NO LEAD Other Function uPs,uCs & Peripheral ICs 1,528

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	ROM Words	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	ROM Programmability	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code
CC1310F32RHBR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	1 mm		5 mm		30	260	5 mm	28672	CMOS		3.3 V				.5 mm	S-PQCC-N32	3			e4
CC430F6143IRGCT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		16	2/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1 mm	8192	9 mm	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	30	260	9 mm	2048	CMOS		3.3 V	Microcontrollers	FLASH		.5 mm	S-PQCC-N64	3	Not Qualified	20 rpm	e4
CC1310F128RHB	Texas Instruments	MICROPROCESSOR CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V					QUAD	1 mm		5 mm				5 mm		CMOS						.5 mm	S-PQCC-N32
ADN2855ACPZ-R7	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3 V	85 Cel		-40 Cel	MATTE TIN	QUAD	1 mm		5 mm		30	260	5 mm		CMOS		3.3 V				.5 mm	S-XQCC-N32	3	Not Qualified		e3
ADUCM330WDCPZ	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	18 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3.6 V	115 Cel		-40 Cel		QUAD	1 mm		6 mm				6 mm		CMOS						.5 mm	S-XQCC-N32
ADUCM331WDCPZ	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	18 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3.6 V	115 Cel		-40 Cel		QUAD	1 mm		6 mm				6 mm		CMOS						.5 mm	S-XQCC-N32
ADUCM331WFSBCPZ-RL	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	18 V	AEC-Q100			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.24SQ,20	3.6 V	115 Cel		-40 Cel		QUAD	1 mm		6 mm		NOT SPECIFIED	NOT SPECIFIED	6 mm		CMOS					SPI	.5 mm	S-XQCC-N32
ADN2855ACPZ	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3 V	85 Cel		-40 Cel	MATTE TIN	QUAD	1 mm		5 mm		30	260	5 mm		CMOS		3.3 V				.5 mm	S-XQCC-N32	3	Not Qualified		e3
ADUCM330WDCPZ-RL	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	18 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3.6 V	115 Cel		-40 Cel		QUAD	1 mm		6 mm				6 mm		CMOS						.5 mm	S-XQCC-N32
ADUCM331WDCPZ-RL	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	18 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3.6 V	115 Cel		-40 Cel		QUAD	1 mm		6 mm				6 mm		CMOS						.5 mm	S-XQCC-N32
MAX7359ETG+	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V			1.8/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.13SQ,16	1.62 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	.85 mm		3.5 mm		30	260	3.5 mm		BICMOS	.06 mA	2.5 V	Parallel IO Port			.4 mm	S-XQCC-N24	1	Not Qualified		e3
MAX66242E/W+	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	3.63 V				UNCASED CHIP		2.97 V	85 Cel		-40 Cel		UPPER									CMOS		3.3 V					X-XUUC-N
MAX66240ITB+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	10	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES					SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC10,.16,20		85 Cel		-40 Cel		DUAL	.8 mm		3 mm		NOT SPECIFIED	NOT SPECIFIED	4 mm		CMOS						.5 mm	R-PDSO-N10
MAX66242ETB+	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	10	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	3.63 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC10,.16,20	2.97 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	.8 mm		3 mm		30	260	4 mm		CMOS		3.3 V				.5 mm	R-PDSO-N10	1			e4
MAX66240ETB+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	10	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES					SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC10,.16,20		85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	.8 mm		3 mm		30	260	4 mm		CMOS						.5 mm	R-PDSO-N10	1			e4
MAXQ1061ETP+T	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	20		RECTANGULAR	UNSPECIFIED	YES								109 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD					30	260			CMOS							R-XQCC-N20	1			e3
MAX66240ETB+	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	10	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES					SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC10,.16,20		85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	.8 mm		3 mm		30	260	4 mm		CMOS						.5 mm	R-PDSO-N10	1			e4
