Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Information Access Method | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | No. of Bits | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Interrupt Capability | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Ultraviolet Erasable | Terminal Position | DMA Channels | No. of Ports | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | ROM Bits Size | No. of Timers | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Minimum Time | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | Volatile | JESD-609 Code | Maximum Standby Current | On Chip Program ROM Width | No. of I/O Lines | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
STMicroelectronics |
MILITARY |
J BEND |
68 |
QCCJ |
SQUARE |
CERAMIC |
YES |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
125 Cel |
-55 Cel |
Tin/Lead (Sn/Pb) |
Y |
QUAD |
1024 Bits |
CMOS |
5 V |
Other Microprocessor ICs |
1.27 mm |
S-XQCC-J68 |
Not Qualified |
e0 |
.00002 Amp |
.00000015 ns |
|||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
INDUSTRIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
N |
QUAD |
1024 Bits |
CMOS |
5 V |
Other Microprocessor ICs |
1.27 mm |
S-PQCC-J68 |
Not Qualified |
e0 |
.00002 Amp |
.0000002 ns |
|||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
INDUSTRIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
CHIP CARRIER |
LDCC44,.7SQ |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
N |
QUAD |
256 Bits |
CMOS |
5 V |
Other Microprocessor ICs |
1.27 mm |
S-PQCC-J44 |
Not Qualified |
e0 |
.00015 Amp |
.00000015 ns |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
COMMERCIAL |
GULL WING |
52 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.3 |
FLATPACK |
QFP52,.52SQ |
70 Cel |
0 Cel |
N |
QUAD |
1310720 Bits |
3.3 V |
Other Microprocessor ICs |
.635 mm |
S-PQFP-G52 |
Not Qualified |
.0001 Amp |
.00000012 ns |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
INDUSTRIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
N |
QUAD |
256 Bits |
CMOS |
5 V |
Other Microprocessor ICs |
1.27 mm |
S-PQCC-J68 |
Not Qualified |
e0 |
.00002 Amp |
.0000002 ns |
|||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
INDUSTRIAL |
J BEND |
44 |
QCCJ |
SQUARE |
CERAMIC |
YES |
3.3 |
CHIP CARRIER |
LDCC44,.7SQ |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
Y |
QUAD |
512 Bits |
CMOS |
3.3 V |
Other Microprocessor ICs |
1.27 mm |
S-XQCC-J44 |
Not Qualified |
e0 |
.000005 Amp |
.0000002 ns |
|||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
INDUSTRIAL |
GULL WING |
44 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3 |
FLATPACK |
QFP44,.63SQ,40 |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
N |
QUAD |
512 Bits |
CMOS |
3 V |
Other Microprocessor ICs |
1 mm |
S-PQFP-G44 |
Not Qualified |
e0 |
.000005 Amp |
.0000002 ns |
|||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
COMMERCIAL |
GULL WING |
80 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
FLATPACK |
QFP80,.64SQ |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
N |
QUAD |
1024 Bits |
CMOS |
5 V |
Other Microprocessor ICs |
.635 mm |
S-PQFP-G80 |
Not Qualified |
e0 |
.00002 Amp |
.00000009 ns |
|||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
16 |
RECTANGULAR |
UNSPECIFIED |
NO |
5.25 V |
MICROELECTRONIC ASSEMBLY |
4.75 V |
50 Cel |
0 Cel |
UNSPECIFIED |
CMOS |
5 V |
R-XXMA-T16 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
COMMERCIAL |
GULL WING |
44 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
FLATPACK |
QFP44,.63SQ,40 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
N |
QUAD |
256 Bits |
CMOS |
5 V |
Other Microprocessor ICs |
1 mm |
S-PQFP-G44 |
Not Qualified |
e0 |
.0001 Amp |
.00000009 ns |
|||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
COMMERCIAL |
GULL WING |
44 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
FLATPACK |
QFP44,.63SQ,40 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
N |
QUAD |
256 Bits |
CMOS |
5 V |
Other Microprocessor ICs |
1 mm |
S-PQFP-G44 |
Not Qualified |
e0 |
.0001 Amp |
.00000015 ns |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
COMMERCIAL |
GULL WING |
52 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.3 |
FLATPACK |
QFP52,.52SQ |
70 Cel |
0 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
N |
QUAD |
1310720 Bits |
CMOS |
3.3 V |
Other Microprocessor ICs |
.635 mm |
S-PQFP-G52 |
Not Qualified |
e4 |
.0001 Amp |
.00000007 ns |
||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
3.3 |
CHIP CARRIER |
LDCC44,.7SQ |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
N |
QUAD |
256 Bits |
