Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Information Access Method | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | No. of Bits | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Interrupt Capability | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Ultraviolet Erasable | Terminal Position | DMA Channels | No. of Ports | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | ROM Bits Size | No. of Timers | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Minimum Time | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | Volatile | JESD-609 Code | Maximum Standby Current | On Chip Program ROM Width | No. of I/O Lines | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.465 V |
TS 16949 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.20SQ,25 |
3.135 V |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
1 mm |
5 mm |
ALSO OPERATES AT 5V SUPPLY |
5 mm |
CMOS |
3.3 V |
.65 mm |
S-PQCC-N20 |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.465 V |
TS 16949 |
SMALL OUTLINE, SHRINK PITCH |
3.135 V |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
2 mm |
5.3 mm |
ALSO OPERATES AT 5V SUPPLY |
40 |
260 |
7.2 mm |
CMOS |
3.3 V |
.65 mm |
R-PDSO-G20 |
2 |
Not Qualified |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.465 V |
TS 16949 |
SMALL OUTLINE |
SOP20,.4 |
3.135 V |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
2.65 mm |
7.5 mm |
ALSO OPERATES AT 5V SUPPLY |
260 |
12.8 mm |
CMOS |
3.3 V |
1.27 mm |
R-PDSO-G20 |
1 |
Not Qualified |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
CRYPTOGRAPHIC AUTHENTICATOR |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.12SQ,16 |
1.62 V |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
QUAD |
.33 mm |
3 mm |
30 |
260 |
3 mm |
CMOS |
1.8 V |
.4 mm |
S-PQCC-N20 |
1 |
e4 |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.465 V |
TS 16949 |
SMALL OUTLINE, SHRINK PITCH |
SSOP20,.3 |
3.135 V |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
2 mm |
5.3 mm |
ALSO OPERATES AT 5V SUPPLY |
40 |
260 |
7.2 mm |
CMOS |
3.3 V |
.65 mm |
R-PDSO-G20 |
2 |
Not Qualified |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
CRYPTOGRAPHIC AUTHENTICATOR |
OTHER |
NO LEAD |
20 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.12SQ,16 |
1.62 V |
85 Cel |
-25 Cel |
NICKEL PALLADIUM GOLD SILVER |
QUAD |
.33 mm |
3 mm |
30 |
260 |
3 mm |
CMOS |
1.8 V |
.4 mm |
S-PQCC-N20 |
1 |
e4 |
||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
CRYPTOGRAPHIC AUTHENTICATOR |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.12SQ,16 |
1.62 V |
105 Cel |
-40 Cel |
QUAD |
.33 mm |
3 mm |
260 |
3 mm |
CMOS |
1.8 V |
.4 mm |
S-XQCC-N20 |
1 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
CRYPTOGRAPHIC AUTHENTICATOR |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.12SQ,16 |
1.62 V |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
QUAD |
.33 mm |
3 mm |
30 |
260 |
3 mm |
CMOS |
1.8 V |
.4 mm |
S-PQCC-N20 |
1 |
e4 |
||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
CRYPTOGRAPHIC AUTHENTICATOR |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.12SQ,16 |
1.62 V |
105 Cel |
-40 Cel |
QUAD |
.33 mm |
3 mm |
260 |
3 mm |
CMOS |
1.8 V |
.4 mm |
S-XQCC-N20 |
1 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
CRYPTOGRAPHIC AUTHENTICATOR |
OTHER |
NO LEAD |
20 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.12SQ,16 |
1.62 V |
85 Cel |
-25 Cel |
NICKEL PALLADIUM GOLD SILVER |
QUAD |
.33 mm |
3 mm |
30 |
260 |
3 mm |
CMOS |
1.8 V |
.4 mm |
S-PQCC-N20 |
1 |
e4 |
||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
CRYPTOGRAPHIC AUTHENTICATOR |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.12SQ,16 |
