RECTANGULAR Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
MAX7348AEP+	Analog Devices	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		2.5/3.3	SMALL OUTLINE, SHRINK PITCH	SSOP20,.25	2.4 V	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	1.73 mm	3.9 mm	MONITORS UP TO 40 KEYS	30	260	8.65 mm	BICMOS	.1 mA	3.3 V	Parallel IO Port	.635 mm	R-PDSO-G20	1	Not Qualified	e3
DS8314-RRX+	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	6 V		3.3,5	SMALL OUTLINE	SOP28,.4	2.7 V	85 Cel	-40 Cel		DUAL	2.65 mm	7.5 mm		NOT SPECIFIED	NOT SPECIFIED	17.9 mm	CMOS	85 mA	3.3 V	Other Microprocessor ICs	1.27 mm	R-PDSO-G28		Not Qualified
MAX66242ETB+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	10	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	3.63 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC10,.16,20	2.97 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	.8 mm	3 mm		30	260	4 mm	CMOS		3.3 V		.5 mm	R-PDSO-N10	1		e4
MAX66242ESA+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.63 V			SMALL OUTLINE	SOP8,.25	2.97 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	1.75 mm	3.9 mm		30	260	4.9 mm	CMOS		3.3 V		1.27 mm	R-PDSO-G8	1		e3
DS1209SN-B1	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES			5	SMALL OUTLINE	SOP16,.4		85 Cel	-40 Cel	TIN LEAD	DUAL							CMOS	.5 mA	5 V	Other Microprocessor ICs	1.27 mm	R-PDSO-G16		Not Qualified	e0
MAXQ1061ETP+	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	20		RECTANGULAR	UNSPECIFIED	YES							109 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD				30	260		CMOS					R-XQCC-N20	1		e3
MAX7349AEG+	Analog Devices	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		2.5/3.3	SMALL OUTLINE, SHRINK PITCH	SSOP24,.24	2.4 V	125 Cel	-40 Cel	MATTE TIN	DUAL	1.73 mm	3.9 mm	MONITORS UP TO 64 KEYS	30	260	8.65 mm	BICMOS	.1 mA	3.3 V	Parallel IO Port	.635 mm	R-PDSO-G24	1	Not Qualified	e3
MAX7349AEG+T	Analog Devices	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		2.5/3.3	SMALL OUTLINE, SHRINK PITCH	SSOP24,.24	2.4 V	125 Cel	-40 Cel	MATTE TIN	DUAL	1.73 mm	3.9 mm		30	260	8.65 mm	BICMOS	.1 mA	3.3 V	Parallel IO Port	.635 mm	R-PDSO-G24	1	Not Qualified	e3
DS24L65P+T	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	C BEND	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	1.89 V			SMALL OUTLINE		1.71 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	1.5 mm			30	260		CMOS		1.8 V		1.27 mm	R-PDSO-C6	1		e3
DS24L65P+	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	C BEND	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	1.89 V			SMALL OUTLINE		1.71 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	1.5 mm			30	260		CMOS		1.8 V		1.27 mm	R-PDSO-C6	1		e3
DS2460S+T&R	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		3/5	SMALL OUTLINE	SOP8,.25	2.7 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	1.75 mm	3.9 mm		30	260	4.9 mm	CMOS	.5 mA		Other Microprocessor ICs	1.27 mm	R-PDSO-G8	1	Not Qualified	e3
DS2460S+	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		3/5	SMALL OUTLINE	SOP8,.25	2.7 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	1.75 mm	3.9 mm		30	260	4.9 mm	CMOS	.5 mA		Other Microprocessor ICs	1.27 mm	R-PDSO-G8	1	Not Qualified	e3
LTC4263CDE-1#PBF	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		4.5 V	70 Cel	0 Cel	MATTE TIN	DUAL	.8 mm	3 mm		30	260	4 mm	CMOS		5 V		.5 mm	R-PDSO-N14	1	Not Qualified	e3
LTC4263CS#TR	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V			SMALL OUTLINE		4.5 V	70 Cel	0 Cel	TIN LEAD	DUAL	1.752 mm	3.9 mm				8.649 mm	CMOS		5 V		1.27 mm	R-PDSO-G14	1	Not Qualified	e0
LTC4263CS	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V			SMALL OUTLINE		4.5 V	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	DUAL	1.752 mm	3.9 mm				8.649 mm	CMOS		5 V		1.27 mm	R-PDSO-G14	1	Not Qualified	e0
