56 Other Function uPs,uCs & Peripheral ICs 49

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
NRF52832-CIAA-R	Nordic Semiconductor Asa	SoC		BALL	56	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA56,7X8,16	1.7 V	85 Cel	-40 Cel		BOTTOM	.399 mm	2.956 mm				3.226 mm	CMOS		3 V		.4 mm	R-PBGA-B56
NRF52832-CIAA-R7	Nordic Semiconductor Asa	SoC		BALL	56	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA56,7X8,16	1.7 V	85 Cel	-40 Cel		BOTTOM	.399 mm	2.956 mm				3.226 mm	CMOS		3 V		.4 mm	R-PBGA-B56
ATMXT224S-MAUR036	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	3.47 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.24SQ,14	3 V	85 Cel	-40 Cel		QUAD	.6 mm	6 mm				6 mm	CMOS		3.3 V		.35 mm	S-XQCC-N56
ATMXT224S-MAUR	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	3.47 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.24SQ,14	1.71 V	85 Cel	-40 Cel		QUAD	.6 mm	6 mm				6 mm	CMOS		1.8 V		.35 mm	S-XQCC-N56
ATMXT224S-MAUR043	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	3.47 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.24SQ,14	3 V	85 Cel	-40 Cel		QUAD	.6 mm	6 mm				6 mm	CMOS		3.3 V		.35 mm	S-XQCC-N56
ATMXT224S-MAUR033	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	3.47 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.24SQ,14	3 V	85 Cel	-40 Cel		QUAD	.6 mm	6 mm				6 mm	CMOS		3.3 V		.35 mm	S-XQCC-N56
CY8C4248LQI-BL483	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.71 V	85 Cel	-40 Cel		QUAD	.6 mm	7 mm				7 mm	CMOS		3.3 V		.4 mm	S-XQCC-N56
CY8C4247LWA-M484	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	1.71 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	.9 mm	8 mm		30	260	8 mm	CMOS		1.8 V		.5 mm	S-XQCC-N56	3		e4
SI3459-B02-IM	Silicon Labs	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3 V	85 Cel	-40 Cel		QUAD	.9 mm	8 mm		NOT SPECIFIED	NOT SPECIFIED	8 mm	CMOS		3.3 V		.5 mm	S-XQCC-N56
PCA9504A-T	NXP Semiconductors	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		3 V	70 Cel	0 Cel		DUAL	1.2 mm	6.1 mm		NOT SPECIFIED	NOT SPECIFIED	14 mm	CMOS		3.3 V		.5 mm	R-PDSO-G56		Not Qualified
935267864118	NXP Semiconductors	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		3 V	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	DUAL	1.2 mm	6.1 mm				14 mm	CMOS		3.3 V		.5 mm	R-PDSO-G56	1	Not Qualified	e4
PCA9504ADGG,112	NXP Semiconductors	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		3 V	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	DUAL	1.2 mm	6.1 mm				14 mm	CMOS		3.3 V		.5 mm	R-PDSO-G56	1	Not Qualified	e4
PCA9504ADGG,118	NXP Semiconductors	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		3 V	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	DUAL	1.2 mm	6.1 mm				14 mm	CMOS		3.3 V		.5 mm	R-PDSO-G56	1	Not Qualified	e4
935267864112	NXP Semiconductors	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		3 V	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	DUAL	1.2 mm	6.1 mm				14 mm	CMOS		3.3 V		.5 mm	R-PDSO-G56	1	Not Qualified	e4
PCA9504A	NXP Semiconductors	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		3 V	70 Cel	0 Cel		DUAL	1.2 mm	6.1 mm		NOT SPECIFIED	NOT SPECIFIED	14 mm	CMOS		3.3 V		.5 mm	R-PDSO-G56		Not Qualified
ISP1132DL	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	56	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V			SMALL OUTLINE, SHRINK PITCH		4 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2.8 mm	7.5 mm				18.425 mm	CMOS		5 V		.635 mm	R-PDSO-G56		Not Qualified	e4
