2785 Other Function uPs,uCs & Peripheral ICs 65

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Part	Manufacturer	Peripheral IC Type	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Position	Maximum Seated Height	Width	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code
XCVP1202-2MSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	110 Cel	0 Cel	BOTTOM	4.48 mm	50 mm	50 mm	CMOS	.8 V	.92 mm	S-PBGA-B2785
XCVP1502-3HSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.854 V	100 Cel	0 Cel	BOTTOM	4.48 mm	50 mm	50 mm	CMOS	.88 V	.92 mm	S-PBGA-B2785
XCVP1202-1MSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	100 Cel	0 Cel	BOTTOM	4.48 mm	50 mm	50 mm	CMOS	.8 V	.92 mm	S-PBGA-B2785
XCVP1202-2MLEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	110 Cel	0 Cel	BOTTOM	4.48 mm	50 mm	50 mm	CMOS	.8 V	.92 mm	S-PBGA-B2785
XCVP1402-1MSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	100 Cel	0 Cel	BOTTOM	4.48 mm	50 mm	50 mm	CMOS	.8 V	.92 mm	S-PBGA-B2785
XCVP1502-2MSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	110 Cel	0 Cel	BOTTOM	4.48 mm	50 mm	50 mm	CMOS	.8 V	.92 mm	S-PBGA-B2785
XCVP1202-2LSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.676 V	110 Cel	0 Cel	BOTTOM	4.48 mm	50 mm	50 mm	CMOS	.7 V	.92 mm	S-PBGA-B2785
XCVP1102-1MSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	110 Cel	-40 Cel	BOTTOM	4.48 mm	50 mm	50 mm	CMOS	.8 V	.92 mm	S-PBGA-B2785
XCVP1202-1LLIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.676 V	110 Cel	-40 Cel	BOTTOM	4.48 mm	50 mm	50 mm	CMOS	.7 V	.92 mm	S-PBGA-B2785
XCVP1102-2LLEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.676 V	110 Cel	0 Cel	BOTTOM	4.48 mm	50 mm	50 mm	CMOS	.7 V	.92 mm	S-PBGA-B2785
XCVP1502-1LLIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.676 V	110 Cel	-40 Cel	BOTTOM	4.48 mm	50 mm	50 mm	CMOS	.7 V	.92 mm	S-PBGA-B2785
XCVP1552-1MSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	100 Cel	0 Cel	BOTTOM	4.48 mm	50 mm	50 mm	CMOS	.8 V	.92 mm	S-PBGA-B2785
XCVP1102-1LSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.676 V	110 Cel	-40 Cel	BOTTOM	4.48 mm	50 mm	50 mm	CMOS	.7 V	.92 mm	S-PBGA-B2785
XCVP1102-2LSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.676 V	110 Cel	0 Cel	BOTTOM	4.48 mm	50 mm	50 mm	CMOS	.7 V	.92 mm	S-PBGA-B2785
XCVP1552-2MLEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	110 Cel	0 Cel	BOTTOM	4.48 mm	50 mm	50 mm	CMOS	.8 V	.92 mm	S-PBGA-B2785
XCVP1502-1LSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.676 V	100 Cel	0 Cel	BOTTOM	4.48 mm	50 mm	50 mm	CMOS	.7 V	.92 mm	S-PBGA-B2785
XCVP1552-1MSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	110 Cel	-40 Cel	BOTTOM	4.48 mm	50 mm	50 mm	CMOS	.8 V	.92 mm	S-PBGA-B2785
XCVP1552-1LLIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.676 V	110 Cel	-40 Cel	BOTTOM	4.48 mm	50 mm	50 mm	CMOS	.7 V	.92 mm	S-PBGA-B2785
XCVP1552-1MLIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	110 Cel	-40 Cel	BOTTOM	4.48 mm	50 mm	50 mm	CMOS	.8 V	.92 mm	S-PBGA-B2785
XCVP1402-3HSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.854 V	100 Cel	0 Cel	BOTTOM	4.48 mm	50 mm	50 mm	CMOS	.88 V	.92 mm	S-PBGA-B2785
XCVP1402-2MSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	110 Cel	0 Cel	BOTTOM	4.48 mm	50 mm	50 mm	CMOS	.8 V	.92 mm	S-PBGA-B2785
XCVP1102-2MSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	110 Cel	0 Cel	BOTTOM	4.48 mm	50 mm	50 mm	CMOS	.8 V	.92 mm	S-PBGA-B2785
XCVP1402-1LSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.676 V	110 Cel	-40 Cel	BOTTOM	4.48 mm	50 mm	50 mm	CMOS	.7 V	.92 mm	S-PBGA-B2785