LTC4263CS#TRPBF	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V			SMALL OUTLINE		4.5 V	70 Cel	0 Cel	MATTE TIN	DUAL	1.752 mm	3.899 mm		30	260	8.649 mm	CMOS		5 V		1.27 mm	R-PDSO-G14	1	Not Qualified	e3
LTC4263CDE#TR	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	14	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V			SMALL OUTLINE, VERY THIN PROFILE		4.5 V	70 Cel	0 Cel	TIN LEAD	DUAL	.8 mm	3 mm				4 mm	CMOS		5 V		.5 mm	R-PDSO-N14	1	Not Qualified	e0
LTC4263CDE	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	14	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V			SMALL OUTLINE, VERY THIN PROFILE		4.5 V	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	DUAL	.8 mm	3 mm				4 mm	CMOS		5 V		.5 mm	R-PDSO-N14	1	Not Qualified	e0
LTC4263CDE-1#TRPBF	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		4.5 V	70 Cel	0 Cel	MATTE TIN	DUAL	.8 mm	3 mm		30	260	4 mm	CMOS		5 V		.5 mm	R-PDSO-N14	1	Not Qualified	e3
LTC4263CDE#PBF	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		4.5 V	70 Cel	0 Cel	MATTE TIN	DUAL	.8 mm	3 mm		30	260	4 mm	CMOS		5 V		.5 mm	R-PDSO-N14	1	Not Qualified	e3
LTC4263IDE#TR	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	14	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V			SMALL OUTLINE, VERY THIN PROFILE		4.5 V	85 Cel	-40 Cel	TIN LEAD	DUAL	.8 mm	3 mm				4 mm	CMOS		5 V		.5 mm	R-PDSO-N14	1	Not Qualified	e0
DS28E10P+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		C BEND	6		RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V					2.8 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL				30	260		CMOS		3.3 V			R-PDSO-C6	1		e3
MXD1210ESA+	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V			SMALL OUTLINE		4.5 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	1.75 mm	3.9 mm		30	260	4.9 mm	CMOS	.5 mA	5 V		1.27 mm	R-PDSO-G8	1	Not Qualified	e3
DS28C40G/V+U	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	10	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	3.63 V	AEC-Q100		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC10,.16,20	2.97 V	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	.8 mm	3 mm		30	260	4 mm	CMOS		3.3 V		.5 mm	R-PDSO-N10	1		e3
DS8024-RJX+	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	6 V		3.3,5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	2.7 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	1.1 mm	4.4 mm		30	260	9.7 mm	CMOS	215 mA	3.3 V	Other Microprocessor ICs	.65 mm	R-PDSO-G28	1	Not Qualified	e3
DS8024-RJX+T&R	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	6 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		2.7 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	1.1 mm	4.4 mm		30	260	9.7 mm	CMOS		3.3 V		.65 mm	R-PDSO-G28	1		e3
DS28E10P+	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		C BEND	6		RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V					2.8 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL				30	260		CMOS		3.3 V			R-PDSO-C6	1		e3
DS28C22Q+U	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	3.63 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2.97 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	.8 mm	2 mm		30	260	3 mm	CMOS		3.3 V		.5 mm	R-PDSO-N8	1		e3
MXD1210CSA+T	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V			SMALL OUTLINE		4.5 V	70 Cel	0 Cel	Matte Tin (Sn) - annealed	DUAL	1.75 mm	3.9 mm		30	260	4.9 mm	CMOS	.5 mA	5 V		1.27 mm	R-PDSO-G8	1	Not Qualified	e3
DS28E10R+	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	3		RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V					2.8 V	85 Cel	-40 Cel		DUAL				30	260		CMOS		3.3 V			R-PDSO-G3
DS8024M-RJX+T	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	6 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		2.7 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	1.1 mm	4.4 mm		30	260	9.7 mm	CMOS		3.3 V		.65 mm	R-PDSO-G28	1		e3
