Renesas Electronics Other Function uPs,uCs & Peripheral ICs 483

Reset All

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	No. of Bits	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
DA14531MOD-00F01002	Renesas Electronics	SoC																						250								3
14255R-100	Renesas Electronics	SoC
DA14531-00000FX2	Renesas Electronics	SoC																														1		e4
14450R-500	Renesas Electronics	SoC
DA14531-00000OG2	Renesas Electronics	SoC																														1
MC-10105F1-821-FNA-M1-A	Renesas Electronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V		1,3.3	GRID ARRAY	BGA196,14X14,40	.9 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.71 mm	15 mm	ALSO OPERATES AT 3.3 V			15 mm	CMOS		1 V	Other uPs/uCs/Peripheral ICs	1 mm	S-PBGA-B196		Not Qualified	e1
DA14531MOD-00F0100C	Renesas Electronics	SoC																						250								3
DA14682-00F08A92	Renesas Electronics	SoC																						255								3
D2-92633-LR	Renesas Electronics	SoC	OTHER	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.9 V			FLATPACK, LOW PROFILE, FINE PITCH		1.7 V	85 Cel	-10 Cel	MATTE TIN	QUAD	1.6 mm	14 mm		30	260	14 mm	CMOS		1.8 V		.4 mm	S-PQFP-G128	3		e3
TW8804-LC3-GRSH	Renesas Electronics																	MATTE TIN														3		e3
DA16200MOD-AAC4WA32	Renesas Electronics	SYSTEM ON CHIP																					40	260
D2-92683-QR-T	Renesas Electronics	SoC	OTHER	NO LEAD	72	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.9 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	85 Cel	-10 Cel	MATTE TIN	QUAD	.9 mm	10 mm		30	260	10 mm	CMOS		1.8 V		.5 mm	S-PQCC-N72	3		e3
D2-45057-QR-T	Renesas Electronics	SYSTEM ON CHIP		NO LEAD	68	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.9 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.4SQ,20	1.7 V	85 Cel	-10 Cel	NICKEL PALLADIUM GOLD	QUAD	1 mm	10 mm				10 mm	CMOS		1.8 V		.5 mm	S-PQCC-N68	3		e4
DA16200MOD-AAE4WA32	Renesas Electronics	SYSTEM ON CHIP																					40	260
UPD720200F1-DAK-A	Renesas Electronics																							260
DA14683-00000U22	Renesas Electronics	SoC																														1
D2-45057-QR	Renesas Electronics	SYSTEM ON CHIP		NO LEAD	68	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.9 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.4SQ,20	1.7 V	85 Cel	-10 Cel	NICKEL PALLADIUM GOLD	QUAD	1 mm	10 mm				10 mm	CMOS		1.8 V		.5 mm	S-PQCC-N68	3		e4
DA14695-00000HQ2	Renesas Electronics	SoC																														3
D2-71083-LR	Renesas Electronics	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.9 V			FLATPACK, LOW PROFILE, FINE PITCH		1.7 V	85 Cel	-10 Cel	MATTE TIN	QUAD	1.6 mm	14 mm		30	260	14 mm	CMOS		1.8 V		.4 mm	S-PQFP-G128	3		e3
SLG7NT4129V	Renesas Electronics	SoC
TW8816-LB3-GRS	Renesas Electronics	MICROPROCESSOR CIRCUIT																MATTE TIN														3		e3
TW8823-LC2-CE	Renesas Electronics																	MATTE TIN					30	260								3		e3
DA14580-01UNA	Renesas Electronics	SoC																														1
DA14583-01F01AT1	Renesas Electronics	SoC
DA14586-00F02AT2	Renesas Electronics	SoC																														3
TW8816-LA3-GRS	Renesas Electronics																	MATTE TIN					30	260								3		e3
D2-74083-LR	Renesas Electronics	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.9 V			FLATPACK, LOW PROFILE, FINE PITCH		1.7 V	85 Cel	-10 Cel	MATTE TIN	QUAD	1.6 mm	14 mm		30	260	14 mm	CMOS		1.8 V		.4 mm	S-PQFP-G128	3		e3
DA14531-01000OG2	Renesas Electronics	SoC
TW8819AT-NA2-GRT	Renesas Electronics																	NICKEL GOLD PALLADIUM SILVER														3
D2-71583-LR	Renesas Electronics	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.9 V			FLATPACK, LOW PROFILE, FINE PITCH		1.7 V	85 Cel	-10 Cel	MATTE TIN	QUAD	1.6 mm	14 mm		30	260	14 mm	CMOS		1.8 V		.4 mm	S-PQFP-G128	3		e3
CDP68HC68P1M	Renesas Electronics	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	6 V	8	5	SMALL OUTLINE	SOP16,.25	3 V	85 Cel	-55 Cel	TIN LEAD	DUAL	1.75 mm	3.9 mm			240	9.9 mm	CMOS		3.3 V	Parallel IO Port	1.27 mm	R-PDSO-G16	1	Not Qualified	e0
D2-92683-QR	Renesas Electronics	SoC	OTHER	NO LEAD	72	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.9 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	85 Cel	-10 Cel	MATTE TIN	QUAD	.9 mm	10 mm		30	260	10 mm	CMOS		1.8 V		.5 mm	S-PQCC-N72	3		e3
