Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Information Access Method | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | No. of Bits | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Interrupt Capability | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Ultraviolet Erasable | Terminal Position | DMA Channels | No. of Ports | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | ROM Bits Size | No. of Timers | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Minimum Time | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | Volatile | JESD-609 Code | Maximum Standby Current | On Chip Program ROM Width | No. of I/O Lines | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
STMicroelectronics |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
16 |
RECTANGULAR |
UNSPECIFIED |
NO |
5.25 V |
MICROELECTRONIC ASSEMBLY |
4.75 V |
50 Cel |
0 Cel |
UNSPECIFIED |
CMOS |
5 V |
R-XXMA-T16 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MILITARY |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
5 |
IN-LINE |
DIP40,.6 |
125 Cel |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
CMOS |
30 mA |
5 V |
Other Microprocessor ICs |
2.54 mm |
R-XDIP-T40 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
COMMERCIAL |
THROUGH-HOLE |
48 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
5 |
IN-LINE |
DIP48,.6 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
MOS |
180 mA |
5 V |
Other Microprocessor ICs |
2.54 mm |
R-XDIP-T48 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR CIRCUIT |
MILITARY |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
18 V |
IN-LINE |
3 V |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
5.71 mm |
15.24 mm |
CMOS |
5 V |
2.54 mm |
R-GDIP-T24 |
Not Qualified |
e0 |
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STMicroelectronics |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
16 |
RECTANGULAR |
UNSPECIFIED |
NO |
5.25 V |
MICROELECTRONIC ASSEMBLY |
4.75 V |
50 Cel |
0 Cel |
UNSPECIFIED |
CMOS |
5 V |
R-XXMA-T16 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
5 |
IN-LINE |
DIP40,.6 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
CMOS |
30 mA |
5 V |
Other Microprocessor ICs |
2.54 mm |
R-XDIP-T40 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MILITARY |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
5 |
IN-LINE |
DIP40,.6 |
125 Cel |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
CMOS |
30 mA |
5 V |
Other Microprocessor ICs |
2.54 mm |
R-XDIP-T40 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
COMMERCIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
5 |
IN-LINE |
DIP28,.6 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
CMOS |
5 V |
Other Microprocessor ICs |
2.54 mm |
R-XDIP-T28 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
INDUSTRIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
5 |
IN-LINE |
DIP40,.6 |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
CMOS |
30 mA |
5 V |
Other Microprocessor ICs |
2.54 mm |
R-XDIP-T40 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR CIRCUIT |
OTHER |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
10 V |
IN-LINE |
7 V |
70 Cel |
-20 Cel |
DUAL |
15.24 mm |
36.83 mm |
CMOS |
8.5 V |
2.54 mm |
R-PDIP-T28 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR CIRCUIT |
MILITARY |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
5.25 V |
IN-LINE |
4.75 V |
125 Cel |
-55 Cel |
DUAL |
4.242 mm |
15.24 mm |
36.068 mm |
CMOS |
5 V |
2.54 mm |
R-CDIP-T28 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MILITARY |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
5 |
IN-LINE |
DIP28,.6 |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
CMOS |
5 V |
Other uPs/uCs/Peripheral ICs |
2.54 mm |
R-XDIP-T28 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
COMMERCIAL |
THROUGH-HOLE |
48 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5 |
IN-LINE |
DIP48,.6 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
CMOS |
5 V |
Other Microprocessor ICs |
2.54 mm |
R-PDIP-T48 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
16 |
RECTANGULAR |
UNSPECIFIED |
NO |
5.25 V |
MICROELECTRONIC ASSEMBLY |
4.75 V |
50 Cel |
0 Cel |
UNSPECIFIED |
CMOS |
5 V |
R-XXMA-T16 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
INDUSTRIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5 |
IN-LINE |
DIP40,.6 |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
CMOS |
30 mA |
5 V |
Other Microprocessor ICs |
2.54 mm |
R-PDIP-T40 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
5 |
IN-LINE |
DIP40,.6 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
CMOS |
30 mA |
5 V |
Other Microprocessor ICs |
2.54 mm |
R-XDIP-T40 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
15 V |
IN-LINE |
3 V |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
15.24 mm |
CMOS |
2.54 mm |
R-PDIP-T24 |
Not Qualified |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
16 |
RECTANGULAR |
UNSPECIFIED |
NO |
5.25 V |
MICROELECTRONIC ASSEMBLY |
4.75 V |
50 Cel |
0 Cel |
UNSPECIFIED |
CMOS |
5 V |
R-XXMA-T16 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MILITARY |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
5 |
IN-LINE |
DIP40,.6 |
125 Cel |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
CMOS |
30 mA |
5 V |
Other Microprocessor ICs |
2.54 mm |
R-XDIP-T40 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5 |
IN-LINE |
DIP40,.6 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
CMOS |
30 mA |
5 V |
Other Microprocessor ICs |
2.54 mm |
R-PDIP-T40 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.25 V |
5 |
IN-LINE |
DIP24,.3 |
4.75 V |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
4.953 mm |
7.62 mm |
31.75 mm |
CMOS |
5 V |
Other Microprocessor ICs |
2.54 mm |
R-PDIP-T24 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
INDUSTRIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5 |
IN-LINE |
DIP40,.6 |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
CMOS |
30 mA |
5 V |
Other Microprocessor ICs |
2.54 mm |
R-PDIP-T40 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
15 V |
IN-LINE |
3 V |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
15.24 mm |
CMOS |
5 V |
2.54 mm |
R-PDIP-T24 |
Not Qualified |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
INDUSTRIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
5 |
IN-LINE |
DIP40,.6 |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
CMOS |
30 mA |
5 V |
Other Microprocessor ICs |
2.54 mm |
R-XDIP-T40 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
16 |
RECTANGULAR |
UNSPECIFIED |
NO |
5.25 V |
MICROELECTRONIC ASSEMBLY |
4.75 V |
50 Cel |
0 Cel |
DUAL |
CMOS |
5 V |
R-XDMA-T16 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
MICROPROCESSOR CIRCUIT |
MILITARY |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
5.25 V |
5 |
IN-LINE |
DIP28,.6 |
4.75 V |
125 Cel |
-55 Cel |
GOLD |
DUAL |
4.242 mm |
15.24 mm |
36.068 mm |
CMOS |
5 V |
Other uPs/uCs/Peripheral ICs |
2.54 mm |
R-CDIP-T28 |
Not Qualified |
e4 |
||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
OTHER |
THROUGH-HOLE |
4 |
RECTANGULAR |
UNSPECIFIED |
NO |
1.98 V |
1.8/5 |
MICROELECTRONIC ASSEMBLY |
MODULE(UNSPEC) |
1.62 V |
85 Cel |
-25 Cel |
DUAL |
ALSO OPERATES AT 3V, 5V SUPPLY |
35 mm |
CMOS |
1.8 V |
Other Microprocessor ICs |
R-XDMA-T4 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
OTHER |
THROUGH-HOLE |
6 |
RECTANGULAR |
UNSPECIFIED |
NO |
1.98 V |
1.8/5 |
MICROELECTRONIC ASSEMBLY |
MODULE(UNSPEC) |
1.62 V |
85 Cel |
-25 Cel |
DUAL |
ALSO OPERATES AT 3V, 5V SUPPLY |
35 mm |
CMOS |
1.8 V |
Other Microprocessor ICs |
R-XDMA-T6 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
15 V |
IN-LINE |
2 V |
85 Cel |
-40 Cel |
DUAL |
4.2 mm |
7.62 mm |
40 |
250 |
9.5 mm |
BIPOLAR |
5 V |
2.54 mm |
R-PDIP-T8 |
NOT APPLICABLE |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
OTHER |
THROUGH-HOLE |
6 |
RECTANGULAR |
UNSPECIFIED |
NO |
1.98 V |
1.8/5 |
MICROELECTRONIC ASSEMBLY |
MODULE(UNSPEC) |
1.62 V |
85 Cel |
-25 Cel |
DUAL |
ALSO OPERATES AT 3V, 5V SUPPLY |
35 mm |
CMOS |
1.8 V |
Other Microprocessor ICs |
R-XDMA-T6 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
OTHER |
THROUGH-HOLE |
4 |
RECTANGULAR |
UNSPECIFIED |
NO |
1.98 V |
1.8/5 |
MICROELECTRONIC ASSEMBLY |
MODULE(UNSPEC) |
1.62 V |
85 Cel |
-25 Cel |
DUAL |
ALSO OPERATES AT 3V, 5V SUPPLY |
35 mm |
CMOS |
1.8 V |
Other Microprocessor ICs |
R-XDMA-T4 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
OTHER |
THROUGH-HOLE |
4 |
RECTANGULAR |
UNSPECIFIED |
NO |
1.98 V |
1.8/5 |
MICROELECTRONIC ASSEMBLY |
MODULE(UNSPEC) |
1.62 V |
