1024 Other Function uPs,uCs & Peripheral ICs 42

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Part	Manufacturer	Peripheral IC Type	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Position	Maximum Seated Height	Width	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code
XCVC1352-1MSINBVA1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel	BOTTOM				CMOS	.8 V		S-PBGA-B1024
XCVC1352-2HSINBVA1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	BGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY		.854 V	110 Cel	-40 Cel	BOTTOM				CMOS	.88 V		S-PBGA-B1024
XCVC1352-2LLENBVA1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel	BOTTOM				CMOS	.7 V		S-PBGA-B1024
XCVC1352-1MLINBVA1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel	BOTTOM				CMOS	.8 V		S-PBGA-B1024
XCVC1352-2LSENBVA1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel	BOTTOM				CMOS	.7 V		S-PBGA-B1024
XCVC1352-1MSENBVA1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	100 Cel	0 Cel	BOTTOM				CMOS	.8 V		S-PBGA-B1024
XCVC1352-2MLENBVA1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	0 Cel	BOTTOM				CMOS	.8 V		S-PBGA-B1024
XCVC1352-2MLINBVA1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel	BOTTOM				CMOS	.8 V		S-PBGA-B1024
XCVC1352-1LSINBVA1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel	BOTTOM				CMOS	.7 V		S-PBGA-B1024
XCVC1352-2LLINBVA1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel	BOTTOM				CMOS	.7 V		S-PBGA-B1024
XCVC1352-1LSENBVA1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	100 Cel	0 Cel	BOTTOM				CMOS	.7 V		S-PBGA-B1024
XCVC1352-2MSENBVA1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	0 Cel	BOTTOM				CMOS	.8 V		S-PBGA-B1024
XCVC1352-2MSINBVA1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel	BOTTOM				CMOS	.8 V		S-PBGA-B1024
XCVC1352-1LLINBVA1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel	BOTTOM				CMOS	.7 V		S-PBGA-B1024
XCVM1302-2MLENBVB1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1024,32X32,36	.775 V	110 Cel	0 Cel	BOTTOM	2.94 mm	31 mm	31 mm	CMOS	.8 V	.92 mm	S-PBGA-B1024
XCVM1402-1LSENBVB1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1024,32X32,36	.676 V	100 Cel	0 Cel	BOTTOM	2.94 mm	31 mm	31 mm	CMOS	.7 V	.92 mm	S-PBGA-B1024
XCVM1302-2MSINBVB1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1024,32X32,36	.775 V	110 Cel	-40 Cel	BOTTOM	2.94 mm	31 mm	31 mm	CMOS	.8 V	.92 mm	S-PBGA-B1024
XCVM1302-1LLINBVB1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1024,32X32,36	.676 V	110 Cel	-40 Cel	BOTTOM	2.94 mm	31 mm	31 mm	CMOS	.7 V	.92 mm	S-PBGA-B1024
XCVM1402-2MLINBVB1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1024,32X32,36	.775 V	110 Cel	-40 Cel	BOTTOM	2.94 mm	31 mm	31 mm	CMOS	.8 V	.92 mm	S-PBGA-B1024
XCVM1402-1MSENBVB1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1024,32X32,36	.775 V	100 Cel	0 Cel	BOTTOM	2.94 mm	31 mm	31 mm	CMOS	.8 V	.92 mm	S-PBGA-B1024
XCVM1402-2MSENBVB1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1024,32X32,36	.775 V	110 Cel	0 Cel	BOTTOM	2.94 mm	31 mm	31 mm	CMOS	.8 V	.92 mm	S-PBGA-B1024
XCVM1402-2MLENBVB1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1024,32X32,36	.775 V	110 Cel	0 Cel	BOTTOM	2.94 mm	31 mm	31 mm	CMOS	.8 V	.92 mm	S-PBGA-B1024
XCVM1402-1MLINBVB1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1024,32X32,36	.775 V	110 Cel	-40 Cel	BOTTOM	2.94 mm	31 mm	31 mm	CMOS	.8 V	.92 mm	S-PBGA-B1024
