Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Ultraviolet Erasable | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | ROM Bits Size | No. of Timers | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | JESD-609 Code | Maximum Standby Current | On Chip Program ROM Width | No. of I/O Lines | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Cypress Semiconductor |
INDUSTRIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.25 V |
0 |
8 |
2.7/5 |
IN-LINE |
DIP20,.3 |
4.75 V |
85 Cel |
M8C |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
4.826 mm |
4096 |
256 |
7.62 mm |
ALSO OPERATES AT 2.7V AND 3.3V SUPPLY |
NO |
0 |
24.6 MHz |
40 |
260 |
25.527 mm |
256 |
CMOS |
8 mA |
5 V |
Microcontrollers |
FLASH |
USB |
2.54 mm |
R-PDIP-T20 |
1 |
Not Qualified |
24 rpm |
e4 |
16 |
||||||||||||||||||||||||
|
Cypress Semiconductor |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
3/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC68,.32SQ,16 |
2.7 V |
85 Cel |
-40 Cel |
N |
QUAD |
1 mm |
16384 |
8 mm |
NO |
25 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
8 mm |
131072 Bits |
CMOS |
5 V |
Other Microprocessor ICs |
I2C; USB |
.4 mm |
S-XQCC-N68 |
Not Qualified |
46 |
|||||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
INDUSTRIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.25 V |
0 |
8 |
2.7/5 |
SMALL OUTLINE |
SOP20,.4 |
4.75 V |
85 Cel |
M8C |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2.67 mm |
4096 |
256 |
7.505 mm |
ALSO OPERATES AT 2.7V AND 3.3V SUPPLY |
NO |
0 |
24.6 MHz |
20 |
260 |
12.8265 mm |
256 |
CMOS |
8 mA |
5 V |
Microcontrollers |
FLASH |
USB |
1.27 mm |
R-PDSO-G20 |
3 |
Not Qualified |
24 rpm |
e4 |
16 |
||||||||||||||||||||||||
|
Cypress Semiconductor |
INDUSTRIAL |
BALL |
68 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.71 V |
85 Cel |
-40 Cel |
BOTTOM |
.55 mm |
8192 |
3.52 mm |
YES |
48 MHz |
3.91 mm |
CMOS |
1.8 V |
I2C |
.4 mm |
R-PBGA-B68 |
36 |
|||||||||||||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
OTHER |
NO LEAD |
42 |
HQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG |
2.7 V |
45 Cel |
5 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
2.46 mm |
1024 |
8.3 mm |
SEATED HT-CALCULATED |
NO |
25.2 MHz |
20 |
260 |
8.3 mm |
CMOS |
3.3 V |
I2C; USB |
.5 mm |
S-PQCC-N42 |
3 |
Not Qualified |
e4 |
28 |
||||||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
COMMERCIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
0 |
8 |
2.4/3.6 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
2.7 V |
70 Cel |
M8C |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
8192 |
512 |
5 mm |
IT ALSO OPERATES AT 2.4V AT 93KHZ |
NO |
0 |
12 MHz |
40 |
260 |
5 mm |
512 |
CMOS |
2 mA |
3 V |
Microcontrollers |
FLASH |
I2C; USB |
.5 mm |
S-XQCC-N32 |
3 |
Not Qualified |
24.6 rpm |
e4 |
28 |
||||||||||||||||||||||||
|
Cypress Semiconductor |
INDUSTRIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
0 |
1.8/5 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
1.71 V |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
N |
QUAD |
1.6 mm |
32768 |
14 mm |
YES |
0 |
40 MHz |
40 |
260 |
14 mm |
65536 Bits |
CMOS |
1.8 V |
Other Microprocessor ICs |
.5 mm |
S-PQFP-G100 |
3 |
Not Qualified |
e4 |
72 |
|||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
3/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC68,.32SQ,16 |
2.7 V |
85 Cel |
-40 Cel |
N |
QUAD |
1 mm |
8192 |
8 mm |
NO |
25 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
