14 Serial Communication Controllers 22

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Maximum Data Transfer Rate	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Boundary Scan	External Data Bus Width	Communication Protocol	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of Serial I/Os	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Low Power Mode	JESD-609 Code	No. of I/O Lines
MCP2518FDT-E/SL	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V					SMALL OUTLINE	SOP14,.24	2.7 V	125 Cel	1 MBps	-40 Cel	MATTE TIN	DUAL	1.75 mm		3.9 mm	NO		SYNC; BIT ;BYTE	40 MHz	30	260	8.65 mm	CMOS	20 mA	3.3 V	1		SPI	1.27 mm	R-PDSO-G14			YES	e3
MCP2518FDT-E/QBB	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	AUTOMOTIVE	NO LEAD	14	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		TS 16949			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,25	2.7 V	125 Cel	1 MBps	-40 Cel	MATTE TIN	DUAL	.9 mm		3 mm	NO		SYNC; BIT ;BYTE	40 MHz	30	260	4.5 mm	CMOS	20 mA	3.3 V	1		SPI	.65 mm	R-PDSO-N14			YES	e3
MCP2518FDT-H/QBB	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	AUTOMOTIVE	NO LEAD	14	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,25	2.7 V	150 Cel	1 MBps	-40 Cel	MATTE TIN	DUAL	.9 mm		3 mm	NO		SYNC; BIT ;BYTE	40 MHz	30	260	4.5 mm	CMOS	20 mA	3.3 V	1		SPI	.65 mm	R-PDSO-N14			YES	e3
MCP2518FDT-E/QBBVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	AUTOMOTIVE	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		AEC-Q100; TS 16949	0		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	LCC14,.18X.12,30	2.7 V	125 Cel	1 MBps	-40 Cel	MATTE TIN	DUAL	.9 mm		3 mm	NO	0	SYNC; BIT ;BYTE	40 MHz	30	260	4.5 mm	CMOS	20 mA	3.3 V	1		SPI	.65 mm	R-PDSO-N14			YES	e3
MCP2518FDT-H/SL	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V					SMALL OUTLINE	SOP14,.24	2.7 V	150 Cel	1 MBps	-40 Cel	MATTE TIN	DUAL	1.75 mm		3.9 mm	NO		SYNC; BIT ;BYTE	40 MHz	30	260	8.65 mm	CMOS	20 mA	3.3 V	1		SPI	1.27 mm	R-PDSO-G14			YES	e3
MCP2518FDT-E/SLVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		AEC-Q100; TS 16949	0		SMALL OUTLINE	SOP14,.24	2.7 V	125 Cel	1 MBps	-40 Cel	MATTE TIN	DUAL	1.75 mm		3.9 mm	NO	0	SYNC; BIT ;BYTE	40 MHz	30	260	8.65 mm	CMOS	20 mA	3.3 V	1		SPI	1.27 mm	R-PDSO-G14			YES	e3
MCP2518FDT-H/SLVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		AEC-Q100; TS 16949			SMALL OUTLINE	SOP14,.24	2.7 V	150 Cel	1 MBps	-40 Cel	MATTE TIN	DUAL	1.75 mm		3.9 mm	NO		SYNC; BIT ;BYTE	40 MHz	30	260	8.65 mm	CMOS	20 mA	3.3 V	1		SPI	1.27 mm	R-PDSO-G14			YES	e3
MCP2518FDT-H/QBBVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	AUTOMOTIVE	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		AEC-Q100; TS 16949	0		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	LCC14,.18X.12,30	2.7 V	150 Cel	1 MBps	-40 Cel	MATTE TIN	DUAL	.9 mm		3 mm	NO	0	SYNC; BIT ;BYTE	40 MHz	30	260	4.5 mm	CMOS	20 mA	3.3 V	1		SPI	.65 mm	R-PDSO-N14			YES	e3
MCP2517FD-H/SL	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8	TS 16949	0		SMALL OUTLINE	SOP14,.25	2.7 V	150 Cel	1 MBps	-40 Cel	MATTE TIN	DUAL	1.75 mm	2048	3.9 mm	NO	0	CAN FD	40 MHz	30	260	8.65 mm	CMOS	20 mA		1		SPI	1.27 mm	R-PDSO-G14			YES	e3	2
MCP2517FD-H/JHA	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8	TS 16949	0		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		2.7 V	150 Cel	1 MBps	-40 Cel	MATTE TIN	DUAL	.9 mm	2048	3 mm	NO	0	CAN FD	40 MHz	30	260	4.5 mm	CMOS	20 mA		1		SPI	.65 mm	R-PDSO-N14			YES		2
MCP2517FDT-H/SL	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8	TS 16949	0		SMALL OUTLINE	SOP14,.25	2.7 V	150 Cel	1 MBps	-40 Cel	MATTE TIN	DUAL	1.75 mm	2048	3.9 mm	NO	0	CAN FD	40 MHz	30	260	8.65 mm	CMOS	20 mA		1		SPI	1.27 mm	R-PDSO-G14			YES	e3	2
MCP2517FDT-H/JHA	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8	TS 16949	0		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		2.7 V	150 Cel	1 MBps	-40 Cel	MATTE TIN	DUAL	.9 mm	2048	3 mm	NO	0	CAN FD	40 MHz	30	260	4.5 mm	CMOS	20 mA		1		SPI	.65 mm	R-PDSO-N14			YES		2