XCVM1402-1MSINBVB1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1024,32X32,36	.775 V	110 Cel	-40 Cel	BOTTOM	2.94 mm	31 mm	31 mm	CMOS	.8 V	.92 mm	S-PBGA-B1024
XCVM1302-1MLINBVB1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1024,32X32,36	.775 V	110 Cel	-40 Cel	BOTTOM	2.94 mm	31 mm	31 mm	CMOS	.8 V	.92 mm	S-PBGA-B1024
XCVM1402-2LSENBVB1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1024,32X32,36	.676 V	110 Cel	0 Cel	BOTTOM	2.94 mm	31 mm	31 mm	CMOS	.7 V	.92 mm	S-PBGA-B1024
XCVM1302-1MSINBVB1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1024,32X32,36	.775 V	110 Cel	-40 Cel	BOTTOM	2.94 mm	31 mm	31 mm	CMOS	.8 V	.92 mm	S-PBGA-B1024
XCVM1302-1MSENBVB1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1024,32X32,36	.775 V	100 Cel	0 Cel	BOTTOM	2.94 mm	31 mm	31 mm	CMOS	.8 V	.92 mm	S-PBGA-B1024
XCVM1402-1LSINBVB1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1024,32X32,36	.676 V	110 Cel	-40 Cel	BOTTOM	2.94 mm	31 mm	31 mm	CMOS	.7 V	.92 mm	S-PBGA-B1024
XCVM1302-1LSENBVB1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1024,32X32,36	.676 V	100 Cel	0 Cel	BOTTOM	2.94 mm	31 mm	31 mm	CMOS	.7 V	.92 mm	S-PBGA-B1024
XCVM1302-2LSENBVB1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1024,32X32,36	.676 V	110 Cel	0 Cel	BOTTOM	2.94 mm	31 mm	31 mm	CMOS	.7 V	.92 mm	S-PBGA-B1024
XCVM1302-2MSENBVB1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1024,32X32,36	.775 V	110 Cel	0 Cel	BOTTOM	2.94 mm	31 mm	31 mm	CMOS	.8 V	.92 mm	S-PBGA-B1024
XCVM1302-2MLINBVB1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1024,32X32,36	.775 V	110 Cel	-40 Cel	BOTTOM	2.94 mm	31 mm	31 mm	CMOS	.8 V	.92 mm	S-PBGA-B1024
XCVM1302-2LLENBVB1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1024,32X32,36	.676 V	110 Cel	0 Cel	BOTTOM	2.94 mm	31 mm	31 mm	CMOS	.7 V	.92 mm	S-PBGA-B1024
XCVM1302-1LSINBVB1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1024,32X32,36	.676 V	110 Cel	-40 Cel	BOTTOM	2.94 mm	31 mm	31 mm	CMOS	.7 V	.92 mm	S-PBGA-B1024
XCVM1402-1LLINBVB1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1024,32X32,36	.676 V	110 Cel	-40 Cel	BOTTOM	2.94 mm	31 mm	31 mm	CMOS	.7 V	.92 mm	S-PBGA-B1024
XCVM1402-2LLENBVB1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1024,32X32,36	.676 V	110 Cel	0 Cel	BOTTOM	2.94 mm	31 mm	31 mm	CMOS	.7 V	.92 mm	S-PBGA-B1024
XCVM1402-2MSINBVB1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1024,32X32,36	.775 V	110 Cel	-40 Cel	BOTTOM	2.94 mm	31 mm	31 mm	CMOS	.8 V	.92 mm	S-PBGA-B1024
XCVM1302-2HSINBVB1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	HBGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY, HEAT SINK/SLUG	BGA1024,32X32,36	.854 V	110 Cel	-40 Cel	BOTTOM	2.94 mm	31 mm	31 mm	CMOS	.88 V	.92 mm	S-PBGA-B1024
XCVM1302-2LLINBVB1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1024,32X32,36	.676 V	110 Cel	-40 Cel	BOTTOM	2.94 mm	31 mm	31 mm	CMOS	.7 V	.92 mm	S-PBGA-B1024
XCVM1402-2LLINBVB1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1024,32X32,36	.676 V	110 Cel	-40 Cel	BOTTOM	2.94 mm	31 mm	31 mm	CMOS	.7 V	.92 mm	S-PBGA-B1024
XCVM1402-2HSINBVB1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	HBGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY, HEAT SINK/SLUG	BGA1024,32X32,36	.854 V	110 Cel	-40 Cel	BOTTOM	2.94 mm	31 mm	31 mm	CMOS	.88 V	.92 mm	S-PBGA-B1024

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.