Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Information Access Method | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | No. of Bits | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Interrupt Capability | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Ultraviolet Erasable | Terminal Position | DMA Channels | No. of Ports | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | ROM Bits Size | No. of Timers | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Minimum Time | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | Volatile | JESD-609 Code | Maximum Standby Current | On Chip Program ROM Width | No. of I/O Lines | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
MICROELECTRONIC ASSEMBLY |
2.7 V |
85 Cel |
-40 Cel |
UNSPECIFIED |
2.113 mm |
14.73 mm |
NOT SPECIFIED |
NOT SPECIFIED |
21.72 mm |
CMOS |
3.3 V |
R-XXMA-N28 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
Nordic Semiconductor Asa |
SoC |
BALL |
28 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA28,6X7,16 |
1.7 V |
85 Cel |
-40 Cel |
BOTTOM |
.535 mm |
2.464 mm |
2.482 mm |
CMOS |
3 V |
.4 mm |
R-PBGA-B28 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
FTDI |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.25 V |
SMALL OUTLINE, SHRINK PITCH |
3.3 V |
85 Cel |
-40 Cel |
DUAL |
2 mm |
5.3 mm |
40 |
260 |
10.2 mm |
CMOS |
.65 mm |
R-PDSO-G28 |
3 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
MICROELECTRONIC ASSEMBLY |
2.7 V |
85 Cel |
-40 Cel |
UNSPECIFIED |
2.113 mm |
14.73 mm |
NOT SPECIFIED |
NOT SPECIFIED |
21.72 mm |
CMOS |
3.3 V |
R-XXMA-N28 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
Microchip Technology |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
TS 16949 |
MICROELECTRONIC ASSEMBLY |
MODULE28(UNSPEC) |
2.7 V |
80 Cel |
-40 Cel |
UNSPECIFIED |
2.11 mm |
14.73 mm |
48 MHz |
21.72 mm |
CMOS |
3.3 V |
R-XXMA-N28 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
Microchip Technology |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
TS 16949 |
MICROELECTRONIC ASSEMBLY |
2.7 V |
85 Cel |
-40 Cel |
UNSPECIFIED |
2.113 mm |
14.73 mm |
21.72 mm |
CMOS |
3.3 V |
R-XXMA-N28 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Nordic Semiconductor Asa |
SoC |
BALL |
28 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA28,6X7,16 |
1.7 V |
85 Cel |
-40 Cel |
BOTTOM |
.535 mm |
2.464 mm |
2.482 mm |
CMOS |
3 V |
.4 mm |
R-PBGA-B28 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
MICROELECTRONIC ASSEMBLY |
2.7 V |
85 Cel |
-40 Cel |
UNSPECIFIED |
2.113 mm |
14.73 mm |
NOT SPECIFIED |
NOT SPECIFIED |
21.72 mm |
CMOS |
3.3 V |
R-XXMA-N28 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
Nordic Semiconductor Asa |
SoC |
BALL |
28 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA28,6X7,16 |
1.7 V |
85 Cel |
-40 Cel |
BOTTOM |
.535 mm |
2.464 mm |
2.482 mm |
CMOS |
3 V |
.4 mm |
R-PBGA-B28 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
FTDI |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
SSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
SMALL OUTLINE, SHRINK PITCH |
3.3 V |
85 Cel |
-40 Cel |
DUAL |
2 mm |
5.3 mm |
40 |
260 |
10.2 mm |
CMOS |
.65 mm |
S-PDSO-G28 |
3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
FTDI |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.25 V |
SMALL OUTLINE, SHRINK PITCH |
3.3 V |
85 Cel |
-40 Cel |
DUAL |
2 mm |
5.3 mm |
10.2 mm |
CMOS |
.65 mm |
R-PDSO-G28 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
Nordic Semiconductor Asa |
SoC |
BALL |
28 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA28,6X7,16 |
1.7 V |
85 Cel |
