36 Serial Communication Controllers 68

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Address Bus Width	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Maximum Data Transfer Rate	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Data Encoding or Decoding Method	Communication Protocol	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of Serial I/Os	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Low Power Mode	JESD-609 Code
LAN8700IC-AEZG-TR	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES		TS 16949	0		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.24SQ,20		85 Cel	12.5 MBps	-40 Cel	MATTE TIN	QUAD	1 mm	6 mm	IT ALSO HAS IEEE802.3AB NETWORK PROTOCOL	NO	0	NRZI; BIPH-LEVEL(MANCHESTER)	ASYNC, BIT; SYNC, BYTE	25 MHz			6 mm	CMOS	41.3 mA	1.8 V	4		.5 mm	S-PQCC-N36			YES	e3
LAN8700IC-AEZG	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V	TS 16949	0		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.24SQ,20	3 V	85 Cel	12.5 MBps	-40 Cel	MATTE TIN	QUAD	1 mm	6 mm		NO	0	NRZI; BIPH-LEVEL(MANCHESTER)	ASYNC, BIT; SYNC, BYTE	25 MHz		260	6 mm	CMOS	41.3 mA	1.8 V	4		.5 mm	S-PQCC-N36	3	Not Qualified	YES	e3
LAN8700C-AEZG-TR	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	COMMERCIAL	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V	TS 16949	0		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.24SQ,20	3 V	70 Cel	12.5 MBps	0 Cel	MATTE TIN	QUAD	1 mm	6 mm		NO	0	NRZI; BIPH-LEVEL(MANCHESTER)	ASYNC, BIT; SYNC, BYTE	25 MHz			6 mm	CMOS	41.3 mA	1.8 V	4		.5 mm	S-PQCC-N36		Not Qualified	YES	e3
LAN8700IC-AEZG-TR-CAG	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V	TS 16949	0		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.24SQ,20	3 V	85 Cel	12.5 MBps	-40 Cel	MATTE TIN	QUAD	1 mm	6 mm	IT ALSO HAS IEEE802.3AB NETWORK PROTOCOL	NO	0	NRZI; BIPH-LEVEL(MANCHESTER)	ASYNC, BIT; SYNC, BYTE	25 MHz			6 mm	CMOS	41.3 mA	1.8 V	4		.5 mm	S-PQCC-N36			YES	e3
LAN8700IC-AEZG-CAG	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V	TS 16949	0		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.24SQ,20	3 V	85 Cel	12.5 MBps	-40 Cel	MATTE TIN	QUAD	1 mm	6 mm		NO	0	NRZI; BIPH-LEVEL(MANCHESTER)	ASYNC, BIT; SYNC, BYTE	25 MHz			6 mm	CMOS	41.3 mA	1.8 V	4		.5 mm	S-PQCC-N36			YES	e3
LAN8700C-AEZG	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	COMMERCIAL	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V	TS 16949	0		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.24SQ,20	3 V	70 Cel	12.5 MBps	0 Cel	MATTE TIN	QUAD	1 mm	6 mm		NO	0	NRZI; BIPH-LEVEL(MANCHESTER)	ASYNC, BIT; SYNC, BYTE	25 MHz			6 mm	CMOS	41.3 mA	1.8 V	4		.5 mm	S-PQCC-N36		Not Qualified	YES	e3
LAN8700I-AEZG	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	3.63 V		0		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2.97 V	85 Cel	12.5 MBps	-40 Cel	MATTE TIN	QUAD	1 mm	6 mm		NO	0	NRZI; BIPH-LEVEL(MANCHESTER)		25 MHz			6 mm	CMOS		3.3 V	1		.5 mm	S-XQCC-N36	3	Not Qualified	YES	e3
935282854557	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	BALL	36	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.95 V		0		GRID ARRAY, THIN PROFILE, FINE PITCH		1.65 V	85 Cel	.625 MBps	-40 Cel		BOTTOM	1.15 mm	3.5 mm		NO	8	NRZ	ASYNC, BIT	80 MHz			3.5 mm	CMOS		1.8 V	1		.5 mm	S-PBGA-B36			YES
935282518551	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	BALL	36	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.95 V		8		GRID ARRAY, THIN PROFILE, FINE PITCH		1.65 V	85 Cel	.625 MBps	-40 Cel		BOTTOM	1.15 mm	3.5 mm		NO	8	NRZ	ASYNC, BIT	80 MHz			3.5 mm	CMOS		1.8 V	2		.5 mm	S-PBGA-B36			YES