MAX66240ITB+	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	10	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES					SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC10,.16,20		85 Cel		-40 Cel		DUAL	.8 mm		3 mm		NOT SPECIFIED	NOT SPECIFIED	4 mm		CMOS						.5 mm	R-PDSO-N10
MAX7359ETG+T	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.62 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	.8 mm		3.5 mm		30	260	3.5 mm		BICMOS		2.5 V				.4 mm	S-XQCC-N24	1			e3
MAX66240E/W+	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES					UNCASED CHIP			85 Cel		-40 Cel		UPPER					NOT SPECIFIED	NOT SPECIFIED			CMOS							X-XUUC-N
MAX66242ETB+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	10	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	3.63 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC10,.16,20	2.97 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	.8 mm		3 mm		30	260	4 mm		CMOS		3.3 V				.5 mm	R-PDSO-N10	1			e4
MAXQ1061ETP+	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	20		RECTANGULAR	UNSPECIFIED	YES								109 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD					30	260			CMOS							R-XQCC-N20	1			e3
MAX7349ATG+T	Analog Devices	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V			2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	2.4 V	125 Cel		-40 Cel	MATTE TIN	QUAD	.8 mm		4 mm	MONITORS UP TO 64 KEYS	30	260	4 mm		BICMOS	.1 mA	3.3 V	Parallel IO Port			.5 mm	S-XQCC-N24	1	Not Qualified		e3
MAX7349ATG+	Analog Devices	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V			2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	2.4 V	125 Cel		-40 Cel	MATTE TIN	QUAD	.8 mm		4 mm	MONITORS UP TO 64 KEYS	30	260	4 mm		BICMOS	.1 mA	3.3 V	Parallel IO Port			.5 mm	S-XQCC-N24	1	Not Qualified		e3
DS2476Q+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	6	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.63 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.12,37	2.97 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	.8 mm		3 mm		30	260	3 mm		CMOS		3.3 V				.95 mm	S-PDSO-N6	1			e3
DS2476Q+U	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	6	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.63 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.12,37	2.97 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	.8 mm		3 mm		30	260	3 mm		CMOS		3.3 V				.95 mm	S-PDSO-N6	1			e3
DS2477Q+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	6	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.63 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.12,37	2.97 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	.8 mm		3 mm		30	260	3 mm		CMOS		3.3 V				.95 mm	S-PDSO-N6	1			e3
DS2476BQ+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	6	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.63 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.12,37	2.2 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	.8 mm		3 mm		30	260	3 mm		CMOS		3.3 V				.95 mm	S-PDSO-N6	1			e3
LTC4263CDE-1#PBF	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		4.5 V	70 Cel		0 Cel	MATTE TIN	DUAL	.8 mm		3 mm		30	260	4 mm		CMOS		5 V				.5 mm	R-PDSO-N14	1	Not Qualified		e3
LTC4263CDE#TR	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	14	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V				SMALL OUTLINE, VERY THIN PROFILE		4.5 V	70 Cel		0 Cel	TIN LEAD	DUAL	.8 mm		3 mm				4 mm		CMOS		5 V				.5 mm	R-PDSO-N14	1	Not Qualified		e0
LTC4263CDE	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	14	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V				SMALL OUTLINE, VERY THIN PROFILE		4.5 V	70 Cel		0 Cel	Tin/Lead (Sn/Pb)	DUAL	.8 mm		3 mm				4 mm		CMOS		5 V				.5 mm	R-PDSO-N14	1	Not Qualified		e0
LTC4263CDE-1#TRPBF	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		4.5 V	70 Cel		0 Cel	MATTE TIN	DUAL	.8 mm		3 mm		30	260	4 mm		CMOS		5 V				.5 mm	R-PDSO-N14	1	Not Qualified		e3
LTC4263CDE#PBF	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		4.5 V	70 Cel		0 Cel	MATTE TIN	DUAL	.8 mm		3 mm		30	260	4 mm		CMOS		5 V				.5 mm	R-PDSO-N14	1	Not Qualified		e3
