Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Ultraviolet Erasable | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | ROM Bits Size | No. of Timers | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | JESD-609 Code | Maximum Standby Current | On Chip Program ROM Width | No. of I/O Lines | Maximum Access Time |
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Texas Instruments |
MULTIFUNCTION PERIPHERAL |
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|
Texas Instruments |
AUTOMOTIVE |
BALL |
538 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.2 V |
AEC-Q100 |
16 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.11 V |
125 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.298 mm |
512K |
17 mm |
YES |
32 |
32 MHz |
30 |
260 |
17 mm |
CMOS |
1.15 V |
CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB |
.65 mm |
S-PBGA-B538 |
3 |
600 rpm |
e1 |
186 |
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Texas Instruments |
MULTIFUNCTION PERIPHERAL |
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Texas Instruments |
MULTIFUNCTION PERIPHERAL |
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Texas Instruments |
MULTIFUNCTION PERIPHERAL |
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Texas Instruments |
CMOS |
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|
Texas Instruments |
MICROPROCESSOR, RISC |
AUTOMOTIVE |
BALL |
760 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
1.2 V |
AEC-Q100 |
16 |
32 |
GRID ARRAY, FINE PITCH |
1.11 V |
125 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
2.96 mm |
2.5M |
23 mm |
YES |
32 |
38.4 MHz |
30 |
250 |
23 mm |
CMOS |
1.15 V |
CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB |
.8 mm |
FLOATING POINT |
S-PBGA-B760 |
3 |
500 rpm |
YES |
e1 |
247 |
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Texas Instruments |
MULTIFUNCTION PERIPHERAL |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
AUTOMOTIVE |
BALL |
784 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.2 V |
AEC-Q100 |
16 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.11 V |
125 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.63 mm |
2.5M |
23 mm |
YES |
32 |
38.4 MHz |
30 |
250 |
23 mm |
CMOS |
1.15 V |
CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB |
.8 mm |
S-PBGA-B784 |
3 |
e1 |
247 |
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|
Texas Instruments |
MULTIFUNCTION PERIPHERAL |
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Texas Instruments |
MULTIFUNCTION PERIPHERAL |
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Texas Instruments |
MULTIFUNCTION PERIPHERAL |
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|
Texas Instruments |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
515 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.4175 V |
26 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.2825 V |
105 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1 mm |
64K |
14 mm |
YES |
16 |
38.4 MHz |
30 |
260 |
14 mm |
CMOS |
1.35 V |
CAN; I2C; IRDA; PCI; SPI; UART; USB |
.5 mm |
FIXED POINT |
S-PBGA-B515 |
3 |
600 rpm |
YES |
e1 |
188 |
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|
Texas Instruments |
MICROPROCESSOR, RISC |
OTHER |
BALL |
515 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.4175 V |
26 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.2825 V |
90 Cel |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
.9 mm |
64K |
12 mm |
YES |
16 |
38.4 MHz |
NOT SPECIFIED |
260 |
12 mm |
CMOS |
1.35 V |
CAN; I2C; IRDA; PCI; SPI; UART; USB |
.5 mm |
FIXED POINT |
S-PBGA-B515 |
3 |
720 rpm |
YES |
e1 |
188 |
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Texas Instruments |
MULTIFUNCTION PERIPHERAL |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
AUTOMOTIVE |
BALL |
538 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.2 V |
AEC-Q100 |
16 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.11 V |
125 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.298 mm |
512K |
17 mm |
YES |
32 |
38.4 MHz |
30 |
260 |
17 mm |
CMOS |
1.15 V |
CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB |
.65 mm |
S-PBGA-B538 |
3 |
800 rpm |
e1 |
186 |
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|
Texas Instruments |
MULTIFUNCTION PERIPHERAL |
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|
Texas Instruments |
MULTIFUNCTION PERIPHERAL |
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|
Texas Instruments |
MICROPROCESSOR, RISC |
AUTOMOTIVE |
BALL |
760 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
1.2 V |
AEC-Q100 |
16 |
32 |
GRID ARRAY, FINE PITCH |
1.11 V |
125 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
2.96 mm |
2.5M |
23 mm |
YES |
32 |
38.4 MHz |
30 |
250 |
23 mm |
CMOS |
1.15 V |
CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB |
.8 mm |
FLOATING POINT |
S-PBGA-B760 |
3 |
1176 rpm |
YES |
e1 |
247 |
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|
Texas Instruments |
AUTOMOTIVE |
BALL |