9LPRS436CKILF	Renesas Electronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.465 V		3.3	CHIP CARRIER	LCC48,.24SQ,16	3.135 V	85 Cel	-40 Cel	MATTE TIN	QUAD	1 mm	6 mm		30	260	6 mm	CMOS	100 mA	3.3 V	Clock Generators	.4 mm	S-PQCC-N48	3	Not Qualified	e3
9LPRS501YGLFT	Renesas Electronics	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	64	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.465 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		3.135 V	70 Cel	0 Cel	MATTE TIN	DUAL	1.2 mm	6.1 mm				17 mm	CMOS		3.3 V		.5 mm	R-PDSO-G64		Not Qualified	e3
9LPRS535CFLFT	Renesas Electronics	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	48	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.465 V			SMALL OUTLINE, SHRINK PITCH		3.135 V	70 Cel	0 Cel	MATTE TIN	DUAL	2.8 mm	7.5 mm		30	260	15.875 mm	CMOS		3.3 V		.635 mm	R-PDSO-G48		Not Qualified	e3
9LPRS355BKLFT	Renesas Electronics	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.465 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3.135 V	70 Cel	0 Cel	TIN	QUAD	1 mm	9 mm			260	9 mm	CMOS		3.3 V		.5 mm	S-PQCC-N64	3		e3
9LPR501YGLFT	Renesas Electronics	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	64	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.465 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		3.135 V	70 Cel	0 Cel	MATTE TIN	DUAL	1.2 mm	6.1 mm				17 mm	CMOS		3.3 V		.5 mm	R-PDSO-G64		Not Qualified	e3
9LPRS501YKLFT	Renesas Electronics	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.465 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3.135 V	70 Cel	0 Cel	MATTE TIN	QUAD	1 mm	9 mm				9 mm	CMOS		3.3 V		.5 mm	S-PQCC-N64		Not Qualified	e3
9LPRS535BGLF	Renesas Electronics	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	48	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.465 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		3.135 V	70 Cel	0 Cel	MATTE TIN	DUAL	1.2 mm	6.1 mm		30	260	12.5 mm	CMOS		3.3 V		.5 mm	R-PDSO-G48		Not Qualified	e3
9LPRS502YGLFT	Renesas Electronics	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.465 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.3,20	3.135 V	70 Cel	0 Cel	Matte Tin (Sn)	DUAL	1.2 mm	6.1 mm		30	260	14 mm	CMOS		3.3 V		.5 mm	R-PDSO-G56		Not Qualified	e3
9LPRS535CFLF	Renesas Electronics	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	48	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.465 V			SMALL OUTLINE, SHRINK PITCH		3.135 V	70 Cel	0 Cel	MATTE TIN	DUAL	2.8 mm	7.5 mm		30	260	15.875 mm	CMOS		3.3 V		.635 mm	R-PDSO-G48		Not Qualified	e3
9LPRS355YGLFT	Renesas Electronics	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	64	TSOP2	RECTANGULAR	PLASTIC/EPOXY	YES	3.465 V			SMALL OUTLINE, THIN PROFILE		3.135 V	70 Cel	0 Cel		DUAL	1.2 mm	6.1 mm				17 mm	CMOS		3.3 V		.5 mm	R-PDSO-G64
9LPRS355BKT	Renesas Electronics	MICROPROCESSOR CIRCUIT
9LPRS436CKLF	Renesas Electronics	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.465 V		3.3	CHIP CARRIER	LCC48,.24SQ,16	3.135 V	85 Cel	0 Cel	MATTE TIN	QUAD	1 mm	6 mm		30	260	6 mm	CMOS	100 mA	3.3 V	Clock Generators	.4 mm	S-PQCC-N48	3	Not Qualified	e3
9LPRS436CGILF	Renesas Electronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	48	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.465 V		3.3	SMALL OUTLINE	TSSOP48,.3,20	3.135 V	85 Cel	-40 Cel	MATTE TIN	DUAL	1.2 mm	6.1 mm		30	260	12.5 mm	CMOS	100 mA	3.3 V	Clock Generators	.5 mm	R-PDSO-G48	1	Not Qualified	e3
9LPRS502YKLFT	Renesas Electronics	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	56	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.465 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	3.135 V	70 Cel	0 Cel	Matte Tin (Sn)	QUAD	1 mm	8 mm		30	260	8 mm	CMOS		3.3 V		.5 mm	S-PQCC-N56		Not Qualified	e3
9LPR501SGLF	Renesas Electronics	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	64	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.465 V		3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP64,.32,20	3.135 V	70 Cel	0 Cel	TIN	DUAL	1.2 mm	6.1 mm			260	17 mm	CMOS	250 mA	3.3 V	Clock Generators	.5 mm	R-PDSO-G64	1	Not Qualified	e3
9LPRS525AGILFT	Renesas Electronics	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.465 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		3.135 V	70 Cel	0 Cel	MATTE TIN	DUAL	1.2 mm	6.1 mm			260	14 mm	CMOS		3.3 V		.5 mm	R-PDSO-G56	1		e3

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.