Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Maximum Data Transfer Rate | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | RAM Words | Width | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Data Encoding or Decoding Method | Communication Protocol | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | No. of Timers | RAM Bytes | Technology | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Drive Interface Standard | Low Power Mode | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
FTDI |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.98 V |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
1.62 V |
85 Cel |
1.5 MBps |
-40 Cel |
QUAD |
1.6 mm |
10 mm |
YES |
ASYNC, BIT; SYNC, BYTE |
12 MHz |
40 |
260 |
10 mm |
CMOS |
1.8 V |
4 |
I2C; RS-232; RS-422; RS-485; SPI; UART; USB |
.5 mm |
S-PQFP-G64 |
3 |
Not Qualified |
YES |
8 |
|||||||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
32 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.31SQ,20 |
3 V |
85 Cel |
60 MBps |
-40 Cel |
MATTE TIN |
QUAD |
1 mm |
7168 |
8 mm |
YES |
0 |
NRZI |
25 MHz |
8 mm |
CMOS |
3.3 V |
4 |
PCI; USB |
.5 mm |
S-XQCC-N56 |
YES |
11 |
|||||||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
32 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.31SQ,20 |
3 V |
85 Cel |
60 MBps |
-40 Cel |
MATTE TIN |
QUAD |
1 mm |
7168 |
8 mm |
YES |
0 |
NRZI |
25 MHz |
8 mm |
CMOS |
3.3 V |
4 |
PCI; USB |
.5 mm |
S-XQCC-N56 |
YES |
11 |
|||||||||||||||||||||||||||||||||
|
FTDI |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.98 V |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
1.62 V |
85 Cel |
1.5 MBps |
-40 Cel |
QUAD |
1.6 mm |
10 mm |
YES |
ASYNC, BIT; SYNC, BYTE |
12 MHz |
40 |
260 |
10 mm |
CMOS |
1.8 V |
4 |
I2C; RS-232; RS-422; RS-485; SPI; UART; USB |
.5 mm |
S-PQFP-G64 |
3 |
Not Qualified |
YES |
8 |
|||||||||||||||||||||||||||||||||
|
FTDI |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
NO LEAD |
64 |
HQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.98 V |
CHIP CARRIER, HEAT SINK/SLUG |
LCC64,.35SQ,20 |
1.62 V |
85 Cel |
1.5 MBps |
-40 Cel |
QUAD |
1 mm |
9 mm |
YES |
ASYNC, BIT; SYNC, BYTE |
12 MHz |
40 |
260 |
9 mm |
CMOS |
1.8 V |
4 |
I2C; RS-232; RS-422; RS-485; SPI; UART; USB |
.5 mm |
S-XQCC-N64 |
3 |
Not Qualified |
YES |
8 |
|||||||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
TS 16949 |
0 |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC64,.35SQ,20 |
3 V |
70 Cel |
60 MBps |
0 Cel |
MATTE TIN |
QUAD |
1 mm |
9 mm |
YES |
0 |
SYNC; BIT ;BYTE |
25 MHz |
40 |
260 |
9 mm |
CMOS |
1.8 V |
1 |
Serial IO/Communication Controllers |
USB |
.5 mm |
S-PQCC-N64 |
1 |
Not Qualified |
YES |
e3 |
8 |
||||||||||||||||||||||||||
|
FTDI |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.98 V |
0 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
1.62 V |
85 Cel |
1.5 MBps |
-40 Cel |
QUAD |
1.6 mm |
10 mm |
YES |
0 |
ASYNC, BIT; SYNC, BYTE |
12 MHz |
40 |
260 |
10 mm |
CMOS |
1.8 V |
4 |
I2C; RS-232; RS-422; RS-485; SPI; UART; USB |
.5 mm |
S-PQFP-G64 |
3 |
YES |
8 |
|||||||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, CAN |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
8 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.16SQ,20 |
4.5 V |
85 Cel |
.125 MBps |
-40 Cel |
MATTE TIN |
QUAD |
1 mm |
14 |
4 mm |
NO |
0 |
NRZ |
SYNC; BIT ;BYTE |
40 MHz |
260 |
4 mm |
CMOS |
10 mA |
5 V |
1 |
SPI |
.5 mm |
S-PQCC-N20 |
1 |
YES |
e3 |
0 |
