SERIAL IO/COMMUNICATION CONTROLLER, CAN Serial Communication Controllers 24

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Maximum Data Transfer Rate	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Boundary Scan	External Data Bus Width	Data Encoding or Decoding Method	Communication Protocol	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of Serial I/Os	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Low Power Mode	JESD-609 Code	No. of I/O Lines
MCP2518FDT-E/SL	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V				SMALL OUTLINE	SOP14,.24	2.7 V	125 Cel	1 MBps	-40 Cel	MATTE TIN	DUAL	1.75 mm		3.9 mm	NO			SYNC; BIT ;BYTE	40 MHz	30	260	8.65 mm	CMOS	20 mA	3.3 V	1	SPI	1.27 mm	R-PDSO-G14		YES	e3
MCP2515-I/ST	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8		0	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	4.5 V	85 Cel	.125 MBps	-40 Cel	Matte Tin (Sn)	DUAL	1.2 mm	14	4.4 mm	NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz	40	260	6.5 mm	CMOS	10 mA	5 V	1	SPI	.65 mm	R-PDSO-G20	1	YES	e3	0
MCP2515-I/SO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	INDUSTRIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8		0	SMALL OUTLINE	SOP18,.4	4.5 V	85 Cel	.125 MBps	-40 Cel	Matte Tin (Sn) - annealed	DUAL	2.65 mm	14	7.5 mm	NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz	40	260	11.55 mm	CMOS	10 mA	5 V	1	SPI	1.27 mm	R-PDSO-G18	1	YES	e3	0
MCP2518FDT-E/QBB	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	AUTOMOTIVE	NO LEAD	14	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		TS 16949		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,25	2.7 V	125 Cel	1 MBps	-40 Cel	MATTE TIN	DUAL	.9 mm		3 mm	NO			SYNC; BIT ;BYTE	40 MHz	30	260	4.5 mm	CMOS	20 mA	3.3 V	1	SPI	.65 mm	R-PDSO-N14		YES	e3
MCP2515T-I/ST	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8		0	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	4.5 V	85 Cel	.125 MBps	-40 Cel	MATTE TIN	DUAL	1.2 mm	14	4.4 mm	NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz		260	6.5 mm	CMOS	10 mA	5 V	1	SPI	.65 mm	R-PDSO-G20	1	YES	e3	0
MCP2518FDT-H/QBB	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	AUTOMOTIVE	NO LEAD	14	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,25	2.7 V	150 Cel	1 MBps	-40 Cel	MATTE TIN	DUAL	.9 mm		3 mm	NO			SYNC; BIT ;BYTE	40 MHz	30	260	4.5 mm	CMOS	20 mA	3.3 V	1	SPI	.65 mm	R-PDSO-N14		YES	e3
MCP2515-E/SO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	AUTOMOTIVE	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8		0	SMALL OUTLINE	SOP18,.4	4.5 V	125 Cel	.125 MBps	-40 Cel	MATTE TIN	DUAL	2.65 mm	14	7.5 mm	NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			11.55 mm	CMOS	10 mA	5 V	1	SPI	1.27 mm	R-PDSO-G18	1	YES	e3	0
MCP2518FDT-H/SL	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V				SMALL OUTLINE	SOP14,.24	2.7 V	150 Cel	1 MBps	-40 Cel	MATTE TIN	DUAL	1.75 mm		3.9 mm	NO			SYNC; BIT ;BYTE	40 MHz	30	260	8.65 mm	CMOS	20 mA	3.3 V	1	SPI	1.27 mm	R-PDSO-G14		YES	e3
MCP2515T-I/ML	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	5.5 V	8		0	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	4.5 V	85 Cel	.125 MBps	-40 Cel	MATTE TIN	QUAD	1 mm	14	4 mm	NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz		260	4 mm	CMOS	10 mA	5 V	1	SPI	.5 mm	S-PQCC-N20	1	YES	e3	0
MCP2515-I/P	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	INDUSTRIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V	8		0	IN-LINE	DIP18,.3	4.5 V	85 Cel	.125 MBps	-40 Cel	MATTE TIN	DUAL	5.334 mm	14	7.62 mm	NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			22.86 mm	CMOS	10 mA	5 V	1	SPI	2.54 mm	R-PDIP-T18		YES	e3	0
MCP2518FDT-H/QBBVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	AUTOMOTIVE	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		AEC-Q100; TS 16949	0	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	LCC14,.18X.12,30	2.7 V	150 Cel	1 MBps	-40 Cel	MATTE TIN	DUAL	.9 mm		3 mm	NO	0		SYNC; BIT ;BYTE	40 MHz	30	260	4.5 mm	CMOS	20 mA	3.3 V	1	SPI	.65 mm	R-PDSO-N14		YES	e3
MCP2515-I/ML	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	5.5 V	8		0	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	4.5 V	85 Cel	.125 MBps	-40 Cel	MATTE TIN	QUAD	1 mm	14	4 mm	NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz	40	260	4 mm	CMOS	10 mA	5 V	1	SPI	.5 mm	S-PQCC-N20	1	YES	e3	0
MCP2515-I/STVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8	AEC-Q100	0	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	4.5 V	85 Cel	.125 MBps	-40 Cel	MATTE TIN	DUAL	1.2 mm	14	4.4 mm	NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			6.5 mm	CMOS	10 mA	5 V	1	SPI	.65 mm	R-PDSO-G20		YES	e3	0
MCP2515-I/SOVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	INDUSTRIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8	AEC-Q100	0	SMALL OUTLINE	SOP18,.4	4.5 V	85 Cel	.125 MBps	-40 Cel	MATTE TIN	DUAL	2.65 mm	14	7.5 mm	NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			11.55 mm	CMOS	10 mA	5 V	1	SPI	1.27 mm	R-PDSO-G18		YES	e3	0
