HTFQFP Serial Communication Controllers 9

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Maximum Data Transfer Rate Minimum Operating Temperature Terminal Finish ADC Channels Terminal Position DMA Channels Maximum Seated Height ROM Words RAM Words Width Additional Features Boundary Scan Peripherals External Data Bus Width Data Encoding or Decoding Method Communication Protocol Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) No. of Timers RAM Bytes Technology Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Drive Interface Standard Low Power Mode JESD-609 Code On Chip Program ROM Width No. of I/O Lines

LAN9252I/PT

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, LAN

GULL WING

64

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

TS 16949

16

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP64,.47SQ

3 V

85 Cel

12.5 MBps

-40 Cel

MATTE TIN

QUAD

1.2 mm

10 mm

YES

16

NRZI

SYNC, BYTE; ETHERNET

25 MHz

10 mm

CMOS

3.3 V

4

I2C, SPI

.5 mm

S-PQFP-G64

YES

LAN9252/PT

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, LAN

GULL WING

64

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

TS 16949

16

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP64,.47SQ

3 V

70 Cel

12.5 MBps

0 Cel

MATTE TIN

QUAD

1.2 mm

10 mm

YES

16

NRZI

SYNC, BYTE; ETHERNET

25 MHz

10 mm

CMOS

3.3 V

4

I2C, SPI

.5 mm

S-PQFP-G64

YES

LAN9252TI/PT

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, LAN

GULL WING

64

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

TS 16949

16

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP64,.47SQ

3 V

85 Cel

12.5 MBps

-40 Cel

MATTE TIN

QUAD

1.2 mm

10 mm

YES

16

NRZI

SYNC, BYTE; ETHERNET

25 MHz

10 mm

CMOS

3.3 V

4

I2C, SPI

.5 mm

S-PQFP-G64

YES

LAN9252T/PT

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, LAN

GULL WING

64

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

TS 16949

16

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP64,.47SQ

3 V

70 Cel

12.5 MBps

0 Cel

MATTE TIN

QUAD

1.2 mm

10 mm

YES

16

NRZI

SYNC, BYTE; ETHERNET

25 MHz

10 mm

CMOS

3.3 V

4

I2C, SPI

.5 mm

S-PQFP-G64

YES

TSB41BA3BTPFPEP

Texas Instruments

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

INDUSTRIAL

GULL WING

80

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

2 V

0

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

1.75 V

110 Cel

50 MBps

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1.2 mm

12 mm

ALSO REQUIRES 3.3V SUPPLY

NO

8

IEEE1394

49.152 MHz

30

260

12 mm

CMOS

1.85 V

3

.5 mm

S-PQFP-G80

3

Not Qualified

YES

e4

V62/03670-03XE

Texas Instruments

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

INDUSTRIAL

GULL WING

80

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

2 V

0

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

1.75 V

110 Cel

50 MBps

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1.2 mm

12 mm

ALSO REQUIRES 3.3V SUPPLY

NO

8

IEEE1394

49.152 MHz

30

260

12 mm

CMOS

1.85 V

3

.5 mm

S-PQFP-G80

3

Not Qualified

YES

e4

TSB41BA3BPFPG4

Texas Instruments

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

COMMERCIAL

GULL WING

80

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

2 V

2

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

1.7 V

70 Cel

50 MBps

0 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

1.2 mm

12 mm

ALSO REQUIRES 3.3V SUPPLY

NO

8

IEEE1394

49.152 MHz

NOT SPECIFIED

260

12 mm

CMOS

1.85 V

3

.5 mm

S-PQFP-G80

3

Not Qualified

YES

e4

TSB41BA3BIPFP

Texas Instruments

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

INDUSTRIAL

GULL WING

80

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

2 V

2

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

1.75 V

85 Cel

50 MBps

-40 Cel

QUAD

1.2 mm

12 mm

ALSO REQUIRES 3.3V SUPPLY

NO

8

49.152 MHz

12 mm

CMOS

1.85 V

3

.5 mm

S-PQFP-G80

Not Qualified

YES

TSB41BA3BPFP

Texas Instruments

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

COMMERCIAL

GULL WING

80

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

2 V

2

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

1.7 V

70 Cel

50 MBps

0 Cel

NICKEL PALLADIUM GOLD

QUAD

1.2 mm

12 mm

ALSO REQUIRES 3.3V SUPPLY

NO

8

IEEE1394

49.152 MHz

30

260

12 mm

CMOS

1.85 V

3

.5 mm

S-PQFP-G80

3

Not Qualified

YES

e4

Serial Communication Controllers

Serial communication controllers are electronic devices that manage the input/output operations between a computer or microcontroller and other devices through serial communication protocols such as UART, SPI, I2C, and USB. These controllers provide an interface that allows the computer or microcontroller to send and receive data over a serial connection and manage the communication operations.

Serial communication controllers can be integrated into the computer or microcontroller's chipset or added as an external module. They typically include a serial interface that connects to the device and a host interface that connects to the computer or microcontroller's bus system. The serial interface can be based on various standards such as UART, SPI, or I2C, while the host interface can be based on various standards such as PCI, PCIe, or USB.

Serial communication controllers offer various benefits such as increased data transfer rates, improved reliability, and increased compatibility with a wide range of devices. They also provide advanced features such as error checking, flow control, and clock synchronization that can improve the accuracy and reliability of the communication.