|||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
TS 16949 |
0 |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC64,.35SQ,20 |
3 V |
85 Cel |
60 MBps |
-40 Cel |
MATTE TIN |
QUAD |
1 mm |
9 mm |
YES |
0 |
SYNC; BIT ;BYTE |
25 MHz |
40 |
260 |
9 mm |
CMOS |
1.8 V |
1 |
Serial IO/Communication Controllers |
USB |
.5 mm |
S-PQCC-N64 |
1 |
Not Qualified |
YES |
e3 |
8 |
||||||||||||||||||||||||||
|
FTDI |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
NO LEAD |
56 |
HQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.98 V |
CHIP CARRIER, HEAT SINK/SLUG |
LCC56,.31SQ,20 |
1.62 V |
85 Cel |
1.5 MBps |
-40 Cel |
QUAD |
1 mm |
8 mm |
YES |
ASYNC, BIT; SYNC, BYTE |
12 MHz |
40 |
260 |
8 mm |
CMOS |
1.8 V |
4 |
I2C; RS-232; RS-422; RS-485; SPI; UART; USB |
.5 mm |
S-XQCC-N56 |
3 |
YES |
8 |
||||||||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
TS 16949 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC64,.35SQ,20 |
3 V |
85 Cel |
60 MBps |
-40 Cel |
MATTE TIN |
QUAD |
1 mm |
9 mm |
YES |
0 |
SYNC; BIT ;BYTE |
25 MHz |
9 mm |
CMOS |
1.8 V |
1 |
USB |
.5 mm |
S-PQCC-N64 |
3 |
Not Qualified |
YES |
e3 |
8 |
||||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, CAN |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
8 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.16SQ,20 |
4.5 V |
85 Cel |
.125 MBps |
-40 Cel |
MATTE TIN |
QUAD |
1 mm |
14 |
4 mm |
NO |
0 |
NRZ |
SYNC; BIT ;BYTE |
40 MHz |
40 |
260 |
4 mm |
CMOS |
10 mA |
5 V |
1 |
SPI |
.5 mm |
S-PQCC-N20 |
1 |
YES |
e3 |
0 |
||||||||||||||||||||||||||
|
FTDI |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
NO LEAD |
64 |
HQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.98 V |
CHIP CARRIER, HEAT SINK/SLUG |
LCC64,.35SQ,20 |
1.62 V |
85 Cel |
1.5 MBps |
-40 Cel |
QUAD |
1 mm |
9 mm |
YES |
ASYNC, BIT; SYNC, BYTE |
12 MHz |
40 |
260 |
9 mm |
CMOS |
1.8 V |
4 |
I2C; RS-232; RS-422; RS-485; SPI; UART; USB |
.5 mm |
S-XQCC-N64 |
3 |
Not Qualified |
YES |
8 |
|||||||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
TS 16949 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.31SQ,20 |
1.14 V |
85 Cel |
125 MBps |
-40 Cel |
MATTE TIN |
QUAD |
1 mm |
8 mm |
YES |
0 |
SYNC; BIT ;BYTE |
25 MHz |
260 |
8 mm |
CMOS |
1.2 V |
4 |
USB |
.5 mm |
S-PQCC-N56 |
3 |
YES |
e3 |
|||||||||||||||||||||||||||||||
|
FTDI |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
NO LEAD |
56 |
HQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.98 V |
CHIP CARRIER, HEAT SINK/SLUG |
LCC56,.31SQ,20 |
1.62 V |
85 Cel |
1.5 MBps |
-40 Cel |
QUAD |
1 mm |
8 mm |
YES |
ASYNC, BIT; SYNC, BYTE |
12 MHz |
40 |
260 |
8 mm |
CMOS |
1.8 V |
4 |
I2C; RS-232; RS-422; RS-485; SPI; UART; USB |
.5 mm |
S-XQCC-N56 |
3 |
YES |
8 |
||||||||||||||||||||||||||||||||||
|
Intel |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
INDUSTRIAL |
NO LEAD |
64 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
0.9 |
CHIP CARRIER |
LCC64,.35SQ,20 |
85 Cel |
-40 Cel |
QUAD |
I2C |
CMOS |
.9 V |
Serial IO/Communication Controllers |
PCI |
.5 mm |
S-PQCC-N64 |
Not Qualified |
YES |
||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
INDUSTRIAL |
GULL WING |
128 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.63 V |
TS 16949 |
16 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP128,.63SQ,16 |
2.97 V |
85 Cel |
12.5 MBps |
-40 Cel |
MATTE TIN |
QUAD |
1.2 mm |
14 mm |
NO |
32 |
NRZ; BIPH-LEVEL(MANCHESTER) |
SYNC, BIT, BYTE, ETHERNET |
25 MHz |
260 |
14 mm |