MCP2515T-I/SO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	INDUSTRIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8		0	SMALL OUTLINE	SOP18,.4	4.5 V	85 Cel	.125 MBps	-40 Cel	Matte Tin (Sn)	DUAL	2.65 mm	14	7.5 mm	NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz	40	260	11.55 mm	CMOS	10 mA	5 V	1	SPI	1.27 mm	R-PDSO-G18	2	YES	e3	0
MCP2515T-I/STVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8	AEC-Q100	0	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	4.5 V	85 Cel	.125 MBps	-40 Cel	MATTE TIN	DUAL	1.2 mm	14	4.4 mm	NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			6.5 mm	CMOS	10 mA	5 V	1	SPI	.65 mm	R-PDSO-G20		YES	e3	0
MCP2515-E/ML	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	AUTOMOTIVE	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	5.5 V	8		0	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	4.5 V	125 Cel	.125 MBps	-40 Cel	MATTE TIN	QUAD	1 mm	14	4 mm	NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz	40	260	4 mm	CMOS	10 mA	5 V	1	SPI	.5 mm	S-PQCC-N20	1	YES	e3	0
MCP2515-E/SOVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	AUTOMOTIVE	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8	AEC-Q100	0	SMALL OUTLINE	SOP18,.4	4.5 V	125 Cel	.125 MBps	-40 Cel	MATTE TIN	DUAL	2.65 mm	14	7.5 mm	NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			11.55 mm	CMOS	10 mA	5 V	1	SPI	1.27 mm	R-PDSO-G18		YES	e3	0
MCP2515T-I/SOVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	INDUSTRIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8	AEC-Q100	0	SMALL OUTLINE	SOP18,.4	4.5 V	85 Cel	.125 MBps	-40 Cel	MATTE TIN	DUAL	2.65 mm	14	7.5 mm	NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			11.55 mm	CMOS	10 mA	5 V	1	SPI	1.27 mm	R-PDSO-G18		YES	e3	0
MCP2515-I/MLVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	5.5 V	8	AEC-Q100	0	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	4.5 V	85 Cel	.125 MBps	-40 Cel	MATTE TIN	QUAD	1 mm	14	4 mm	NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			4 mm	CMOS	10 mA	5 V	1	SPI	.5 mm	S-PQCC-N20		YES	e3	0
MCP2515-E/MLVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	AUTOMOTIVE	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	5.5 V	8	AEC-Q100	0	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	4.5 V	125 Cel	.125 MBps	-40 Cel	MATTE TIN	QUAD	1 mm	14	4 mm	NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			4 mm	CMOS	10 mA	5 V	1	SPI	.5 mm	S-PQCC-N20		YES	e3	0
MCP2515T-E/ML	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	AUTOMOTIVE	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	5.5 V	8		0	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	4.5 V	125 Cel	.125 MBps	-40 Cel	MATTE TIN	QUAD	1 mm	14	4 mm	NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz		260	4 mm	CMOS	10 mA	5 V	1	SPI	.5 mm	S-PQCC-N20	1	YES	e3	0
MCP2515-E/P	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	AUTOMOTIVE	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V	8		0	IN-LINE	DIP18,.3	4.5 V	125 Cel	.125 MBps	-40 Cel	MATTE TIN	DUAL	5.334 mm	14	7.62 mm	NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			22.86 mm	CMOS	10 mA	5 V	1	SPI	2.54 mm	R-PDIP-T18		YES	e3	0
MCP2515T-E/MLVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	AUTOMOTIVE	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	5.5 V	8	AEC-Q100	0	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	4.5 V	125 Cel	.125 MBps	-40 Cel	MATTE TIN	QUAD	1 mm	14	4 mm	NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			4 mm	CMOS	10 mA	5 V	1	SPI	.5 mm	S-PQCC-N20		YES	e3	0

Serial Communication Controllers

Serial communication controllers are electronic devices that manage the input/output operations between a computer or microcontroller and other devices through serial communication protocols such as UART, SPI, I2C, and USB. These controllers provide an interface that allows the computer or microcontroller to send and receive data over a serial connection and manage the communication operations.

Serial communication controllers can be integrated into the computer or microcontroller's chipset or added as an external module. They typically include a serial interface that connects to the device and a host interface that connects to the computer or microcontroller's bus system. The serial interface can be based on various standards such as UART, SPI, or I2C, while the host interface can be based on various standards such as PCI, PCIe, or USB.

Serial communication controllers offer various benefits such as increased data transfer rates, improved reliability, and increased compatibility with a wide range of devices. They also provide advanced features such as error checking, flow control, and clock synchronization that can improve the accuracy and reliability of the communication.