Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | Maximum Supply Voltage | Screening Level | Address Bus Width | No. of Bits | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | Minimum Operating Temperature | Terminal Finish | Ultraviolet Erasable | Terminal Position | No. of Ports | Maximum Seated Height | ROM Words | Width | Additional Features | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | ROM Bits Size | No. of Timers | RAM Bytes | Technology | Maximum Supply Current | Nominal Supply Voltage | Memory Organization | Sub-Category | ROM Programmability | Terminal Pitch | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | JESD-609 Code | Maximum Standby Current | No. of I/O Lines | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP Semiconductors |
PARALLEL IO PORT, GENERAL PURPOSE |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
CERAMIC, GLASS-SEALED |
YES |
5.5 V |
CHIP CARRIER |
4.5 V |
70 Cel |
0 Cel |
QUAD |
3 |
16 |
CMOS |
95 mA |
5 V |
S-GQCC-J44 |
Not Qualified |
19 |
||||||||||||||||||||||||||||||||
NXP Semiconductors |
PARALLEL IO PORT, GENERAL PURPOSE |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
CERAMIC, GLASS-SEALED |
YES |
5.5 V |
CHIP CARRIER |
4.5 V |
70 Cel |
0 Cel |
QUAD |
3 |
16 |
CMOS |
95 mA |
5 V |
S-GQCC-J44 |
Not Qualified |
19 |
||||||||||||||||||||||||||||||||
NXP Semiconductors |
PARALLEL IO PORT, GENERAL PURPOSE |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
CERAMIC, GLASS-SEALED |
YES |
5.5 V |
CHIP CARRIER |
4.5 V |
70 Cel |
0 Cel |
QUAD |
3 |
8 |
CMOS |
95 mA |
5 V |
S-GQCC-J44 |
Not Qualified |
19 |
||||||||||||||||||||||||||||||||
NXP Semiconductors |
PARALLEL IO PORT, GENERAL PURPOSE |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
CERAMIC, GLASS-SEALED |
YES |
5.5 V |
CHIP CARRIER |
4.5 V |
70 Cel |
0 Cel |
QUAD |
3 |
8 |
CMOS |
95 mA |
5 V |
S-GQCC-J44 |
Not Qualified |
19 |
||||||||||||||||||||||||||||||||
NXP Semiconductors |
PARALLEL IO PORT, GENERAL PURPOSE |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
CERAMIC, GLASS-SEALED |
YES |
5.5 V |
CHIP CARRIER |
3 V |
70 Cel |
0 Cel |
QUAD |
3 |
8 |
CMOS |
40 mA |
3.3 V |
S-GQCC-J44 |
Not Qualified |
19 |
||||||||||||||||||||||||||||||||
NXP Semiconductors |
PARALLEL IO PORT, GENERAL PURPOSE |
COMMERCIAL |
GULL WING |
52 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
FLATPACK |
4.5 V |
70 Cel |
0 Cel |
QUAD |
3 |
16 |
CMOS |
95 mA |
5 V |
S-PQFP-G52 |
Not Qualified |
19 |
||||||||||||||||||||||||||||||||
NXP Semiconductors |
PARALLEL IO PORT, GENERAL PURPOSE |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
CERAMIC, GLASS-SEALED |
YES |
5.5 V |
CHIP CARRIER |
3 V |
70 Cel |
0 Cel |
QUAD |
3 |
8 |
CMOS |
40 mA |
3.3 V |
S-GQCC-J44 |
Not Qualified |
19 |
||||||||||||||||||||||||||||||||
NXP Semiconductors |
PARALLEL IO PORT, GENERAL PURPOSE |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
CERAMIC, GLASS-SEALED |
YES |
5.5 V |
CHIP CARRIER |
4.5 V |
70 Cel |
0 Cel |
QUAD |
3 |
8 |
CMOS |
95 mA |
5 V |
S-GQCC-J44 |
Not Qualified |
19 |
||||||||||||||||||||||||||||||||
NXP Semiconductors |
PARALLEL IO PORT, GENERAL PURPOSE |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
CERAMIC, GLASS-SEALED |
YES |
5.5 V |
CHIP CARRIER |
4.5 V |
70 Cel |
0 Cel |
QUAD |
3 |
16 |
CMOS |