8 mm |
524288 Bits |
CMOS |
5 V |
Other Microprocessor ICs |
I2C; USB |
.4 mm |
S-XQCC-N68 |
Not Qualified |
46 |
|||||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
3/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC68,.32SQ,16 |
2.7 V |
85 Cel |
-40 Cel |
N |
QUAD |
1 mm |
8192 |
8 mm |
NO |
25 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
8 mm |
65536 Bits |
CMOS |
5 V |
Other Microprocessor ICs |
I2C; USB |
.4 mm |
S-XQCC-N68 |
Not Qualified |
46 |
|||||||||||||||||||||||||||||||||||
Cypress Semiconductor |
INDUSTRIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.25 V |
0 |
8 |
3.3/5 |
IN-LINE |
DIP20,.3 |
3 V |
85 Cel |
M8C |
-40 Cel |
TIN LEAD |
DUAL |
4.826 mm |
4096 |
256 |
7.62 mm |
NO |
0 |
24.24 MHz |
25.527 mm |
256 |
CMOS |
8 mA |
3.3 V |
Microcontrollers |
FLASH |
2.54 mm |
R-PDIP-T20 |
Not Qualified |
24 rpm |
e0 |
16 |
||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.25 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
4.75 V |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
1 mm |
512 |
8 mm |
IT ALSO OPERATES 93KHZ AT 3 V |
NO |
0 |
24 MHz |
8 mm |
CMOS |
5 V |
USB |
.5 mm |
S-XQCC-N56 |
3 |
Not Qualified |
e3 |
49 |
||||||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
INDUSTRIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.25 V |
0 |
8 |
2.7/5 |
IN-LINE |
DIP28,.3 |
4.75 V |
85 Cel |
M8C |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
4.82 mm |
4096 |
256 |
7.62 mm |
ALSO OPERATES AT 2.7V AND 3.3V SUPPLY |
NO |
0 |
24.6 MHz |
40 |
260 |
34.67 mm |
256 |
CMOS |
8 mA |
5 V |
Microcontrollers |
FLASH |
USB |
2.54 mm |
R-PDIP-T28 |
1 |
Not Qualified |
24 rpm |
e4 |
24 |
||||||||||||||||||||||||
|
Cypress Semiconductor |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
QUAD |
.6 mm |
8192 |
7 mm |
YES |
48 MHz |
7 mm |
CMOS |
1.8 V |
I2C |
.4 mm |
S-XQCC-N56 |
36 |
|||||||||||||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
INDUSTRIAL |
GULL WING |
44 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
0 |
8 |
3.3/5 |
FLATPACK, LOW PROFILE |
QFP44,.47SQ,32 |
4.75 V |
85 Cel |
M8C |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
1.6 mm |
16384 |
512 |
10 mm |
ALSO OPERATES AT 3V MINIMUM SUPPLY |
NO |
0 |
24 MHz |
20 |
260 |
10 mm |
1024 |
CMOS |
14 mA |
5 V |
Microcontrollers |
FLASH |
USB |
.8 mm |
S-PQFP-G44 |
3 |
Not Qualified |
24 rpm |
e4 |
40 |
||||||||||||||||||||||||
|
Cypress Semiconductor |
INDUSTRIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.25 V |
0 |
8 |
3.3/5 |
IN-LINE |
DIP28,.3 |
4.75 V |
85 Cel |
M8C |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
4.82 mm |
32768 |
1024 |
7.62 mm |
ALSO OPERATES AT 3V SUPPLY |
NO |
0 |
24 MHz |
40 |
260 |
34.67 mm |
2048 |
CMOS |
14 mA |
5 V |
Microcontrollers |
FLASH |
2.54 mm |
R-PDIP-T28 |
1 |
Not Qualified |
24 rpm |
e4 |
24 |
|||||||||||||||||||||||||
Cypress Semiconductor |
CMOS |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.6 mm |
8192 |
7 mm |
YES |
48 MHz |
7 mm |
CMOS |
1.8 V |
I2C |
.4 mm |
S-XQCC-N56 |
3 |
e4 |
36 |
||||||||||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
QUAD |
.6 mm |
8192 |
7 mm |
YES |
48 MHz |
7 mm |
CMOS |
1.8 V |
I2C |
.4 mm |
S-XQCC-N56 |
36 |
|||||||||||||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
8 |
1.8/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
1.71 V |
85 Cel |
M8C |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
1 mm |
16384 |
1024 |
7 mm |
NO |
