Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Ultraviolet Erasable | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | ROM Bits Size | No. of Timers | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | JESD-609 Code | Maximum Standby Current | On Chip Program ROM Width | No. of I/O Lines | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
16 |
VQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
8 |
1.8/5 |
CHIP CARRIER, VERY THIN PROFILE |
LCC16,.12SQ,20 |
1.71 V |
85 Cel |
M8C |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.6 mm |
16384 |
1024 |
3 mm |
NO |
0 |
25.2 MHz |
20 |
260 |
3 mm |
2048 |
CMOS |
4 mA |
3 V |
Microcontrollers |
FLASH |
USB |
.5 mm |
S-XQCC-N16 |
3 |
Not Qualified |
25.2 rpm |
e4 |
13 |
|||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
2/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
BGA99,9X11,20 |
1.71 V |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
N |
QUAD |
1 mm |
8192 |
8 mm |
YES |
33 MHz |
30 |
260 |
8 mm |
524288 Bits |
CMOS |
1.8 V |
Other uPs/uCs/Peripheral ICs |
I2C; USB; PS/2 |
.4 mm |
S-XQCC-N68 |
3 |
Not Qualified |
e4 |
48 |
||||||||||||||||||||||||||||||||
|
Infineon Technologies |
COMMERCIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.25 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
4.75 V |
70 Cel |
-20 Cel |
Matte Tin (Sn) |
QUAD |
1 mm |
512 |
4 mm |
ALSO OPERATES AT 2.7V AND 3V SUPPLY |
NO |
0 |
12.6 MHz |
20 |
260 |
4 mm |
CMOS |
5 V |
.5 mm |
S-XQCC-N24 |
3 |
Not Qualified |
e3 |
20 |
|||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
PURE TIN |
QUAD |
.6 mm |
16384 |
7 mm |
NO |
0 |
48 MHz |
7 mm |
CMOS |
3.3 V |
I2C; SPI; UART; IRDA; IDE; LIN |
.4 mm |
S-XQCC-N56 |
3 |
36 |
|||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.25 V |
0 |
8 |
2.7/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
2.4 V |
85 Cel |
M8C |
-40 Cel |
MATTE TIN |
QUAD |
.6 mm |
8192 |
512 |
4 mm |
NO |
0 |
12 MHz |
20 |
260 |
4 mm |
512 |
CMOS |
2.5 mA |
3 V |
Microcontrollers |
FLASH |
USB |
.5 mm |
S-XQCC-N24 |
3 |
Not Qualified |
12 rpm |
e3 |
||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
8 |
1.8/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
1.71 V |
85 Cel |
M8C |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.6 mm |
32768 |
1024 |
5 mm |
NO |
0 |
25.2 MHz |
40 |
260 |
5 mm |
2048 |
CMOS |
4 mA |
3 V |
Microcontrollers |
FLASH |
USB |
.5 mm |
S-XQCC-N32 |
3 |
Not Qualified |
25.2 rpm |
e4 |
28 |
|||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
1 mm |
8192 |
8 mm |
YES |
0 |
33 MHz |
30 |
260 |
8 mm |
CMOS |
3.3 V |
I2C; I2S; LIN; PS/2; SPI; UART; USB; SIO; IDE; SMBUS |
.4 mm |
S-XQCC-N68 |
3 |
e4 |
38 |
||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
MULTIFUNCTION PERIPHERAL |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.25 V |
0 |
8 |
2.7/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
4.75 V |
85 Cel |
M8C |
-40 Cel |
MATTE TIN |
QUAD |
.6 mm |
8192 |
512 |
4 mm |
ALSO OPERATES AT 750 KHZ WITH 2.4 V |
NO |
0 |
12 MHz |
20 |
260 |
4 mm |
512 |
CMOS |
2.5 mA |
5 V |
Microcontrollers |
FLASH |
I2C; USB |
.5 mm |
S-XQCC-N24 |
3 |
Not Qualified |
12.6 rpm |
e3 |
20 |
|||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
8 |
1.8/5.5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
1.71 V |
85 Cel |
M8C |
-40 Cel |
Matte Tin (Sn) |
QUAD |
.6 mm |
32768 |
1024 |
4 mm |
NO |
25.2 MHz |
20 |
260 |
4 mm |
2048 |
CMOS |
4 mA |
3 V |
Microcontrollers |
FLASH |
I2C; USB |
.5 mm |
S-XQCC-N24 |
3 |
Not Qualified |
24 rpm |
e3 |
20 |
|||||||||||||||||||||||||||
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
QUAD |
1 mm |
32768 |
8 mm |
YES |
0 |
33 MHz |
8 mm |
CMOS |
3.3 V |
I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART; USB |
.4 mm |
S-XQCC-N68 |
38 |
||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
8 |
1.8/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
1.71 V |
85 Cel |
M8C |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
16384 |
1024 |
7 mm |
NO |
0 |
25.2 MHz |
7 mm |
2048 |
CMOS |
4 mA |
3 V |
Microcontrollers |
FLASH |
I2C; USB |
.5 mm |
S-XQCC-N48 |
3 |
Not Qualified |
24 rpm |
e4 |
36 |
|||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
16 |
VQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
8 |
1.8/5.5 |
CHIP CARRIER, VERY THIN PROFILE |
LCC16,.12SQ,20 |
1.71 V |
85 Cel |