CMOS |
3.3 V |
Other Microprocessor ICs |
1.27 mm |
S-PQCC-J44 |
Not Qualified |
e0 |
.000005 Amp |
.00000015 ns |
|||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
INDUSTRIAL |
GULL WING |
52 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.3 |
FLATPACK |
QFP52,.52SQ |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
N |
QUAD |
1310720 Bits |
CMOS |
3.3 V |
Other Microprocessor ICs |
.635 mm |
S-PQFP-G52 |
Not Qualified |
e4 |
.0001 Amp |
.00000009 ns |
||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MILITARY |
J BEND |
68 |
QCCJ |
SQUARE |
CERAMIC |
YES |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
125 Cel |
-55 Cel |
Tin/Lead (Sn/Pb) |
Y |
QUAD |
256 Bits |
CMOS |
5 V |
Other Microprocessor ICs |
1.27 mm |
S-XQCC-J68 |
Not Qualified |
e0 |
.00002 Amp |
.0000002 ns |
|||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
INDUSTRIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
N |
QUAD |
256 Bits |
CMOS |
5 V |
Other Microprocessor ICs |
1.27 mm |
S-PQCC-J68 |
Not Qualified |
e0 |
.00002 Amp |
.00000012 ns |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
COMMERCIAL |
GULL WING |
64 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
FLATPACK |
QFP64,.6SQ,32 |
70 Cel |
0 Cel |
N |
QUAD |
2359296 Bits |
CMOS |
5 V |
Other Microprocessor ICs |
.8 mm |
S-PQFP-G64 |
Not Qualified |
.0002 Amp |
.00000007 ns |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
INDUSTRIAL |
GULL WING |
64 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.3 |
FLATPACK |
QFP64,.63SQ,32 |
85 Cel |
-40 Cel |
N |
QUAD |
2097152 Bits |
CMOS |
3.3 V |
Other uPs/uCs/Peripheral ICs |
.8 mm |
S-PQFP-G64 |
Not Qualified |
.00000009 ns |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
INDUSTRIAL |
GULL WING |
44 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.3 |
FLATPACK |
QFP44,.63SQ,40 |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
N |
QUAD |
2048 Bits |
CMOS |
3.3 V |
Other Microprocessor ICs |
1 mm |
S-PQFP-G44 |
Not Qualified |
e0 |
.000005 Amp |
.0000003 ns |
|||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MILITARY |
J BEND |
44 |
QCCJ |
SQUARE |
CERAMIC |
YES |
5 |
CHIP CARRIER |
LDCC44,.7SQ |
125 Cel |
-55 Cel |
Tin/Lead (Sn/Pb) |
Y |
QUAD |
256 Bits |
CMOS |
5 V |
Other Microprocessor ICs |
1.27 mm |
S-XQCC-J44 |
Not Qualified |
e0 |
.00015 Amp |
.0000002 ns |
|||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
INDUSTRIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
CHIP CARRIER |
LDCC44,.7SQ |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
N |
QUAD |
512 Bits |
CMOS |
5 V |
Other Microprocessor ICs |
1.27 mm |
S-PQCC-J44 |
Not Qualified |
e0 |
.00002 Amp |
.00000015 ns |
|||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
N |
QUAD |
256 Bits |
CMOS |
5 V |
Other Microprocessor ICs |
1.27 mm |
S-PQCC-J68 |
Not Qualified |
e0 |
.00002 Amp |
.00000009 ns |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
INDUSTRIAL |
GULL WING |
64 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
FLATPACK |
QFP64,.6SQ,32 |
85 Cel |
-40 Cel |
N |
QUAD |
2359296 Bits |
CMOS |
5 V |
Other Microprocessor ICs |
.8 mm |
S-PQFP-G64 |
Not Qualified |
.0002 Amp |
.00000009 ns |
||||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MATTE TIN |
30 |
250 |
3 |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
INDUSTRIAL |
GULL WING |
64 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
FLATPACK |
QFP64,.6SQ,32 |
85 Cel |
-40 Cel |
N |
QUAD |
1310720 Bits |
CMOS |
5 V |
Other Microprocessor ICs |
.8 mm |
S-PQFP-G64 |
Not Qualified |
.0002 Amp |
.00000009 ns |
||||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
COMMERCIAL |
GULL WING |
44 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.3 |
FLATPACK |
QFP44,.63SQ,40 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
N |
QUAD |
2048 Bits |
CMOS |
3.3 V |
Other Microprocessor ICs |
1 mm |
S-PQFP-G44 |
Not Qualified |
e0 |
.000005 Amp |
.0000002 ns |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
INDUSTRIAL |
GULL WING |
52 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.3 |
FLATPACK |
QFP52,.52SQ |
85 Cel |
-40 Cel |
N |
QUAD |
1048576 Bits |
CMOS |
3.3 V |
Other uPs/uCs/Peripheral ICs |
.635 mm |
S-PQFP-G52 |
Not Qualified |
.00000009 ns |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
INDUSTRIAL |
GULL WING |
64 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
FLATPACK |
QFP64,.6SQ,32 |
85 Cel |
-40 Cel |
N |
QUAD |
1310720 Bits |
CMOS |
5 V |
Other Microprocessor ICs |
.8 mm |
S-PQFP-G64 |
Not Qualified |
.0002 Amp |
.00000015 ns |
||||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
