Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | Maximum Supply Voltage | Screening Level | Address Bus Width | No. of Bits | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | Minimum Operating Temperature | Terminal Finish | Ultraviolet Erasable | Terminal Position | No. of Ports | Maximum Seated Height | ROM Words | Width | Additional Features | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | ROM Bits Size | No. of Timers | RAM Bytes | Technology | Maximum Supply Current | Nominal Supply Voltage | Memory Organization | Sub-Category | ROM Programmability | Terminal Pitch | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | JESD-609 Code | Maximum Standby Current | No. of I/O Lines | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Analog Devices |
INDUSTRIAL |
BALL |
9 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.3/5 |
GRID ARRAY, FINE PITCH |
BGA9,3X3,20 |
85 Cel |
-40 Cel |
TIN SILVER COPPER NICKEL |
BOTTOM |
30 |
260 |
.75 mA |
Parallel IO Port |
.5 mm |
S-PBGA-B9 |
1 |
Not Qualified |
e2 |
||||||||||||||||||||||||||||||
|
Texas Instruments |
PARALLEL IO PORT, GENERAL PURPOSE |
INDUSTRIAL |
BALL |
25 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
18 |
1.8/3.3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA25,5X5,16 |
1.65 V |
85 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
1 |
.5 mm |
1.96 mm |
1 MHz |
NOT SPECIFIED |
260 |
1.96 mm |
CMOS |
2.3 V |
Parallel IO Port |
.4 mm |
S-PBGA-B25 |
1 |
Not Qualified |
e1 |
18 |
||||||||||||||||||
|
NXP Semiconductors |
PARALLEL IO PORT, GENERAL PURPOSE |
INDUSTRIAL |
BALL |
24 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
16 |
1.8/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA24,5X5,20 |
1.65 V |
85 Cel |
-40 Cel |
BOTTOM |
2 |
1 mm |
3 mm |
0 |
260 |
3 mm |
0 |
CMOS |
200 mA |
1.8 V |
Parallel IO Port |
.5 mm |
S-PBGA-B24 |
1 |
Not Qualified |
16 |
||||||||||||||||||||
|
NXP Semiconductors |
PARALLEL IO PORT, GENERAL PURPOSE |
INDUSTRIAL |
BALL |
36 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA36.6X6,16 |
1.65 V |
85 Cel |
-40 Cel |
BOTTOM |
3 |
1 mm |
2.6 mm |
260 |
2.6 mm |
CMOS |
200 mA |
1.8 V |
.4 mm |
S-PBGA-B36 |
1 |
24 |
||||||||||||||||||||||||||
|
Texas Instruments |
PARALLEL IO PORT, GENERAL PURPOSE |
INDUSTRIAL |
BALL |
24 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
16 |
1.8/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA24,5X5,20 |
1.65 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
2 |
1 mm |
3 mm |
IT ALSO OPERATES AT 2.5V, 3.3V AND 5V |
.4 MHz |
30 |
260 |
3 mm |
CMOS |
.02 mA |
1.8 V |
Parallel IO Port |
.5 mm |
S-PBGA-B24 |
1 |
Not Qualified |
e1 |
16 |
|||||||||||||||||
|
NXP Semiconductors |
PARALLEL IO PORT, GENERAL PURPOSE |
INDUSTRIAL |
BALL |
24 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
16 |
1.8/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA24,5X5,20 |
1.65 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
2 |
1 mm |
3 mm |
30 |
260 |
3 mm |
CMOS |
1.8 V |
Parallel IO Port |
.5 mm |
S-PBGA-B24 |
1 |
Not Qualified |
e1 |
16 |
||||||||||||||||||||
|
Texas Instruments |
PARALLEL IO PORT, GENERAL PURPOSE |
INDUSTRIAL |
BALL |
24 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1.2/3.3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA24,5X5,20 |
1.1 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
2 |
1 mm |
3 mm |
30 |
260 |
3 mm |
CMOS |