95 mA |
5 V |
S-GQCC-J44 |
Not Qualified |
19 |
||||||||||||||||||||||||||||||||
NXP Semiconductors |
PARALLEL IO PORT, GENERAL PURPOSE |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
CHIP CARRIER |
4.5 V |
70 Cel |
0 Cel |
QUAD |
3 |
16 |
CMOS |
95 mA |
5 V |
S-PQCC-J44 |
Not Qualified |
19 |
||||||||||||||||||||||||||||||||
NXP Semiconductors |
PARALLEL IO PORT, GENERAL PURPOSE |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
CHIP CARRIER |
4.5 V |
70 Cel |
0 Cel |
QUAD |
3 |
8 |
CMOS |
95 mA |
5 V |
S-PQCC-J44 |
Not Qualified |
19 |
||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
PARALLEL IO PORT, PRINTER INTERFACE |
COMMERCIAL |
GULL WING |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
3 V |
70 Cel |
0 Cel |
DUAL |
1 |
1.1 mm |
4.4 mm |
260 |
6.5 mm |
CMOS |
3.3 V |
.65 mm |
R-PDSO-G20 |
Not Qualified |
8 |
||||||||||||||||||||||||||||
NXP Semiconductors |
PARALLEL IO PORT, GENERAL PURPOSE |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
CERAMIC, GLASS-SEALED |
YES |
5.5 V |
CHIP CARRIER |
4.5 V |
70 Cel |
0 Cel |
QUAD |
3 |
16 |
CMOS |
95 mA |
5 V |
S-GQCC-J44 |
Not Qualified |
19 |
||||||||||||||||||||||||||||||||
NXP Semiconductors |
PARALLEL IO PORT, GENERAL PURPOSE |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
CHIP CARRIER |
4.5 V |
70 Cel |
0 Cel |
QUAD |
3 |
8 |
CMOS |
95 mA |
5 V |
S-PQCC-J44 |
Not Qualified |
19 |
||||||||||||||||||||||||||||||||
NXP Semiconductors |
PARALLEL IO PORT, GENERAL PURPOSE |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
CERAMIC, GLASS-SEALED |
YES |
5.5 V |
CHIP CARRIER |
4.5 V |
70 Cel |
0 Cel |
QUAD |
3 |
16 |
CMOS |
95 mA |
5 V |
S-GQCC-J44 |
Not Qualified |
19 |
||||||||||||||||||||||||||||||||
NXP Semiconductors |
PARALLEL IO PORT, GENERAL PURPOSE |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
CHIP CARRIER |
3 V |
70 Cel |
0 Cel |
QUAD |
3 |
8 |
CMOS |
40 mA |
3.3 V |
S-PQCC-J44 |
Not Qualified |
19 |
||||||||||||||||||||||||||||||||
NXP Semiconductors |
PARALLEL IO PORT, GENERAL PURPOSE |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
CHIP CARRIER |
4.5 V |
70 Cel |
0 Cel |
QUAD |
3 |
8 |
CMOS |
95 mA |
5 V |
S-PQCC-J44 |
Not Qualified |
19 |
||||||||||||||||||||||||||||||||
NXP Semiconductors |
PARALLEL IO PORT, GENERAL PURPOSE |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
CHIP CARRIER |
4.5 V |
70 Cel |
0 Cel |
QUAD |
3 |
16 |
CMOS |
95 mA |
5 V |
S-PQCC-J44 |
Not Qualified |
19 |
||||||||||||||||||||||||||||||||
NXP Semiconductors |
PARALLEL IO PORT, GENERAL PURPOSE |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
CHIP CARRIER |
3 V |
70 Cel |
0 Cel |
QUAD |
3 |
8 |
CMOS |
40 mA |
3.3 V |
S-PQCC-J44 |
Not Qualified |
19 |
||||||||||||||||||||||||||||||||
NXP Semiconductors |
PARALLEL IO PORT, GENERAL PURPOSE |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
CERAMIC, GLASS-SEALED |
YES |
5.5 V |
CHIP CARRIER |
4.5 V |
70 Cel |
0 Cel |
QUAD |
3 |
16 |
CMOS |
95 mA |
5 V |
S-GQCC-J44 |
Not Qualified |
19 |
||||||||||||||||||||||||||||||||
NXP Semiconductors |
PARALLEL IO PORT, GENERAL PURPOSE |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
5.5 V |
IN-LINE |
4.5 V |
70 Cel |
0 Cel |
DUAL |
3 |
4.32 mm |
15.24 mm |
50.8 mm |
CMOS |
5 V |
2.54 mm |
R-CDIP-T40 |
24 |
|||||||||||||||||||||||||||||||
