD

1.6 mm

1024

14 mm

32K X 8 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

NO

8

34.48 MHz

14 mm

256 Bits

CMOS

5 V

Other Microprocessor ICs

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

.65 mm

S-PQFP-G80

Not Qualified

e0

.00002 Amp

40

.00000015 ns

ZPSD512B0-70J

STMicroelectronics

COMMERCIAL

J BEND

68

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5.5 V

16

CHIP CARRIER

4.5 V

70 Cel

0 Cel

QUAD

4.57 mm

24.1808 mm

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

NO

8

36 MHz

24.1808 mm

CMOS

5 V

8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

1.27 mm

S-PQCC-J68

Not Qualified

40

PSD502B1-70U

STMicroelectronics

COMMERCIAL

GULL WING

80

LQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

16

5

FLATPACK, LOW PROFILE

QFP80,.64SQ

4.5 V

70 Cel

0 Cel

TIN LEAD

N

QUAD

1.6 mm

512

14 mm

32K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

NO

16

50 MHz

14 mm

512 Bits

CMOS

5 V

Other Microprocessor ICs

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

.65 mm

S-PQFP-G80

Not Qualified

e0

.00002 Amp

40

.00000007 ns

STPCC0366BTC3

STMicroelectronics

MULTIFUNCTION PERIPHERAL

COMMERCIAL

BALL

388

BGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

32

32

3.3

GRID ARRAY

BGA388,26X26,50

3 V

70 Cel

0 Cel

TIN LEAD

BOTTOM

2.38 mm

35 mm

0 TO 100 OPERATING CASE TEMPERATURE

NO

32

66 MHz

35 mm

CMOS

3.3 V

Microprocessors

PCI; ISA

1.27 mm

S-PBGA-B388

Not Qualified

66 rpm

e0

STPCD0166BTC3

STMicroelectronics

MULTIFUNCTION PERIPHERAL

COMMERCIAL

BALL

388

BGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

32

32

3.3

GRID ARRAY

BGA388,26X26,50

3 V

70 Cel

0 Cel

TIN LEAD

BOTTOM

2.38 mm

35 mm

0 TO 100 OPERATING CASE TEMPERATURE

NO

32

14.318 MHz

35 mm

CMOS

3.3 V

Microprocessors

PCI; ISA

1.27 mm

S-PBGA-B388

Not Qualified

66 rpm

e0

ZPSD513B1-70J

STMicroelectronics

COMMERCIAL

J BEND

68

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5.5 V

16

5

CHIP CARRIER

LDCC68,1.0SQ

4.5 V

70 Cel

0 Cel

TIN LEAD

N

QUAD

4.57 mm

1024

24.18 mm

128K X 8 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

NO

8

50 MHz

24.18 mm

1024 Bits

CMOS

5 V

Other Microprocessor ICs

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

1.27 mm

S-PQCC-J68

Not Qualified

e0

.00002 Amp

40

.00000007 ns

ZPSD512B1-70J

STMicroelectronics

COMMERCIAL

J BEND

68

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5.5 V

16

5

CHIP CARRIER

LDCC68,1.0SQ

4.5 V

70 Cel

0 Cel

TIN LEAD

N

QUAD

4.57 mm

1024

24.18 mm

64K X 8 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

NO

8

50 MHz

24.18 mm

512 Bits

CMOS

5 V

Other Microprocessor ICs

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

1.27 mm

S-PQCC-J68

Not Qualified

e0

.00002 Amp

40

.00000007 ns

ZPSD512B0-15L

STMicroelectronics

COMMERCIAL

J BEND

68

WQCCJ

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

5.5 V

16

CHIP CARRIER, WINDOW

4.5 V

70 Cel

0 Cel

QUAD

4.57 mm

24.105 mm

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

NO

8

22 MHz

24.105 mm

CMOS

5 V

8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

1.27 mm

S-CQCC-J68

Not Qualified

40

ZPSD503B1-70L

STMicroelectronics

COMMERCIAL

J BEND

68

WQCCJ

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

5.5 V

16

CHIP CARRIER, WINDOW

4.5 V

70 Cel

0 Cel

QUAD

4.57 mm

512

24.105 mm

64K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

NO

16

50 MHz

24.105 mm

CMOS

5 V

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

1.27 mm

S-CQCC-J68

Not Qualified

40

68901Q04

STMicroelectronics

COMMERCIAL

J BEND

52

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5.25 V

5

CHIP CARRIER

4.75 V

70 Cel

0 Cel

QUAD

4.572 mm

19.1262 mm

NO

8

4 MHz

19.1262 mm

CMOS

5 V

68000

1.27 mm

S-PQCC-J52

Not Qualified

8

ZPSD502B1-15J

STMicroelectronics

COMMERCIAL

J BEND

68

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5.5 V

16

5

CHIP CARRIER

LDCC68,1.0SQ

4.5 V

70 Cel

0 Cel

TIN LEAD

N

QUAD

4.57 mm

512

24.18 mm

32K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

NO

16

34.48 MHz

24.18 mm

512 Bits

CMOS

5 V

Other Microprocessor ICs

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

1.27 mm

S-PQCC-J68

Not Qualified

e0

.00002 Amp

40

.00000015 ns

MK68901Q05

STMicroelectronics

COMMERCIAL

J BEND

52

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5.25 V

5

5

CHIP CARRIER

LDCC52,.8SQ

4.75 V

70 Cel

0 Cel

TIN LEAD

QUAD

4.57 mm

19.1262 mm