.036 mA |
1.2 V |
Parallel IO Port |
.5 mm |
S-PBGA-B24 |
1 |
Not Qualified |
e1 |
15 |
||||||||||||||||||||
|
NXP Semiconductors |
PARALLEL IO PORT, GENERAL PURPOSE |
INDUSTRIAL |
BALL |
24 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
16 |
1.8/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA24,5X5,16 |
1.65 V |
85 Cel |
-40 Cel |
BOTTOM |
2 |
.5 mm |
2 mm |
260 |
2 mm |
CMOS |
1.8 V |
Parallel IO Ports |
.4 mm |
S-PBGA-B24 |
1 |
Not Qualified |
16 |
|||||||||||||||||||||||
|
Texas Instruments |
PARALLEL IO PORT, GENERAL PURPOSE |
INDUSTRIAL |
BALL |
24 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
16 |
1.8/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA24,5X5,20 |
1.65 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
2 |
1 mm |
3 mm |
.4 MHz |
30 |
260 |
3 mm |
CMOS |
.03 mA |
1.8 V |
Parallel IO Port |
.5 mm |
S-PBGA-B24 |
1 |
Not Qualified |
e1 |
16 |
||||||||||||||||||
|
NXP Semiconductors |
PARALLEL IO PORT, GENERAL PURPOSE |
INDUSTRIAL |
BALL |
24 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.65 V |
85 Cel |
-40 Cel |
BOTTOM |
2 |
.65 mm |
2 mm |
260 |
2 mm |
CMOS |
1.8 V |
.4 mm |
S-PBGA-B24 |
1 |
16 |
||||||||||||||||||||||||||||
|
NXP Semiconductors |
PARALLEL IO PORT, GENERAL PURPOSE |
INDUSTRIAL |
BALL |
24 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.65 V |
85 Cel |
-40 Cel |
BOTTOM |
2 |
.65 mm |
2 mm |
260 |
2 mm |
CMOS |
1.8 V |
.4 mm |
S-PBGA-B24 |
1 |
16 |
||||||||||||||||||||||||||||
|
NXP Semiconductors |
PARALLEL IO PORT, GENERAL PURPOSE |
INDUSTRIAL |
BALL |
24 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.65 V |
85 Cel |
-40 Cel |
BOTTOM |
2 |
1 mm |
3 mm |
3 mm |
CMOS |
1.8 V |
.5 mm |
S-PBGA-B24 |
1 |
16 |
|||||||||||||||||||||||||||||
NXP Semiconductors |
PARALLEL IO PORT, GENERAL PURPOSE |
INDUSTRIAL |
BALL |
24 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.65 V |
85 Cel |
-40 Cel |
BOTTOM |
2 |
1 mm |
3 mm |
3 mm |
CMOS |
1.8 V |
.5 mm |
S-PBGA-B24 |
16 |
|||||||||||||||||||||||||||||||
|
Texas Instruments |
PARALLEL IO PORT, GENERAL PURPOSE |
INDUSTRIAL |
BALL |
20 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
8 |
1.8/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA20,4X5,20 |
1.65 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
.61 mm |
2.5 mm |
30 |
260 |
3 mm |
CMOS |
1.8 V |
Parallel IO Port |
.5 mm |
R-PBGA-B20 |
1 |
Not Qualified |
e1 |
8 |
||||||||||||||||||||
|
Texas Instruments |
PARALLEL IO PORT, GENERAL PURPOSE |
INDUSTRIAL |
BALL |
16 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
8 |
1.8/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA16,4X4,20 |
1.65 V |
85 Cel |
-40 Cel |
BOTTOM |
1 |
.55 mm |
2 mm |
.4 MHz |
30 |
260 |
2 mm |
CMOS |
.02 mA |
1.8 V |
Parallel IO Ports |
.5 mm |
S-PBGA-B16 |
2 |
Not Qualified |
8 |
||||||||||||||||||||
Texas Instruments |
PARALLEL IO PORT, GENERAL PURPOSE |
INDUSTRIAL |
BALL |
36 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.98 V |
GRID ARRAY, THIN PROFILE, FINE PITCH |
1.62 V |
85 Cel |
-40 Cel |
BOTTOM |
1 |
1.1 mm |
3.5 mm |
3.5 mm |
CMOS |
1.9 V |
.5 mm |
S-PBGA-B36 |
16 |
|||||||||||||||||||||||||||||||
Texas Instruments |
PARALLEL IO PORT, GENERAL PURPOSE |
INDUSTRIAL |
BALL |
36 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.98 V |
GRID ARRAY, THIN PROFILE, FINE PITCH |
1.62 V |
85 Cel |
-40 Cel |
BOTTOM |
1 |
1.1 mm |
3.5 mm |
3.5 mm |
CMOS |
1.9 V |
