PROGRAMMABLE SYSTEM ON CHIP Other Function uPs,uCs & Peripheral ICs 54

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code
XC7Z035-1FFG900C	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA900,30X30,40	.95 V	85 Cel	0 Cel		BOTTOM	3.35 mm	31 mm		31 mm	CMOS	1 V	1 mm	S-PBGA-B900
XC7Z035-2FFG900E	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	0 Cel		BOTTOM	3.35 mm	31 mm		31 mm	CMOS	1 V	1 mm	S-PBGA-B900
XC7Z035-3FFG900E	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	0 Cel		BOTTOM	3.35 mm	31 mm		31 mm	CMOS	1 V	1 mm	S-PBGA-B900
XC7Z045-2FF676E	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	0 Cel		BOTTOM	2.54 mm	27 mm		27 mm	CMOS	1 V	1 mm	S-PBGA-B676
XC7Z035-1FFG900I	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	-40 Cel		BOTTOM	3.35 mm	31 mm		31 mm	CMOS	1 V	1 mm	S-PBGA-B900
XC7Z035-2FFG900I	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	-40 Cel		BOTTOM	3.35 mm	31 mm		31 mm	CMOS	1 V	1 mm	S-PBGA-B900
CY8C4149AZI-S598	Infineon Technologies	PROGRAMMABLE SYSTEM ON CHIP														TIN				260						3	e3
XC7Z015-1CL485I	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	485	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	100 Cel	-40 Cel		BOTTOM	1.6 mm	19 mm		19 mm	CMOS	1 V	.8 mm	S-PBGA-B485
CY8C4149AZI-S593	Infineon Technologies	PROGRAMMABLE SYSTEM ON CHIP														TIN				260						3	e3
CY8C4149AZI-S595	Infineon Technologies	PROGRAMMABLE SYSTEM ON CHIP														TIN				260						3	e3
XC7Z030-1FF676I	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel		BOTTOM	2.54 mm	27 mm		27 mm	CMOS	1 V	1 mm	S-PBGA-B676
XC7Z030-1SB485I	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	485	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA485,22X22,32	.95 V	100 Cel	-40 Cel		BOTTOM	2.44 mm	19 mm		19 mm	CMOS	1 V	.8 mm	S-PBGA-B485
CY8C24533-24PVXI	Infineon Technologies	PROGRAMMABLE SYSTEM ON CHIP	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	3 V	85 Cel	-40 Cel		DUAL	2 mm	5.3 mm		10.2 mm	CMOS	3.3 V	.65 mm	R-PDSO-G28
XC7Z030-2FF676I	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel		BOTTOM	2.54 mm	27 mm		27 mm	CMOS	1 V	1 mm	S-PBGA-B676
XC7Z045-2FF900I	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	-40 Cel		BOTTOM	3.35 mm	31 mm		31 mm	CMOS	1 V	1 mm	S-PBGA-B900
CY8C24533-24PVXIT	Infineon Technologies	PROGRAMMABLE SYSTEM ON CHIP	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	3 V	85 Cel	-40 Cel		DUAL	2 mm	5.3 mm		10.2 mm	CMOS	3.3 V	.65 mm	R-PDSO-G28
CY8C4149AZI-S585	Infineon Technologies	PROGRAMMABLE SYSTEM ON CHIP														TIN				260						3	e3
CY8C4149AZI-S578	Infineon Technologies	PROGRAMMABLE SYSTEM ON CHIP														TIN				260						3	e3
CY8C4149AZQ-S593	Infineon Technologies	PROGRAMMABLE SYSTEM ON CHIP														TIN				260						3	e3
CY8C4148AZI-S555	Infineon Technologies	PROGRAMMABLE SYSTEM ON CHIP														TIN				260						3	e3
