361 Other Function uPs,uCs & Peripheral ICs 89

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

OMAPL138EZWTD4E

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.35 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.25 V

90 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16 mm

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

32

50 MHz

30

260

16 mm

CMOS

1.3 V

I2C; SPI; UART; USB

.8 mm

S-PBGA-B361

3

456 rpm

e1

OMAPL138EZWTD4

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.35 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.25 V

90 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16 mm

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

32

50 MHz

30

260

16 mm

CMOS

1.3 V

I2C; SPI; UART; USB

.8 mm

S-PBGA-B361

3

456 rpm

e1

OMAPL138EZCEA3R

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.35 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.25 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

13 mm

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

32

50 MHz

30

260

13 mm

CMOS

1.3 V

I2C; SPI; UART; USB

.65 mm

S-PBGA-B361

3

456 rpm

e1

OMAPL138EZWTA3

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.35 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.25 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16 mm

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

32

50 MHz

30

260

16 mm

CMOS

1.3 V

I2C; SPI; UART; USB

.8 mm

S-PBGA-B361

3

456 rpm

e1

OMAPL138EZWTA3E

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.35 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.25 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16 mm

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

32

50 MHz

30

260

16 mm

CMOS

1.3 V

I2C; SPI; UART; USB

.8 mm

S-PBGA-B361

3

456 rpm

e1

OMAPL138EZCEA3E

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.35 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.25 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

13 mm

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

30

260

13 mm

CMOS

1.3 V

.65 mm

S-PBGA-B361

3

e1

OMAPL138EZCEA3

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.35 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.25 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

13 mm

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

32

50 MHz

30

260

13 mm

CMOS

1.3 V

I2C; SPI; UART; USB

.65 mm

S-PBGA-B361

3

456 rpm

e1

OMAPL138EZWT3

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.35 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.25 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16 mm

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

32

50 MHz

30

260

16 mm

CMOS

1.3 V

I2C; SPI; UART; USB

.8 mm

S-PBGA-B361

3

456 rpm

e1

OMAPL138EZCED4E

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.35 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.25 V

90 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

13 mm

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

32

50 MHz

30

260

13 mm

CMOS

1.3 V

I2C; SPI; UART; USB

.65 mm

S-PBGA-B361

3

456 rpm

e1

TMS320DM6446AZWTA

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA361,19X19,32

1.14 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16384

16 mm

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

48

30

260

16 mm

CMOS

1.2 V

Digital Signal Processors

I2C; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B361

3

Not Qualified

e1

OMAPL138EZCE3

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.35 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.25 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

13 mm

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

32

50 MHz

30

260

13 mm

CMOS

1.3 V

I2C; SPI; UART; USB

.65 mm

S-PBGA-B361

3

456 rpm

e1

OMAPL132EZWTA2R

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.14 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16 mm

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

30

260

16 mm

CMOS

1.2 V

.8 mm

S-PBGA-B361

3

200 rpm

e1

OMAPL138EZWT4

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.35 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.25 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16 mm

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

32

50 MHz

30

260

16 mm

CMOS

1.3 V

I2C; SPI; UART; USB

.8 mm

S-PBGA-B361

3

456 rpm

e1

OMAPL138EZCED4

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.35 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.25 V

90 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

13 mm

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

32

50 MHz

30

260

13 mm

CMOS

1.3 V

I2C; SPI; UART; USB

.65 mm

S-PBGA-B361

3

456 rpm

e1

OMAPL138EZCE4

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.35 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.25 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

13 mm

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

32

50 MHz

30

260

13 mm

CMOS

1.3 V

I2C; SPI; UART; USB

.65 mm

S-PBGA-B361

3

456 rpm

e1

OMAPL138EZWTA3R

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.35 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.25 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16 mm

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

32

50 MHz

30

260

16 mm

CMOS

1.3 V

I2C; SPI; UART; USB

.8 mm

S-PBGA-B361

3

456 rpm

e1

DM6446ANB6C2127VC

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.14 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16 mm

30

260

16 mm

CMOS

1.2 V

.8 mm

S-PBGA-B361

3

e1

DM6446AZWTKEDACOM

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.14 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16 mm

30

260

16 mm

CMOS

1.2 V

.8 mm

S-PBGA-B361

3

e1

DM6446GB6C0121MV

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.14 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16 mm

30

260

16 mm

CMOS

1.2 V

.8 mm

S-PBGA-B361

3

e1

OMAPL138BZWTRB

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.35 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.25 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16 mm

IT ASLO OPERATES IN 0.95V MINIMUM SUPPLY

30

260

16 mm

CMOS

1.3 V

.8 mm

S-PBGA-B361

3

e1

OMAPL138CZWTA3RW

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.14 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16 mm

30

260

16 mm

CMOS

1.2 V

.8 mm

S-PBGA-B361

3

e1

TMS320DM6446AZWT

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA361,19X19,32

1.14 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16384

16 mm

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

48

30

260

16 mm

CMOS

1.2 V

Digital Signal Processors

I2C; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B361

3

Not Qualified

e1

TMSDM6446AZWT-COM

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.14 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16 mm

30

260

16 mm

CMOS

1.2 V

.8 mm

S-PBGA-B361

3

e1

TNETV6446AINZWT

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.14 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16 mm

