Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Information Access Method | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | No. of Bits | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Interrupt Capability | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Ultraviolet Erasable | Terminal Position | DMA Channels | No. of Ports | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | ROM Bits Size | No. of Timers | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Minimum Time | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | Volatile | JESD-609 Code | Maximum Standby Current | On Chip Program ROM Width | No. of I/O Lines | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Renesas Electronics |
SYSTEM ON CHIP |
NO LEAD |
68 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.9 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC68,.4SQ,20 |
1.7 V |
85 Cel |
-10 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
10 mm |
10 mm |
CMOS |
1.8 V |
.5 mm |
S-PQCC-N68 |
3 |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
SYSTEM ON CHIP |
NO LEAD |
68 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.9 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC68,.4SQ,20 |
1.7 V |
85 Cel |
-10 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
10 mm |
10 mm |
CMOS |
1.8 V |
.5 mm |
S-PQCC-N68 |
3 |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
SYSTEM ON CHIP |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC68,.32SQ,16 |
1.62 V |
85 Cel |
-40 Cel |
QUAD |
.9 mm |
8 mm |
30 |
260 |
8 mm |
CMOS |
1.8 V |
.4 mm |
S-XQCC-N68 |
3 |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
SoC |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC68,.32SQ,16 |
1.7 V |
85 Cel |
-40 Cel |
QUAD |
1 mm |
8 mm |
8 mm |
CMOS |
1.8 V |
.4 mm |
S-XQCC-N68 |
3 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PROGRAMMABLE SoC |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC68,.32SQ,16 |
1.7 V |
85 Cel |
-40 Cel |
QUAD |
1 mm |
8 mm |
8 mm |
CMOS |
1.8 V |
.4 mm |
S-XQCC-N68 |
3 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PROGRAMMABLE SoC |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC68,.32SQ,16 |
1.7 V |
85 Cel |
-40 Cel |
PURE TIN |
QUAD |
1 mm |
8 mm |
8 mm |
CMOS |
1.8 V |
.4 mm |
S-XQCC-N68 |
3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
IXYS Corporation |
INDUSTRIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
85 Cel |
-40 Cel |
QUAD |
CMOS |
50 mA |
5 V |
Other uPs/uCs/Peripheral ICs |
1.27 mm |
S-PQCC-J68 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
SYSTEM ON CHIP |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC68,.32SQ,16 |
1.62 V |
85 Cel |
-40 Cel |
QUAD |
.9 mm |
8 mm |
8 mm |
CMOS |
1.8 V |
.4 mm |
S-XQCC-N68 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
SYSTEM ON CHIP |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC68,.32SQ,16 |
1.62 V |
85 Cel |
-40 Cel |
QUAD |
.9 mm |
8 mm |
8 mm |
CMOS |
1.8 V |
.4 mm |
S-XQCC-N68 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
SYSTEM ON CHIP |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC68,.32SQ,16 |
1.62 V |
85 Cel |
-40 Cel |
QUAD |
.9 mm |
8 mm |
8 mm |
CMOS |
1.8 V |
.4 mm |
S-XQCC-N68 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
INDUSTRIAL |
NO LEAD |
68 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3/5 |
CHIP CARRIER |
LCC68,.32SQ,16 |
85 Cel |
-40 Cel |
N |
QUAD |
524288 Bits |
CMOS |
Other Microprocessor ICs |
.4 mm |
S-PQCC-N68 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PROGRAMMABLE SoC |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC68,.32SQ,16 |
1.7 V |
85 Cel |
-40 Cel |
QUAD |
1 mm |
8 mm |
8 mm |
CMOS |
1.8 V |
.4 mm |
S-XQCC-N68 |
3 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
SYSTEM ON CHIP |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC68,.32SQ,16 |
1.62 V |
85 Cel |
-40 Cel |
QUAD |
.9 mm |
8 mm |
8 mm |
CMOS |
1.8 V |
.4 mm |
S-XQCC-N68 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
SYSTEM ON CHIP |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC68,.32SQ,16 |
1.62 V |
85 Cel |
-40 Cel |
QUAD |
.9 mm |
8 mm |
8 mm |