M8C |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
.6 mm |
32768 |
1024 |
3 mm |
NO |
25.2 MHz |
20 |
260 |
3 mm |
2048 |
CMOS |
4 mA |
3 V |
Microcontrollers |
FLASH |
I2C; USB |
.5 mm |
S-XQCC-N16 |
3 |
Not Qualified |
24 rpm |
e4 |
13 |
|||||||||||||||||||||||||||
Infineon Technologies |
MULTIFUNCTION PERIPHERAL |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.8 V |
85 Cel |
-40 Cel |
QUAD |
.6 mm |
1024 |
3 mm |
NO |
16 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
CMOS |
3.3 V |
I2C; USB |
.5 mm |
S-XQCC-N16 |
12 |
|||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
MULTIFUNCTION PERIPHERAL |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.8 V |
85 Cel |
-40 Cel |
QUAD |
.6 mm |
1024 |
4 mm |
NO |
16 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
4 mm |
CMOS |
3.3 V |
I2C; USB |
.5 mm |
S-XQCC-N24 |
20 |
|||||||||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
MULTIFUNCTION PERIPHERAL |
INDUSTRIAL |
NO LEAD |
44 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
3/3.3,5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC44,.28SQ,20 |
2.7 V |
85 Cel |
-40 Cel |
QUAD |
.8 mm |
1024 |
7 mm |
OPERATES BETWEEN 3 TO 3.6 V WHEN USB IS USED |
NO |
24 MHz |
7 mm |
CMOS |
35 mA |
3 V |
Other Microprocessor ICs |
I2C; USB |
.5 mm |
S-XQCC-N44 |
3 |
Not Qualified |
||||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
MULTIFUNCTION PERIPHERAL |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
3/5,5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC68,.32SQ,16 |
3 V |
85 Cel |
-40 Cel |
QUAD |
.8 mm |
1024 |
8 mm |
NO |
24 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
8 mm |
CMOS |
78 mA |
3.3 V |
Other Microprocessor ICs |
I2C; USB |
.4 mm |
S-XQCC-N68 |
Not Qualified |
18 |
|||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
MULTIFUNCTION PERIPHERAL |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
3/3.3,5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC68,.32SQ,16 |
2.7 V |
85 Cel |
-40 Cel |
QUAD |
.8 mm |
1024 |
8 mm |
OPERATES BETWEEN 3 TO 3.6 V WHEN USB IS USED |
NO |
24 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
8 mm |
CMOS |
35 mA |
3 V |
Other Microprocessor ICs |
I2C; USB |
.4 mm |
S-XQCC-N68 |
Not Qualified |
|||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
MULTIFUNCTION PERIPHERAL |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
3/3.3,5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC68,.32SQ,16 |
2.7 V |
85 Cel |
-40 Cel |
QUAD |
.8 mm |
1024 |
8 mm |
OPERATES BETWEEN 3 TO 3.6 V WHEN USB IS USED |
NO |
24 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
8 mm |
CMOS |
35 mA |
3 V |
Other Microprocessor ICs |
I2C; USB |
.4 mm |
S-XQCC-N68 |
Not Qualified |
|||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
MULTIFUNCTION PERIPHERAL |
INDUSTRIAL |
NO LEAD |
44 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
3/3.3,5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC44,.28SQ,20 |
2.7 V |
85 Cel |
-40 Cel |
QUAD |
.8 mm |
1024 |
7 mm |
OPERATES BETWEEN 3 TO 3.6 V WHEN USB IS USED |
NO |
24 MHz |
7 mm |
CMOS |
35 mA |
3 V |
Other Microprocessor ICs |
I2C; USB |
.5 mm |
S-XQCC-N44 |
3 |
Not Qualified |
Multi-functional peripherals (MFPs) are devices that combine several different functions, such as printing, scanning, copying, and faxing, into a single piece of equipment. These devices are often used in office settings to streamline workflows and reduce the need for multiple pieces of equipment.
MFPs typically come with a range of features and capabilities, including high-quality printing and scanning, fast copying and faxing, and the ability to handle large volumes of documents. They may also offer additional features, such as double-sided printing, wireless connectivity, and cloud-based printing and scanning.
One of the key benefits of MFPs is their ability to save space and reduce clutter in an office environment. By combining several different functions into a single device, MFPs eliminate the need for separate printers, scanners, copiers, and fax machines, freeing up valuable space and reducing costs.
In addition to their space-saving benefits, MFPs also offer enhanced efficiency and productivity. With the ability to print, scan, copy, and fax all from a single device, users can complete tasks quickly and easily, without the need to switch between different pieces of equipment.