DS28C22Q+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	3.63 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2.97 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	.8 mm	2 mm		30	260	3 mm	CMOS		3.3 V		.5 mm	R-PDSO-N8	1		e3
MXD1210CWE+T	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V			SMALL OUTLINE		4.5 V	70 Cel	0 Cel	Matte Tin (Sn) - annealed	DUAL	1.75 mm	3.9 mm				9.9 mm	CMOS	.5 mA	5 V		1.27 mm	R-PDSO-G16	1	Not Qualified	e3
MXD1210CSA+	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V			SMALL OUTLINE		4.5 V	70 Cel	0 Cel	Matte Tin (Sn) - annealed	DUAL	1.75 mm	3.9 mm		30	260	4.9 mm	CMOS	.5 mA	5 V		1.27 mm	R-PDSO-G8	1	Not Qualified	e3
MXD1210ESA+T	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V			SMALL OUTLINE		4.5 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	1.75 mm	3.9 mm		30	260	4.9 mm	CMOS	.5 mA	5 V		1.27 mm	R-PDSO-G8	1	Not Qualified	e3
MXD1210CPA+	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V			IN-LINE		4.5 V	70 Cel	0 Cel	Matte Tin (Sn) - annealed	DUAL	4.572 mm	7.62 mm		30	260	9.375 mm	CMOS	.5 mA	5 V		2.54 mm	R-PDIP-T8	1	Not Qualified	e3
MXD1210EPA+	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V			IN-LINE		4.5 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	4.572 mm	7.62 mm		30	260	9.375 mm	CMOS	.5 mA	5 V		2.54 mm	R-PDIP-T8	1	Not Qualified	e3
DS28E10R+U	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	3		RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V					2.8 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL				30	260		CMOS		3.3 V			R-PDSO-G3	1		e3
DS28E36Q+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	6	HVSON	RECTANGULAR	UNSPECIFIED	YES	3.63 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.11,37	2.97 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	.8 mm	3 mm		30	260	3 mm	CMOS		3.3 V		.95 mm	S-XDSO-N6	1		e3
CAT93C8614JI-25TE13	Onsemi	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	6 V			SMALL OUTLINE		2.7 V	85 Cel	-40 Cel	TIN LEAD	DUAL	1.75 mm	3.9 mm				4.9 mm	CMOS		5 V		1.27 mm	R-PDSO-G8		Not Qualified	e0
CAT93C5733U-30TE13	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	6 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		2.7 V	70 Cel	0 Cel	TIN LEAD	DUAL	1.1 mm	3 mm				3 mm	CMOS		5 V		.65 mm	R-PDSO-G8	1	Not Qualified	e0
CAT93C5631PI-42	Onsemi	MICROPROCESSOR CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	6 V			IN-LINE		2.7 V	85 Cel	-40 Cel	TIN LEAD	DUAL	4.57 mm	7.62 mm				9.27 mm	CMOS		5 V		2.54 mm	R-PDIP-T8		Not Qualified	e0
CAT93C8631SI-28TE13	Onsemi	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	6 V			SMALL OUTLINE		2.7 V	85 Cel	-40 Cel	TIN LEAD	DUAL	1.75 mm	3.9 mm				4.9 mm	CMOS		5 V		1.27 mm	R-PDSO-G8		Not Qualified	e0
CAT93C8632J-30TE13	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	6 V			SMALL OUTLINE		2.7 V	70 Cel	0 Cel	TIN LEAD	DUAL	1.75 mm	3.9 mm				4.9 mm	CMOS		5 V		1.27 mm	R-PDSO-G8		Not Qualified	e0
CAT93C5722JA-45TE13	Onsemi	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	6 V			SMALL OUTLINE		2.7 V	105 Cel	-40 Cel	TIN LEAD	DUAL	1.75 mm	3.9 mm				4.9 mm	CMOS		5 V		1.27 mm	R-PDSO-G8		Not Qualified	e0
CAT93C5612UI-45TE13	Onsemi	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	6 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		2.7 V	85 Cel	-40 Cel	TIN LEAD	DUAL	1.1 mm	3 mm				3 mm	CMOS		5 V		.65 mm	R-PDSO-G8	1	Not Qualified	e0
CAT93C6613SI-45TE13	Onsemi	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	6 V			SMALL OUTLINE		2.7 V	85 Cel	-40 Cel	TIN LEAD	DUAL	1.75 mm	3.9 mm				4.9 mm	CMOS		5 V		1.27 mm	R-PDSO-G8		Not Qualified	e0
CAT93C6614S-30TE13	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	6 V			SMALL OUTLINE		2.7 V	70 Cel	0 Cel	TIN LEAD	DUAL	1.75 mm	3.9 mm				4.9 mm	CMOS		5 V		1.27 mm	R-PDSO-G8		Not Qualified	e0

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.