CMOS |
1.8 V |
.4 mm |
S-XQCC-N68 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
SYSTEM ON CHIP |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC68,.32SQ,16 |
1.62 V |
85 Cel |
-40 Cel |
QUAD |
.9 mm |
8 mm |
8 mm |
CMOS |
1.8 V |
.4 mm |
S-XQCC-N68 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR CIRCUIT |
PIN/PEG |
68 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
5.5 V |
38535Q/M;38534H;883B |
GRID ARRAY |
PGA68,11X11 |
4.5 V |
-55 Cel |
PERPENDICULAR |
NOT SPECIFIED |
NOT SPECIFIED |
NMOS |
5 V |
Display Controllers |
2.54 mm |
S-CPGA-P68 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR CIRCUIT |
MILITARY |
GULL WING |
68 |
QFP |
CERAMIC |
YES |
5 |
FLATPACK |
QFP68(UNSPEC) |
125 Cel |
-55 Cel |
QUAD |
CMOS |
5 V |
Other Microprocessor ICs |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR CIRCUIT |
MILITARY |
FLAT |
68 |
QFF |
SQUARE |
CERAMIC, GLASS-SEALED |
YES |
3.6 V |
MIL-PRF-38535 |
3.3 |
FLATPACK |
QFL68,.5SQ,25 |
2.7 V |
125 Cel |
-55 Cel |
QUAD |
3.86 mm |
12.51 mm |
12.51 mm |
BICMOS |
3 V |
Other Microprocessor ICs |
.635 mm |
S-GQFP-F68 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
70 Cel |
0 Cel |
QUAD |
CMOS |
5 V |
Other Microprocessor ICs |
1.27 mm |
S-PQCC-J68 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
CHIP CARRIER |
4.75 V |
70 Cel |
0 Cel |
QUAD |
4.57 mm |
24.2316 mm |
NOT SPECIFIED |
NOT SPECIFIED |
24.2316 mm |
BICMOS |
5 V |
1.27 mm |
S-PQCC-J68 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR CIRCUIT |
MILITARY |
PIN/PEG |
68 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
5.5 V |
MIL-STD-883 |
GRID ARRAY |
4.5 V |
125 Cel |
-55 Cel |
PERPENDICULAR |
NOT SPECIFIED |
NOT SPECIFIED |
CMOS |
5 V |
S-CPGA-P68 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR CIRCUIT |
MILITARY |
PIN/PEG |
68 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
5.5 V |
MIL-PRF-38535 |
5 |
GRID ARRAY |
PGA68,11X11 |
4.5 V |
125 Cel |
-55 Cel |
TIN LEAD |
PERPENDICULAR |
3.62 mm |
24.38 mm |
16 |
24.38 mm |
CMOS |
.45 mA |
5 V |
Other Microprocessor ICs |
2.54 mm |
S-CPGA-P68 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR CIRCUIT |
MILITARY |
FLAT |
68 |
QFF |
SQUARE |
CERAMIC, GLASS-SEALED |
YES |
5.5 V |
MIL-STD-883 |
FLATPACK |
4.5 V |
125 Cel |
-55 Cel |
QUAD |
16 |
NOT SPECIFIED |
NOT SPECIFIED |
CMOS |
5 V |
S-GQFP-F68 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR CIRCUIT |
MILITARY |
PIN/PEG |
68 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
5.5 V |
MIL-STD-883 |
5 |
GRID ARRAY |
PGA68,11X11 |
4.5 V |
125 Cel |
-55 Cel |
TIN LEAD |
PERPENDICULAR |
3.62 mm |
24.38 mm |
16 |
24.38 mm |
CMOS |
5 V |
Other Microprocessor ICs |
2.54 mm |
S-CPGA-P68 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR CIRCUIT |
MILITARY |
FLAT |
68 |
QFF |
SQUARE |
CERAMIC, GLASS-SEALED |
YES |
5.5 V |
FLATPACK |
4.5 V |
125 Cel |
-55 Cel |
QUAD |
3.86 mm |
12.51 mm |
12.51 mm |
CMOS |
.45 mA |
5 V |
.635 mm |
S-GQFP-F68 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR CIRCUIT |
PIN/PEG |
68 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
5.5 V |
GRID ARRAY |
4.5 V |
-55 Cel |
PERPENDICULAR |
NMOS |
5 V |
S-CPGA-P68 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR CIRCUIT |
MILITARY |
FLAT |
68 |
QFF |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
5.5 V |
MIL-STD-883 |
5 |
FLATPACK |
QFL68,.5SQ,25 |
4.5 V |
125 Cel |
-55 Cel |
QUAD |
3.86 mm |
12.51 mm |
16 |
NOT SPECIFIED |
NOT SPECIFIED |
12.51 mm |
CMOS |
5 V |
Other Microprocessor ICs |
.635 mm |
S-CQFP-F68 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
CHIP CARRIER |
4.75 V |
70 Cel |
0 Cel |
QUAD |
4.57 mm |
24.2316 mm |
NOT SPECIFIED |
NOT SPECIFIED |
24.2316 mm |
BICMOS |
5 V |
1.27 mm |
S-PQCC-J68 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR CIRCUIT |
MILITARY |
PIN/PEG |
68 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
5.5 V |
GRID ARRAY |
4.5 V |
125 Cel |
-55 Cel |
PERPENDICULAR |
CMOS |
.45 mA |
5 V |
S-CPGA-P68 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
GULL WING |
68 |
QFP |
CERAMIC |
YES |
5 |
FLATPACK |
QFP68(UNSPEC) |
70 Cel |
0 Cel |
QUAD |
CMOS |