1.62 V |
105 Cel |
-40 Cel |
QUAD |
.33 mm |
3 mm |
260 |
3 mm |
CMOS |
1.8 V |
.4 mm |
S-XQCC-N20 |
1 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.465 V |
TS 16949 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.20SQ,25 |
3.135 V |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
1 mm |
5 mm |
ALSO OPERATES AT 5V SUPPLY |
5 mm |
CMOS |
3.3 V |
.65 mm |
S-PQCC-N20 |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
CRYPTOGRAPHIC AUTHENTICATOR |
OTHER |
NO LEAD |
20 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.12SQ,16 |
1.62 V |
85 Cel |
-25 Cel |
NICKEL PALLADIUM GOLD SILVER |
QUAD |
.33 mm |
3 mm |
30 |
260 |
3 mm |
CMOS |
1.8 V |
.4 mm |
S-PQCC-N20 |
1 |
e4 |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.465 V |
TS 16949 |
SMALL OUTLINE |
SOP20,.4 |
3.135 V |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
2.65 mm |
7.5 mm |
ALSO OPERATES AT 5V SUPPLY |
12.8 mm |
CMOS |
3.3 V |
1.27 mm |
R-PDSO-G20 |
Not Qualified |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Broadcom |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
PIN/PEG |
20 |
RECTANGULAR |
UNSPECIFIED |
NO |
5.5 V |
MICROELECTRONIC ASSEMBLY |
4.5 V |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
260 |
CMOS |
5 V |
R-XDMA-P20 |
Not Qualified |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
CRYPTOGRAPHIC AUTHENTICATOR |
INDUSTRIAL |
GULL WING |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
AEC-Q100 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP20,.25 |
105 Cel |
-40 Cel |
DUAL |
1.2 mm |
4.4 mm |
also operates with 3.3v and 5v nominal |
6.5 mm |
CMOS |
1.8 V |
.65 mm |
R-PDSO-G20 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
CRYPTOGRAPHIC AUTHENTICATOR |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.12SQ,16 |
1.62 V |
105 Cel |
-40 Cel |
QUAD |
.33 mm |
3 mm |
260 |
3 mm |
CMOS |
1.8 V |
.4 mm |
S-XQCC-N20 |
1 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
CRYPTOGRAPHIC AUTHENTICATOR |
INDUSTRIAL |
GULL WING |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
AEC-Q100 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP20,.25 |
105 Cel |
-40 Cel |
DUAL |
1.2 mm |
4.4 mm |
also operates with 3.3v and 5v nominal |
6.5 mm |
CMOS |
1.8 V |
.65 mm |
R-PDSO-G20 |
1 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
SMALL OUTLINE |
SOP20,.4 |
70 Cel |
0 Cel |
DUAL |
2.64 mm |
7.49 mm |
Touch Screen Microcontroller |
12.8 mm |
CMOS |
1.27 mm |
R-PDSO-G20 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
COMMERCIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
IN-LINE |
DIP20,.3 |
70 Cel |
0 Cel |
DUAL |
MOS |
Other Microprocessor ICs |
2.54 mm |
R-XDIP-T20 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
GULL WING |
20 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
SMALL OUTLINE, SHRINK PITCH |
4.5 V |
70 Cel |
0 Cel |
DUAL |
2.05 mm |
5.3 mm |
7.2 mm |
CMOS |
5 V |
.65 mm |
R-PDSO-G20 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
J BEND |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
CHIP CARRIER |
4.75 V |
70 Cel |
0 Cel |
QUAD |
4.57 mm |
8.9662 mm |
NOT SPECIFIED |
NOT SPECIFIED |
8.9662 mm |
CMOS |
5 V |
1.27 mm |
S-PQCC-J20 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR CIRCUIT |
MILITARY |
NO LEAD |
20 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
5.5 V |
CHIP CARRIER |
4.5 V |
125 Cel |
-55 Cel |
QUAD |
2.03 mm |
8.89 mm |
NOT SPECIFIED |
NOT SPECIFIED |
8.89 mm |
CMOS |
5 V |
1.27 mm |
S-CQCC-N20 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
COMMERCIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
IN-LINE |
DIP20,.3 |
70 Cel |
0 Cel |
DUAL |
MOS |