.5 mm |
S-PBGA-B36 |
16 |
|||||||||||||||||||||||||||||||
|
Texas Instruments |
PARALLEL IO PORT, GENERAL PURPOSE |
INDUSTRIAL |
BALL |
8 |
VFBGA |
RECTANGULAR |
UNSPECIFIED |
YES |
5.5 V |
4 |
2.5/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA8,2X4,20 |
2.3 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
.5 mm |
.9 mm |
30 |
260 |
1.98 mm |
CMOS |
3 V |
Parallel IO Ports |
.5 mm |
R-XBGA-B8 |
1 |
Not Qualified |
e1 |
4 |
||||||||||||||||||||
|
Analog Devices |
PARALLEL IO PORT, GENERAL PURPOSE |
INDUSTRIAL |
BALL |
25 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
18 |
1.8/3.3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA25,5X5,16 |
1.65 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
2 |
.645 mm |
1.97 mm |
30 |
260 |
1.97 mm |
CMOS |
1.8 V |
Parallel IO Ports |
.4 mm |
S-PBGA-B25 |
1 |
Not Qualified |
e1 |
18 |
||||||||||||||||||||
|
STMicroelectronics |
PARALLEL IO PORT, GENERAL PURPOSE |
INDUSTRIAL |
BALL |
36 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.95 V |
24 |
1.8 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA36,6X6,20 |
1.65 V |
85 Cel |
-40 Cel |
BOTTOM |
1 |
1.16 mm |
3.5 mm |
NOT SPECIFIED |
NOT SPECIFIED |
3.6 mm |
CMOS |
1.8 V |
Parallel IO Port |
.5 mm |
S-PBGA-B36 |
Not Qualified |
24 |
|||||||||||||||||||||||
|
STMicroelectronics |
PARALLEL IO PORT, GENERAL PURPOSE |
INDUSTRIAL |
BALL |
36 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1.95 V |
1.8 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA36,6X6,20 |
1.65 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
1.16 mm |
3.5 mm |
30 |
260 |
3.6 mm |
CMOS |
1.8 V |
Parallel IO Port |
.5 mm |
R-PBGA-B36 |
3 |
Not Qualified |
e1 |
24 |
|||||||||||||||||||||
|
STMicroelectronics |
PARALLEL IO PORT, GENERAL PURPOSE |
INDUSTRIAL |
BALL |
25 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
16 |
1.8/3.3 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA25,5X5,20 |
1.65 V |
85 Cel |
-40 Cel |
MATTE TIN |
BOTTOM |
1 |
1.16 mm |
3 mm |
3 mm |
CMOS |
1.8 V |
Parallel IO Port |
.5 mm |
S-PBGA-B25 |
1 |
Not Qualified |
e3 |
16 |
||||||||||||||||||||||
|
STMicroelectronics |
PARALLEL IO PORT, GENERAL PURPOSE |
INDUSTRIAL |
BALL |
25 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
18 |
1.8/3.3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA25,5X5,16 |
1.65 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
2 |
.66 mm |
2 mm |
30 |
235 |
2 mm |
CMOS |
1.8 V |
Parallel IO Port |
.4 mm |
S-PBGA-B25 |
Not Qualified |
e1 |
18 |
|||||||||||||||||||||
NXP Semiconductors |
PARALLEL IO PORT, GENERAL PURPOSE |
INDUSTRIAL |
BALL |
16 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.65 V |
85 Cel |
-40 Cel |
BOTTOM |
1 |
.5 mm |
1.6 mm |
1.6 mm |
CMOS |
1.8 V |
.4 mm |
S-PBGA-B16 |
8 |
|||||||||||||||||||||||||||||||
|
NXP Semiconductors |
PARALLEL IO PORT, GENERAL PURPOSE |
INDUSTRIAL |
BALL |
24 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.65 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
2 |
1 mm |
3 mm |
30 |
260 |
3 mm |
CMOS |
1.8 V |
.5 mm |
S-PBGA-B24 |
1 |
e1 |
16 |
|||||||||||||||||||||||||
NXP Semiconductors |
PARALLEL IO PORT, GENERAL PURPOSE |
INDUSTRIAL |
BALL |
24 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.65 V |
85 Cel |
-40 Cel |
BOTTOM |
2 |
.65 mm |
2 mm |
2 mm |
CMOS |
1.8 V |
.4 mm |
S-PBGA-B24 |
16 |
|||||||||||||||||||||||||||||||
|
NXP Semiconductors |
