Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Ultraviolet Erasable | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | ROM Bits Size | No. of Timers | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | JESD-609 Code | Maximum Standby Current | On Chip Program ROM Width | No. of I/O Lines | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Renesas Electronics |
COMMERCIAL |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.465 V |
32 |
FLATPACK, FINE PITCH |
3.135 V |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
4.1 mm |
28 mm |
YES |
32 |
75 MHz |
28 mm |
CMOS |
3.3 V |
PCI; RC32364; RC32134 |
.5 mm |
S-PQFP-G208 |
Not Qualified |
e3 |
12 |
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Renesas Electronics |
BALL |
387 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
TIN SILVER COPPER |
BOTTOM |
2.48 mm |
35 mm |
35 mm |
CMOS |
1.27 mm |
S-PBGA-B387 |
Not Qualified |
e1 |
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Renesas Electronics |
MULTIFUNCTION PERIPHERAL |
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Renesas Electronics |
MULTIFUNCTION PERIPHERAL |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
COMMERCIAL |
GULL WING |
208 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.465 V |
26 |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP208,1.2SQ,20 |
3.135 V |
70 Cel |
0 Cel |
QUAD |
1.7 mm |
256 |
28 mm |
NO |
16 |
80 MHz |
28 mm |
CMOS |
3.3 V |
Bus Controllers |
VR4100 |
.5 mm |
S-PQFP-G208 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MULTIFUNCTION PERIPHERAL |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
INDUSTRIAL |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.465 V |
32 |
FLATPACK, FINE PITCH |
3.135 V |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
4.1 mm |
28 mm |
YES |
32 |
75 MHz |
28 mm |
CMOS |
3.3 V |
PCI; RC32364; RC32134 |
.5 mm |
S-PQFP-G208 |
Not Qualified |
e3 |
12 |
|||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
BALL |
387 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
TIN SILVER COPPER |
BOTTOM |
2.48 mm |
27 mm |
27 mm |
CMOS |
1.27 mm |
S-PBGA-B387 |
Not Qualified |
e1 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
COMMERCIAL |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.465 V |
32 |
FLATPACK, FINE PITCH |
3.135 V |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
4.1 mm |
28 mm |
YES |
32 |
75 MHz |
28 mm |
CMOS |
3.3 V |
PCI; RC32364; RC32134 |
.5 mm |
S-PQFP-G208 |
Not Qualified |
e3 |
12 |
|||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
BALL |
387 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
TIN SILVER COPPER |
BOTTOM |
2.48 mm |
35 mm |
35 mm |
CMOS |
1.27 mm |
S-PBGA-B387 |
Not Qualified |
e1 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
INDUSTRIAL |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.465 V |
32 |
FLATPACK, FINE PITCH |
3.135 V |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
4.1 mm |
28 mm |
YES |
32 |
75 MHz |
28 mm |
CMOS |
3.3 V |
PCI; RC32364; RC32134 |
.5 mm |
S-PQFP-G208 |
Not Qualified |
e3 |
12 |
Multi-functional peripherals (MFPs) are devices that combine several different functions, such as printing, scanning, copying, and faxing, into a single piece of equipment. These devices are often used in office settings to streamline workflows and reduce the need for multiple pieces of equipment.
MFPs typically come with a range of features and capabilities, including high-quality printing and scanning, fast copying and faxing, and the ability to handle large volumes of documents. They may also offer additional features, such as double-sided printing, wireless connectivity, and cloud-based printing and scanning.
One of the key benefits of MFPs is their ability to save space and reduce clutter in an office environment. By combining several different functions into a single device, MFPs eliminate the need for separate printers, scanners, copiers, and fax machines, freeing up valuable space and reducing costs.
In addition to their space-saving benefits, MFPs also offer enhanced efficiency and productivity. With the ability to print, scan, copy, and fax all from a single device, users can complete tasks quickly and easily, without the need to switch between different pieces of equipment.