6 Other Function uPs,uCs & Peripheral ICs 33

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
DS2413P	Maxim Integrated	MICROPROCESSOR CIRCUIT	COMMERCIAL	C BEND	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V		SMALL OUTLINE		2.8 V	70 Cel	0 Cel	TIN LEAD	DUAL	1.5 mm	3.76 mm			245	3.94 mm	CMOS		3.3 V		1.27 mm	R-PDSO-C6	1	Not Qualified	e0
DS2413P/T&R	Maxim Integrated	MICROPROCESSOR CIRCUIT	COMMERCIAL	C BEND	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V		SMALL OUTLINE		2.8 V	70 Cel	0 Cel	TIN LEAD	DUAL	1.5 mm	3.76 mm				3.94 mm	CMOS		3.3 V		1.27 mm	R-PDSO-C6	1	Not Qualified	e0
TEA1792TS/1,115	NXP Semiconductors			GULL WING	6	TSOP	RECTANGULAR	PLASTIC/EPOXY	YES		20	SMALL OUTLINE, THIN PROFILE	TSOP6,.11,37					DUAL					260				20 V	Other Microprocessor ICs	.95 mm	R-PDSO-G6	1	Not Qualified
DS28E36BQ+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	6	HVSON	RECTANGULAR	UNSPECIFIED	YES	3.63 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.11,37	2.97 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	.8 mm	3 mm		30	260	3 mm	CMOS		3.3 V		.95 mm	S-XDSO-N6	1		e3
SLE952500000XTSA1	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	6	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	1.6 V		GRID ARRAY	SOLCC6,.04,20	1.35 V	85 Cel	-40 Cel		BOTTOM	.4 mm	1.1 mm	ALSO OPERATES WITH 3.8V NOM SUPPLY			1.5 mm	CMOS		1.45 V		.5 mm	R-PBCC-N6	1
DS2465P+T	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	C BEND	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	3.63 V		SMALL OUTLINE		2.97 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	1.5 mm	3.76 mm		30	260	3.94 mm	CMOS		3.3 V		1.27 mm	R-PDSO-C6	1		e3
DS2465P+	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	C BEND	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	3.63 V		SMALL OUTLINE		2.97 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	1.5 mm	3.76 mm		30	260	3.94 mm	CMOS		3.3 V		1.27 mm	R-PDSO-C6	1		e3
DS28E50Q+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	6	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.63 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.12,37	2.97 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	.8 mm	3 mm		30	260	3 mm	CMOS		3.3 V		.95 mm	S-PDSO-N6	1		e3
DS24L65P+T	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	C BEND	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	1.89 V		SMALL OUTLINE		1.71 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	1.5 mm			30	260		CMOS		1.8 V		1.27 mm	R-PDSO-C6	1		e3
DS2476Q+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	6	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.63 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.12,37	2.97 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	.8 mm	3 mm		30	260	3 mm	CMOS		3.3 V		.95 mm	S-PDSO-N6	1		e3
DS24L65P+	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	C BEND	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	1.89 V		SMALL OUTLINE		1.71 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	1.5 mm			30	260		CMOS		1.8 V		1.27 mm	R-PDSO-C6	1		e3
DS2476Q+U	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	6	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.63 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.12,37	2.97 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	.8 mm	3 mm		30	260	3 mm	CMOS		3.3 V		.95 mm	S-PDSO-N6	1		e3
DS2477Q+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	6	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.63 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.12,37	2.97 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	.8 mm	3 mm		30	260	3 mm	CMOS		3.3 V		.95 mm	S-PDSO-N6	1		e3
DS2476BQ+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	6	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.63 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.12,37	2.2 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	.8 mm	3 mm		30	260	3 mm	CMOS		3.3 V		.95 mm	S-PDSO-N6	1		e3
DS28C36BQ+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	6	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.63 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.12,38	2.2 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	.8 mm	3 mm		30	260	3 mm	CMOS		3.3 V		.95 mm	S-PDSO-N6	1		e3
DS28E10P+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		C BEND	6		RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V				2.8 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL				30	260		CMOS		3.3 V			R-PDSO-C6	1		e3