784 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.2 V |
AEC-Q100 |
16 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.11 V |
125 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.63 mm |
2.5M |
23 mm |
YES |
32 |
38.4 MHz |
30 |
250 |
23 mm |
CMOS |
1.15 V |
CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB |
.8 mm |
S-PBGA-B784 |
3 |
e1 |
247 |
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|
Texas Instruments |
AUTOMOTIVE |
BALL |
784 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.2 V |
AEC-Q100 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.11 V |
125 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.63 mm |
2.5M |
23 mm |
YES |
64 |
38.4 MHz |
30 |
250 |
23 mm |
CMOS |
1.15 V |
CAN; ETHERNET; I2C; SPI; UART; USB |
.8 mm |
S-PBGA-B784 |
3 |
1800 rpm |
e1 |
247 |
||||||||||||||||||||||||||||||||||
|
Texas Instruments |
AUTOMOTIVE |
BALL |
538 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.2 V |
AEC-Q100 |
16 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.11 V |
125 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.298 mm |
512K |
17 mm |
YES |
32 |
38.4 MHz |
30 |
260 |
17 mm |
CMOS |
1.15 V |
CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB |
.65 mm |
S-PBGA-B538 |
3 |
800 rpm |
e1 |
186 |
||||||||||||||||||||||||||||||||||
|
Texas Instruments |
AUTOMOTIVE |
BALL |
784 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.2 V |
AEC-Q100 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.11 V |
125 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.63 mm |
2.5M |
23 mm |
YES |
64 |
38.4 MHz |
30 |
250 |
23 mm |
CMOS |
1.15 V |
CAN; ETHERNET; I2C; SPI; UART; USB |
.8 mm |
S-PBGA-B784 |
3 |
1800 rpm |
e1 |
247 |
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|
Texas Instruments |
MULTIFUNCTION PERIPHERAL |
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|
Texas Instruments |
MULTIFUNCTION PERIPHERAL |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR, RISC |
AUTOMOTIVE |
BALL |
760 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
1.2 V |
8 |
AEC-Q100 |
16 |
GRID ARRAY, FINE PITCH |
1.11 V |
125 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
2.96 mm |
512K |
23 mm |
YES |
32 |
38.4 MHz |
30 |
250 |
23 mm |
CMOS |
1.15 V |
CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB |
.8 mm |
FIXED POINT |
S-PBGA-B760 |
3 |
1176 rpm |
YES |
e1 |
215 |
|||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR, RISC |
AUTOMOTIVE |
BALL |
760 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
1.2 V |
AEC-Q100 |
16 |
GRID ARRAY, FINE PITCH |
1.11 V |
125 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
2.96 mm |
512K |
23 mm |
YES |
32 |
27 MHz |
30 |
250 |
23 mm |
CMOS |
1.15 V |
CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB |
.8 mm |
FIXED POINT |
S-PBGA-B760 |
3 |
800 rpm |
YES |
e1 |
215 |
||||||||||||||||||||||||||||||
|
Texas Instruments |
AUTOMOTIVE |
BALL |
538 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.2 V |
AEC-Q100 |
16 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.11 V |
125 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.298 mm |
512K |
17 mm |
YES |
32 |
38.4 MHz |
30 |
260 |
17 mm |
CMOS |
1.15 V |
CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB |
.65 mm |
S-PBGA-B538 |
3 |
300 rpm |
e1 |
186 |
||||||||||||||||||||||||||||||||||
Texas Instruments |
MULTIFUNCTION PERIPHERAL |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR, RISC |
AUTOMOTIVE |
BALL |
760 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.2 V |
AEC-Q100 |
GRID ARRAY, FINE PITCH |
1.11 V |
125 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
2.96 mm |
2.5M |
23 mm |
YES |
38.4 MHz |
250 |
23 mm |
CMOS |
1.15 V |
CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB |
.8 mm |
S-PBGA-B760 |
3 |
1176 rpm |
e1 |
247 |
Multi-functional peripherals (MFPs) are devices that combine several different functions, such as printing, scanning, copying, and faxing, into a single piece of equipment. These devices are often used in office settings to streamline workflows and reduce the need for multiple pieces of equipment.
MFPs typically come with a range of features and capabilities, including high-quality printing and scanning, fast copying and faxing, and the ability to handle large volumes of documents. They may also offer additional features, such as double-sided printing, wireless connectivity, and cloud-based printing and scanning.
One of the key benefits of MFPs is their ability to save space and reduce clutter in an office environment. By combining several different functions into a single device, MFPs eliminate the need for separate printers, scanners, copiers, and fax machines, freeing up valuable space and reducing costs.
In addition to their space-saving benefits, MFPs also offer enhanced efficiency and productivity. With the ability to print, scan, copy, and fax all from a single device, users can complete tasks quickly and easily, without the need to switch between different pieces of equipment.