NO

8

5 MHz

19.1262 mm

NMOS

180 mA

5 V

1

Other Microprocessor ICs

68000

1.27 mm

S-PQCC-J52

Not Qualified

e0

8

TS68HC901CP5

STMicroelectronics

COMMERCIAL

THROUGH-HOLE

48

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5.25 V

5

5

IN-LINE

DIP48,.6

4.75 V

70 Cel

0 Cel

TIN LEAD

DUAL

4.8 mm

15.24 mm

NO

8

5 MHz

61.04 mm

HCMOS

6 mA

5 V

1

Other Microprocessor ICs

68000

2.54 mm

R-PDIP-T48

Not Qualified

e0

8

PSD501B1-15U

STMicroelectronics

COMMERCIAL

GULL WING

80

LQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

16

5

FLATPACK, LOW PROFILE

QFP80,.64SQ

4.5 V

70 Cel

0 Cel

TIN LEAD

N

QUAD

1.6 mm

512

14 mm

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

NO

16

34.48 MHz

14 mm

256 Bits

CMOS

5 V

Other Microprocessor ICs

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

.65 mm

S-PQFP-G80

Not Qualified

e0

.00002 Amp

40

.00000015 ns

ZPSD512B0-15U

STMicroelectronics

COMMERCIAL

GULL WING

80

LQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

16

FLATPACK, LOW PROFILE

4.5 V

70 Cel

0 Cel

QUAD

1.6 mm

14 mm

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

NO

8

22 MHz

14 mm

CMOS

5 V

8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

.65 mm

S-PQFP-G80

Not Qualified

40

ZPSD501B1-70L

STMicroelectronics

COMMERCIAL

J BEND

68

WQCCJ

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

5.5 V

16

CHIP CARRIER, WINDOW

4.5 V

70 Cel

0 Cel

QUAD

4.57 mm

512

24.105 mm

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

NO

16

50 MHz

24.105 mm

CMOS

5 V

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

1.27 mm

S-CQCC-J68

Not Qualified

40

MK68901P04

STMicroelectronics

COMMERCIAL

THROUGH-HOLE

48

DIP

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

NO

5.25 V

5

5

IN-LINE

DIP48,.6

4.75 V

70 Cel

0 Cel

TIN LEAD

DUAL

4.064 mm

15.24 mm

NO

8

4 MHz

60.96 mm

NMOS

180 mA

5 V

1

Other Microprocessor ICs

68000

2.54 mm

R-CDIP-T48

Not Qualified

e0

8

ZPSD502B1-70J

STMicroelectronics

COMMERCIAL

J BEND

68

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5.5 V

16

5

CHIP CARRIER

LDCC68,1.0SQ

4.5 V

70 Cel

0 Cel

TIN LEAD

N

QUAD

4.57 mm

512

24.18 mm

32K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

NO

16

50 MHz

24.18 mm

512 Bits

CMOS

5 V

Other Microprocessor ICs

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

1.27 mm

S-PQCC-J68

Not Qualified

e0

.00002 Amp

40

.00000007 ns

PSD513B1-70J

STMicroelectronics

COMMERCIAL

J BEND

68

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5.5 V

16

5

CHIP CARRIER

LDCC68,1.0SQ

4.5 V

70 Cel

0 Cel

TIN LEAD

N

QUAD

4.57 mm

1024

24.18 mm

128K X 8 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

NO

8

50 MHz

24.18 mm

1024 Bits

CMOS

5 V

Other Microprocessor ICs

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

1.27 mm

S-PQCC-J68

Not Qualified

e0

.00002 Amp

40

.00000007 ns

STPCC0375BTC3

STMicroelectronics

MULTIFUNCTION PERIPHERAL

COMMERCIAL

BALL

388

BGA

SQUARE

PLASTIC/EPOXY

YES

3.75 V

32

32

3.3

GRID ARRAY

BGA388,26X26,50

3.15 V

70 Cel

0 Cel

TIN LEAD

BOTTOM

2.38 mm

35 mm

0 TO 100 OPERATING CASE TEMPERATURE

NO

32

14.318 MHz

35 mm

CMOS

3.45 V

Microprocessors

PCI; ISA

1.27 mm

S-PBGA-B388

Not Qualified

75 rpm

e0

0

Multi-functional Peripherals

Multi-functional peripherals (MFPs) are devices that combine several different functions, such as printing, scanning, copying, and faxing, into a single piece of equipment. These devices are often used in office settings to streamline workflows and reduce the need for multiple pieces of equipment.

MFPs typically come with a range of features and capabilities, including high-quality printing and scanning, fast copying and faxing, and the ability to handle large volumes of documents. They may also offer additional features, such as double-sided printing, wireless connectivity, and cloud-based printing and scanning.

One of the key benefits of MFPs is their ability to save space and reduce clutter in an office environment. By combining several different functions into a single device, MFPs eliminate the need for separate printers, scanners, copiers, and fax machines, freeing up valuable space and reducing costs.

In addition to their space-saving benefits, MFPs also offer enhanced efficiency and productivity. With the ability to print, scan, copy, and fax all from a single device, users can complete tasks quickly and easily, without the need to switch between different pieces of equipment.