-40 Cel |
BOTTOM |
.535 mm |
2.464 mm |
2.482 mm |
CMOS |
3 V |
.4 mm |
R-PBGA-B28 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
NETWORK CONTROLLER |
INDUSTRIAL |
NO LEAD |
28 |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
MICROELECTRONIC ASSEMBLY |
MODULE28(UNSPEC) |
2.7 V |
85 Cel |
-40 Cel |
UNSPECIFIED |
2.113 mm |
14.73 mm |
NOT SPECIFIED |
NOT SPECIFIED |
21.72 mm |
CMOS |
3.3 V |
1.016 mm |
R-XXMA-N28 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
TS 16949 |
MICROELECTRONIC ASSEMBLY |
MODULE28(UNSPEC) |
2.7 V |
80 Cel |
-40 Cel |
UNSPECIFIED |
2.11 mm |
14.73 mm |
48 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
21.72 mm |
CMOS |
3.3 V |
R-XXMA-N28 |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
NETWORK CONTROLLER |
INDUSTRIAL |
NO LEAD |
28 |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
MICROELECTRONIC ASSEMBLY |
MODULE28(UNSPEC) |
2.7 V |
85 Cel |
-40 Cel |
UNSPECIFIED |
2.113 mm |
14.73 mm |
NOT SPECIFIED |
NOT SPECIFIED |
21.72 mm |
CMOS |
3.3 V |
1.016 mm |
R-XXMA-N28 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
MICROELECTRONIC ASSEMBLY |
2.7 V |
85 Cel |
-40 Cel |
UNSPECIFIED |
2.113 mm |
14.73 mm |
NOT SPECIFIED |
NOT SPECIFIED |
21.72 mm |
CMOS |
3.3 V |
R-XXMA-N28 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
CRYPTOGRAPHIC AUTHENTICATOR |
GULL WING |
28 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP28,.25 |
3 V |
85 Cel |
-20 Cel |
TIN |
DUAL |
1.1 mm |
4.4 mm |
9.7 mm |
CMOS |
3.3 V |
.65 mm |
R-PDSO-G28 |
3 |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
TS 16949 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC28,.16SQ,16 |
1.8 V |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
.55 mm |
4 mm |
40 |
260 |
4 mm |
CMOS |
3 V |
.4 mm |
S-PQCC-N28 |
1 |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||||
Microchip Technology |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
MICROELECTRONIC ASSEMBLY |
2.7 V |
85 Cel |
-40 Cel |
UNSPECIFIED |
2.113 mm |
14.73 mm |
21.72 mm |
CMOS |
3.3 V |
R-XXMA-N28 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
RECTANGULAR |
UNSPECIFIED |
YES |
4.2 V |
MICROELECTRONIC ASSEMBLY |
3 V |
85 Cel |
-40 Cel |
UNSPECIFIED |
2.113 mm |
14.73 mm |
SEATED HGT-NOM |
NOT SPECIFIED |
NOT SPECIFIED |
21.72 mm |
CMOS |
3.6 V |
R-XXMA-N28 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
RECTANGULAR |
UNSPECIFIED |
YES |
4.2 V |
MICROELECTRONIC ASSEMBLY |
3 V |
85 Cel |
-40 Cel |
UNSPECIFIED |
2.113 mm |
14.73 mm |
SEATED HGT-NOM |
NOT SPECIFIED |
NOT SPECIFIED |
21.72 mm |
CMOS |
3.6 V |
R-XXMA-N28 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
Microchip Technology |
MICROPROCESSOR CIRCUIT |
NO LEAD |
28 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
4.2 V |
MICROELECTRONIC ASSEMBLY |
3 V |
85 Cel |
-40 Cel |
UNSPECIFIED |
2.113 mm |
14.73 mm |
21.72 mm |
CMOS |
3.3 V |
R-XXMA-N28 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.25 V |
5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP28,.3 |
4.75 V |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
2 mm |
5.3 mm |
20 |
260 |
10.2 mm |
CMOS |
5 V |
Other uPs/uCs/Peripheral ICs |
.65 mm |
R-PDSO-G28 |
3 |
Not Qualified |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.25 V |
5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP28,.3 |
4.75 V |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
2 mm |
5.3 mm |
20 |
260 |
10.2 mm |
CMOS |
5 V |
Other uPs/uCs/Peripheral ICs |
.65 mm |
R-PDSO-G28 |
3 |
Not Qualified |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
RECTANGULAR |
UNSPECIFIED |
YES |
4.2 V |
MICROELECTRONIC ASSEMBLY |