Other Microprocessor ICs |
2.54 mm |
R-PDIP-T20 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR CIRCUIT |
MILITARY |
NO LEAD |
20 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
5.5 V |
CHIP CARRIER |
4.5 V |
125 Cel |
-55 Cel |
QUAD |
2.03 mm |
8.89 mm |
NOT SPECIFIED |
NOT SPECIFIED |
8.89 mm |
CMOS |
5 V |
1.27 mm |
S-CQCC-N20 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
COMMERCIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
IN-LINE |
DIP20,.3 |
70 Cel |
0 Cel |
DUAL |
MOS |
Other Microprocessor ICs |
2.54 mm |
R-XDIP-T20 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
SMALL OUTLINE |
4.5 V |
70 Cel |
0 Cel |
DUAL |
2.642 mm |
7.493 mm |
12.8015 mm |
CMOS |
5 V |
1.27 mm |
R-PDSO-G20 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
COMMERCIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5 |
IN-LINE |
DIP20,.3 |
70 Cel |
0 Cel |
DUAL |
MOS |
59 mA |
5 V |
Other Microprocessor ICs |
2.54 mm |
R-PDIP-T20 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
COMMERCIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5 |
IN-LINE |
DIP20,.3 |
70 Cel |
0 Cel |
DUAL |
MOS |
5 V |
Other Microprocessor ICs |
2.54 mm |
R-PDIP-T20 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
J BEND |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CHIP CARRIER |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
4.57 mm |
8.9662 mm |
8.9662 mm |
CMOS |
1.27 mm |
S-PQCC-J20 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
MICROPROCESSOR CIRCUIT |
AUTOMOTIVE |
GULL WING |
20 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
2.5/3.3 |
SMALL OUTLINE, SHRINK PITCH |
SSOP20,.25 |
2.4 V |
125 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
1.73 mm |
3.9 mm |
30 |
260 |
8.65 mm |
BICMOS |
.1 mA |
3.3 V |
Parallel IO Port |
.635 mm |
R-PDSO-G20 |
1 |
Not Qualified |
e3 |
||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
RECTANGULAR |
UNSPECIFIED |
YES |
109 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
30 |
260 |
CMOS |
R-XQCC-N20 |
1 |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
MICROPROCESSOR CIRCUIT |
AUTOMOTIVE |
GULL WING |
20 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
2.5/3.3 |
SMALL OUTLINE, SHRINK PITCH |
SSOP20,.25 |
2.4 V |
125 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
1.73 mm |
3.9 mm |
MONITORS UP TO 40 KEYS |
30 |
260 |
8.65 mm |
BICMOS |
.1 mA |
3.3 V |
Parallel IO Port |
.635 mm |
R-PDSO-G20 |
1 |
Not Qualified |
e3 |
|||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
RECTANGULAR |
UNSPECIFIED |
YES |
109 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
30 |
260 |
CMOS |
R-XQCC-N20 |
1 |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Onsemi |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
BUTT |
20 |
BCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CHIP CARRIER |
40 Cel |
0 Cel |
BOTTOM |
1.83 mm |
3.15 mm |
NOT SPECIFIED |
NOT SPECIFIED |
5.46 mm |
CMOS |
1.25 V |
R-PBCC-B20 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Onsemi |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
NO LEAD |
20 |
RECTANGULAR |
UNSPECIFIED |
YES |
MICROELECTRONIC ASSEMBLY |
40 Cel |
0 Cel |
UNSPECIFIED |
1.27 mm |
3.81 mm |
NOT SPECIFIED |
NOT SPECIFIED |
6.35 mm |
CMOS |
1.25 V |
R-XXMA-N20 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Onsemi |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
NO LEAD |
20 |
RECTANGULAR |
UNSPECIFIED |
YES |
MICROELECTRONIC ASSEMBLY |
40 Cel |
0 Cel |
UNSPECIFIED |
1.27 mm |
3.81 mm |
NOT SPECIFIED |
NOT SPECIFIED |
6.35 mm |
CMOS |
1.25 V |
R-XXMA-N20 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Onsemi |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
