14 Other Function uPs,uCs & Peripheral ICs 53

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

MCP2221-I/SL

Microchip Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

TS 16949

SMALL OUTLINE

SOP14,.24

3 V

85 Cel

-40 Cel

MATTE TIN

DUAL

1.75 mm

3.9 mm

8.65 mm

CMOS

3.3 V

1.27 mm

R-PDSO-G14

e3

MCP2221-I/ST

Microchip Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

14

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

TS 16949

3.3/5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP14,.25

3 V

85 Cel

-40 Cel

MATTE TIN

DUAL

1.2 mm

4.4 mm

5 mm

CMOS

15 mA

3.3 V

Serial IO/Communication Controllers

.65 mm

R-PDSO-G14

Not Qualified

e3

MCP25050-E/P

Microchip Technology

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

THROUGH-HOLE

14

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5.5 V

TS 16949

8

5

IN-LINE

DIP14,.3

4.5 V

125 Cel

-40 Cel

MATTE TIN

DUAL

4.318 mm

7.62 mm

19.05 mm

CMOS

5 V

Parallel IO Port

2.54 mm

R-PDIP-T14

Not Qualified

e3

MCP2221-I/P

Microchip Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

THROUGH-HOLE

14

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5.5 V

TS 16949

3.3/5

IN-LINE

DIP14,.3

3 V

85 Cel

-40 Cel

MATTE TIN

DUAL

5.334 mm

7.62 mm

19.05 mm

CMOS

15 mA

3.3 V

Serial IO/Communication Controllers

2.54 mm

R-PDIP-T14

Not Qualified

e3

MCP25050-I/P

Microchip Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

THROUGH-HOLE

14

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5.5 V

TS 16949

8

3/5

IN-LINE

DIP14,.3

2.7 V

85 Cel

-40 Cel

MATTE TIN

DUAL

4.318 mm

7.62 mm

260

19.05 mm

CMOS

5 V

Parallel IO Port

2.54 mm

R-PDIP-T14

Not Qualified

e3

MCP25020-I/SL

Microchip Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

TS 16949

8

3/5

SMALL OUTLINE

SOP14,.24

2.7 V

85 Cel

-40 Cel

Matte Tin (Sn)

DUAL

1.75 mm

3.9 mm

260

8.65 mm

CMOS

5 V

Parallel IO Port

1.27 mm

R-PDSO-G14

1

Not Qualified

e3

MCP25050-I/SL

Microchip Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

TS 16949

8

3/5

SMALL OUTLINE

SOP14,.24

2.7 V

85 Cel

-40 Cel

Matte Tin (Sn)

DUAL

1.75 mm

3.9 mm

8.65 mm

CMOS

5 V

Parallel IO Port

1.27 mm

R-PDSO-G14

1

Not Qualified

e3

MCP25020-I/P

Microchip Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

THROUGH-HOLE

14

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5.5 V

TS 16949

8

3/5

IN-LINE

DIP14,.3

2.7 V

85 Cel

-40 Cel

MATTE TIN

DUAL

4.318 mm

7.62 mm

19.05 mm

CMOS

5 V

Parallel IO Port

2.54 mm

R-PDIP-T14

Not Qualified

e3

LTC4263IS#PBF

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE

4.5 V

85 Cel

-40 Cel

MATTE TIN

DUAL

1.752 mm

3.899 mm

30

260

8.649 mm

CMOS

5 V

1.27 mm

R-PDSO-G14

1

Not Qualified

e3

LTC4263CS#PBF

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE

4.5 V

70 Cel

0 Cel

MATTE TIN

DUAL

1.752 mm

3.899 mm

30

260

8.649 mm

CMOS

5 V

1.27 mm

R-PDSO-G14

1

Not Qualified

e3

MCP25050T-I/SL

Microchip Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

TS 16949

8

3/5

SMALL OUTLINE

SOP14,.24

2.7 V

85 Cel

-40 Cel

Matte Tin (Sn)