5 V |
Other Microprocessor ICs |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR CIRCUIT |
MILITARY |
FLAT |
68 |
QFF |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
5.5 V |
MIL-PRF-38535 |
5 |
FLATPACK |
QFL68,.5SQ,25 |
4.5 V |
125 Cel |
-55 Cel |
QUAD |
3.86 mm |
12.51 mm |
16 |
NOT SPECIFIED |
NOT SPECIFIED |
12.51 mm |
CMOS |
.45 mA |
5 V |
Other Microprocessor ICs |
.635 mm |
S-CQFP-F68 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CHIP CARRIER |
LDCC68,1.0SQ |
70 Cel |
0 Cel |
QUAD |
NOT SPECIFIED |
NOT SPECIFIED |
CMOS |
Display Controllers |
1.27 mm |
S-PQCC-J68 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
CHIP CARRIER |
LDCC68,1.0SQ |
4.5 V |
70 Cel |
0 Cel |
QUAD |
NOT SPECIFIED |
NOT SPECIFIED |
CMOS |
5 V |
Display Controllers |
1.27 mm |
S-PQCC-J68 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
CHIP CARRIER |
4.75 V |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
4.45 mm |
24.1808 mm |
24.1808 mm |
CMOS |
5 V |
1.27 mm |
S-PQCC-J68 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
235 |
CMOS |
.1 mA |
5 V |
Other Microprocessor ICs |
1.27 mm |
S-PQCC-J68 |
3 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
INDUSTRIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
235 |
CMOS |
.1 mA |
5 V |
Other Microprocessor ICs |
1.27 mm |
S-PQCC-J68 |
3 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
235 |
CMOS |
.1 mA |
5 V |
Other Microprocessor ICs |
1.27 mm |
S-PQCC-J68 |
3 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
CHIP CARRIER |
4.75 V |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
4.45 mm |
24.1808 mm |
24.1808 mm |
CMOS |
5 V |
1.27 mm |
S-PQCC-J68 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
INDUSTRIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
CHIP CARRIER |
LDCC68,1.0SQ |
4.5 V |
85 Cel |
-40 Cel |
QUAD |
5.08 mm |
25.15 mm |
8 |
16.5 MHz |
25.15 mm |
CMOS |
5 V |
UART |
1.27 mm |
S-PQCC-J68 |
||||||||||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
INDUSTRIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
235 |
CMOS |
.1 mA |
5 V |
Other Microprocessor ICs |
1.27 mm |
S-PQCC-J68 |
3 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
235 |
CMOS |
.1 mA |
5 V |
Other Microprocessor ICs |
1.27 mm |
S-PQCC-J68 |
3 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
INDUSTRIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
235 |
CMOS |
.1 mA |
5 V |
Other Microprocessor ICs |
1.27 mm |
S-PQCC-J68 |
3 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
INDUSTRIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
CHIP CARRIER |
LDCC68,1.0SQ |
4.5 V |
85 Cel |
-40 Cel |
QUAD |
5.08 mm |
25.15 mm |
8 |
16.5 MHz |
25.15 mm |
CMOS |
5 V |
UART |
1.27 mm |
S-PQCC-J68 |
||||||||||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
INDUSTRIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
235 |
CMOS |
.1 mA |
5 V |
Other Microprocessor ICs |
1.27 mm |
S-PQCC-J68 |
3 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
235 |
CMOS |
.1 mA |
5 V |
Other Microprocessor ICs |
1.27 mm |
S-PQCC-J68 |
3 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MILITARY |
J BEND |
68 |
QCCJ |
SQUARE |
CERAMIC |
YES |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
125 Cel |
-55 Cel |
Tin/Lead (Sn/Pb) |
Y |
QUAD |
1024 Bits |
CMOS |
5 V |
Other Microprocessor ICs |
1.27 mm |
S-XQCC-J68 |
Not Qualified |
e0 |
.00002 Amp |
.00000015 ns |
|||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
INDUSTRIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
N |
QUAD |
1024 Bits |
CMOS |
5 V |
Other Microprocessor ICs |
1.27 mm |
S-PQCC-J68 |
Not Qualified |
e0 |
.00002 Amp |
.0000002 ns |
|||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
INDUSTRIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
N |
QUAD |
256 Bits |
CMOS |
5 V |
Other Microprocessor ICs |
1.27 mm |
S-PQCC-J68 |
Not Qualified |
e0 |
.00002 Amp |
.0000002 ns |
Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.
Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.
Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.
Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.