935282854515	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	BALL	36	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.95 V		0		GRID ARRAY, THIN PROFILE, FINE PITCH		1.65 V	85 Cel	.625 MBps	-40 Cel		BOTTOM	1.15 mm	3.5 mm		NO	8	NRZ	ASYNC, BIT	80 MHz			3.5 mm	CMOS		1.8 V	1		.5 mm	S-PBGA-B36			YES
935282518515	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	BALL	36	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.95 V		8		GRID ARRAY, THIN PROFILE, FINE PITCH		1.65 V	85 Cel	.625 MBps	-40 Cel		BOTTOM	1.15 mm	3.5 mm		NO	8	NRZ	ASYNC, BIT	80 MHz			3.5 mm	CMOS		1.8 V	2		.5 mm	S-PBGA-B36			YES
935284685115	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	BALL	36	TFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V		3		GRID ARRAY, THIN PROFILE, FINE PITCH		3 V	85 Cel	.625 MBps	-40 Cel		BOTTOM	1.15 mm	3.5 mm	CAN ALSO OPERATE AT 2.5V SUPPLY	NO	8		ASYNC, BIT	80 MHz			3.5 mm	CMOS		3.3 V	1		.5 mm	S-PBGA-B36			YES
935282518157	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	BALL	36	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.95 V		8		GRID ARRAY, THIN PROFILE, FINE PITCH		1.65 V	85 Cel	.625 MBps	-40 Cel		BOTTOM	1.15 mm	3.5 mm		NO	8	NRZ	ASYNC, BIT	80 MHz			3.5 mm	CMOS		1.8 V	2		.5 mm	S-PBGA-B36			YES
935282854115	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	BALL	36	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.95 V		0		GRID ARRAY, THIN PROFILE, FINE PITCH		1.65 V	85 Cel	.625 MBps	-40 Cel		BOTTOM	1.15 mm	3.5 mm		NO	8	NRZ	ASYNC, BIT	80 MHz			3.5 mm	CMOS		1.8 V	1		.5 mm	S-PBGA-B36			YES
935282518557	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	BALL	36	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.95 V		8		GRID ARRAY, THIN PROFILE, FINE PITCH		1.65 V	85 Cel	.625 MBps	-40 Cel		BOTTOM	1.15 mm	3.5 mm		NO	8	NRZ	ASYNC, BIT	80 MHz			3.5 mm	CMOS		1.8 V	2		.5 mm	S-PBGA-B36			YES
935282854157	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	BALL	36	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.95 V		0		GRID ARRAY, THIN PROFILE, FINE PITCH		1.65 V	85 Cel	.625 MBps	-40 Cel		BOTTOM	1.15 mm	3.5 mm		NO	8	NRZ	ASYNC, BIT	80 MHz			3.5 mm	CMOS		1.8 V	1		.5 mm	S-PBGA-B36			YES
935282854151	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	BALL	36	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.95 V		0		GRID ARRAY, THIN PROFILE, FINE PITCH		1.65 V	85 Cel	.625 MBps	-40 Cel		BOTTOM	1.15 mm	3.5 mm		NO	8	NRZ	ASYNC, BIT	80 MHz			3.5 mm	CMOS		1.8 V	1		.5 mm	S-PBGA-B36			YES
935282518118	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	BALL	36	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.95 V		8		GRID ARRAY, THIN PROFILE, FINE PITCH		1.65 V	85 Cel	.625 MBps	-40 Cel		BOTTOM	1.15 mm	3.5 mm		NO	8	NRZ	ASYNC, BIT	80 MHz			3.5 mm	CMOS		1.8 V	2		.5 mm	S-PBGA-B36			YES
935282518151	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	BALL	36	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.95 V		8		GRID ARRAY, THIN PROFILE, FINE PITCH		1.65 V	85 Cel	.625 MBps	-40 Cel		BOTTOM	1.15 mm	3.5 mm		NO	8	NRZ	ASYNC, BIT	80 MHz			3.5 mm	CMOS		1.8 V	2		.5 mm	S-PBGA-B36			YES
935282854118	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	BALL	36	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.95 V		0		GRID ARRAY, THIN PROFILE, FINE PITCH		1.65 V	85 Cel	.625 MBps	-40 Cel		BOTTOM	1.15 mm	3.5 mm		NO	8	NRZ	ASYNC, BIT	80 MHz			3.5 mm	CMOS		1.8 V	1		.5 mm	S-PBGA-B36			YES
935282854551	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	BALL	36	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.95 V		0		GRID ARRAY, THIN PROFILE, FINE PITCH		1.65 V	85 Cel	.625 MBps	-40 Cel		BOTTOM	1.15 mm	3.5 mm		NO	8	NRZ	ASYNC, BIT	80 MHz			3.5 mm	CMOS		1.8 V	1		.5 mm	S-PBGA-B36			YES