0 |
25.2 MHz |
20 |
260 |
7 mm |
2048 |
CMOS |
4 mA |
3 V |
Microcontrollers |
FLASH |
USB |
.5 mm |
S-XQCC-N48 |
3 |
Not Qualified |
25.2 rpm |
e4 |
36 |
|||||||||||||||||||||||||
|
Cypress Semiconductor |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
8 |
1.8/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
1.71 V |
85 Cel |
M8C |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
1 mm |
32768 |
1024 |
7 mm |
NO |
0 |
25.2 MHz |
20 |
260 |
7 mm |
2048 |
CMOS |
4 mA |
3 V |
Microcontrollers |
FLASH |
USB |
.5 mm |
S-XQCC-N48 |
3 |
Not Qualified |
25.2 rpm |
e4 |
36 |
|||||||||||||||||||||||||
|
Cypress Semiconductor |
INDUSTRIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.25 V |
0 |
3.3/5 |
SMALL OUTLINE |
SOP20,.4 |
3 V |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
N |
DUAL |
2.667 mm |
256 |
7.505 mm |
NO |
0 |
.032768 MHz |
20 |
260 |
12.8265 mm |
8192 Bits |
CMOS |
3.3 V |
Other Microprocessor ICs |
1.27 mm |
R-PDSO-G20 |
3 |
Not Qualified |
e4 |
.000005 Amp |
16 |
||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
INDUSTRIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.25 V |
0 |
8 |
3.3/5 |
IN-LINE |
DIP8,.3 |
4.75 V |
85 Cel |
M8C |
-40 Cel |
MATTE TIN |
DUAL |
4.572 mm |
16384 |
256 |
7.62 mm |
ALSO OPERATES AT 3V WITH 93KHZ |
NO |
0 |
24 MHz |
260 |
9.779 mm |
256 |
CMOS |
8 mA |
5 V |
Microcontrollers |
FLASH |
I2C; USB |
2.54 mm |
R-PDIP-T8 |
1 |
Not Qualified |
24 rpm |
e3 |
6 |
|||||||||||||||||||||||||
|
Cypress Semiconductor |
INDUSTRIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.25 V |
0 |
8 |
3.3/5 |
SMALL OUTLINE |
SOP20,.4 |
4.75 V |
85 Cel |
M8C |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2.667 mm |
16384 |
256 |
7.505 mm |
ALSO OPERATES AT 3V WITH 93KHZ |
NO |
0 |
24 MHz |
20 |
260 |
12.8265 mm |
256 |
CMOS |
8 mA |
5 V |
Microcontrollers |
FLASH |
I2C; USB |
1.27 mm |
R-PDSO-G20 |
3 |
Not Qualified |
24 rpm |
e4 |
16 |
||||||||||||||||||||||||
|
Cypress Semiconductor |
INDUSTRIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.25 V |
0 |
8 |
3.3/5 |
IN-LINE |
DIP28,.3 |
4.75 V |
85 Cel |
M8C |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
4.82 mm |
16384 |
256 |
7.62 mm |
ALSO OPERATES AT 3V WITH 93KHZ |
NO |
0 |
24 MHz |
40 |
260 |
34.67 mm |
256 |
CMOS |
8 mA |
5 V |
Microcontrollers |
FLASH |
I2C; USB |
2.54 mm |
R-PDIP-T28 |
1 |
Not Qualified |
24 rpm |
e4 |
24 |
||||||||||||||||||||||||
|
Cypress Semiconductor |
INDUSTRIAL |
GULL WING |
28 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.25 V |
0 |
8 |
3.3/5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP28,.3 |
4.75 V |
85 Cel |
M8C |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2 mm |
32768 |
1024 |
5.3 mm |
ALSO OPERATES AT 3V SUPPLY |
NO |
0 |
24 MHz |
20 |
260 |
10.2 mm |
2048 |
CMOS |
14 mA |
5 V |
Microcontrollers |
FLASH |
USB |
.65 mm |
R-PDSO-G28 |
3 |
Not Qualified |
24 rpm |
e4 |
24 |
||||||||||||||||||||||||
|
Cypress Semiconductor |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
1.8/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC68,.32SQ,16 |
1.71 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
N |
QUAD |
1 mm |
32768 |
8 mm |
YES |
0 |
40 MHz |
260 |
8 mm |
65536 Bits |
CMOS |
1.8 V |
Other Microprocessor ICs |
.4 mm |
S-XQCC-N68 |
3 |
Not Qualified |
e4 |
48 |
||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
3/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC68,.32SQ,16 |
2.7 V |
85 Cel |
-40 Cel |
N |