ISP1132N	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	THROUGH-HOLE	56	SDIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V			IN-LINE, SHRINK PITCH		4 V	85 Cel	-40 Cel	TIN/NICKEL PALLADIUM GOLD	DUAL	5.08 mm	15.24 mm				52 mm	CMOS		5 V		1.778 mm	R-PDIP-T56		Not Qualified	e3/e4
ISP1130DL	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	56	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		5	SMALL OUTLINE, SHRINK PITCH	SSOP56,.4	4 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2.8 mm	7.5 mm				18.425 mm	CMOS		5 V	Bus Controllers	.635 mm	R-PDSO-G56		Not Qualified	e4
ISP1130N	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	THROUGH-HOLE	56	SDIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V		5	IN-LINE, SHRINK PITCH	SDIP56,.6	4 V	85 Cel	-40 Cel	TIN/NICKEL PALLADIUM GOLD	DUAL	5.08 mm	15.24 mm				52 mm	CMOS		5 V	Bus Controllers	1.778 mm	R-PDIP-T56		Not Qualified	e3/e4
CY8C4247LWS-M484	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	1.71 V	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	.9 mm	8 mm				8 mm	CMOS		1.8 V		.5 mm	S-XQCC-N56	3		e4
CY8C4247LWS-M464	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	1.71 V	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	.9 mm	8 mm				8 mm	CMOS		1.8 V		.5 mm	S-XQCC-N56	3		e4
CY8C4247FNQ-BL483	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	105 Cel	-40 Cel		QUAD	.6 mm	7 mm		30	260	7 mm	CMOS		3.3 V		.4 mm	S-XQCC-N56	1
CY8C21001-24PVXI	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL	GULL WING	56	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V			SMALL OUTLINE, SHRINK PITCH	SSOP56,.4	4.75 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2.794 mm	7.5057 mm	ALSO OPERATES AT 3.3V SUPPLY	30	260	18.415 mm	CMOS		5 V		.635 mm	R-PDSO-G56	3	Not Qualified	e4
CY8C4248LQI-BL473	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.71 V	85 Cel	-40 Cel		QUAD	.6 mm	7 mm		NOT SPECIFIED	NOT SPECIFIED	7 mm	CMOS		3.3 V		.4 mm	S-XQCC-N56
CY8C4248LQI-BL453	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.71 V	85 Cel	-40 Cel		QUAD	.6 mm	7 mm		NOT SPECIFIED	NOT SPECIFIED	7 mm	CMOS		3.3 V		.4 mm	S-XQCC-N56
CY8C4128LQI-BL493	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.71 V	85 Cel	-40 Cel		QUAD	.6 mm	7 mm				7 mm	CMOS		3.3 V		.4 mm	S-XQCC-N56
CY8CTMA400-56LQIT	Infineon Technologies	MICROPROCESSOR CIRCUIT		NO LEAD	56		SQUARE		YES	5.5 V					1.71 V				QUAD			IT ALSO OPERATES AT 2.65 TO 5.5V ANALOG SUPPLY				CMOS					S-XQCC-N56
CY8C4248LQI-BL493	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.71 V	85 Cel	-40 Cel		QUAD	.6 mm	7 mm				7 mm	CMOS		3.3 V		.4 mm	S-XQCC-N56
CY8C4128LQI-BL443	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.71 V	85 Cel	-40 Cel		QUAD	.6 mm	7 mm				7 mm	CMOS		3.3 V		.4 mm	S-XQCC-N56
CY8CTMA400-56LQI	Infineon Technologies	MICROPROCESSOR CIRCUIT		NO LEAD	56		SQUARE		YES	5.5 V					1.71 V				QUAD			IT ALSO OPERATES AT 2.65 TO 5.5V ANALOG SUPPLY				CMOS					S-XQCC-N56
CY8CTMA467-56LQIT	Infineon Technologies	MICROPROCESSOR CIRCUIT		NO LEAD	56		SQUARE		YES	5.5 V					1.71 V				QUAD			IT ALSO OPERATES AT 2.65 TO 5.5V ANALOG SUPPLY				CMOS					S-XQCC-N56
CY8CTMA468-56LQI	Infineon Technologies	MICROPROCESSOR CIRCUIT		NO LEAD	56		SQUARE		YES	5.5 V					1.71 V				QUAD			IT ALSO OPERATES AT 2.65 TO 5.5V ANALOG SUPPLY				CMOS					S-XQCC-N56
CY8C4248LQI-BL463	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.71 V	85 Cel	-40 Cel		QUAD	.6 mm	7 mm				7 mm	CMOS		3.3 V		.4 mm	S-XQCC-N56