DS28E10P+	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		C BEND	6		RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V				2.8 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL				30	260		CMOS		3.3 V			R-PDSO-C6	1		e3
DS28C36Q+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	6	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.63 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.12,38	2.97 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	.8 mm	3 mm		30	260	3 mm	CMOS		3.3 V		.95 mm	S-PDSO-N6	1		e3
DS28E38Q+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	6	HVSON	SQUARE	UNSPECIFIED	YES	3.63 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.12,37	2.97 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	.8 mm	3 mm		30	260	3 mm	CMOS		3.3 V		.95 mm	S-XDSO-N6	1		e3
DS28E84Q+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR	COMMERCIAL	NO LEAD	6	HVSON	SQUARE	UNSPECIFIED	YES	3.63 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.12,38	2.97 V	50 Cel	0 Cel	Matte Tin (Sn) - annealed	DUAL	.8 mm	3 mm		30	260	3 mm	CMOS		3.3 V		.95 mm	S-XDSO-N6	1		e3
DS28E39Q+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	6	HVSON	SQUARE	UNSPECIFIED	YES	3.63 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.12,38	2.97 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	.8 mm	3 mm		30	260	3 mm	CMOS		3.3 V		.95 mm	S-XDSO-N6	1		e3
DS28E83Q+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR	COMMERCIAL	NO LEAD	6	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.63 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.12,38	2.97 V	50 Cel	0 Cel	Matte Tin (Sn) - annealed	DUAL	.8 mm	3 mm		30	260	3 mm	CMOS		3.3 V		.95 mm	S-PDSO-N6	1		e3
DS28E36Q+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	6	HVSON	RECTANGULAR	UNSPECIFIED	YES	3.63 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.11,37	2.97 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	.8 mm	3 mm		30	260	3 mm	CMOS		3.3 V		.95 mm	S-XDSO-N6	1		e3
P5CD081A6	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	THROUGH-HOLE	6		RECTANGULAR	UNSPECIFIED	NO	1.98 V	1.8/5	MICROELECTRONIC ASSEMBLY	MODULE(UNSPEC)	1.62 V	85 Cel	-25 Cel		DUAL			ALSO OPERATES AT 3V, 5V SUPPLY			35 mm	CMOS		1.8 V	Other Microprocessor ICs		R-XDMA-T6		Not Qualified
P5CD051A6	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	THROUGH-HOLE	6		RECTANGULAR	UNSPECIFIED	NO	1.98 V	1.8/5	MICROELECTRONIC ASSEMBLY	MODULE(UNSPEC)	1.62 V	85 Cel	-25 Cel		DUAL			ALSO OPERATES AT 3V, 5V SUPPLY			35 mm	CMOS		1.8 V	Other Microprocessor ICs		R-XDMA-T6		Not Qualified
TEA1792ATS/1,115	NXP Semiconductors			GULL WING	6	TSOP	RECTANGULAR	PLASTIC/EPOXY	YES		20	SMALL OUTLINE, THIN PROFILE	TSOP6,.11,37					DUAL					260			1.2 mA	20 V	Other uPs/uCs/Peripheral ICs	.95 mm	R-PDSO-G6	1	Not Qualified
SL3S1204FTB0	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES			SMALL OUTLINE, VERY THIN PROFILE			95 Cel	-40 Cel		DUAL	.5 mm	1 mm	LENGTH-1.45 MM				CMOS				.5 mm	R-PDSO-N6
TEA1792ATSX	NXP Semiconductors			GULL WING	6	TSOP	RECTANGULAR	PLASTIC/EPOXY	YES		20	SMALL OUTLINE, THIN PROFILE	TSOP6,.11,37					DUAL								1.2 mA	20 V	Other Microprocessor ICs	.95 mm	R-PDSO-G6		Not Qualified
P5CD016A6	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	THROUGH-HOLE	6		RECTANGULAR	UNSPECIFIED	NO	1.98 V	1.8/5	MICROELECTRONIC ASSEMBLY	MODULE(UNSPEC)	1.62 V	85 Cel	-25 Cel		DUAL			ALSO OPERATES AT 3V, 5V SUPPLY			35 mm	CMOS		1.8 V	Other Microprocessor ICs		R-XDMA-T6		Not Qualified
P5CD041A6	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	THROUGH-HOLE	6		RECTANGULAR	UNSPECIFIED	NO	1.98 V	1.8/5	MICROELECTRONIC ASSEMBLY	MODULE(UNSPEC)	1.62 V	85 Cel	-25 Cel		DUAL			ALSO OPERATES AT 3V, 5V SUPPLY			35 mm	CMOS		1.8 V	Other Microprocessor ICs		R-XDMA-T6		Not Qualified
SLE952500600XTSA1	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	6	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	1.6 V		GRID ARRAY	SOLCC6,.04,20	1.35 V	85 Cel	-40 Cel	TIN	BOTTOM	.4 mm	1.1 mm	ALSO OPERATES WITH 3.8V NOM SUPPLY			1.5 mm	CMOS		1.45 V		.5 mm	R-PBCC-N6	1		e3
SLE95250	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,20	2 V	85 Cel	-40 Cel		BOTTOM	.4 mm	1.1 mm				1.5 mm	CMOS		3.8 V		.5 mm	R-PDSO-N6
SLE4436C	Infineon Technologies	MICROPROCESSOR CIRCUIT		NO LEAD	6		UNSPECIFIED	UNSPECIFIED	YES			UNCASED CHIP						UPPER							CMOS					X-XUUC-N6		Not Qualified

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.