Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Maximum Data Transfer Rate | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | RAM Words | Width | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Data Encoding or Decoding Method | Communication Protocol | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | No. of Timers | RAM Bytes | Technology | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Drive Interface Standard | Low Power Mode | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
32 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.31SQ,20 |
3 V |
70 Cel |
60 MBps |
0 Cel |
QUAD |
1 mm |
7168 |
8 mm |
YES |
0 |
NRZI |
25 MHz |
8 mm |
CMOS |
3.3 V |
4 |
PCI; USB |
.5 mm |
S-XQCC-N56 |
YES |
11 |
||||||||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
INDUSTRIAL |
GULL WING |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
8 |
TS 16949 |
0 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP20,.25 |
4.5 V |
85 Cel |
.125 MBps |
-40 Cel |
Matte Tin (Sn) |
DUAL |
1.2 mm |
14 |
4.4 mm |
OPERATES AT 3V MINIMUM SUPPLY @ 16 MHZ |
NO |
0 |
NRZ |
SYNC; BIT ;BYTE |
25 MHz |
6.5 mm |
CMOS |
10 mA |
5 V |
1 |
SPI |
.65 mm |
R-PDSO-G20 |
1 |
Not Qualified |
YES |
e3 |
||||||||||||||||||||||||||
Motorola |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
24 |
FLATPACK, LOW PROFILE, FINE PITCH |
1.25 MBps |
QUAD |
1.7 mm |
14 mm |
YES |
16 |
20 MHz |
14 mm |
HCMOS |
4 |
68000 |
.5 mm |
S-PQFP-G100 |
Not Qualified |
NO |
||||||||||||||||||||||||||||||||||||||||||||
|
Intel |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
COMMERCIAL |
NO LEAD |
256 |
BGA |
SQUARE |
UNSPECIFIED |
YES |
1 |
GRID ARRAY |
BGA256,16X16,40 |
55 Cel |
-10 Cel |
UNSPECIFIED |
NO |
SYNC; BIT ;BYTE |
CMOS |
2218 mA |
1 V |
Serial IO/Communication Controllers |
PCI; I2C |
1 mm |
S-PBGA-B256 |
Not Qualified |
YES |
||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
COMMERCIAL |
GULL WING |
128 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.63 V |
TS 16949 |
16 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP128,.63SQ,16 |
2.97 V |
70 Cel |
12.5 MBps |
0 Cel |
MATTE TIN |
QUAD |
1.2 mm |
14 mm |
NO |
32 |
NRZ; BIPH-LEVEL(MANCHESTER) |
SYNC, BIT, BYTE, ETHERNET |
25 MHz |
260 |
14 mm |
CMOS |
140 mA |
3.3 V |
4 |
680X0; 683XX |
.4 mm |
S-PQFP-G128 |
3 |
Not Qualified |
YES |
e3 |
||||||||||||||||||||||||||||
|
Cirrus Logic |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
COMMERCIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.465 V |
20 |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
3.135 V |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
1.6 mm |
14 mm |
YES |
16 |
NRZ; BIPH-LEVEL(MANCHESTER) |
ASYNC, BIT |
20 MHz |
40 |
260 |
14 mm |
CMOS |
3.3 V |
2 |
Serial IO/Communication Controllers |
ISA |
.5 mm |
S-PQFP-G100 |
3 |
Not Qualified |
YES |
e3 |
||||||||||||||||||||||||||||
|
Cirrus Logic |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
INDUSTRIAL |
GULL WING |
100 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.465 V |
20 |
FLATPACK, FINE PITCH |
3.135 V |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
14 mm |
YES |
16 |
NRZ; BIPH-LEVEL(MANCHESTER) |
ASYNC, BIT |
20 MHz |
260 |
14 mm |
CMOS |
3.3 V |
2 |
ISA |
.5 mm |
S-PQFP-G100 |
3 |
YES |
e3 |
||||||||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
MATTE TIN |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
INDUSTRIAL |
NO LEAD |
64 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
TS 16949 |
16 |
1.2,3.3 |
CHIP CARRIER |
LCC64,.35SQ,20 |
1.14 V |
85 Cel |
12.5 MBps |
-40 Cel |
MATTE TIN |
QUAD |
1 mm |
9 mm |
YES |
16 |
NRZ; BIPH-LEVEL(MANCHESTER) |
ASYNC, BIT; SYNC, BYTE |
25 MHz |
9 mm |
CMOS |
1.2 V |