85 Cel |
-25 Cel |
DUAL |
ALSO OPERATES AT 3V, 5V SUPPLY |
35 mm |
CMOS |
1.8 V |
Other Microprocessor ICs |
R-XDMA-T4 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
OTHER |
THROUGH-HOLE |
6 |
RECTANGULAR |
UNSPECIFIED |
NO |
1.98 V |
1.8/5 |
MICROELECTRONIC ASSEMBLY |
MODULE(UNSPEC) |
1.62 V |
85 Cel |
-25 Cel |
DUAL |
ALSO OPERATES AT 3V, 5V SUPPLY |
35 mm |
CMOS |
1.8 V |
Other Microprocessor ICs |
R-XDMA-T6 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
OTHER |
THROUGH-HOLE |
6 |
RECTANGULAR |
UNSPECIFIED |
NO |
1.98 V |
1.8/5 |
MICROELECTRONIC ASSEMBLY |
MODULE(UNSPEC) |
1.62 V |
85 Cel |
-25 Cel |
DUAL |
ALSO OPERATES AT 3V, 5V SUPPLY |
35 mm |
CMOS |
1.8 V |
Other Microprocessor ICs |
R-XDMA-T6 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
OTHER |
THROUGH-HOLE |
4 |
RECTANGULAR |
UNSPECIFIED |
NO |
1.98 V |
1.8/5 |
MICROELECTRONIC ASSEMBLY |
MODULE(UNSPEC) |
1.62 V |
85 Cel |
-25 Cel |
DUAL |
ALSO OPERATES AT 3V, 5V SUPPLY |
35 mm |
CMOS |
1.8 V |
Other Microprocessor ICs |
R-XDMA-T4 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
5 |
IN-LINE |
DIP40,.6 |
70 Cel |
0 Cel |
DUAL |
MOS |
385 mA |
5 V |
Other uPs/uCs/Peripheral ICs |
2.54 mm |
R-XDIP-T40 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
56 |
SDIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.5 V |
IN-LINE, SHRINK PITCH |
4 V |
85 Cel |
-40 Cel |
TIN/NICKEL PALLADIUM GOLD |
DUAL |
5.08 mm |
15.24 mm |
52 mm |
CMOS |
5 V |
1.778 mm |
R-PDIP-T56 |
Not Qualified |
e3/e4 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
56 |
SDIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.5 V |
5 |
IN-LINE, SHRINK PITCH |
SDIP56,.6 |
4 V |
85 Cel |
-40 Cel |
TIN/NICKEL PALLADIUM GOLD |
DUAL |
5.08 mm |
15.24 mm |
52 mm |
CMOS |
5 V |
Bus Controllers |
1.778 mm |
R-PDIP-T56 |
Not Qualified |
e3/e4 |
|||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
5 |
IN-LINE |
DIP40,.6 |
70 Cel |
0 Cel |
DUAL |
MOS |
385 mA |
5 V |
Other uPs/uCs/Peripheral ICs |
2.54 mm |
R-XDIP-T40 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
GRAPHICS PROCESSOR |
OTHER |
THROUGH-HOLE |
22 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5 |
IN-LINE |
DIP22,.4 |
70 Cel |
-25 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
CMOS |
5 V |
Other Microprocessor ICs |
2.54 mm |
R-PDIP-T22 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Diodes Incorporated |
COMMERCIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
3.5/5 |
IN-LINE |
DIP16,.3 |
70 Cel |
-10 Cel |
DUAL |
.3 mA |
Other uPs/uCs/Peripheral ICs |
2.54 mm |
R-PDIP-T16 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Diodes Incorporated |
COMMERCIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
3.5/5 |
IN-LINE |
DIP16,.3 |
70 Cel |
-10 Cel |
DUAL |
.3 mA |
Other uPs/uCs/Peripheral ICs |
2.54 mm |
R-PDIP-T16 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Diodes Incorporated |
OTHER |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
3.5/5 |
IN-LINE |
DIP8,.3 |
85 Cel |
-20 Cel |
DUAL |
CMOS |
.25 mA |
Other uPs/uCs/Peripheral ICs |
2.54 mm |
R-PDIP-T8 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
3.6 V |
IN-LINE |
2.7 V |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
4.572 mm |
7.62 mm |
9.375 mm |
CMOS |
3 V |
2.54 mm |
R-PDIP-T8 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
3.6 V |
IN-LINE |
2.7 V |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
4.572 mm |
7.62 mm |
9.375 mm |
CMOS |
3 V |
2.54 mm |
R-PDIP-T8 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
3.6 V |
IN-LINE |
2.7 V |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
4.572 mm |
7.62 mm |
9.375 mm |
CMOS |
3 V |
2.54 mm |
R-PDIP-T8 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
IN-LINE |
70 Cel |
0 Cel |
MATTE TIN |
DUAL |
4.572 mm |
7.62 mm |
30 |
260 |
26.16 mm |
CMOS |
5 V |
2.54 mm |
R-PDIP-T20 |
1 |
Not Qualified |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.25 V |
IN-LINE |
4.75 V |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
4.572 mm |
7.62 mm |
9.375 mm |
CMOS |
5 V |
2.54 mm |
R-PDIP-T8 |
Not Qualified |
e0 |
Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.
Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.
Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.
Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.