NXP Semiconductors |
PARALLEL IO PORT, GENERAL PURPOSE |
COMMERCIAL |
THROUGH-HOLE |
48 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.25 V |
IN-LINE |
4.75 V |
70 Cel |
0 Cel |
DUAL |
3 |
5.08 mm |
15.24 mm |
61.72 mm |
CMOS |
5 V |
2.54 mm |
R-PDIP-T48 |
Not Qualified |
24 |
||||||||||||||||||||||||||||||
NXP Semiconductors |
PARALLEL IO PORT, GENERAL PURPOSE |
COMMERCIAL |
THROUGH-HOLE |
48 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.25 V |
IN-LINE |
4.75 V |
70 Cel |
0 Cel |
DUAL |
3 |
5.08 mm |
15.24 mm |
61.72 mm |
CMOS |
5 V |
2.54 mm |
R-PDIP-T48 |
Not Qualified |
24 |
||||||||||||||||||||||||||||||
NXP Semiconductors |
PARALLEL IO PORT, GENERAL PURPOSE |
COMMERCIAL |
THROUGH-HOLE |
48 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
5.25 V |
IN-LINE |
4.75 V |
70 Cel |
0 Cel |
DUAL |
3 |
4.064 mm |
15.24 mm |
60.96 mm |
CMOS |
5 V |
2.54 mm |
R-CDIP-T48 |
Not Qualified |
24 |
||||||||||||||||||||||||||||||
NXP Semiconductors |
PARALLEL IO PORT, GENERAL PURPOSE |
COMMERCIAL |
NO LEAD |
40 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
5.5 V |
CHIP CARRIER |
LCC40,.5SQ,40 |
4.5 V |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
3 |
2.08 mm |
12.19 mm |
OPERATES AT 3V MIN SUPPLY |
8 |
1 MHz |
12.19 mm |
CMOS |
3 mA |
5 V |
Parallel IO Port |
1.02 mm |
S-CQCC-N40 |
Not Qualified |
e0 |
24 |
||||||||||||||||||||||
NXP Semiconductors |
PARALLEL IO PORT, GENERAL PURPOSE |
COMMERCIAL |
THROUGH-HOLE |
48 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
5.25 V |
IN-LINE |
4.75 V |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
3 |
4.31 mm |
15.24 mm |
60.96 mm |
CMOS |
5 V |
2.54 mm |
R-CDIP-T48 |
Not Qualified |
e0 |
24 |
||||||||||||||||||||||||||||
NXP Semiconductors |
PARALLEL IO PORT, GENERAL PURPOSE |
COMMERCIAL |
GULL WING |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
6 V |
5 |
FLATPACK |
QFP100(UNSPEC) |
3 V |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
6 |
3.3 mm |
14 mm |
20 mm |
CMOS |
5 V |
Parallel IO Port |
.65 mm |
R-PQFP-G100 |
Not Qualified |
e0 |
48 |
|||||||||||||||||||||||||
NXP Semiconductors |
PARALLEL IO PORT, GENERAL PURPOSE |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.5 V |
IN-LINE |
4.5 V |
70 Cel |
0 Cel |
DUAL |
3 |
5.08 mm |
15.24 mm |
52.07 mm |
CMOS |
5 V |
2.54 mm |
R-PDIP-T40 |
24 |
|||||||||||||||||||||||||||||||
NXP Semiconductors |
PARALLEL IO PORT, GENERAL PURPOSE |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
5.5 V |
IN-LINE |
DIP40,.6 |
4.5 V |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
3 |
5.84 mm |
15.24 mm |
OPERATES AT 3V MIN SUPPLY |
8 |
1 MHz |
52.275 mm |
CMOS |
3 mA |
5 V |
Parallel IO Port |
2.54 mm |
R-CDIP-T40 |
Not Qualified |
e0 |
24 |
||||||||||||||||||||||
Infineon Technologies |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
14 |
5 |
IN-LINE |
DIP40,.6 |
70 Cel |
8085 |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
3 |
1 |
MOS |
180 mA |
5 V |
256X8 |
Parallel IO Port |
2.54 mm |
R-PDIP-T40 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||
Infineon Technologies |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
14 |
5 |
IN-LINE |
DIP40,.6 |
70 Cel |
8085 |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
3 |
1 |
MOS |
180 mA |
5 V |
256X8 |
Parallel IO Port |