CMOS |
140 mA |
3.3 V |
4 |
680X0; 683XX |
.4 mm |
S-PQFP-G128 |
3 |
Not Qualified |
YES |
e3 |
||||||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
GULL WING |
240 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
FLATPACK |
85 Cel |
1.25 MBps |
-40 Cel |
TIN |
QUAD |
YES |
32 |
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC |
25 MHz |
40 |
260 |
CMOS |
68000 |
S-PQFP-G240 |
3 |
YES |
e3 |
||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
NO LEAD |
28 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
TS 16949 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.7 V |
125 Cel |
.125 MBps |
-40 Cel |
MATTE TIN |
QUAD |
1 mm |
6 mm |
NO |
0 |
CAN |
25 MHz |
40 |
260 |
6 mm |
CMOS |
10 mA |
4.5 V |
1 |
SPI |
.65 mm |
S-PQCC-N28 |
1 |
YES |
e3 |
|||||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
INDUSTRIAL |
NO LEAD |
28 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
8 |
TS 16949 |
0 |
3.3 |
CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG |
LCC28,.24SQ,25 |
3.1 V |
85 Cel |
1.25 MBps |
-40 Cel |
MATTE TIN |
QUAD |
1 mm |
8192 |
6 mm |
NO |
0 |
SYNC; BIT ;BYTE |
25 MHz |
40 |
260 |
6 mm |
CMOS |
180 mA |
3.3 V |
1 |
Serial IO/Communication Controllers |
SPI |
.65 mm |
S-PQCC-N28 |
1 |
Not Qualified |
YES |
e3 |
||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
INDUSTRIAL |
NO LEAD |
36 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
TS 16949 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC36,.24SQ,20 |
85 Cel |
12.5 MBps |
-40 Cel |
MATTE TIN |
QUAD |
1 mm |
6 mm |
IT ALSO HAS IEEE802.3AB NETWORK PROTOCOL |
NO |
0 |
NRZI; BIPH-LEVEL(MANCHESTER) |
ASYNC, BIT; SYNC, BYTE |
25 MHz |
6 mm |
CMOS |
41.3 mA |
1.8 V |
4 |
.5 mm |
S-PQCC-N36 |
YES |
e3 |
|||||||||||||||||||||||||||||||||
|
Texas Instruments |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
OTHER |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
32 |
FLATPACK, LOW PROFILE, FINE PITCH |
3 V |
85 Cel |
12.5 MBps |
0 Cel |
MATTE TIN |
QUAD |
1.6 mm |
20 mm |
NO |
32 |
NRZ; NRZI; BIPH-LEVEL(MANCHESTER) |
ASYNC, BIT; SYNC, BYTE; ETHERNET |
30 |
260 |
20 mm |
CMOS |
3.3 V |
7 |
PCI |
.5 mm |
S-PQFP-G144 |
3 |
YES |
e3 |
||||||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
TS 16949 |
0 |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC64,.35SQ,20 |
3 V |
70 Cel |
60 MBps |
0 Cel |
MATTE TIN |
QUAD |
1 mm |
9 mm |
YES |
0 |
SYNC; BIT ;BYTE |
25 MHz |
260 |
9 mm |
CMOS |
1.8 V |
1 |
Serial IO/Communication Controllers |
USB |
.5 mm |
S-PQCC-N64 |
1 |
Not Qualified |
YES |
e3 |
8 |
|||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
NO LEAD |
28 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
TS 16949 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.7 V |
125 Cel |
.125 MBps |
-40 Cel |
MATTE TIN |
QUAD |
1 mm |
6 mm |
NO |
0 |
CAN |
25 MHz |
40 |
260 |
6 mm |
CMOS |
10 mA |
4.5 V |
1 |
SPI |
.65 mm |
S-PQCC-N28 |
1 |
YES |
e3 |
|||||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
GULL WING |
64 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
16 |
TS 16949 |
16 |
FLATPACK, THIN PROFILE, FINE PITCH |
3 V |
85 Cel |
12.5 MBps |
-40 Cel |
QUAD |
1.2 mm |
12288 |
10 mm |
NO |
16 |
25 MHz |
10 mm |
CMOS |
117 mA |
3.3 V |
SPI |
.5 mm |
S-PQFP-G64 |
YES |
||||||||||||||||||||||||||||||||||||
|
FTDI |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.32 V |
AEC-Q100 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC64,.35SQ,20 |
1.08 V |
105 Cel |
60 MBps |