DUAL

1.75 mm

3.9 mm

8.65 mm

CMOS

5 V

Parallel IO Port

1.27 mm

R-PDSO-G14

1

Not Qualified

e3

LTC4263IDE#PBF

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

14

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

4.5 V

85 Cel

-40 Cel

MATTE TIN

DUAL

.8 mm

3 mm

30

260

4 mm

CMOS

5 V

.5 mm

R-PDSO-N14

1

Not Qualified

e3

MCP25050-E/SL

Microchip Technology

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

TS 16949

8

5

SMALL OUTLINE

SOP14,.24

4.5 V

125 Cel

-40 Cel

Matte Tin (Sn)

DUAL

1.75 mm

3.9 mm

8.65 mm

CMOS

5 V

Parallel IO Port

1.27 mm

R-PDSO-G14

1

Not Qualified

e3

MCP25050T-E/SL

Microchip Technology

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

TS 16949

8

5

SMALL OUTLINE

SOP14,.24

4.5 V

125 Cel

-40 Cel

Matte Tin (Sn)

DUAL

1.75 mm

3.9 mm

8.65 mm

CMOS

5 V

Parallel IO Port

1.27 mm

R-PDSO-G14

1

Not Qualified

e3

MCP2221T-I/ST

Microchip Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

14

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

TS 16949

3.3/5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP14,.25

3 V

85 Cel

-40 Cel

MATTE TIN

DUAL

1.2 mm

4.4 mm

5 mm

CMOS

15 mA

3.3 V

Serial IO/Communication Controllers

.65 mm

R-PDSO-G14

Not Qualified

e3

LTC4263IDE-1#PBF

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

14

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

4.5 V

85 Cel

-40 Cel

MATTE TIN

DUAL

.8 mm

3 mm

30

260

4 mm

CMOS

5 V

.5 mm

R-PDSO-N14

1

Not Qualified

e3

MAXQ1061EUD+

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

14

RECTANGULAR

PLASTIC/EPOXY

YES

109 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

30

260

CMOS

R-PDSO-G14

1

e3

LTC4263IDE-1#TRPBF

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

14

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

4.5 V

85 Cel

-40 Cel

MATTE TIN

DUAL

.8 mm

3 mm

30

260

4 mm

CMOS

5 V

.5 mm

R-PDSO-N14

1

Not Qualified

e3

LTC4263IS#TRPBF

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE

4.5 V

85 Cel

-40 Cel

MATTE TIN

DUAL

1.752 mm

3.899 mm

30

260

8.649 mm

CMOS

5 V

1.27 mm

R-PDSO-G14

1

Not Qualified

e3

MCP25055-I/P

Microchip Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

THROUGH-HOLE

14

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5.5 V

TS 16949

8

3/5

IN-LINE

DIP14,.3

2.7 V

85 Cel

-40 Cel

MATTE TIN

DUAL

4.318 mm

7.62 mm

19.05 mm

CMOS

5 V

Parallel IO Port

2.54 mm

R-PDIP-T14

Not Qualified

e3

MCP25055-I/SL

Microchip Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

TS 16949

8

3/5

SMALL OUTLINE

SOP14,.24

2.7 V

85 Cel

-40 Cel

Matte Tin (Sn)

DUAL

1.75 mm

3.9 mm

8.65 mm

CMOS

5 V

Parallel IO Port

1.27 mm

R-PDSO-G14

1

Not Qualified

e3

MCP25055T-I/SL

Microchip Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

TS 16949

8

3/5

SMALL OUTLINE

SOP14,.24

2.7 V

85 Cel

-40 Cel

Matte Tin (Sn)