3 V |
85 Cel |
-40 Cel |
UNSPECIFIED |
2.113 mm |
14.73 mm |
SEATED HGT-NOM |
NOT SPECIFIED |
NOT SPECIFIED |
21.72 mm |
CMOS |
3.6 V |
R-XXMA-N28 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
CRYPTOGRAPHIC AUTHENTICATOR |
GULL WING |
28 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP28,.25 |
3 V |
85 Cel |
-40 Cel |
TIN |
DUAL |
1.1 mm |
4.4 mm |
9.7 mm |
CMOS |
3.3 V |
.65 mm |
R-PDSO-G28 |
3 |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||||||||
Microchip Technology |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
RECTANGULAR |
UNSPECIFIED |
YES |
4.2 V |
MICROELECTRONIC ASSEMBLY |
3 V |
85 Cel |
-40 Cel |
UNSPECIFIED |
2.113 mm |
14.73 mm |
SEATED HGT-NOM |
21.72 mm |
CMOS |
3.6 V |
R-XXMA-N28 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Onsemi |
SYSTEM ON CHIP |
INDUSTRIAL |
NO LEAD |
28 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG |
LCC28,.35X.55 |
2.2 V |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
1 mm |
5 mm |
260 |
7 mm |
CMOS |
3 V |
.5 mm |
S-PQCC-N28 |
1 |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PROGRAMMABLE SoC |
GULL WING |
28 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
SMALL OUTLINE, SHRINK PITCH |
SSOP28,.3 |
1.8 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2 mm |
5.3 mm |
10.2 mm |
CMOS |
3 V |
.65 mm |
R-PDSO-G28 |
3 |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
CRYPTOGRAPHIC AUTHENTICATOR |
INDUSTRIAL |
GULL WING |
28 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP28,.25 |
105 Cel |
-40 Cel |
DUAL |
1.2 mm |
4.4 mm |
ALSO OPERATES AT 3.3V NOMINAL VOLATGE |
9.7 mm |
CMOS |
1.8 V |
.65 mm |
R-PDSO-G28 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
CRYPTOGRAPHIC AUTHENTICATOR |
GULL WING |
28 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP28,.25 |
105 Cel |
-40 Cel |
DUAL |
1.2 mm |
4.4 mm |
ALSO OPERATES AT 3.3V NOMINAL VOLATGE |
NOT SPECIFIED |
NOT SPECIFIED |
9.7 mm |
CMOS |
1.8 V |
.65 mm |
R-PDSO-G28 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
CRYPTOGRAPHIC AUTHENTICATOR |
GULL WING |
28 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP28,.25 |
105 Cel |
-40 Cel |
DUAL |
1.2 mm |
4.4 mm |
ALSO OPERATES AT 3.3V NOMINAL VOLATGE |
NOT SPECIFIED |
NOT SPECIFIED |
9.7 mm |
CMOS |
1.8 V |
.65 mm |
R-PDSO-G28 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
CRYPTOGRAPHIC AUTHENTICATOR |
INDUSTRIAL |
GULL WING |
28 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP28,.25 |
105 Cel |
-40 Cel |
DUAL |
1.2 mm |
4.4 mm |
ALSO OPERATES AT 3.3V NOMINAL VOLATGE |
9.7 mm |
CMOS |
1.8 V |
.65 mm |
R-PDSO-G28 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
RECTANGULAR |
UNSPECIFIED |
YES |
4.2 V |
MICROELECTRONIC ASSEMBLY |
3 V |
85 Cel |
-40 Cel |
UNSPECIFIED |
2.113 mm |
14.73 mm |
SEATED HGT-NOM |
NOT SPECIFIED |
NOT SPECIFIED |
21.72 mm |
CMOS |
3.6 V |
R-XXMA-N28 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
6 V |
3.3,5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP28,.25 |
2.7 V |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
1.1 mm |
4.4 mm |
30 |
260 |
9.7 mm |
CMOS |
215 mA |
3.3 V |
Other Microprocessor ICs |
.65 mm |
R-PDSO-G28 |
1 |
Not Qualified |
e3 |
||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
6 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
2.7 V |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
1.1 mm |
4.4 mm |
ALSO AVAILABLE IN 5V |
30 |
260 |
9.7 mm |
CMOS |
3.3 V |
.65 mm |
R-PDSO-G28 |
1 |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
6 V |
3.3,5 |
SMALL OUTLINE |
SOP28,.4 |
2.7 V |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