-40 Cel |
QUAD |
.8 mm |
9 mm |
YES |
ASYNC, BIT; SYNC, BYTE |
12 MHz |
40 |
260 |
9 mm |
CMOS |
1.2 V |
4 |
I2C; RS-232; RS-422; RS-485; SPI; UART; USB |
.5 mm |
S-XQCC-N64 |
3 |
YES |
8 |
||||||||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
INDUSTRIAL |
NO LEAD |
36 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
TS 16949 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC36,.24SQ,20 |
3 V |
85 Cel |
12.5 MBps |
-40 Cel |
MATTE TIN |
QUAD |
1 mm |
6 mm |
NO |
0 |
NRZI; BIPH-LEVEL(MANCHESTER) |
ASYNC, BIT; SYNC, BYTE |
25 MHz |
260 |
6 mm |
CMOS |
41.3 mA |
1.8 V |
4 |
.5 mm |
S-PQCC-N36 |
3 |
Not Qualified |
YES |
e3 |
|||||||||||||||||||||||||||||
|
Intel |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
INDUSTRIAL |
NO LEAD |
64 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
0.9 |
CHIP CARRIER |
LCC64,.35SQ,20 |
85 Cel |
-40 Cel |
QUAD |
I2C |
CMOS |
.9 V |
Serial IO/Communication Controllers |
PCI |
.5 mm |
S-PQCC-N64 |
Not Qualified |
YES |
||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
GULL WING |
80 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
3 |
3.3/5 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP80,.55SQ,20 |
4.5 V |
85 Cel |
.375 MBps |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1.6 mm |
12 mm |
ALSO OPERATES AT 3.3V SUPPLY |
NO |
8 |
NRZ |
ASYNC, BIT |
50 MHz |
30 |
260 |
12 mm |
CMOS |
5 V |
4 |
Serial IO/Communication Controllers |
.5 mm |
S-PQFP-G80 |
3 |
Not Qualified |
YES |
e4 |
|||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.98 V |
8 |
TS 16949 |
8 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.31SQ,20 |
1.62 V |
85 Cel |
12.5 MBps |
-40 Cel |
MATTE TIN |
QUAD |
1 mm |
16384 |
8 mm |
NO |
16 |
NRZ; NRZI; BIPH-LEVEL(MANCHESTER) |
ASYNC, BIT; SYNC, BYTE |
25 MHz |
260 |
8 mm |
CMOS |
48 mA |
1.8 V |
1 |
.5 mm |
S-PQCC-N56 |
3 |
Not Qualified |
YES |
e3 |
3 |
||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
GULL WING |
44 |
TQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
16 |
TS 16949 |
15 |
FLATPACK, THIN PROFILE |
3 V |
85 Cel |
12.5 MBps |
-40 Cel |
QUAD |
1.2 mm |
12288 |
10 mm |
NO |
15 |
25 MHz |
10 mm |
CMOS |
117 mA |
3.3 V |
SPI |
.8 mm |
S-PQFP-G44 |
YES |
||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
INDUSTRIAL |
GULL WING |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
16 |
5 |
FLATPACK, LOW PROFILE |
QFP64,.6SQ,32 |
4.5 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1.6 mm |
14 mm |
NO |
8 |
DIFF BIPHASE-LEVEL |
20 MHz |
20 |
260 |
14 mm |
CMOS |
32 mA |
5 V |
5 |
Serial IO/Communication Controllers |
.8 mm |
S-PQFP-G64 |
3 |
Not Qualified |
NO |
e4 |
|||||||||||||||||||||||||||||
|
Exar |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
BALL |
176 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
0 |
3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA176,15X15,32 |
85 Cel |
3.125 MBps |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.5 mm |
13 mm |
YES |
8 |
NRZ |
ASYNC, BIT |
245 |
13 mm |
CMOS |
1.2 V |
8 |
Serial IO/Communication Controllers |
PCI |
.8 mm |
S-PBGA-B176 |
4 |
Not Qualified |
YES |
e1 |
|||||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
TS 16949 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.28SQ,20 |
1.14 V |
85 Cel |
250 MBps |
-40 Cel |
QUAD |
1 mm |
7 mm |
ALSO HAVING NETWORK PROTOCOLS IEEE 802.3AZ; IEEE 802.1Q; IEEE 802.3X |
YES |
0 |
SYNC, BIT, BYTE, ETHERNET |
25 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
