VFBGA Serial Communication Controllers 14

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Maximum Data Transfer Rate Minimum Operating Temperature Terminal Finish ADC Channels Terminal Position DMA Channels Maximum Seated Height ROM Words RAM Words Width Additional Features Boundary Scan Peripherals External Data Bus Width Data Encoding or Decoding Method Communication Protocol Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) No. of Timers RAM Bytes Technology Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Drive Interface Standard Low Power Mode JESD-609 Code On Chip Program ROM Width No. of I/O Lines

TL16C550DIZQSR

Texas Instruments

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

INDUSTRIAL

BALL

24

VFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

3

2.5/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA24,5X5,20

4.5 V

85 Cel

.1875 MBps

-40 Cel

TIN SILVER COPPER

BOTTOM

1 mm

3 mm

ALSO OPERATES AT 2.5V/3.3V SUPPLY

NO

8

ASYNC, BIT

24 MHz

30

260

3 mm

CMOS

8 mA

5 V

1

Serial IO/Communication Controllers

.5 mm

S-PBGA-B24

1

Not Qualified

NO

e1

TL16C550DZQSR

Texas Instruments

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

COMMERCIAL

BALL

24

VFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

3

2.5/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA24,5X5,20

4.5 V

70 Cel

.1875 MBps

0 Cel

TIN SILVER COPPER

BOTTOM

1 mm

3 mm

ALSO OPERATES AT 2.5V/3.3V SUPPLY

NO

8

ASYNC, BIT

24 MHz

30

260

3 mm

CMOS

5 V

1

Serial IO/Communication Controllers

.5 mm

S-PBGA-B24

1

Not Qualified

NO

e1

SCH3224-SY

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER

COMMERCIAL

BALL

100

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.63 V

8

0

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA100,11X11,25

2.97 V

70 Cel

.1875 MBps

0 Cel

TIN SILVER COPPER

BOTTOM

.8 mm

256

8 mm

NO

0

SYNC, BYTE

33 MHz

8 mm

CMOS

1 mA

3 V

4

2

PCI; UART

.65 mm

S-PBGA-B100

YES

e1

24

SCH3226I-SY

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER

INDUSTRIAL

BALL

100

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.63 V

8

0

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA100,11X11,25

2.97 V

85 Cel

.1875 MBps

-40 Cel

TIN SILVER COPPER

BOTTOM

.8 mm

256

8 mm

NO

0

SYNC, BYTE

33 MHz

8 mm

CMOS

1 mA

3 V

0

6

PCI; UART

.65 mm

S-PBGA-B100

YES

e1

40

TL16C550DIZQS

Texas Instruments

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

INDUSTRIAL

BALL

24

VFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

3

2.5/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA24,5X5,20

4.5 V

85 Cel

.1875 MBps

-40 Cel

BOTTOM

1 mm

3 mm

ALSO OPERATES AT 2.5V/3.3V SUPPLY

NO

8

ASYNC, BIT

24 MHz

3 mm

CMOS

5 V

1

Serial IO/Communication Controllers

.5 mm

S-PBGA-B24

Not Qualified

NO

MAX3108EWA+T

Analog Devices

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

0

1.8/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA25,5X5,16

1.71 V

85 Cel

3 MBps

-40 Cel

TIN SILVER COPPER NICKEL

BOTTOM

.69 mm

2.065 mm

NO

0

ASYNC, BIT

35 MHz

30

260

2.065 mm

BICMOS

2.8 V

1

Serial IO/Communication Controllers

I2C; IRDA; MICROWIRE; RS232; RS485; SPI

.4 mm

S-PBGA-B25

1

Not Qualified

YES

e2

MAX3108AEWA+

Maxim Integrated

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

0

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.71 V

85 Cel

3 MBps

-40 Cel

TIN SILVER COPPER NICKEL

BOTTOM

.69 mm

2.065 mm

NO

0

ASYNC, BIT

35 MHz

30

260

2.065 mm

BICMOS

2.8 V

1

I2C; IRDA; MICROWIRE; RS232; RS485; SPI

.4 mm

S-PBGA-B25

1

YES

e2

MAX3108AEWA+T

Maxim Integrated

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

0

1.8/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA25,5X5,16

1.71 V

85 Cel

3 MBps

-40 Cel

TIN SILVER COPPER NICKEL

BOTTOM

.69 mm

2.065 mm

NO

