DIP Other Function uPs,uCs & Peripheral ICs 1,015

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

MK85C30-P1011

STMicroelectronics

MILITARY

THROUGH-HOLE

40

DIP

RECTANGULAR

CERAMIC

NO

5

IN-LINE

DIP40,.6

125 Cel

-55 Cel

Tin/Lead (Sn/Pb)

DUAL

CMOS

30 mA

5 V

Other Microprocessor ICs

2.54 mm

R-XDIP-T40

Not Qualified

e0

IMSC011-S20S

STMicroelectronics

COMMERCIAL

THROUGH-HOLE

28

DIP

RECTANGULAR

CERAMIC

NO

5

IN-LINE

DIP28,.6

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

DUAL

CMOS

5 V

Other Microprocessor ICs

2.54 mm

R-XDIP-T28

Not Qualified

e0

MK85C30-P1010

STMicroelectronics

INDUSTRIAL

THROUGH-HOLE

40

DIP

RECTANGULAR

CERAMIC

NO

5

IN-LINE

DIP40,.6

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

CMOS

30 mA

5 V

Other Microprocessor ICs

2.54 mm

R-XDIP-T40

Not Qualified

e0

L6603A

STMicroelectronics

MICROPROCESSOR CIRCUIT

OTHER

THROUGH-HOLE

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

10 V

IN-LINE

7 V

70 Cel

-20 Cel

DUAL

15.24 mm

36.83 mm

CMOS

8.5 V

2.54 mm

R-PDIP-T28

Not Qualified

IMSC011A-S20E

STMicroelectronics

MICROPROCESSOR CIRCUIT

MILITARY

THROUGH-HOLE

28

DIP

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

NO

5.25 V

IN-LINE

4.75 V

125 Cel

-55 Cel

DUAL

4.242 mm

15.24 mm

36.068 mm

CMOS

5 V

2.54 mm

R-CDIP-T28

IMSC011-S20M

STMicroelectronics

MILITARY

THROUGH-HOLE

28

DIP

RECTANGULAR

CERAMIC

NO

5

IN-LINE

DIP28,.6

125 Cel

-55 Cel

TIN LEAD

DUAL

CMOS

5 V

Other uPs/uCs/Peripheral ICs

2.54 mm

R-XDIP-T28

Not Qualified

e0

MK50H28N25

STMicroelectronics

COMMERCIAL

THROUGH-HOLE

48

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5

IN-LINE

DIP48,.6

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

DUAL

CMOS

5 V

Other Microprocessor ICs

2.54 mm

R-PDIP-T48

Not Qualified

e0

MK85C30-N1010

STMicroelectronics

INDUSTRIAL

THROUGH-HOLE

40

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5

IN-LINE

DIP40,.6

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

CMOS

30 mA

5 V

Other Microprocessor ICs

2.54 mm

R-PDIP-T40

Not Qualified

e0

MK85C30-P0800

STMicroelectronics

COMMERCIAL

THROUGH-HOLE

40

DIP

RECTANGULAR

CERAMIC

NO

5

IN-LINE

DIP40,.6

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

DUAL

CMOS

30 mA

5 V

Other Microprocessor ICs

2.54 mm

R-XDIP-T40

Not Qualified

e0

HCF40108BEY

STMicroelectronics

MICROPROCESSOR CIRCUIT

INDUSTRIAL

THROUGH-HOLE

24

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

15 V

IN-LINE

3 V

85 Cel

-40 Cel

MATTE TIN

DUAL

15.24 mm

CMOS

2.54 mm

R-PDIP-T24

Not Qualified

e3

MK85C30-P0811

STMicroelectronics

MILITARY

THROUGH-HOLE

40

DIP

RECTANGULAR

CERAMIC

NO

5

IN-LINE

DIP40,.6

125 Cel

-55 Cel

Tin/Lead (Sn/Pb)