CY8C4149AZI-S555	Infineon Technologies	PROGRAMMABLE SYSTEM ON CHIP														TIN				260						3	e3
CY8C4148AZI-S558	Infineon Technologies	PROGRAMMABLE SYSTEM ON CHIP														TIN				260						3	e3
CY8C4149AZI-S548	Infineon Technologies	PROGRAMMABLE SYSTEM ON CHIP														TIN				260						3	e3
CY8C4148AZQ-S558	Infineon Technologies	PROGRAMMABLE SYSTEM ON CHIP														TIN				260						3	e3
CY8C4149AZI-S568	Infineon Technologies	PROGRAMMABLE SYSTEM ON CHIP														TIN				260						3	e3
CY8C4149AZI-S553	Infineon Technologies	PROGRAMMABLE SYSTEM ON CHIP														TIN				260						3	e3
CY8C4148AZI-S595	Infineon Technologies	PROGRAMMABLE SYSTEM ON CHIP														TIN				260						3	e3
CY8C4148AZI-S583	Infineon Technologies	PROGRAMMABLE SYSTEM ON CHIP														TIN				260						3	e3
CY8C4149AZQ-S595	Infineon Technologies	PROGRAMMABLE SYSTEM ON CHIP														TIN				260						3	e3
CY8C4148AZI-S593	Infineon Technologies	PROGRAMMABLE SYSTEM ON CHIP														TIN				260						3	e3
CY8C4149AZI-S588	Infineon Technologies	PROGRAMMABLE SYSTEM ON CHIP														TIN				260						3	e3
CY8C4148AZI-S598	Infineon Technologies	PROGRAMMABLE SYSTEM ON CHIP														TIN				260						3	e3
CY8C4149AZI-S565	Infineon Technologies	PROGRAMMABLE SYSTEM ON CHIP														TIN				260						3	e3
CY8C4149AZQ-S555	Infineon Technologies	PROGRAMMABLE SYSTEM ON CHIP														TIN				260						3	e3
CY8C4149AZI-S543	Infineon Technologies	PROGRAMMABLE SYSTEM ON CHIP														TIN				260						3	e3
CY8C4149AZQ-S545	Infineon Technologies	PROGRAMMABLE SYSTEM ON CHIP														TIN				260						3	e3
CY8C4149AZI-S558	Infineon Technologies	PROGRAMMABLE SYSTEM ON CHIP														TIN				260						3	e3
CY8C4148AZI-S553	Infineon Technologies	PROGRAMMABLE SYSTEM ON CHIP														TIN				260						3	e3
CY8C4149AZQ-S598	Infineon Technologies	PROGRAMMABLE SYSTEM ON CHIP														TIN				260						3	e3
CY8C4149AZI-S545	Infineon Technologies	PROGRAMMABLE SYSTEM ON CHIP														TIN				260						3	e3
CY8C4148AZI-S548	Infineon Technologies	PROGRAMMABLE SYSTEM ON CHIP														TIN				260						3	e3
CY8C4148AZI-S585	Infineon Technologies	PROGRAMMABLE SYSTEM ON CHIP														TIN				260						3	e3
CY8C4149AZQ-S548	Infineon Technologies	PROGRAMMABLE SYSTEM ON CHIP														TIN				260						3	e3
CY8C4149AZI-S575	Infineon Technologies	PROGRAMMABLE SYSTEM ON CHIP														TIN				260						3	e3
CY8C4149AZQ-S558	Infineon Technologies	PROGRAMMABLE SYSTEM ON CHIP														TIN				260						3	e3
CY8C4148AZI-S588	Infineon Technologies	PROGRAMMABLE SYSTEM ON CHIP														TIN				260						3	e3
CY8C4149AZI-S583	Infineon Technologies	PROGRAMMABLE SYSTEM ON CHIP														TIN				260						3	e3
XC7Z035-L2FFG900I	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	-40 Cel		BOTTOM	3.35 mm	31 mm		31 mm	CMOS	1 V	1 mm	S-PBGA-B900

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.