MCP2517FD-H/SLVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8	AEC-Q100; TS 16949	0		SMALL OUTLINE	SOP14,.25	2.7 V	150 Cel	1 MBps	-40 Cel		DUAL	1.75 mm	2048	3.9 mm	NO	0	CAN FD	40 MHz			8.65 mm	CMOS	20 mA		1		SPI	1.27 mm	R-PDSO-G14			YES		2
MCP2517FDT-H/JHAVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8	AEC-Q100; TS 16949	0		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		2.7 V	150 Cel	1 MBps	-40 Cel		DUAL	.9 mm	2048	3 mm	NO	0	CAN FD	40 MHz			4.5 mm	CMOS	20 mA		1		SPI	.65 mm	R-PDSO-N14			YES		2
MCP2517FDT-H/SLVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8	AEC-Q100; TS 16949	0		SMALL OUTLINE	SOP14,.25	2.7 V	150 Cel	1 MBps	-40 Cel		DUAL	1.75 mm	2048	3.9 mm	NO	0	CAN FD	40 MHz			8.65 mm	CMOS	20 mA		1		SPI	1.27 mm	R-PDSO-G14			YES		2
MCP2517FD-H/JHAVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8	AEC-Q100; TS 16949	0		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		2.7 V	150 Cel	1 MBps	-40 Cel		DUAL	.9 mm	2048	3 mm	NO	0	CAN FD	40 MHz			4.5 mm	CMOS	20 mA		1		SPI	.65 mm	R-PDSO-N14			YES		2
MAX3100EPD	Maxim Integrated	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V				3/5	IN-LINE	DIP14,.3	2.7 V	85 Cel	.028125 MBps	-40 Cel	TIN LEAD	DUAL	4.572 mm		7.62 mm	NO	1	ASYNC, BIT	3.6864 MHz			19.05 mm	CMOS		3.3 V	1	Serial IO/Communication Controllers		2.54 mm	R-PDIP-T14	1	Not Qualified	YES	e0
MAX3100EPD+	Analog Devices	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V			0	3/5	IN-LINE	DIP14,.3	2.7 V	85 Cel	.028125 MBps	-40 Cel	Matte Tin (Sn) - annealed	DUAL	4.572 mm		7.62 mm	NO	0	ASYNC, BIT	3.6864 MHz	30	260	19.05 mm	BICMOS		3.3 V	1	Serial IO/Communication Controllers		2.54 mm	R-PDIP-T14	1	Not Qualified	YES	e3
MAX3100CPD	Maxim Integrated	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V				3/5	IN-LINE	DIP14,.3	2.7 V	70 Cel	.028125 MBps	0 Cel	TIN LEAD	DUAL	4.572 mm		7.62 mm	NO	1	ASYNC, BIT	3.6864 MHz			19.05 mm	CMOS		3.3 V	1	Serial IO/Communication Controllers		2.54 mm	R-PDIP-T14	1	Not Qualified	YES	e0
MAX3100CPD+	Analog Devices	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V			0	3/5	IN-LINE	DIP14,.3	2.7 V	70 Cel	.028125 MBps	0 Cel	Matte Tin (Sn) - annealed	DUAL	4.572 mm		7.62 mm	NO	0	ASYNC, BIT	3.6864 MHz	30	260	19.05 mm	BICMOS		3.3 V	1	Serial IO/Communication Controllers		2.54 mm	R-PDIP-T14	1	Not Qualified	YES	e3
MAX3100EPC	Analog Devices	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO					3/5	IN-LINE	DIP14,.3		85 Cel		-40 Cel	TIN LEAD	DUAL											BIPOLAR				Serial IO/Communication Controllers		2.54 mm	R-PDIP-T14		Not Qualified		e0
PCA9542PWDH	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, I2C BUS	COMMERCIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V			3		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		2.5 V	70 Cel		0 Cel		DUAL	1.1 mm		4.4 mm	NO	1	I2C				5 mm	CMOS		3.3 V	2			.65 mm	R-PDSO-G14		Not Qualified	NO

Serial Communication Controllers

Serial communication controllers are electronic devices that manage the input/output operations between a computer or microcontroller and other devices through serial communication protocols such as UART, SPI, I2C, and USB. These controllers provide an interface that allows the computer or microcontroller to send and receive data over a serial connection and manage the communication operations.

Serial communication controllers can be integrated into the computer or microcontroller's chipset or added as an external module. They typically include a serial interface that connects to the device and a host interface that connects to the computer or microcontroller's bus system. The serial interface can be based on various standards such as UART, SPI, or I2C, while the host interface can be based on various standards such as PCI, PCIe, or USB.

Serial communication controllers offer various benefits such as increased data transfer rates, improved reliability, and increased compatibility with a wide range of devices. They also provide advanced features such as error checking, flow control, and clock synchronization that can improve the accuracy and reliability of the communication.