935284685157	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	BALL	36	TFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V		3		GRID ARRAY, THIN PROFILE, FINE PITCH		3 V	85 Cel	.625 MBps	-40 Cel		BOTTOM	1.15 mm	3.5 mm	CAN ALSO OPERATE AT 2.5V SUPPLY	NO	8		ASYNC, BIT	80 MHz			3.5 mm	CMOS		3.3 V	1		.5 mm	S-PBGA-B36			YES
935286451157	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	BALL	36	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.95 V		8		GRID ARRAY, THIN PROFILE, FINE PITCH		1.65 V	85 Cel	.0000012122176018 MBps	-40 Cel	TIN SILVER COPPER	BOTTOM	1.15 mm	3.5 mm		NO	8	NRZ	ASYNC, BIT	80 MHz			3.5 mm	CMOS		1.8 V	2		.5 mm	S-PBGA-B36			YES	e1
935284685151	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	BALL	36	TFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V		3		GRID ARRAY, THIN PROFILE, FINE PITCH		3 V	85 Cel	.625 MBps	-40 Cel		BOTTOM	1.15 mm	3.5 mm	CAN ALSO OPERATE AT 2.5V SUPPLY	NO	8		ASYNC, BIT	80 MHz			3.5 mm	CMOS		3.3 V	1		.5 mm	S-PBGA-B36			YES
935286451151	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	BALL	36	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.95 V		8		GRID ARRAY, THIN PROFILE, FINE PITCH		1.65 V	85 Cel	.0000012122176018 MBps	-40 Cel	TIN SILVER COPPER	BOTTOM	1.15 mm	3.5 mm		NO	8	NRZ	ASYNC, BIT	80 MHz			3.5 mm	CMOS		1.8 V	2		.5 mm	S-PBGA-B36			YES	e1
935282518115	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	BALL	36	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.95 V		8		GRID ARRAY, THIN PROFILE, FINE PITCH		1.65 V	85 Cel	.625 MBps	-40 Cel		BOTTOM	1.15 mm	3.5 mm		NO	8	NRZ	ASYNC, BIT	80 MHz			3.5 mm	CMOS		1.8 V	2		.5 mm	S-PBGA-B36			YES
935285388151	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	BALL	36	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.95 V		0		GRID ARRAY, THIN PROFILE, FINE PITCH		1.65 V	85 Cel	.625 MBps	-40 Cel		BOTTOM	1.15 mm	3.5 mm		NO	8	NRZ	ASYNC, BIT	80 MHz			3.5 mm	CMOS		1.8 V	2		.5 mm	S-PBGA-B36			YES
935286451115	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	BALL	36	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.95 V		8		GRID ARRAY, THIN PROFILE, FINE PITCH		1.65 V	85 Cel	.0000012122176018 MBps	-40 Cel	TIN SILVER COPPER	BOTTOM	1.15 mm	3.5 mm		NO	8	NRZ	ASYNC, BIT	80 MHz			3.5 mm	CMOS		1.8 V	2		.5 mm	S-PBGA-B36			YES	e1
935285388118	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	BALL	36	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.95 V		0		GRID ARRAY, THIN PROFILE, FINE PITCH		1.65 V	85 Cel	.625 MBps	-40 Cel		BOTTOM	1.15 mm	3.5 mm		NO	8	NRZ	ASYNC, BIT	80 MHz			3.5 mm	CMOS		1.8 V	2		.5 mm	S-PBGA-B36			YES
935285388157	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	BALL	36	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.95 V		0		GRID ARRAY, THIN PROFILE, FINE PITCH		1.65 V	85 Cel	.625 MBps	-40 Cel		BOTTOM	1.15 mm	3.5 mm		NO	8	NRZ	ASYNC, BIT	80 MHz			3.5 mm	CMOS		1.8 V	2		.5 mm	S-PBGA-B36			YES
935285388115	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	BALL	36	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.95 V		0		GRID ARRAY, THIN PROFILE, FINE PITCH		1.65 V	85 Cel	.625 MBps	-40 Cel		BOTTOM	1.15 mm	3.5 mm		NO	8	NRZ	ASYNC, BIT	80 MHz			3.5 mm	CMOS		1.8 V	2		.5 mm	S-PBGA-B36			YES
SC16C850IET-G	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	BALL	36	FBGA	SQUARE	PLASTIC/EPOXY	YES				2.5/3.3	GRID ARRAY, FINE PITCH	BGA36,6X6,20		85 Cel		-40 Cel		BOTTOM												CMOS				Serial IO/Communication Controllers	.5 mm	S-PBGA-B36		Not Qualified
SC16C850LIET-S	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	BALL	36	FBGA	SQUARE	PLASTIC/EPOXY	YES				1.8	GRID ARRAY, FINE PITCH	BGA36,6X6,20		85 Cel		-40 Cel		BOTTOM												CMOS		1.8 V		Serial IO/Communication Controllers	.5 mm	S-PBGA-B36		Not Qualified