NO LEAD |
20 |
RECTANGULAR |
UNSPECIFIED |
YES |
MICROELECTRONIC ASSEMBLY |
40 Cel |
-10 Cel |
UNSPECIFIED |
1.6 mm |
3.12 mm |
NOT SPECIFIED |
NOT SPECIFIED |
4.82 mm |
CMOS |
1.3 V |
R-XXMA-N20 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Onsemi |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
NO LEAD |
20 |
RECTANGULAR |
UNSPECIFIED |
YES |
MICROELECTRONIC ASSEMBLY |
40 Cel |
-10 Cel |
UNSPECIFIED |
1.6 mm |
3.12 mm |
NOT SPECIFIED |
NOT SPECIFIED |
4.82 mm |
CMOS |
1.3 V |
R-XXMA-N20 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Onsemi |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
BUTT |
20 |
BCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CHIP CARRIER |
40 Cel |
-10 Cel |
BOTTOM |
1.6 mm |
3.12 mm |
4.82 mm |
CMOS |
1.3 V |
R-PBCC-B20 |
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|
Onsemi |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
BUTT |
20 |
BCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CHIP CARRIER |
40 Cel |
0 Cel |
BOTTOM |
1.83 mm |
3.15 mm |
NOT SPECIFIED |
NOT SPECIFIED |
5.46 mm |
CMOS |
1.25 V |
R-PBCC-B20 |
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Onsemi |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
BUTT |
20 |
BCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CHIP CARRIER |
40 Cel |
0 Cel |
BOTTOM |
1.27 mm |
3.81 mm |
6.35 mm |
CMOS |
1.25 V |
R-PBCC-B20 |
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|
STMicroelectronics |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
J BEND |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
15 V |
CHIP CARRIER |
3 V |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
4.57 mm |
8.9662 mm |
8.9662 mm |
CMOS |
1.27 mm |
S-PQCC-J20 |
Not Qualified |
e3 |
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NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
OTHER |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1.98 V |
SMALL OUTLINE |
1.62 V |
85 Cel |
-25 Cel |
DUAL |
CMOS |
1.8 V |
R-PDSO-G20 |
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NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
OTHER |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1.98 V |
1.8/5 |
SMALL OUTLINE |
SSOP20,.25 |
1.62 V |
85 Cel |
-25 Cel |
DUAL |
CMOS |
1.8 V |
Other Microprocessor ICs |
.635 mm |
R-PDSO-G20 |
Not Qualified |
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NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
OTHER |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1.98 V |
1.8/5 |
SMALL OUTLINE |
SSOP20,.25 |
1.62 V |
85 Cel |
-25 Cel |
DUAL |
CMOS |
1.8 V |
Other Microprocessor ICs |
.635 mm |
R-PDSO-G20 |
Not Qualified |
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NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
OTHER |
GULL WING |
20 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1.98 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
1.62 V |
85 Cel |
-25 Cel |
DUAL |
1.5 mm |
4.4 mm |
ALSO OPERATES AT 3V, 5V SUPPLY |
6.5 mm |
CMOS |
1.8 V |
.65 mm |
R-PDSO-G20 |
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NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
OTHER |
GULL WING |
20 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1.98 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
1.62 V |
85 Cel |
-25 Cel |
DUAL |
1.5 mm |
4.4 mm |
ALSO OPERATES AT 3V, 5V SUPPLY |
6.5 mm |
CMOS |
1.8 V |
.65 mm |
R-PDSO-G20 |
Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.
Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.
Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.
Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.