Serial IO/Communication Controllers |
I2C; SPI |
.5 mm |
S-PQCC-N64 |
Not Qualified |
YES |
e3 |
||||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
COMMERCIAL |
NO LEAD |
64 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
TS 16949 |
16 |
1.2,3.3 |
CHIP CARRIER |
LCC64,.35SQ,20 |
1.14 V |
70 Cel |
12.5 MBps |
0 Cel |
MATTE TIN |
QUAD |
1 mm |
9 mm |
YES |
16 |
NRZ; BIPH-LEVEL(MANCHESTER) |
ASYNC, BIT; SYNC, BYTE |
25 MHz |
9 mm |
CMOS |
1.2 V |
Serial IO/Communication Controllers |
I2C; SPI |
.5 mm |
S-PQCC-N64 |
Not Qualified |
YES |
e3 |
||||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
GULL WING |
64 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
TS 16949 |
16 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
3 V |
70 Cel |
12.5 MBps |
0 Cel |
MATTE TIN |
QUAD |
1.2 mm |
10 mm |
YES |
16 |
NRZI |
SYNC, BYTE; ETHERNET |
25 MHz |
10 mm |
CMOS |
3.3 V |
4 |
I2C, SPI |
.5 mm |
S-PQFP-G64 |
YES |
||||||||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
COMMERCIAL |
GULL WING |
64 |
TQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
TS 16949 |
16 |
1.2,3.3 |
FLATPACK, THIN PROFILE |
TQFP64,.47SQ |
1.14 V |
70 Cel |
12.5 MBps |
0 Cel |
MATTE TIN |
QUAD |
1.2 mm |
10 mm |
YES |
16 |
NRZ; BIPH-LEVEL(MANCHESTER) |
ASYNC, BIT; SYNC, BYTE |
25 MHz |
10 mm |
CMOS |
1.2 V |
Serial IO/Communication Controllers |
I2C; SPI |
.5 mm |
S-PQFP-G64 |
Not Qualified |
YES |
e3 |
||||||||||||||||||||||||||||||
|
Robert Bosch |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
AUTOMOTIVE |
NO LEAD |
44 |
QCCN |
UNSPECIFIED |
PLASTIC/EPOXY |
YES |
5.5 V |
16 |
CHIP CARRIER |
4.5 V |
125 Cel |
-40 Cel |
QUAD |
NO |
16 |
ASYNC, BIT; SYNC, BYTE; SDLC |
20 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
CMOS |
5 V |
2 |
X-PQCC-N44 |
YES |
|||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
INDUSTRIAL |
GULL WING |
64 |
TQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
TS 16949 |
16 |
1.2,3.3 |
FLATPACK, THIN PROFILE |
TQFP64,.47SQ |
1.14 V |
85 Cel |
12.5 MBps |
-40 Cel |
MATTE TIN |
QUAD |
1.2 mm |
10 mm |
YES |
16 |
NRZ; BIPH-LEVEL(MANCHESTER) |
ASYNC, BIT; SYNC, BYTE |
25 MHz |
10 mm |
CMOS |
1.2 V |
Serial IO/Communication Controllers |
I2C; SPI |
.5 mm |
S-PQFP-G64 |
Not Qualified |
YES |
e3 |
||||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
INDUSTRIAL |
NO LEAD |
64 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
TS 16949 |
16 |
1.2,3.3 |
CHIP CARRIER |
LCC64,.35SQ,20 |
1.14 V |
85 Cel |
12.5 MBps |
-40 Cel |
MATTE TIN |
QUAD |
1 mm |
9 mm |
YES |
16 |
NRZ; BIPH-LEVEL(MANCHESTER) |
ASYNC, BIT; SYNC, BYTE |
25 MHz |
9 mm |
CMOS |
1.2 V |
Serial IO/Communication Controllers |
I2C; SPI |
.5 mm |
S-PQCC-N64 |
Not Qualified |
YES |
e3 |
||||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
INDUSTRIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.26 V |
TS 16949 |
16 |
1.2,3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC64,.35SQ,20 |
1.14 V |
105 Cel |
12.5 MBps |
-40 Cel |
MATTE TIN |
QUAD |
1 mm |
9 mm |
25MHZ NOMINAL CLOCK AVAILABLE; IEEE802.3Z NETWORK PROTOCOL AVAILABLE |
YES |
16 |
NRZ; NRZI; BIPH-LEVEL(MANCHESTER) |
ASYNC, BIT; SYNC, BYTE |
25 MHz |
9 mm |
CMOS |
1.2 V |
Serial IO/Communication Controllers |
I2C; SPI |
.5 mm |
S-XQCC-N64 |
Not Qualified |
YES |
e3 |
|||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
NO LEAD |
64 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
TS 16949 |
16 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC64,.35SQ,20 |
3 V |
105 Cel |
12.5 MBps |
-40 Cel |
MATTE TIN |
QUAD |
1 mm |
9 mm |
YES |
16 |
NRZI |
SYNC, BYTE; ETHERNET |
25 MHz |
9 mm |
CMOS |
3.3 V |
4 |
I2C, SPI |
.5 mm |
S-XQCC-N64 |
YES |