SC16C852LIET,157	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	BALL	36	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.95 V		3	1.8	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA36,6X6,20	1.65 V	85 Cel	.625 MBps	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.15 mm	3.5 mm		NO	8	NRZ	ASYNC, BIT	80 MHz	30	260	3.5 mm	CMOS		1.8 V	2	Serial IO/Communication Controllers	.5 mm	S-PBGA-B36	1	Not Qualified	YES	e1
SC16C850LIET	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	BALL	36	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.95 V		0	1.8	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA36,6X6,20	1.65 V	85 Cel	.625 MBps	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.15 mm	3.5 mm		NO	8	NRZ	ASYNC, BIT	80 MHz	30	260	3.5 mm	CMOS		1.8 V	1	Serial IO/Communication Controllers	.5 mm	S-PBGA-B36	1	Not Qualified	YES	e1
SC16C852VIET-S	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	BALL	36	FBGA	SQUARE	PLASTIC/EPOXY	YES				1.8	GRID ARRAY, FINE PITCH	BGA36,6X6,20		85 Cel		-40 Cel		BOTTOM												CMOS		1.8 V		Serial IO/Communication Controllers	.5 mm	S-PBGA-B36		Not Qualified
SC16C852SVIET	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	BALL	36	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.95 V		8		GRID ARRAY, THIN PROFILE, FINE PITCH		1.65 V	85 Cel	.0000012122176018 MBps	-40 Cel	TIN SILVER COPPER	BOTTOM	1.15 mm	3.5 mm		NO	8	NRZ	ASYNC, BIT	80 MHz			3.5 mm	CMOS		1.8 V	2		.5 mm	S-PBGA-B36	1	Not Qualified	YES	e1
SC16C850IET,115	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	BALL	36	TFBGA	SQUARE	PLASTIC/EPOXY	YES	2.75 V			2.5/3.3	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA36,6X6,20	2.25 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.15 mm	3.5 mm	IT ALSO NEED 3.3V SUPPLY					80 MHz	30	260	3.5 mm	CMOS		2.5 V		Serial IO/Communication Controllers	.5 mm	S-PBGA-B36	1	Not Qualified	YES	e1
SC16C852LIET,151	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	BALL	36	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.95 V		3	1.8	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA36,6X6,20	1.65 V	85 Cel	.625 MBps	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.15 mm	3.5 mm		NO	8	NRZ	ASYNC, BIT	80 MHz	30	260	3.5 mm	CMOS		1.8 V	2	Serial IO/Communication Controllers	.5 mm	S-PBGA-B36	1	Not Qualified	YES	e1
SC16C850IET-S	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	BALL	36	FBGA	SQUARE	PLASTIC/EPOXY	YES				2.5/3.3	GRID ARRAY, FINE PITCH	BGA36,6X6,20		85 Cel		-40 Cel		BOTTOM												CMOS				Serial IO/Communication Controllers	.5 mm	S-PBGA-B36		Not Qualified
SC16C852VIET,151	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	BALL	36	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.95 V		8	1.8	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA36,6X6,20	1.65 V	85 Cel	.625 MBps	-40 Cel	TIN SILVER COPPER	BOTTOM	1.15 mm	3.5 mm		NO	8	NRZ	ASYNC, BIT	80 MHz	30	260	3.5 mm	CMOS		1.8 V	2	Serial IO/Communication Controllers	.5 mm	S-PBGA-B36	1	Not Qualified	YES	e1
SC16C852LIET,115	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	BALL	36	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.95 V		3	1.8	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA36,6X6,20	1.65 V	85 Cel	.625 MBps	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.15 mm	3.5 mm		NO	8	NRZ	ASYNC, BIT	80 MHz	30	260	3.5 mm	CMOS		1.8 V	2	Serial IO/Communication Controllers	.5 mm	S-PBGA-B36	1	Not Qualified	YES	e1