DUAL

CMOS

30 mA

5 V

Other Microprocessor ICs

2.54 mm

R-XDIP-T40

Not Qualified

e0

MK85C30-N1000

STMicroelectronics

COMMERCIAL

THROUGH-HOLE

40

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5

IN-LINE

DIP40,.6

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

DUAL

CMOS

30 mA

5 V

Other Microprocessor ICs

2.54 mm

R-PDIP-T40

Not Qualified

e0

IMSC012-P20S

STMicroelectronics

MICROPROCESSOR CIRCUIT

COMMERCIAL

THROUGH-HOLE

24

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5.25 V

5

IN-LINE

DIP24,.3

4.75 V

70 Cel

0 Cel

TIN LEAD

DUAL

4.953 mm

7.62 mm

31.75 mm

CMOS

5 V

Other Microprocessor ICs

2.54 mm

R-PDIP-T24

Not Qualified

e0

MK85C30-N1210

STMicroelectronics

INDUSTRIAL

THROUGH-HOLE

40

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5

IN-LINE

DIP40,.6

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

CMOS

30 mA

5 V

Other Microprocessor ICs

2.54 mm

R-PDIP-T40

Not Qualified

e0

HCF40208BEY

STMicroelectronics

MICROPROCESSOR CIRCUIT

INDUSTRIAL

THROUGH-HOLE

24

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

15 V

IN-LINE

3 V

85 Cel

-40 Cel

MATTE TIN

DUAL

15.24 mm

CMOS

5 V

2.54 mm

R-PDIP-T24

Not Qualified

e3

MK85C30-P0810

STMicroelectronics

INDUSTRIAL

THROUGH-HOLE

40

DIP

RECTANGULAR

CERAMIC

NO

5

IN-LINE

DIP40,.6

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

CMOS

30 mA

5 V

Other Microprocessor ICs

2.54 mm

R-XDIP-T40

Not Qualified

e0

IMSC011-S20E

STMicroelectronics

MICROPROCESSOR CIRCUIT

MILITARY

THROUGH-HOLE

28

DIP

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

NO

5.25 V

5

IN-LINE

DIP28,.6

4.75 V

125 Cel

-55 Cel

GOLD

DUAL

4.242 mm

15.24 mm

36.068 mm

CMOS

5 V

Other uPs/uCs/Peripheral ICs

2.54 mm

R-CDIP-T28

Not Qualified

e4

935262297112

NXP Semiconductors

MICROPROCESSOR CIRCUIT

INDUSTRIAL

THROUGH-HOLE

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

15 V

IN-LINE

2 V

85 Cel

-40 Cel

DUAL

4.2 mm

7.62 mm

40

250

9.5 mm

BIPOLAR

5 V

2.54 mm

R-PDIP-T8

NOT APPLICABLE

Not Qualified

MC68153P

NXP Semiconductors

COMMERCIAL

THROUGH-HOLE

40

DIP

RECTANGULAR

CERAMIC

NO

5

IN-LINE

DIP40,.6

70 Cel

0 Cel

DUAL

MOS

385 mA

5 V

Other uPs/uCs/Peripheral ICs

2.54 mm

R-XDIP-T40

Not Qualified

MC68153L

NXP Semiconductors

COMMERCIAL

THROUGH-HOLE

40

DIP

RECTANGULAR

CERAMIC

NO

5

IN-LINE

DIP40,.6

70 Cel

0 Cel

DUAL

MOS

385 mA

5 V

Other uPs/uCs/Peripheral ICs

2.54 mm

R-XDIP-T40

Not Qualified

TBB278A

Infineon Technologies

GRAPHICS PROCESSOR

OTHER

THROUGH-HOLE

22

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5

IN-LINE

DIP22,.4

70 Cel

-25 Cel

Tin/Lead (Sn/Pb)