||||||||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
COMMERCIAL |
NO LEAD |
64 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
TS 16949 |
16 |
1.2,3.3 |
CHIP CARRIER |
LCC64,.35SQ,20 |
1.14 V |
70 Cel |
12.5 MBps |
0 Cel |
MATTE TIN |
QUAD |
1 mm |
9 mm |
YES |
16 |
NRZ; BIPH-LEVEL(MANCHESTER) |
ASYNC, BIT; SYNC, BYTE |
25 MHz |
9 mm |
CMOS |
1.2 V |
Serial IO/Communication Controllers |
I2C; SPI |
.5 mm |
S-PQCC-N64 |
Not Qualified |
YES |
e3 |
||||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
COMMERCIAL |
GULL WING |
64 |
TQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
TS 16949 |
16 |
1.2,3.3 |
FLATPACK, THIN PROFILE |
TQFP64,.47SQ |
1.14 V |
70 Cel |
12.5 MBps |
0 Cel |
MATTE TIN |
QUAD |
1.2 mm |
10 mm |
YES |
16 |
NRZ; BIPH-LEVEL(MANCHESTER) |
ASYNC, BIT; SYNC, BYTE |
25 MHz |
10 mm |
CMOS |
1.2 V |
Serial IO/Communication Controllers |
I2C; SPI |
.5 mm |
S-PQFP-G64 |
Not Qualified |
YES |
e3 |
||||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
INDUSTRIAL |
GULL WING |
64 |
TQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
TS 16949 |
16 |
1.2,3.3 |
FLATPACK, THIN PROFILE |
TQFP64,.47SQ |
1.14 V |
85 Cel |
12.5 MBps |
-40 Cel |
MATTE TIN |
QUAD |
1.2 mm |
10 mm |
YES |
16 |
NRZ; BIPH-LEVEL(MANCHESTER) |
ASYNC, BIT; SYNC, BYTE |
25 MHz |
10 mm |
CMOS |
1.2 V |
Serial IO/Communication Controllers |
I2C; SPI |
.5 mm |
S-PQFP-G64 |
Not Qualified |
YES |
e3 |
||||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
INDUSTRIAL |
NO LEAD |
64 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
TS 16949 |
16 |
1.2,3.3 |
CHIP CARRIER |
LCC64,.35SQ,20 |
1.14 V |
105 Cel |
12.5 MBps |
-40 Cel |
MATTE TIN |
QUAD |
1 mm |
9 mm |
YES |
16 |
NRZ; BIPH-LEVEL(MANCHESTER) |
ASYNC, BIT; SYNC, BYTE |
25 MHz |
9 mm |
CMOS |
1.2 V |
Serial IO/Communication Controllers |
I2C; SPI |
.5 mm |
S-PQCC-N64 |
Not Qualified |
YES |
e3 |
||||||||||||||||||||||||||||||
|
Silicon Labs |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
INDUSTRIAL |
NO LEAD |
28 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
8 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3.1 V |
85 Cel |
-40 Cel |
QUAD |
1 mm |
5 mm |
YES |
8 |
20 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
5 mm |
CMOS |
3.3 V |
1 |
.5 mm |
S-XQCC-N28 |
Not Qualified |
YES |
|||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
COMMERCIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.31SQ,20 |
1.1 V |
70 Cel |
125 MBps |
0 Cel |
QUAD |
1 mm |
8 mm |
YES |
0 |
ASYNC, BIT; SYNC, BYTE |
25 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
8 mm |
CMOS |
183 mA |
1.2 V |
2 |
USB |
.5 mm |
S-PQCC-N56 |
YES |
|||||||||||||||||||||||||||||||||
|
Intel |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.08 V |
0 |
GRID ARRAY |
.93 V |
85 Cel |
320 MBps |
-10 Cel |
BOTTOM |
2.01 mm |
17 mm |
ALSO REQUIRES 1.8V AND 3.3V SUPPLY |
YES |
0 |
BIPH-LEVEL(MANCHESTER) |
ASYNC, BIT |
25 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
17 mm |
CMOS |
1 V |
4 |
PCI |
1 mm |
S-PBGA-B256 |
YES |
|||||||||||||||||||||||||||||||||
|
Asix Electronics |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
COMMERCIAL |
GULL WING |
64 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.8,3.3 |
FLATPACK |
QFP64,.35SQ,16 |
70 Cel |
0 Cel |
QUAD |
CMOS |
Serial IO/Communication Controllers |
.4 mm |
S-PQFP-G64 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
MATTE TIN |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Intel |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
CMOS |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
8 |
3 |
5 |
CHIP CARRIER |
LDCC28,.5SQ |
4.5 V |
85 Cel |
.625 MBps |
-40 Cel |
MATTE TIN |
QUAD |
4.57 mm |
2048 |
11.506 mm |
NO |
8 |
NRZ |