LTC4263IDE#TR	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	14	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V				SMALL OUTLINE, VERY THIN PROFILE		4.5 V	85 Cel		-40 Cel	TIN LEAD	DUAL	.8 mm		3 mm				4 mm		CMOS		5 V				.5 mm	R-PDSO-N14	1	Not Qualified		e0
DS28C36BQ+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	6	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.63 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.12,38	2.2 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	.8 mm		3 mm		30	260	3 mm		CMOS		3.3 V				.95 mm	S-PDSO-N6	1			e3
DS28C40G/V+U	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	10	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	3.63 V	AEC-Q100			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC10,.16,20	2.97 V	125 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	.8 mm		3 mm		30	260	4 mm		CMOS		3.3 V				.5 mm	R-PDSO-N10	1			e3
DS28C22Q+U	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	3.63 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2.97 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	.8 mm		2 mm		30	260	3 mm		CMOS		3.3 V				.5 mm	R-PDSO-N8	1			e3
DS28C36Q+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	6	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.63 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.12,38	2.97 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	.8 mm		3 mm		30	260	3 mm		CMOS		3.3 V				.95 mm	S-PDSO-N6	1			e3
DS28E38Q+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	6	HVSON	SQUARE	UNSPECIFIED	YES	3.63 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.12,37	2.97 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	.8 mm		3 mm		30	260	3 mm		CMOS		3.3 V				.95 mm	S-XDSO-N6	1			e3
DS28E84Q+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR	COMMERCIAL	NO LEAD	6	HVSON	SQUARE	UNSPECIFIED	YES	3.63 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.12,38	2.97 V	50 Cel		0 Cel	Matte Tin (Sn) - annealed	DUAL	.8 mm		3 mm		30	260	3 mm		CMOS		3.3 V				.95 mm	S-XDSO-N6	1			e3
DS28S60Q+	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	12	HVSON	SQUARE	UNSPECIFIED	YES	3.63 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC12,.12,20	1.62 V	105 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	.8 mm		3 mm		30	260	3 mm		CMOS		3.3 V				.5 mm	S-XDSO-N12	1			e3
DS28C22Q+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	3.63 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2.97 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	.8 mm		2 mm		30	260	3 mm		CMOS		3.3 V				.5 mm	R-PDSO-N8	1			e3
DS28E39Q+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	6	HVSON	SQUARE	UNSPECIFIED	YES	3.63 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.12,38	2.97 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	.8 mm		3 mm		30	260	3 mm		CMOS		3.3 V				.95 mm	S-XDSO-N6	1			e3
DS28E83Q+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR	COMMERCIAL	NO LEAD	6	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.63 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.12,38	2.97 V	50 Cel		0 Cel	Matte Tin (Sn) - annealed	DUAL	.8 mm		3 mm		30	260	3 mm		CMOS		3.3 V				.95 mm	S-PDSO-N6	1			e3
DS28E36Q+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	6	HVSON	RECTANGULAR	UNSPECIFIED	YES	3.63 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.11,37	2.97 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	.8 mm		3 mm		30	260	3 mm		CMOS		3.3 V				.95 mm	S-XDSO-N6	1			e3
AX-SFUS-1-01-TX30	Onsemi	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel		-40 Cel	NICKEL GOLD PALLADIUM	QUAD	1 mm		5 mm		30	260	7 mm		CMOS		3 V				.5 mm	R-XQCC-N40	1
SA3230-E1-T	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	32		RECTANGULAR	UNSPECIFIED	YES					MICROELECTRONIC ASSEMBLY			40 Cel		0 Cel		UNSPECIFIED	1.777 mm		3.68 mm	SEATED HGT-NOM	NOT SPECIFIED	NOT SPECIFIED	6.35 mm		CMOS		1.25 V					R-XXMA-N32
GA3227-E1	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	20		RECTANGULAR	UNSPECIFIED	YES					MICROELECTRONIC ASSEMBLY			40 Cel		0 Cel		UNSPECIFIED	1.27 mm		3.81 mm		NOT SPECIFIED	NOT SPECIFIED	6.35 mm		CMOS		1.25 V					R-XXMA-N20

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.