SC16C850LIET,115	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	BALL	36	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.95 V		3	1.8	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA36,6X6,20	1.65 V	85 Cel	.625 MBps	-40 Cel	TIN SILVER COPPER	BOTTOM	1.15 mm	3.5 mm		NO	8	NRZ	ASYNC, BIT	80 MHz	30	260	3.5 mm	CMOS		1.8 V	1	Serial IO/Communication Controllers	.5 mm	S-PBGA-B36	1	Not Qualified	YES	e1
SC16C850LIET,151	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	BALL	36	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.95 V		3	1.8	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA36,6X6,20	1.65 V	85 Cel	.625 MBps	-40 Cel	TIN SILVER COPPER	BOTTOM	1.15 mm	3.5 mm		NO	8	NRZ	ASYNC, BIT	80 MHz	30	260	3.5 mm	CMOS		1.8 V	1	Serial IO/Communication Controllers	.5 mm	S-PBGA-B36	1	Not Qualified	YES	e1
SC16C852VIET,515	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	BALL	36	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.95 V		8	1.8	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA36,6X6,20	1.65 V	85 Cel	.625 MBps	-40 Cel	TIN SILVER COPPER	BOTTOM	1.15 mm	3.5 mm		NO	8	NRZ	ASYNC, BIT	80 MHz	30	260	3.5 mm	CMOS		1.8 V	2	Serial IO/Communication Controllers	.5 mm	S-PBGA-B36	2	Not Qualified	YES	e1
SC16C850IET	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	BALL	36	TFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V		3	2.5/3.3	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA36,6X6,20	3 V	85 Cel	.625 MBps	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.15 mm	3.5 mm	CAN ALSO OPERATE AT 2.5V SUPPLY	NO	8		ASYNC, BIT	80 MHz	30	260	3.5 mm	CMOS		3.3 V	1	Serial IO/Communication Controllers	.5 mm	S-PBGA-B36	1	Not Qualified	YES	e1
SC16C850IET,157	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	BALL	36	TFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V		3	2.5/3.3	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA36,6X6,20	3 V	85 Cel	.625 MBps	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.15 mm	3.5 mm	CAN ALSO OPERATE AT 2.5V SUPPLY	NO	8		ASYNC, BIT	80 MHz	30	260	3.5 mm	CMOS		3.3 V	1	Serial IO/Communication Controllers	.5 mm	S-PBGA-B36	1	Not Qualified	YES	e1
SC16C852SVIET,151	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	BALL	36	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.95 V		8	1.8	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA36,6X6,20	1.65 V	85 Cel	.0000012122176018 MBps	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.15 mm	3.5 mm		NO	8	NRZ	ASYNC, BIT	80 MHz	30	260	3.5 mm	CMOS		1.8 V	2	Serial IO/Communication Controllers	.5 mm	S-PBGA-B36	1	Not Qualified	YES	e1

Serial Communication Controllers

Serial communication controllers are electronic devices that manage the input/output operations between a computer or microcontroller and other devices through serial communication protocols such as UART, SPI, I2C, and USB. These controllers provide an interface that allows the computer or microcontroller to send and receive data over a serial connection and manage the communication operations.

Serial communication controllers can be integrated into the computer or microcontroller's chipset or added as an external module. They typically include a serial interface that connects to the device and a host interface that connects to the computer or microcontroller's bus system. The serial interface can be based on various standards such as UART, SPI, or I2C, while the host interface can be based on various standards such as PCI, PCIe, or USB.

Serial communication controllers offer various benefits such as increased data transfer rates, improved reliability, and increased compatibility with a wide range of devices. They also provide advanced features such as error checking, flow control, and clock synchronization that can improve the accuracy and reliability of the communication.