DUAL

1.75 mm

3.9 mm

8.65 mm

CMOS

5 V

Parallel IO Port

1.27 mm

R-PDSO-G14

1

Not Qualified

e3

FM31256-G

Infineon Technologies

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

SERIAL, FIXED PROTOCOL

5.5 V

3/5

SMALL OUTLINE

SOP14,.25

N

2.7 V

85 Cel

-40 Cel

PURE TIN

DUAL

1.75 mm

3.9 mm

30

260

8.64 mm

CMOS

SECONDS

3 V

Timer or RTC

1.27 mm

R-PDSO-G14

3

Not Qualified

NO

LTC4263CDE#TRPBF

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

NO LEAD

14

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

4.5 V

70 Cel

0 Cel

MATTE TIN

DUAL

.8 mm

3 mm

30

260

4 mm

CMOS

5 V

.5 mm

R-PDSO-N14

1

Not Qualified

e3

MAXQ1061EUD+T

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

14

RECTANGULAR

PLASTIC/EPOXY

YES

109 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

30

260

CMOS

R-PDSO-G14

1

e3

LTC4263IDE

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

14

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE, VERY THIN PROFILE

4.5 V

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

.8 mm

3 mm

4 mm

CMOS

5 V

.5 mm

R-PDSO-N14

1

Not Qualified

e0

LTC4263IS

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE

4.5 V

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

1.752 mm

3.9 mm

8.649 mm

CMOS

5 V

1.27 mm

R-PDSO-G14

1

Not Qualified

e0

LTC4263IS#TR

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE

4.5 V

85 Cel

-40 Cel

TIN LEAD

DUAL

1.752 mm

3.9 mm

8.649 mm

CMOS

5 V

1.27 mm

R-PDSO-G14

1

Not Qualified

e0

MCP25025-I/SL

Microchip Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

TS 16949

8

3/5

SMALL OUTLINE

SOP14,.24

2.7 V

85 Cel

-40 Cel

Matte Tin (Sn)

DUAL

1.75 mm

3.9 mm

8.65 mm

CMOS

5 V

Parallel IO Port

1.27 mm

R-PDSO-G14

1

Not Qualified

e3

MCP25025T-I/SL

Microchip Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

TS 16949

8

3/5

SMALL OUTLINE

SOP14,.24

2.7 V

85 Cel

-40 Cel

Matte Tin (Sn)

