NXP Semiconductors Multi-functional Peripherals 798

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Address Bus Width	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of Serial I/Os	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code	No. of I/O Lines
LS1017ASE7NQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		14	GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel	0 Cel		BOTTOM	2.61 mm	262144	17 mm	YES	32		40	260	17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm	S-PBGA-B448	3		68
LS1017ACE7NQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	AEC-Q100	14	GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	85 Cel	-40 Cel		BOTTOM	2.61 mm	262144	17 mm	YES	32				17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm	S-PBGA-B448			68
LS1017AXN7HQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		14	GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel	-40 Cel		BOTTOM	2.61 mm	262144	17 mm	YES	32				17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm	S-PBGA-B448			68
MIMX8MQ7DVAJZAB	NXP Semiconductors
MCIMX6DP4AVT1AAR	NXP Semiconductors																	TIN SILVER COPPER								40	260									3
LS1024ASN7ELA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	COMMERCIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		26	GRID ARRAY, FINE PITCH	BGA625,25X25,32	1.045 V	70 Cel	-10 Cel		BOTTOM	2.67 mm		21 mm	YES	0	650 MHz	30	250	21 mm	CMOS	1200 mA	1.1 V			.8 mm	S-PBGA-B625	3
MIMX8UX6AVOFZAC	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	AUTOMOTIVE	BALL	417	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, FINE PITCH	BGA417,29X29,32	1.05 V	125 Cel	-40 Cel		BOTTOM	2.73 mm	512K	17 mm	YES		24 MHz	40	260	17 mm	CMOS	5000 mA	1.1 V		CAN(3), SAI(4), SPI(4), UART(6)	.8 mm	S-PBGA-B417	3		75
LS1017AXE7PNA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		14	GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel	-40 Cel		BOTTOM	2.61 mm	262144	17 mm	YES	32				17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm	S-PBGA-B448			68
LS1017AXE7NNA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		14	GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel	-40 Cel		BOTTOM	2.61 mm	262144	17 mm	YES	32				17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm	S-PBGA-B448			68
LS1026ASE8M1A	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		14	GRID ARRAY, FINE PITCH		.87 V				BOTTOM	2.61 mm		23 mm	YES	64				23 mm	CMOS		.9 V		I2C, PCI, SPI, UART, USB	.8 mm	S-PBGA-B780			76
LS1027ACN7KQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	AEC-Q100	14	GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	85 Cel	-40 Cel		BOTTOM	2.61 mm	262144	17 mm	YES	32				17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm	S-PBGA-B448			68
LS1017ACE7NNA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	AEC-Q100	14	GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	85 Cel	-40 Cel		BOTTOM	2.61 mm	262144	17 mm	YES	32				17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm	S-PBGA-B448			68
MCIMX6QP6AVT8ABR	NXP Semiconductors																	TIN SILVER COPPER								40	260									3	e1
LS1017AXE7HNA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		14	GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel	-40 Cel		BOTTOM	2.61 mm	262144	17 mm	YES	32		40	260	17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm	S-PBGA-B448	3		68
MCIMX6D7CZK08AE	NXP Semiconductors																	TIN SILVER COPPER								40	260									3	e1
LS1017AXE7KQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		14	GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel	-40 Cel		BOTTOM	2.61 mm	262144	17 mm	YES	32		40	260	17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm	S-PBGA-B448	3		68
LS1027ACE7PNA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	AEC-Q100	14	GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	85 Cel	-40 Cel		BOTTOM	2.61 mm	262144	17 mm	YES	32				17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm	S-PBGA-B448			68
MCIMX6DP5EVT2AA	NXP Semiconductors																	TIN SILVER COPPER								40	260									3	e1
LS1026ASE8Q1A	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		14	GRID ARRAY, FINE PITCH		.97 V			TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm	YES	64		30	250	23 mm	CMOS		1 V		I2C, PCI, SPI, UART, USB	.8 mm	S-PBGA-B780	3	e1	76
LS1026AXE8Q1A	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		14	GRID ARRAY, FINE PITCH		.97 V			TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm	YES	64		30	250	23 mm	CMOS		1 V		I2C, PCI, SPI, UART, USB	.8 mm	S-PBGA-B780	3	e1	76
LS1017ASN7HQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		14	GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel	0 Cel		BOTTOM	2.61 mm	262144	17 mm	YES	32				17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm	S-PBGA-B448			68
LS1046ASN8T1A	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		14	GRID ARRAY, FINE PITCH		.97 V			TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm	YES	64		30	250	23 mm	CMOS		1 V		I2C, PCI, SPI, UART, USB	.8 mm	S-PBGA-B780	3	e1	76
LS1017ACN7PNA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	AEC-Q100	14	GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	85 Cel	-40 Cel		BOTTOM	2.61 mm	262144	17 mm	YES	32				17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm	S-PBGA-B448			68
LS1017ACN7PQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	AEC-Q100	14	GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	85 Cel	-40 Cel		BOTTOM	2.61 mm	262144	17 mm	YES	32				17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm	S-PBGA-B448			68
LS1026ASN8PQA	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		14	GRID ARRAY, FINE PITCH		.97 V				BOTTOM	2.61 mm		23 mm	YES	64				23 mm	CMOS		1 V		I2C, PCI, SPI, UART, USB	.8 mm	S-PBGA-B780			76
LS1027AYN7HNA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	AUTOMOTIVE	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		14	GRID ARRAY, FINE PITCH	BGA448,30X30,30	.87 V	125 Cel	-40 Cel		BOTTOM	2.61 mm	262144	17 mm	YES	32				17 mm	CMOS		.9 V	8	I2C, SAI, SPI, UART	.75 mm	S-PBGA-B448			68
LS1017AYN7KQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	AUTOMOTIVE	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		14	GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	125 Cel	-40 Cel		BOTTOM	2.61 mm	262144	17 mm	YES	32				17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm	S-PBGA-B448			68
MCIMX7D2DVK12SDR	NXP Semiconductors
MCIMX6DP6AVT1ABR	NXP Semiconductors
MCIMX6X3CVK08ACR	NXP Semiconductors																									40	260									3

Multi-functional Peripherals

Multi-functional peripherals (MFPs) are devices that combine several different functions, such as printing, scanning, copying, and faxing, into a single piece of equipment. These devices are often used in office settings to streamline workflows and reduce the need for multiple pieces of equipment.

MFPs typically come with a range of features and capabilities, including high-quality printing and scanning, fast copying and faxing, and the ability to handle large volumes of documents. They may also offer additional features, such as double-sided printing, wireless connectivity, and cloud-based printing and scanning.

One of the key benefits of MFPs is their ability to save space and reduce clutter in an office environment. By combining several different functions into a single device, MFPs eliminate the need for separate printers, scanners, copiers, and fax machines, freeing up valuable space and reducing costs.

In addition to their space-saving benefits, MFPs also offer enhanced efficiency and productivity. With the ability to print, scan, copy, and fax all from a single device, users can complete tasks quickly and easily, without the need to switch between different pieces of equipment.