2.54 mm |
R-XDIP-T40 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||
Infineon Technologies |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5 |
IN-LINE |
DIP40,.6 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
CMOS |
5 mA |
5 V |
Parallel IO Port |
2.54 mm |
R-PDIP-T40 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||
Infineon Technologies |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
14 |
5 |
IN-LINE |
DIP40,.6 |
70 Cel |
8085 |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
3 |
1 |
MOS |
180 mA |
5 V |
256X8 |
Parallel IO Port |
2.54 mm |
R-XDIP-T40 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||
Infineon Technologies |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
14 |
5 |
IN-LINE |
DIP40,.6 |
70 Cel |
8085 |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
3 |
1 |
MOS |
180 mA |
5 V |
256X8 |
Parallel IO Port |
2.54 mm |
R-PDIP-T40 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||
Maxim Integrated |
COMMERCIAL |
GULL WING |
80 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
FLATPACK |
QFP80,.7SQ,32 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
15 mA |
5 V |
Parallel IO Port |
.8 mm |
S-PQFP-G80 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||
Maxim Integrated |
COMMERCIAL |
GULL WING |
80 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
FLATPACK |
QFP80,.7SQ,32 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
15 mA |
5 V |
Parallel IO Port |
.8 mm |
S-PQFP-G80 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||
Maxim Integrated |
COMMERCIAL |
GULL WING |
80 |
QFP |
SQUARE |
CERAMIC |
YES |
FLATPACK |
QFP80,.7SQ,32 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
Parallel IO Port |
.8 mm |
S-XQFP-G80 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||
Maxim Integrated |
COMMERCIAL |
GULL WING |
80 |
QFP |
SQUARE |
CERAMIC |
YES |
FLATPACK |
QFP80,.7SQ,32 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
Parallel IO Port |
.8 mm |
S-XQFP-G80 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||
Maxim Integrated |
COMMERCIAL |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3/5 |
SMALL OUTLINE |
SOP14,.25 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
.5 mA |
Parallel IO Port |
1.27 mm |
R-PDSO-G14 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||
Toshiba |
PARALLEL IO PORT, GENERAL PURPOSE |
COMMERCIAL |
GULL WING |
40 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.25 V |
SMALL OUTLINE, SHRINK PITCH |
4.75 V |
70 Cel |
-10 Cel |
DUAL |
2 |
2.8 mm |
8.8 mm |
8 |
8 MHz |
17.5 mm |
CMOS |
10 mA |
5 V |
.8 mm |
R-PDSO-G40 |
Not Qualified |
16 |
|||||||||||||||||||||||||||
Toshiba |
PARALLEL IO PORT, GENERAL PURPOSE |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.25 V |
IN-LINE |
4.75 V |
70 Cel |
-10 Cel |
TIN LEAD |
DUAL |
2 |
4.8 mm |
15.24 mm |
8 |
8 MHz |
50.7 mm |
CMOS |
10 mA |
5 V |
2.54 mm |
R-PDIP-T40 |
Not Qualified |
e0 |
16 |
|||||||||||||||||||||||||
Toshiba |
PARALLEL IO PORT, GENERAL PURPOSE |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
CHIP CARRIER |
4.75 V |
70 Cel |
-10 Cel |
QUAD |
2 |
4.52 mm |
16.6 mm |
8 |
8 MHz |
16.6 mm |
CMOS |
10 mA |
5 V |
1.27 mm |
S-PQCC-J44 |
Not Qualified |
16 |
|||||||||||||||||||||||||||
Toshiba |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