2.65 mm |
7.5 mm |
30 |
260 |
17.9 mm |
CMOS |
215 mA |
3.3 V |
Other Microprocessor ICs |
1.27 mm |
R-PDSO-G28 |
1 |
Not Qualified |
e3 |
||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
6 V |
SMALL OUTLINE |
2.7 V |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
2.65 mm |
7.5 mm |
ALSO AVAILABLE IN 5V |
30 |
260 |
17.9 mm |
CMOS |
3.3 V |
1.27 mm |
R-PDSO-G28 |
1 |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
RECTANGULAR |
UNSPECIFIED |
YES |
4.2 V |
MICROELECTRONIC ASSEMBLY |
3 V |
85 Cel |
-40 Cel |
MATTE TIN |
UNSPECIFIED |
2.113 mm |
14.73 mm |
SEATED HGT-NOM |
21.72 mm |
CMOS |
3.6 V |
R-XXMA-N28 |
e3 |
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Microchip Technology |
MICROPROCESSOR CIRCUIT |
NO LEAD |
28 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
4.2 V |
MICROELECTRONIC ASSEMBLY |
3 V |
85 Cel |
-40 Cel |
UNSPECIFIED |
2.113 mm |
14.73 mm |
21.72 mm |
CMOS |
3.3 V |
R-XXMA-N28 |
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Microchip Technology |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
MICROELECTRONIC ASSEMBLY |
2.7 V |
85 Cel |
-40 Cel |
UNSPECIFIED |
2.113 mm |
14.73 mm |
21.72 mm |
CMOS |
3.3 V |
R-XXMA-N28 |
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Microchip Technology |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
MICROELECTRONIC ASSEMBLY |
2.7 V |
85 Cel |
-40 Cel |
UNSPECIFIED |
2.113 mm |
14.73 mm |
21.72 mm |
CMOS |
3.3 V |
R-XXMA-N28 |
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Microchip Technology |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
RECTANGULAR |
UNSPECIFIED |
YES |
4.2 V |
MICROELECTRONIC ASSEMBLY |
3 V |
85 Cel |
-40 Cel |
UNSPECIFIED |
2.113 mm |
14.73 mm |
SEATED HGT-NOM |
21.72 mm |
CMOS |
3.6 V |
R-XXMA-N28 |
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Microchip Technology |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
TS 16949 |
MICROELECTRONIC ASSEMBLY |
2.7 V |
85 Cel |
-40 Cel |
UNSPECIFIED |
CMOS |
3.3 V |
I2C, SPI |
R-XXMA-N28 |
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Microchip Technology |
MICROPROCESSOR CIRCUIT |
NO LEAD |
28 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
4.2 V |
MICROELECTRONIC ASSEMBLY |
3 V |
85 Cel |
-40 Cel |
UNSPECIFIED |
2.113 mm |
14.73 mm |
21.72 mm |
CMOS |
3.3 V |
R-XXMA-N28 |
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|
Microchip Technology |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
TS 16949 |
SMALL OUTLINE, SHRINK PITCH |
SSOP28,.3 |
1.8 V |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
2 mm |
5.3 mm |
40 |
260 |
10.2 mm |
CMOS |
3 V |
.65 mm |
R-PDSO-G28 |
2 |
e3 |
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|
Microchip Technology |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
RECTANGULAR |
UNSPECIFIED |
YES |
4.2 V |
MICROELECTRONIC ASSEMBLY |
3 V |
85 Cel |
-40 Cel |
UNSPECIFIED |
2.113 mm |
14.73 mm |
SEATED HGT-NOM |
NOT SPECIFIED |
NOT SPECIFIED |
21.72 mm |
CMOS |
3.6 V |
R-XXMA-N28 |
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|
Infineon Technologies |
PROGRAMMABLE SoC |
GULL WING |
28 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.25 V |
SMALL OUTLINE, SHRINK PITCH |
SSOP28,.3 |
4.75 V |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
2 mm |
5.3 mm |
ALSO OPERATES AT 2.7V AND 3.3V SUPPLY |
20 |
260 |
10.2 mm |
CMOS |
5 V |
.65 mm |
R-PDSO-G28 |
3 |
e3 |
Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.
Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.
Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.
Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.