DUAL

CMOS

5 V

Other Microprocessor ICs

2.54 mm

R-PDIP-T22

Not Qualified

e0

PT8A3405PE

Diodes Incorporated

COMMERCIAL

THROUGH-HOLE

16

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

3.5/5

IN-LINE

DIP16,.3

70 Cel

-10 Cel

DUAL

.3 mA

Other uPs/uCs/Peripheral ICs

2.54 mm

R-PDIP-T16

Not Qualified

PT8A3406PE

Diodes Incorporated

COMMERCIAL

THROUGH-HOLE

16

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

3.5/5

IN-LINE

DIP16,.3

70 Cel

-10 Cel

DUAL

.3 mA

Other uPs/uCs/Peripheral ICs

2.54 mm

R-PDIP-T16

Not Qualified

PT8A3240PE

Diodes Incorporated

OTHER

THROUGH-HOLE

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

3.5/5

IN-LINE

DIP8,.3

85 Cel

-20 Cel

DUAL

CMOS

.25 mA

Other uPs/uCs/Peripheral ICs

2.54 mm

R-PDIP-T8

Not Qualified

DS1073-60

Maxim Integrated

MICROPROCESSOR CIRCUIT

COMMERCIAL

THROUGH-HOLE

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

3.6 V

IN-LINE

2.7 V

70 Cel

0 Cel

TIN LEAD

DUAL

4.572 mm

7.62 mm

9.375 mm

CMOS

3 V

2.54 mm

R-PDIP-T8

Not Qualified

e0

DS1073M-100

Maxim Integrated

MICROPROCESSOR CIRCUIT

COMMERCIAL

THROUGH-HOLE

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

3.6 V

IN-LINE

2.7 V

70 Cel

0 Cel

TIN LEAD

DUAL

4.572 mm

7.62 mm

9.375 mm

CMOS

3 V

2.54 mm

R-PDIP-T8

Not Qualified

e0

DS1073-80

Maxim Integrated

MICROPROCESSOR CIRCUIT

COMMERCIAL

THROUGH-HOLE

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

3.6 V

IN-LINE

2.7 V

70 Cel

0 Cel

TIN LEAD

DUAL

4.572 mm

7.62 mm

9.375 mm

CMOS

3 V

2.54 mm

R-PDIP-T8

Not Qualified

e0

DS1211+

Maxim Integrated

MICROPROCESSOR CIRCUIT

COMMERCIAL

THROUGH-HOLE

20

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

IN-LINE

70 Cel

0 Cel

MATTE TIN

DUAL

4.572 mm

7.62 mm

30

260

26.16 mm

CMOS

5 V

2.54 mm

R-PDIP-T20

1

Not Qualified

e3

DS1075M

Maxim Integrated

MICROPROCESSOR CIRCUIT

COMMERCIAL

THROUGH-HOLE

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5.25 V

IN-LINE

4.75 V

70 Cel

0 Cel

TIN LEAD

DUAL

4.572 mm

7.62 mm

9.375 mm

CMOS

5 V

2.54 mm

R-PDIP-T8

Not Qualified

e0

DS1222

Maxim Integrated

MICROPROCESSOR CIRCUIT

COMMERCIAL

THROUGH-HOLE

14

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5.5 V

IN-LINE

DIP14,.3

4.5 V

70 Cel

0 Cel

TIN LEAD

DUAL

4.572 mm

7.62 mm

19.05 mm

CMOS

5 V

Other Microprocessor ICs

2.54 mm

R-PDIP-T14

1

Not Qualified

e0

DS1073-66

Maxim Integrated

MICROPROCESSOR CIRCUIT

COMMERCIAL

THROUGH-HOLE

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

3.6 V

IN-LINE

2.7 V

70 Cel

0 Cel

TIN LEAD

DUAL

4.572 mm

7.62 mm

9.375 mm

CMOS

3 V

2.54 mm

R-PDIP-T8

Not Qualified

e0

DS1222N

Maxim Integrated

MICROPROCESSOR CIRCUIT

COMMERCIAL

THROUGH-HOLE

14

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5.5 V

IN-LINE

DIP14,.3

4.5 V

70 Cel

0 Cel

TIN LEAD

DUAL

4.572 mm

7.62 mm

19.05 mm

CMOS

5 V

Other Microprocessor ICs

2.54 mm

R-PDIP-T14

Not Qualified

e0

DS1211N

Maxim Integrated

MICROPROCESSOR CIRCUIT

INDUSTRIAL

THROUGH-HOLE

20

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

IN-LINE

85 Cel

-40 Cel

TIN LEAD

DUAL

4.572 mm

7.62 mm

26.16 mm

CMOS

5 V

2.54 mm

R-PDIP-T20

1

Not Qualified

e0

DS1073-100

Maxim Integrated

MICROPROCESSOR CIRCUIT

COMMERCIAL

THROUGH-HOLE

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

3.6 V

IN-LINE

2.7 V

70 Cel

0 Cel

TIN LEAD

DUAL

4.572 mm

7.62 mm

9.375 mm

CMOS

3 V

2.54 mm

R-PDIP-T8

Not Qualified

e0

DS1073M-66

Maxim Integrated

MICROPROCESSOR CIRCUIT

COMMERCIAL

THROUGH-HOLE

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

3.6 V

IN-LINE