14 |
5 |
IN-LINE |
DIP40,.6 |
70 Cel |
8085 |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
3 |
1 |
MOS |
180 mA |
5 V |
256X8 |
Parallel IO Port |
2.54 mm |
R-PDIP-T40 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||
Toshiba |
PARALLEL IO PORT, GENERAL PURPOSE |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.25 V |
IN-LINE |
4.75 V |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
3 |
4.8 mm |
15.24 mm |
50.7 mm |
CMOS |
5 V |
2.54 mm |
R-PDIP-T40 |
Not Qualified |
e0 |
22 |
||||||||||||||||||||||||||||
Toshiba |
PARALLEL IO PORT, GENERAL PURPOSE |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.25 V |
IN-LINE |
4.75 V |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
3 |
4.8 mm |
15.24 mm |
50.7 mm |
CMOS |
5 V |
2.54 mm |
R-PDIP-T40 |
Not Qualified |
e0 |
22 |
||||||||||||||||||||||||||||
Toshiba |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
14 |
5 |
IN-LINE |
DIP40,.6 |
70 Cel |
8085 |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
3 |
1 |
MOS |
180 mA |
5 V |
256X8 |
Parallel IO Port |
2.54 mm |
R-PDIP-T40 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||
Renesas Electronics |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
14 |
5 |
IN-LINE |
DIP40,.6 |
70 Cel |
8085 |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
3 |
1 |
MOS |
125 mA |
5 V |
256X8 |
Parallel IO Port |
2.54 mm |
R-XDIP-T40 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||
Renesas Electronics |
COMMERCIAL |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
8 |
IN-LINE |
DIP24,.6 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
BIPOLAR |
Parallel IO Port |
2.54 mm |
R-PDIP-T24 |
Not Qualified |
e0 |
Parallel I/O (Input/Output) ports are a type of interface that allows a microcontroller or microprocessor to communicate with other devices in a parallel fashion. This means that multiple bits of data can be transmitted or received simultaneously, as opposed to serial communication which transmits or receives data one bit at a time.
Parallel I/O ports are commonly found in a wide range of electronic devices, including computers, printers, and industrial control systems. They typically consist of a number of input and output lines, with each line representing a single bit of data. The number of lines can vary depending on the specific device, with some systems having only a few lines while others may have dozens or even hundreds.
One of the advantages of parallel I/O ports is their ability to transfer large amounts of data quickly and efficiently. This makes them particularly useful in applications where real-time data acquisition or high-speed communication is required. For example, parallel ports are commonly used in printers and other peripherals to transfer large amounts of data quickly.
However, one of the limitations of parallel I/O ports is that they require a large number of pins on the microcontroller or microprocessor to accommodate all of the data lines. This can make them difficult to implement in systems with limited space or where a large number of I/O lines are required. In addition, parallel I/O ports can be more susceptible to noise and interference compared to serial communication, which can affect data integrity and transmission speeds.