XCVP1502-1MLIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	110 Cel	-40 Cel	BOTTOM	4.48 mm	50 mm	50 mm	CMOS	.8 V	.92 mm	S-PBGA-B2785
XCVP1552-2LLEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.676 V	110 Cel	0 Cel	BOTTOM	4.48 mm	50 mm	50 mm	CMOS	.7 V	.92 mm	S-PBGA-B2785
XCVP1552-1LSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.676 V	100 Cel	0 Cel	BOTTOM	4.48 mm	50 mm	50 mm	CMOS	.7 V	.92 mm	S-PBGA-B2785
XCVP1202-1LSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.676 V	110 Cel	-40 Cel	BOTTOM	4.48 mm	50 mm	50 mm	CMOS	.7 V	.92 mm	S-PBGA-B2785
XCVP1102-2MLEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	110 Cel	0 Cel	BOTTOM	4.48 mm	50 mm	50 mm	CMOS	.8 V	.92 mm	S-PBGA-B2785
XCVP1502-1LSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.676 V	110 Cel	-40 Cel	BOTTOM	4.48 mm	50 mm	50 mm	CMOS	.7 V	.92 mm	S-PBGA-B2785
XCVP1552-2LSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.676 V	110 Cel	0 Cel	BOTTOM	4.48 mm	50 mm	50 mm	CMOS	.7 V	.92 mm	S-PBGA-B2785
XCVP1102-1LLIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.676 V	110 Cel	-40 Cel	BOTTOM	4.48 mm	50 mm	50 mm	CMOS	.7 V	.92 mm	S-PBGA-B2785
XCVP1102-1LSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.676 V	100 Cel	0 Cel	BOTTOM	4.48 mm	50 mm	50 mm	CMOS	.7 V	.92 mm	S-PBGA-B2785
XCVP1552-2MSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	110 Cel	-40 Cel	BOTTOM	4.48 mm	50 mm	50 mm	CMOS	.8 V	.92 mm	S-PBGA-B2785
XCVP1202-1MSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	110 Cel	-40 Cel	BOTTOM	4.48 mm	50 mm	50 mm	CMOS	.8 V	.92 mm	S-PBGA-B2785
XCVP1402-1MLIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	110 Cel	-40 Cel	BOTTOM	4.48 mm	50 mm	50 mm	CMOS	.8 V	.92 mm	S-PBGA-B2785
XCVP1202-2LLEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.676 V	110 Cel	0 Cel	BOTTOM	4.48 mm	50 mm	50 mm	CMOS	.7 V	.92 mm	S-PBGA-B2785
XCVP1202-1LSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.676 V	100 Cel	0 Cel	BOTTOM	4.48 mm	50 mm	50 mm	CMOS	.7 V	.92 mm	S-PBGA-B2785
XCVP1102-2MSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	110 Cel	-40 Cel	BOTTOM	4.48 mm	50 mm	50 mm	CMOS	.8 V	.92 mm	S-PBGA-B2785
XCVP1502-2LSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.676 V	110 Cel	0 Cel	BOTTOM	4.48 mm	50 mm	50 mm	CMOS	.7 V	.92 mm	S-PBGA-B2785
XCVP1202-1MLIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	110 Cel	-40 Cel	BOTTOM	4.48 mm	50 mm	50 mm	CMOS	.8 V	.92 mm	S-PBGA-B2785
XCVP1202-2MLIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	110 Cel	-40 Cel	BOTTOM	4.48 mm	50 mm	50 mm	CMOS	.8 V	.92 mm	S-PBGA-B2785
XCVP1552-3HSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.854 V	100 Cel	0 Cel	BOTTOM	4.48 mm	50 mm	50 mm	CMOS	.88 V	.92 mm	S-PBGA-B2785
XCVP1402-1LLIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.676 V	110 Cel	-40 Cel	BOTTOM	4.48 mm	50 mm	50 mm	CMOS	.7 V	.92 mm	S-PBGA-B2785
XCVP1502-1MSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	110 Cel	-40 Cel	BOTTOM	4.48 mm	50 mm	50 mm	CMOS	.8 V	.92 mm	S-PBGA-B2785
XCVP1402-2LSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.676 V	110 Cel	0 Cel	BOTTOM	4.48 mm	50 mm	50 mm	CMOS	.7 V	.92 mm	S-PBGA-B2785
XCVP1202-2MSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	110 Cel	-40 Cel	BOTTOM	4.48 mm	50 mm	50 mm	CMOS	.8 V	.92 mm	S-PBGA-B2785
XCVP1202-3HSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.854 V	100 Cel	0 Cel	BOTTOM	4.48 mm	50 mm	50 mm	CMOS	.88 V	.92 mm	S-PBGA-B2785
XCVP1402-2MSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	110 Cel	-40 Cel	BOTTOM	4.48 mm	50 mm	50 mm	CMOS	.8 V	.92 mm	S-PBGA-B2785

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.