PARALLEL IO PORT, GENERAL PURPOSE |
INDUSTRIAL |
BALL |
24 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.65 V |
85 Cel |
-40 Cel |
BOTTOM |
2 |
.5 mm |
2 mm |
2 mm |
CMOS |
1.8 V |
.4 mm |
S-PBGA-B24 |
1 |
16 |
|||||||||||||||||||||||||||||
NXP Semiconductors |
PARALLEL IO PORT, GENERAL PURPOSE |
INDUSTRIAL |
BALL |
24 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.65 V |
85 Cel |
-40 Cel |
BOTTOM |
2 |
1 mm |
3 mm |
3 mm |
CMOS |
1.8 V |
.5 mm |
S-PBGA-B24 |
16 |
|||||||||||||||||||||||||||||||
|
NXP Semiconductors |
PARALLEL IO PORT, GENERAL PURPOSE |
INDUSTRIAL |
BALL |
16 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.65 V |
85 Cel |
-40 Cel |
BOTTOM |
1 |
.5 mm |
1.6 mm |
1.6 mm |
CMOS |
1.8 V |
.4 mm |
S-PBGA-B16 |
8 |
||||||||||||||||||||||||||||||
NXP Semiconductors |
PARALLEL IO PORT, GENERAL PURPOSE |
INDUSTRIAL |
BALL |
16 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.65 V |
85 Cel |
-40 Cel |
BOTTOM |
1 |
.5 mm |
1.6 mm |
1.6 mm |
CMOS |
1.8 V |
.4 mm |
S-PBGA-B16 |
8 |
|||||||||||||||||||||||||||||||
|
NXP Semiconductors |
PARALLEL IO PORT, GENERAL PURPOSE |
INDUSTRIAL |
BALL |
24 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA24,5X5,20 |
1.65 V |
85 Cel |
-40 Cel |
BOTTOM |
2 |
1 mm |
3 mm |
0 |
3 mm |
0 |
CMOS |
200 mA |
1.8 V |
.5 mm |
S-PBGA-B24 |
1 |
16 |
||||||||||||||||||||||||
Toshiba |
PARALLEL IO PORT, GENERAL PURPOSE |
INDUSTRIAL |
BALL |
25 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.62 V |
85 Cel |
-40 Cel |
BOTTOM |
2 |
1 mm |
3 mm |
3 mm |
CMOS |
1.8 V |
.5 mm |
S-PBGA-B25 |
20 |
|||||||||||||||||||||||||||||||
Toshiba |
PARALLEL IO PORT, GENERAL PURPOSE |
INDUSTRIAL |
BALL |
36 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
GRID ARRAY |
1.62 V |
85 Cel |
-40 Cel |
BOTTOM |
4 |
CMOS |
1.8 V |
S-PBGA-B36 |
24 |
Parallel I/O (Input/Output) ports are a type of interface that allows a microcontroller or microprocessor to communicate with other devices in a parallel fashion. This means that multiple bits of data can be transmitted or received simultaneously, as opposed to serial communication which transmits or receives data one bit at a time.
Parallel I/O ports are commonly found in a wide range of electronic devices, including computers, printers, and industrial control systems. They typically consist of a number of input and output lines, with each line representing a single bit of data. The number of lines can vary depending on the specific device, with some systems having only a few lines while others may have dozens or even hundreds.
One of the advantages of parallel I/O ports is their ability to transfer large amounts of data quickly and efficiently. This makes them particularly useful in applications where real-time data acquisition or high-speed communication is required. For example, parallel ports are commonly used in printers and other peripherals to transfer large amounts of data quickly.
However, one of the limitations of parallel I/O ports is that they require a large number of pins on the microcontroller or microprocessor to accommodate all of the data lines. This can make them difficult to implement in systems with limited space or where a large number of I/O lines are required. In addition, parallel I/O ports can be more susceptible to noise and interference compared to serial communication, which can affect data integrity and transmission speeds.