30

260

16 mm

CMOS

1.2 V

.8 mm

S-PBGA-B361

3

e1

PAM1806BZCE4

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.35 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.25 V

BOTTOM

1.3 mm

13 mm

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

13 mm

CMOS

1.3 V

.65 mm

S-PBGA-B361

Not Qualified

XAM1806BZWT3

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.35 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.25 V

BOTTOM

1.4 mm

16 mm

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

16 mm

CMOS

1.3 V

.8 mm

S-PBGA-B361

Not Qualified

XAM1806BZWTA4

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.35 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.25 V

BOTTOM

1.4 mm

16 mm

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

16 mm

CMOS

1.3 V

.8 mm

S-PBGA-B361

Not Qualified

PAM1806BZCEA3

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.35 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.25 V

BOTTOM

1.3 mm

13 mm

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

13 mm

CMOS

1.3 V

.65 mm

S-PBGA-B361

Not Qualified

TMX320DM6443BZWT

Texas Instruments

MICROPROCESSOR CIRCUIT

COMMERCIAL EXTENDED

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA361,19X19,32

1.14 V

85 Cel

0 Cel

BOTTOM

1.4 mm

16384

16 mm

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

NOT SPECIFIED

NOT SPECIFIED

16 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B361

Not Qualified

POMAPL132BZWTA2E

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.14 V

BOTTOM

1.4 mm

16 mm

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

16 mm

CMOS

1.2 V

.8 mm

S-PBGA-B361

Not Qualified

SN3490586

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.25 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.15 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16 mm

IT ASLO OPERATES IN 1V MINIMUM SUPPLY

30

260

16 mm

CMOS

1.2 V

.8 mm

S-PBGA-B361

3

e1

XOMAPL132BZWT2E

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.14 V

BOTTOM

1.4 mm

16 mm

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

16 mm

CMOS

1.2 V

.8 mm

S-PBGA-B361

Not Qualified

XAM1806BZWTD4

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.35 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.25 V

BOTTOM

1.4 mm

16 mm

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

16 mm

CMOS

1.3 V

.8 mm

S-PBGA-B361

Not Qualified

AM1806BZWTD3

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.35 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.25 V

BOTTOM

1.4 mm

16 mm

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

16 mm

CMOS

1.3 V

.8 mm

S-PBGA-B361

Not Qualified

POMAPL132BZWT2E

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.14 V

BOTTOM

1.4 mm

16 mm

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

16 mm

CMOS

1.2 V

.8 mm

S-PBGA-B361

Not Qualified

TNETV1647GSTZWT

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.25 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.15 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16 mm

IT ASLO OPERATES IN 1V MINIMUM SUPPLY

30

260

16 mm

CMOS

1.2 V

.8 mm

S-PBGA-B361

3

e1

PAM1806BZWT3

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.35 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.25 V

BOTTOM

1.4 mm

16 mm

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

16 mm

CMOS

1.3 V

.8 mm

S-PBGA-B361

Not Qualified

PAM1806BZWTA4

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.35 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.25 V

BOTTOM

1.4 mm

16 mm

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

16 mm

CMOS

1.3 V

.8 mm

S-PBGA-B361

Not Qualified

AM1806BZWTA4

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.35 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.25 V

BOTTOM

1.4 mm

16 mm

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

16 mm

CMOS

1.3 V

.8 mm

S-PBGA-B361

Not Qualified

XOMAPL132BZWTA2E

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.14 V

BOTTOM

1.4 mm

16 mm

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

16 mm

CMOS

1.2 V

.8 mm

S-PBGA-B361

Not Qualified

XAM1806BZCED3

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.35 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.25 V

BOTTOM

1.3 mm

13 mm

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

13 mm

CMOS

1.3 V

.65 mm

S-PBGA-B361

Not Qualified

XAM1806BZCE3

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.35 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.25 V

BOTTOM

1.3 mm

13 mm

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

13 mm

CMOS

1.3 V

.65 mm

S-PBGA-B361

Not Qualified

TMX320DM6443ZWT

Texas Instruments

MICROPROCESSOR CIRCUIT

COMMERCIAL EXTENDED

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA361,19X19,32

1.14 V

85 Cel

0 Cel

BOTTOM

1.4 mm

16384

16 mm

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

16 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B361

Not Qualified

PAM1806BZCED4

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.35 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.25 V

BOTTOM

1.3 mm

13 mm

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

13 mm

CMOS

1.3 V

.65 mm

S-PBGA-B361

Not Qualified

TNETV6446AINZWT8

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.14 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16 mm

30

260

16 mm

CMOS

1.2 V

.8 mm

S-PBGA-B361

3

e1

XAM1806BZCEA3

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.35 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.25 V

BOTTOM

1.3 mm

13 mm

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

13 mm

CMOS

1.3 V

.65 mm

S-PBGA-B361

Not Qualified

PAM1806BZCE3

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.35 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.25 V

BOTTOM

1.3 mm

13 mm

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

13 mm

CMOS

1.3 V

.65 mm

S-PBGA-B361

Not Qualified

XAM1806BZCED4

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.35 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.25 V

BOTTOM

1.3 mm

13 mm

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

13 mm

CMOS

1.3 V

.65 mm

S-PBGA-B361

Not Qualified

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.