0

ASYNC, BIT

35 MHz

30

260

2.065 mm

BICMOS

2.8 V

1

Serial IO/Communication Controllers

I2C; IRDA; MICROWIRE; RS232; RS485; SPI

.4 mm

S-PBGA-B25

1

Not Qualified

YES

e2

L-FW322-06-NV129-DT

Broadcom

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

COMMERCIAL

BALL

129

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

32

3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA129,13X13,20

3 V

70 Cel

50 MBps

0 Cel

TIN SILVER COPPER

BOTTOM

.98 mm

7 mm

NO

32

24.5785 MHz

7 mm

CMOS

3.3 V

2

Bus Controllers

.5 mm

S-PBGA-B129

Not Qualified

YES

e1

L-FW321-06-NV129-DB

Broadcom

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

COMMERCIAL

BALL

129

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

32

3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA129,13X13,20

3 V

70 Cel

50 MBps

0 Cel

TIN SILVER COPPER

BOTTOM

.98 mm

7 mm

NO

32

24.5785 MHz

7 mm

CMOS

3.3 V

1

Bus Controllers

.5 mm

S-PBGA-B129

Not Qualified

YES

e1

L-FW321-06-NV129-DT

Broadcom

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

COMMERCIAL

BALL

129

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

32

3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA129,13X13,20

3 V

70 Cel

50 MBps

0 Cel

TIN SILVER COPPER

BOTTOM

.98 mm

7 mm

NO

32

24.5785 MHz

7 mm

CMOS

3.3 V

1

Bus Controllers

.5 mm

S-PBGA-B129

Not Qualified

YES

e1

L-FW323-07-NV129-DT

Broadcom

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

COMMERCIAL

BALL

129

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

0

3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA129,13X13,20

3 V

70 Cel

50 MBps

0 Cel

TIN SILVER COPPER

BOTTOM

.98 mm

7 mm

NO

0

ASYNC, BIT

24.578 MHz

7 mm

CMOS

3.3 V

2

Bus Controllers

.5 mm

S-PBGA-B129

Not Qualified

YES

e1

L-FW322-06-NV129-DB

Broadcom

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

COMMERCIAL

BALL

129

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

32

3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA129,13X13,20

3 V

70 Cel

50 MBps

0 Cel

TIN SILVER COPPER

BOTTOM

.98 mm

7 mm

NO

32

24.5785 MHz

7 mm

CMOS

3.3 V

2

Bus Controllers

.5 mm

S-PBGA-B129

Not Qualified

YES

e1

L-FW323-07-NV129-DB

Broadcom

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

COMMERCIAL

BALL

129

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

0

3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA129,13X13,20

3 V

70 Cel

50 MBps

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

.98 mm

7 mm

NO

0

ASYNC, BIT

24.578 MHz

7 mm

CMOS

3.3 V

2

Bus Controllers

.5 mm

S-PBGA-B129

Not Qualified

YES

e1

Serial Communication Controllers

Serial communication controllers are electronic devices that manage the input/output operations between a computer or microcontroller and other devices through serial communication protocols such as UART, SPI, I2C, and USB. These controllers provide an interface that allows the computer or microcontroller to send and receive data over a serial connection and manage the communication operations.

Serial communication controllers can be integrated into the computer or microcontroller's chipset or added as an external module. They typically include a serial interface that connects to the device and a host interface that connects to the computer or microcontroller's bus system. The serial interface can be based on various standards such as UART, SPI, or I2C, while the host interface can be based on various standards such as PCI, PCIe, or USB.

Serial communication controllers offer various benefits such as increased data transfer rates, improved reliability, and increased compatibility with a wide range of devices. They also provide advanced features such as error checking, flow control, and clock synchronization that can improve the accuracy and reliability of the communication.