QUAD |
1 mm |
32768 |
8 mm |
NO |
25 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
8 mm |
2097152 Bits |
CMOS |
5 V |
Other Microprocessor ICs |
I2C; USB |
.4 mm |
S-XQCC-N68 |
Not Qualified |
46 |
|||||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
INDUSTRIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
0 |
1.8/5 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
1.71 V |
105 Cel |
-40 Cel |
N |
QUAD |
1.6 mm |
32768 |
14 mm |
YES |
0 |
33 MHz |
14 mm |
524288 Bits |
CMOS |
3.3 V |
Other uPs/uCs/Peripheral ICs |
I2C; I2S, LIN; PS/2; SPI, USB |
.5 mm |
S-PQFP-G100 |
Not Qualified |
62 |
|||||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
QUAD |
.6 mm |
8192 |
7 mm |
YES |
48 MHz |
7 mm |
CMOS |
1.8 V |
I2C |
.4 mm |
S-XQCC-N56 |
36 |
|||||||||||||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
QUAD |
.6 mm |
16384 |
7 mm |
NO |
0 |
48 MHz |
7 mm |
CMOS |
3.3 V |
I2C; I2S; IDE; IRDA; LIN; SPI; UART |
.4 mm |
S-XQCC-N56 |
36 |
|||||||||||||||||||||||||||||||||||||||||
Cypress Semiconductor |
INDUSTRIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.25 V |
0 |
3.3/5 |
IN-LINE |
DIP8,.3 |
3 V |
85 Cel |
-40 Cel |
TIN LEAD |
N |
DUAL |
4.572 mm |
256 |
7.62 mm |
NO |
0 |
.032768 MHz |
9.779 mm |
4096 Bits |
CMOS |
3.3 V |
Other Microprocessor ICs |
2.54 mm |
R-PDIP-T8 |
Not Qualified |
e0 |
.000005 Amp |
6 |
||||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
INDUSTRIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.25 V |
0 |
8 |
3.3/5 |
SMALL OUTLINE |
SOP20,.4 |
4.75 V |
85 Cel |
M8C |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2.667 mm |
16384 |
256 |
7.505 mm |
ALSO OPERATES AT 3V WITH 93KHZ |
NO |
0 |
24 MHz |
20 |
260 |
12.8265 mm |
256 |
CMOS |
8 mA |
5 V |
Microcontrollers |
FLASH |
I2C; USB |
1.27 mm |
R-PDSO-G20 |
3 |
Not Qualified |
24 rpm |
e4 |
16 |
||||||||||||||||||||||||
|
Cypress Semiconductor |
INDUSTRIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1.8/5 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
1.71 V |
85 Cel |
-40 Cel |
Matte Tin (Sn) |
N |
QUAD |
1.6 mm |
4096 |
14 mm |
YES |
33 MHz |
30 |
260 |
14 mm |
262144 Bits |
CMOS |
3.3 V |
Other uPs/uCs/Peripheral ICs |
I2C; USB; PS/2; 8051 |
.5 mm |
S-PQFP-G100 |
3 |
Not Qualified |
e3 |
72 |
Multi-functional peripherals (MFPs) are devices that combine several different functions, such as printing, scanning, copying, and faxing, into a single piece of equipment. These devices are often used in office settings to streamline workflows and reduce the need for multiple pieces of equipment.
MFPs typically come with a range of features and capabilities, including high-quality printing and scanning, fast copying and faxing, and the ability to handle large volumes of documents. They may also offer additional features, such as double-sided printing, wireless connectivity, and cloud-based printing and scanning.
One of the key benefits of MFPs is their ability to save space and reduce clutter in an office environment. By combining several different functions into a single device, MFPs eliminate the need for separate printers, scanners, copiers, and fax machines, freeing up valuable space and reducing costs.
In addition to their space-saving benefits, MFPs also offer enhanced efficiency and productivity. With the ability to print, scan, copy, and fax all from a single device, users can complete tasks quickly and easily, without the need to switch between different pieces of equipment.