7 mm |
CMOS |
90 mA |
1.2 V |
8 |
PCI |
.5 mm |
S-PQCC-N48 |
YES |
|||||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
COMMERCIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC64,.35SQ,20 |
70 Cel |
60 MBps |
0 Cel |
MATTE TIN |
QUAD |
1 mm |
9 mm |
YES |
SYNC; BIT ;BYTE |
9 mm |
CMOS |
1.8 V |
1 |
Serial IO/Communication Controllers |
.5 mm |
S-PQCC-N64 |
Not Qualified |
YES |
e3 |
|||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
3 |
3.3/5 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
4.75 V |
85 Cel |
.125 MBps |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1.6 mm |
7 mm |
ALSO OPERATES AT 3.3V SUPPLY AT 14.9 MHZ |
NO |
8 |
NRZ |
ASYNC, BIT |
16 MHz |
30 |
260 |
7 mm |
CMOS |
10 mA |
5 V |
1 |
Serial IO/Communication Controllers |
.5 mm |
S-PQFP-G48 |
3 |
Not Qualified |
NO |
e4 |
||||||||||||||||||||||||||
|
Infineon Technologies |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
INDUSTRIAL |
GULL WING |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
16 |
5 |
FLATPACK, LOW PROFILE |
QFP64,.6SQ,32 |
4.5 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1.6 mm |
14 mm |
NO |
8 |
DIFF BIPHASE-LEVEL |
20 MHz |
20 |
260 |
14 mm |
CMOS |
32 mA |
5 V |
5 |
Serial IO/Communication Controllers |
.8 mm |
S-PQFP-G64 |
3 |
Not Qualified |
NO |
e4 |
|||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
GULL WING |
64 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
TS 16949 |
16 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
3 V |
85 Cel |
12.5 MBps |
-40 Cel |
MATTE TIN |
QUAD |
1.2 mm |
10 mm |
YES |
16 |
NRZI |
SYNC, BYTE; ETHERNET |
25 MHz |
10 mm |
CMOS |
3.3 V |
4 |
I2C, SPI |
.5 mm |
S-PQFP-G64 |
YES |
||||||||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
NO LEAD |
64 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
TS 16949 |
16 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC64,.35SQ,20 |
3 V |
85 Cel |
12.5 MBps |
-40 Cel |
MATTE TIN |
QUAD |
1 mm |
9 mm |
YES |
16 |
NRZI |
SYNC, BYTE; ETHERNET |
25 MHz |
9 mm |
CMOS |
3.3 V |
4 |
I2C, SPI |
.5 mm |
S-XQCC-N64 |
YES |
||||||||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
NO LEAD |
44 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
16 |
TS 16949 |
15 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3 V |
85 Cel |
12.5 MBps |
-40 Cel |
QUAD |
1 mm |
12288 |
8 mm |
NO |
15 |
25 MHz |
8 mm |
CMOS |
117 mA |
3.3 V |
SPI |
.65 mm |
S-PQCC-N44 |
YES |
||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
GULL WING |
64 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
TS 16949 |
16 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
3 V |
70 Cel |
12.5 MBps |
0 Cel |
MATTE TIN |
QUAD |
1.2 mm |
10 mm |
YES |
16 |
NRZI |
SYNC, BYTE; ETHERNET |
25 MHz |
10 mm |
CMOS |
3.3 V |
4 |
I2C, SPI |
.5 mm |
S-PQFP-G64 |
YES |
||||||||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
TS 16949 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.28SQ,20 |
1.14 V |
85 Cel |
250 MBps |
-40 Cel |
QUAD |
1 mm |
7 mm |
ALSO HAVING NETWORK PROTOCOLS IEEE 802.3AZ; IEEE 802.1Q; IEEE 802.3X |
YES |
0 |
SYNC, BIT, BYTE, ETHERNET |
25 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
7 mm |
CMOS |
90 mA |
1.2 V |
8 |
PCI |
.5 mm |
S-PQCC-N48 |
YES |
|||||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
0 |
1.2,2.5,3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.31SQ,20 |
1.14 V |
85 Cel |
125 MBps |
-40 Cel |
MATTE TIN |
QUAD |
1 mm |
8 mm |