INDUSTRIAL |
J BEND |
44 |
QCCJ |
SQUARE |
CERAMIC |
YES |
5 |
CHIP CARRIER |
LDCC44,.7SQ |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
Y |
QUAD |
1024 Bits |
CMOS |
5 V |
Other Microprocessor ICs |
1.27 mm |
S-XQCC-J44 |
Not Qualified |
e0 |
.00015 Amp |
.00000012 ns |
|||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
INDUSTRIAL |
J BEND |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
CHIP CARRIER |
LDCC52,.8SQ |
85 Cel |
-40 Cel |
Matte Tin (Sn) |
N |
QUAD |
2359296 Bits |
CMOS |
5 V |
Other Microprocessor ICs |
1.27 mm |
S-PQCC-J52 |
Not Qualified |
e3 |
.0002 Amp |
.00000012 ns |
||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MILITARY |
J BEND |
44 |
QCCJ |
SQUARE |
CERAMIC |
YES |
3.3 |
CHIP CARRIER |
LDCC44,.7SQ |
125 Cel |
-55 Cel |
Tin/Lead (Sn/Pb) |
Y |
QUAD |
512 Bits |
CMOS |
3.3 V |
Other Microprocessor ICs |
1.27 mm |
S-XQCC-J44 |
Not Qualified |
e0 |
.000005 Amp |
.00000025 ns |
|||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
INDUSTRIAL |
J BEND |
44 |
QCCJ |
SQUARE |
CERAMIC |
YES |
3.3 |
CHIP CARRIER |
LDCC44,.7SQ |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
N |
QUAD |
256 Bits |
CMOS |
3.3 V |
Other Microprocessor ICs |
1.27 mm |
S-XQCC-J44 |
Not Qualified |
e0 |
.000005 Amp |
.00000015 ns |
|||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
COMMERCIAL |
GULL WING |
52 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
FLATPACK |
QFP52,.7SQ,40 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
N |
QUAD |
512 Bits |
CMOS |
5 V |
Other Microprocessor ICs |
1 mm |
S-PQFP-G52 |
Not Qualified |
e0 |
.0001 Amp |
.00000009 ns |
|||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
INDUSTRIAL |
GULL WING |
44 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.3 |
FLATPACK |
QFP44,.63SQ,40 |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
N |
QUAD |
256 Bits |
CMOS |
3.3 V |
Other Microprocessor ICs |
1 mm |
S-PQFP-G44 |
Not Qualified |
e0 |
.000005 Amp |
.00000015 ns |
|||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
INDUSTRIAL |
GULL WING |
80 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
FLATPACK |
QFP80,.64SQ |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
N |
QUAD |
1024 Bits |
CMOS |
5 V |
Other Microprocessor ICs |
.635 mm |
S-PQFP-G80 |
Not Qualified |
e0 |
.00002 Amp |
.00000015 ns |
|||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
COMMERCIAL |
GULL WING |
64 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.3 |
FLATPACK |
QFP64,.6SQ,32 |
70 Cel |
0 Cel |
N |
QUAD |
1310720 Bits |
CMOS |
3.3 V |
Other Microprocessor ICs |
.8 mm |
S-PQFP-G64 |
Not Qualified |
.0001 Amp |
.00000015 ns |
||||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
INDUSTRIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5 |
IN-LINE |
DIP40,.6 |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
CMOS |
30 mA |
5 V |
Other Microprocessor ICs |
2.54 mm |
R-PDIP-T40 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MILITARY |
J BEND |
44 |
QCCJ |
SQUARE |
CERAMIC |
YES |
5 |
CHIP CARRIER |
LDCC44,.7SQ |
125 Cel |
-55 Cel |
Tin/Lead (Sn/Pb) |
Y |
QUAD |
1024 Bits |
CMOS |
5 V |
Other Microprocessor ICs |
1.27 mm |
S-XQCC-J44 |
Not Qualified |
e0 |
.00002 Amp |
.00000009 ns |
|||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
INDUSTRIAL |
GULL WING |
80 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
FLATPACK |
QFP80,.64SQ |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
N |
QUAD |
512 Bits |
CMOS |
5 V |
Other Microprocessor ICs |
.635 mm |
S-PQFP-G80 |
Not Qualified |
e0 |
.00002 Amp |
.00000012 ns |
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STMicroelectronics |
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|
STMicroelectronics |
INDUSTRIAL |
J BEND |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
CHIP CARRIER |
LDCC52,.8SQ |
85 Cel |
-40 Cel |
Matte Tin (Sn) |
N |
QUAD |
1310720 Bits |
CMOS |
5 V |
Other Microprocessor ICs |
1.27 mm |
S-PQCC-J52 |
Not Qualified |
e3 |
.0002 Amp |
.0000002 ns |
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|
STMicroelectronics |
COMMERCIAL |
GULL WING |
52 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
FLATPACK |
QFP52,.52SQ |
70 Cel |
0 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
N |
QUAD |
2359296 Bits |
CMOS |
5 V |
Other Microprocessor ICs |
.635 mm |
S-PQFP-G52 |
Not Qualified |
e4 |
.0002 Amp |
.00000012 ns |
Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.
Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.
Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.
Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.