DUAL

1.75 mm

3.9 mm

8.65 mm

CMOS

5 V

Parallel IO Port

1.27 mm

R-PDSO-G14

1

Not Qualified

e3

AD891AJD

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

THROUGH-HOLE

14

DIP

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

NO

IN-LINE

70 Cel

0 Cel

TIN LEAD

DUAL

5.08 mm

7.62 mm

19.43 mm

CMOS

2.54 mm

R-CDIP-T14

Not Qualified

e0

LTC4263CDE-1#PBF

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

NO LEAD

14

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

4.5 V

70 Cel

0 Cel

MATTE TIN

DUAL

.8 mm

3 mm

30

260

4 mm

CMOS

5 V

.5 mm

R-PDSO-N14

1

Not Qualified

e3

LTC4263CS#TR

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE

4.5 V

70 Cel

0 Cel

TIN LEAD

DUAL

1.752 mm

3.9 mm

8.649 mm

CMOS

5 V

1.27 mm

R-PDSO-G14

1

Not Qualified

e0

LTC4263CS

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE

4.5 V

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

DUAL

1.752 mm

3.9 mm

8.649 mm

CMOS

5 V

1.27 mm

R-PDSO-G14

1

Not Qualified

e0

LTC4263CS#TRPBF

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE

4.5 V

70 Cel

0 Cel

MATTE TIN

DUAL

1.752 mm

3.899 mm

30

260

8.649 mm

CMOS

5 V

1.27 mm

R-PDSO-G14

1

Not Qualified

e3

LTC4263CDE#TR

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

NO LEAD

14

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE, VERY THIN PROFILE

4.5 V

70 Cel

0 Cel

TIN LEAD

DUAL

.8 mm

3 mm

4 mm

CMOS

5 V

.5 mm

R-PDSO-N14

1

Not Qualified

e0

LTC4263CDE

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

NO LEAD

14

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE, VERY THIN PROFILE

4.5 V

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

DUAL

.8 mm

3 mm

4 mm

CMOS

5 V

.5 mm

R-PDSO-N14

1

Not Qualified

e0

LTC4263CDE-1#TRPBF

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

NO LEAD

14

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

4.5 V

70 Cel

0 Cel

MATTE TIN

DUAL

.8 mm

3 mm

30

260

4 mm

CMOS

5 V

.5 mm

R-PDSO-N14

1

Not Qualified

e3

LTC4263CDE#PBF

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

NO LEAD

14

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

4.5 V

70 Cel

0 Cel

MATTE TIN

DUAL

.8 mm

3 mm

30

260

4 mm

CMOS

5 V

.5 mm

R-PDSO-N14

1

Not Qualified

e3

LTC4263IDE#TR

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

14

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE, VERY THIN PROFILE

4.5 V

85 Cel

-40 Cel

TIN LEAD

DUAL

.8 mm

3 mm

4 mm

CMOS

5 V

.5 mm

R-PDSO-N14

1

Not Qualified

e0

GB3225-ZZ-T

Onsemi

MICROPROCESSOR CIRCUIT

COMMERCIAL

BUTT

14

BCC

RECTANGULAR

PLASTIC/EPOXY

YES

CHIP CARRIER

40 Cel

-10 Cel

BOTTOM

1.65 mm

3.18 mm

5.76 mm

CMOS

1.3 V

R-PBCC-B14

GB3225-E1

Onsemi

MICROPROCESSOR CIRCUIT

COMMERCIAL

BUTT

14

BCC

RECTANGULAR

PLASTIC/EPOXY

YES

CHIP CARRIER

40 Cel

-10 Cel

BOTTOM

1.65 mm

3.18 mm

5.76 mm

CMOS

1.3 V

R-PBCC-B14

GB3225-ZZ-B

Onsemi

MICROPROCESSOR CIRCUIT

COMMERCIAL

BUTT

14

BCC

RECTANGULAR

PLASTIC/EPOXY

YES

CHIP CARRIER

40 Cel

-10 Cel

BOTTOM

1.65 mm

3.18 mm

5.76 mm

CMOS

1.3 V

R-PBCC-B14

FM3164-G

Infineon Technologies

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

SERIAL, FIXED PROTOCOL

5.5 V

3/5

SMALL OUTLINE

SOP14,.25

N

2.7 V

85 Cel

-40 Cel

PURE TIN

DUAL

1.75 mm

3.9 mm

30

260

8.64 mm

CMOS

SECONDS

3 V

Timer or RTC

1.27 mm

R-PDSO-G14

3

Not Qualified

NO

FM3164-GTR

Infineon Technologies

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

SERIAL, FIXED PROTOCOL

5.5 V

3/5

SMALL OUTLINE

SOP14,.25

N

2.7 V

85 Cel

-40 Cel

PURE TIN

DUAL

1.75 mm

3.9 mm

30

260

8.64 mm

CMOS

SECONDS

3 V

Timer or RTC

1.27 mm

R-PDSO-G14

3

Not Qualified

NO

DS1481S+

Maxim Integrated

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE

2.7 V

40 Cel

0 Cel

MATTE TIN

DUAL

1.75 mm

3.9 mm

30

260

8.65 mm

CMOS

5 V

1.27 mm

R-PDSO-G14

1

Not Qualified

e3

DS1481S+T&R

Maxim Integrated

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE

2.7 V

40 Cel

0 Cel

MATTE TIN

DUAL

30

260

CMOS

5 V

R-PDSO-G14

1

Not Qualified

e3

MAXQ1062EUD+T

Maxim Integrated

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

14

RECTANGULAR

PLASTIC/EPOXY

YES

109 Cel

-40 Cel

MATTE TIN

DUAL

30

260

CMOS

R-PDSO-G14

1

e3

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.