25MHZ NOMINAL FREQUENCY AVAILABLE; IEEE802.3AB NETWORK PROTOCOL |
YES |
0 |
SYNC; BIT ;BYTE |
25 MHz |
260 |
8 mm |
CMOS |
453 mA |
1.2 V |
0 |
Serial IO/Communication Controllers |
USB |
.5 mm |
S-PQCC-N56 |
3 |
Not Qualified |
YES |
e3 |
|||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
INDUSTRIAL |
NO LEAD |
28 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
8 |
TS 16949 |
0 |
3.3 |
CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG |
LCC28,.24SQ,25 |
3.1 V |
85 Cel |
1.25 MBps |
-40 Cel |
MATTE TIN |
QUAD |
1 mm |
8192 |
6 mm |
NO |
0 |
SYNC; BIT ;BYTE |
25 MHz |
40 |
260 |
6 mm |
CMOS |
180 mA |
3.3 V |
1 |
Serial IO/Communication Controllers |
SPI |
.65 mm |
S-PQCC-N28 |
1 |
Not Qualified |
YES |
e3 |
||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
NO LEAD |
64 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
TS 16949 |
16 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC64,.35SQ,20 |
3 V |
70 Cel |
12.5 MBps |
0 Cel |
MATTE TIN |
QUAD |
1 mm |
9 mm |
YES |
16 |
NRZI |
SYNC, BYTE; ETHERNET |
25 MHz |
9 mm |
CMOS |
3.3 V |
4 |
I2C, SPI |
.5 mm |
S-XQCC-N64 |
YES |
||||||||||||||||||||||||||||||||||
|
Intel |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
INDUSTRIAL |
NO LEAD |
64 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
0.9 |
CHIP CARRIER |
LCC64,.35SQ,20 |
85 Cel |
-40 Cel |
QUAD |
I2C |
CMOS |
.9 V |
Serial IO/Communication Controllers |
PCI |
.5 mm |
S-PQCC-N64 |
Not Qualified |
YES |
||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
GULL WING |
80 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
3 |
3.3/5 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP80,.55SQ,20 |
4.5 V |
85 Cel |
.375 MBps |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1.6 mm |
12 mm |
ALSO OPERATES AT 3.3V SUPPLY |
NO |
8 |
NRZ |
ASYNC, BIT |
50 MHz |
30 |
260 |
12 mm |
CMOS |
5 V |
4 |
Serial IO/Communication Controllers |
.5 mm |
S-PQFP-G80 |
3 |
Not Qualified |
YES |
e4 |
8 |
||||||||||||||||||||||||||
|
Intel |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
COMMERCIAL |
NO LEAD |
64 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
0.9 |
CHIP CARRIER |
LCC64,.35SQ,20 |
70 Cel |
0 Cel |
QUAD |
I2C |
CMOS |
.9 V |
Serial IO/Communication Controllers |
PCI |
.5 mm |
S-PQCC-N64 |
Not Qualified |
YES |
Serial communication controllers are electronic devices that manage the input/output operations between a computer or microcontroller and other devices through serial communication protocols such as UART, SPI, I2C, and USB. These controllers provide an interface that allows the computer or microcontroller to send and receive data over a serial connection and manage the communication operations.
Serial communication controllers can be integrated into the computer or microcontroller's chipset or added as an external module. They typically include a serial interface that connects to the device and a host interface that connects to the computer or microcontroller's bus system. The serial interface can be based on various standards such as UART, SPI, or I2C, while the host interface can be based on various standards such as PCI, PCIe, or USB.
Serial communication controllers offer various benefits such as increased data transfer rates, improved reliability, and increased compatibility with a wide range of devices. They also provide advanced features such as error checking, flow control, and clock synchronization that can improve the accuracy and reliability of the communication.