2.7 V

70 Cel

0 Cel

TIN LEAD

DUAL

4.572 mm

7.62 mm

9.375 mm

CMOS

3 V

2.54 mm

R-PDIP-T8

Not Qualified

e0

DS1073M-80

Maxim Integrated

MICROPROCESSOR CIRCUIT

COMMERCIAL

THROUGH-HOLE

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

3.6 V

IN-LINE

2.7 V

70 Cel

0 Cel

TIN LEAD

DUAL

4.572 mm

7.62 mm

9.375 mm

CMOS

3 V

2.54 mm

R-PDIP-T8

Not Qualified

e0

DS1073M-60

Maxim Integrated

MICROPROCESSOR CIRCUIT

COMMERCIAL

THROUGH-HOLE

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

3.6 V

IN-LINE

2.7 V

70 Cel

0 Cel

TIN LEAD

DUAL

4.572 mm

7.62 mm

9.375 mm

CMOS

3 V

2.54 mm

R-PDIP-T8

Not Qualified

e0

DS1211N+

Maxim Integrated

MICROPROCESSOR CIRCUIT

INDUSTRIAL

THROUGH-HOLE

20

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

IN-LINE

85 Cel

-40 Cel

MATTE TIN

DUAL

4.572 mm

7.62 mm

30

260

26.16 mm

CMOS

5 V

2.54 mm

R-PDIP-T20

1

Not Qualified

e3

DS1211

Maxim Integrated

MICROPROCESSOR CIRCUIT

COMMERCIAL

THROUGH-HOLE

20

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

IN-LINE

70 Cel

0 Cel

TIN LEAD

DUAL

4.572 mm

7.62 mm

26.16 mm

CMOS

5 V

2.54 mm

R-PDIP-T20

1

Not Qualified

e0

MXD1210CPA

Maxim Integrated

MICROPROCESSOR CIRCUIT

COMMERCIAL

THROUGH-HOLE

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5.5 V

IN-LINE

4.5 V

70 Cel

0 Cel

TIN LEAD

DUAL

4.572 mm

7.62 mm

9.375 mm

CMOS

.5 mA

5 V

2.54 mm

R-PDIP-T8

1

Not Qualified

e0

MXD1210EPA

Maxim Integrated

MICROPROCESSOR CIRCUIT

INDUSTRIAL

THROUGH-HOLE

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5.5 V

IN-LINE

4.5 V

85 Cel

-40 Cel

TIN LEAD

DUAL

4.572 mm

7.62 mm

245

9.375 mm

CMOS

.5 mA

5 V

2.54 mm

R-PDIP-T8

1

Not Qualified

e0

MXD1210MJA

Maxim Integrated

MICROPROCESSOR CIRCUIT

MILITARY

THROUGH-HOLE

8

DIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

5.5 V

IN-LINE

4.5 V

125 Cel

-55 Cel

TIN LEAD

DUAL

5.715 mm

7.62 mm

CMOS

.5 mA

5 V

2.54 mm

R-GDIP-T8

1

Not Qualified

e0

TMPZ84C40P

Toshiba

INDUSTRIAL

THROUGH-HOLE

40

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5

IN-LINE

DIP40,.6

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

CMOS

5 V

Other Microprocessor ICs

2.54 mm

R-PDIP-T40

Not Qualified

e0

TMPZ84C42P

Toshiba

INDUSTRIAL

THROUGH-HOLE

40

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5

IN-LINE

DIP40,.6

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

CMOS

5 V

Other Microprocessor ICs

2.54 mm

R-PDIP-T40

Not Qualified

e0

TMPZ84C20AP

Toshiba

INDUSTRIAL

THROUGH-HOLE

40

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5

IN-LINE

DIP40,.6

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

CMOS

5 V

Other Microprocessor ICs

2.54 mm

R-PDIP-T40

Not Qualified

e0

TMP8279P-5

Toshiba

MICROPROCESSOR CIRCUIT

COMMERCIAL

THROUGH-HOLE

40

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5.5 V

5

IN-LINE

DIP40,.6

4.5 V

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

DUAL

4.8 mm

15.24 mm

50.7 mm

CMOS

120 mA

5 V

Other Microprocessor ICs

2.54 mm

R-PDIP-T40

Not Qualified

e0

TMPZ84C20P

Toshiba

INDUSTRIAL

THROUGH-HOLE

40

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5

IN-LINE

DIP40,.6

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

CMOS

5 V

Other Microprocessor ICs

2.54 mm

R-PDIP-T40

Not Qualified

e0

TMPZ84C41P

Toshiba

INDUSTRIAL

THROUGH-HOLE

40

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5

IN-LINE

DIP40,.6

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

CMOS

5 V

Other Microprocessor ICs

2.54 mm

R-PDIP-T40

Not Qualified

e0

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.