CY8CTMA467-56LQI	Infineon Technologies	MICROPROCESSOR CIRCUIT		NO LEAD	56		SQUARE		YES	5.5 V					1.71 V				QUAD			IT ALSO OPERATES AT 2.65 TO 5.5V ANALOG SUPPLY				CMOS					S-XQCC-N56
CY8C4128LQI-BL453	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.71 V	85 Cel	-40 Cel		QUAD	.6 mm	7 mm				7 mm	CMOS		3.3 V		.4 mm	S-XQCC-N56
CY8CTMA468-56LQIT	Infineon Technologies	MICROPROCESSOR CIRCUIT		NO LEAD	56		SQUARE		YES	5.5 V					1.71 V				QUAD			IT ALSO OPERATES AT 2.65 TO 5.5V ANALOG SUPPLY				CMOS					S-XQCC-N56
CY8C4128LQI-BL483	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.71 V	85 Cel	-40 Cel		QUAD	.6 mm	7 mm		NOT SPECIFIED	NOT SPECIFIED	7 mm	CMOS		3.3 V		.4 mm	S-XQCC-N56
CY8C4128LQI-BL473	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.71 V	85 Cel	-40 Cel		QUAD	.6 mm	7 mm		NOT SPECIFIED	NOT SPECIFIED	7 mm	CMOS		3.3 V		.4 mm	S-XQCC-N56
CY8C4247LWA-M464	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	1.71 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	.9 mm	8 mm				8 mm	CMOS		1.8 V		.5 mm	S-XQCC-N56	3		e4
9LPRS502YGLFT	Renesas Electronics	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.465 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.3,20	3.135 V	70 Cel	0 Cel	Matte Tin (Sn)	DUAL	1.2 mm	6.1 mm		30	260	14 mm	CMOS		3.3 V		.5 mm	R-PDSO-G56		Not Qualified	e3
9LPRS502YKLFT	Renesas Electronics	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	56	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.465 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	3.135 V	70 Cel	0 Cel	Matte Tin (Sn)	QUAD	1 mm	8 mm		30	260	8 mm	CMOS		3.3 V		.5 mm	S-PQCC-N56		Not Qualified	e3
9LPRS525AGILFT	Renesas Electronics	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.465 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		3.135 V	70 Cel	0 Cel	MATTE TIN	DUAL	1.2 mm	6.1 mm			260	14 mm	CMOS		3.3 V		.5 mm	R-PDSO-G56	1		e3
9LPRS502YGT	Renesas Electronics	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.465 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.3,20	3.135 V	70 Cel	0 Cel		DUAL	1.2 mm	6.1 mm				14 mm	CMOS		3.3 V		.5 mm	R-PDSO-G56
9LPRS502YFLFT	Renesas Electronics	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	56	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.465 V			SMALL OUTLINE, SHRINK PITCH	SSOP56,.4	3.135 V	70 Cel	0 Cel	MATTE TIN	DUAL	2.8 mm	7.5 mm				18.43 mm	CMOS		3.3 V		.635 mm	R-PDSO-G56		Not Qualified	e3
9LPRS525AGLFT	Renesas Electronics	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	56	TSOP2	RECTANGULAR	PLASTIC/EPOXY	YES	3.465 V		3.3	SMALL OUTLINE, THIN PROFILE	TSSOP56,.3,20	3.135 V	70 Cel	0 Cel	MATTE TIN	DUAL	1.2 mm	6.1 mm		30	260	14 mm	CMOS	200 mA	3.3 V	Clock Generators	.5 mm	R-PDSO-G56	1	Not Qualified	e3
9LPRS525AGLF	Renesas Electronics	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.465 V		3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.3,20	3.135 V	70 Cel	0 Cel	MATTE TIN	DUAL	1.2 mm	6.1 mm		30	260	14 mm	CMOS	200 mA	3.3 V	Clock Generators	.5 mm	R-PDSO-G56	1	Not Qualified	e3
9LPRS525AGILF	Renesas Electronics	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.465 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		3.135 V	70 Cel	0 Cel	MATTE TIN	DUAL	1.2 mm	6.1 mm			260	14 mm	CMOS		3.3 V		.5 mm	R-PDSO-G56	1		e3
9LPRS502YKT	Renesas Electronics	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	56	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.465 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	3.135 V	70 Cel	0 Cel		QUAD	1 mm	8 mm				8 mm	CMOS		3.3 V		.5 mm	S-PQCC-N56

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.