ASYNC, BIT; SYNC, BYTE |
20 MHz |
11.506 mm |
CMOS |
5 V |
1 |
Serial IO/Communication Controllers |
8051; 6801 |
1.27 mm |
S-PQCC-J28 |
Not Qualified |
NO |
e3 |
||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.31SQ,20 |
1.1 V |
85 Cel |
125 MBps |
-40 Cel |
QUAD |
1 mm |
8 mm |
YES |
0 |
ASYNC, BIT; SYNC, BYTE |
25 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
8 mm |
CMOS |
183 mA |
1.2 V |
2 |
USB |
.5 mm |
S-PQCC-N56 |
YES |
|||||||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
INDUSTRIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.465 V |
8 |
TS 16949 |
3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
3.135 V |
85 Cel |
.625 MBps |
-40 Cel |
MATTE TIN |
QUAD |
1.6 mm |
2048 |
7 mm |
NO |
8 |
NRZ |
ASYNC, BIT |
40 MHz |
7 mm |
CMOS |
3.3 V |
1 |
8051; 6801 |
.5 mm |
S-PQFP-G48 |
Not Qualified |
NO |
e3 |
|||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
NO LEAD |
64 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
TS 16949 |
16 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC64,.35SQ,20 |
3 V |
70 Cel |
12.5 MBps |
0 Cel |
MATTE TIN |
QUAD |
1 mm |
9 mm |
YES |
16 |
NRZI |
SYNC, BYTE; ETHERNET |
25 MHz |
9 mm |
CMOS |
3.3 V |
4 |
I2C, SPI |
.5 mm |
S-XQCC-N64 |
YES |
||||||||||||||||||||||||||||||||||
|
Intel |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.08 V |
1,1.8,3.3 |
GRID ARRAY |
BGA256,16X16,40 |
.93 V |
85 Cel |
640 MBps |
-10 Cel |
BOTTOM |
ALSO REQUIRES 1.8V SUPPLY |
YES |
BIPH-LEVEL(MANCHESTER) |
ASYNC, BIT |
25 MHz |
CMOS |
2528 mA |
1 V |
4 |
Serial IO/Communication Controllers |
PCI |
1 mm |
S-PBGA-B256 |
Not Qualified |
YES |
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|
Analog Devices |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
AUTOMOTIVE |
GULL WING |
44 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
16 |
FLATPACK |
3 V |
125 Cel |
-40 Cel |
QUAD |
2.4384 mm |
10.0076 mm |
PITCH VALUE-0.7874 |
NO |
16 |
CAN; ASYNC, BIT; SYNC, BYTE |
16 MHz |
10.0076 mm |
CMOS |
3.3 V |
2 |
CAN |
.78 mm |
S-PQFP-G44 |
YES |
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|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
COMMERCIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
8 |
TS 16949 |
7 |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ |
70 Cel |
12.5 MBps |
0 Cel |
MATTE TIN |
QUAD |
1.6 mm |
16384 |
14 mm |
NO |
16 |
NRZI; BIPH-LEVEL(MANCHESTER) |
ASYNC, BIT; SYNC, BYTE |
25 MHz |
40 |
260 |
14 mm |
CMOS |
69 mA |
1.8 V |
1 |
Serial IO/Communication Controllers |
.5 mm |
S-PQFP-G100 |
3 |
Not Qualified |
YES |
e3 |
3 |
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|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
NO LEAD |
64 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.26 V |
16 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC64,.35SQ,20 |
1.14 V |
70 Cel |
12.5 MBps |
0 Cel |
QUAD |
1 mm |
9 mm |
YES |
16 |
NRZI |
SYNC, BYTE |
25 MHz |
9 mm |
CMOS |
1.2 V |
4 |
I2C; SPI |
.5 mm |
S-XQCC-N64 |
YES |
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|
Robert Bosch |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
AUTOMOTIVE |
NO LEAD |
44 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
16 |
5 |
CHIP CARRIER |
LDCC44,.7SQ |
4.5 V |
125 Cel |
-40 Cel |
QUAD |
NO |
16 |
ASYNC, BIT; SYNC, BYTE; SDLC |
20 MHz |
CMOS |
50 mA |
5 V |
2 |
Other Microprocessor ICs |
1.27 mm |
S-PQCC-N44 |
Not Qualified |
YES |
|||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
COMMERCIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
8 |
TS 16949 |
7 |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.31SQ,20 |
70 Cel |
12.5 MBps |
0 Cel |
MATTE TIN |
QUAD |
1 mm |
16384 |
8 mm |
NO |
16 |
NRZI; BIPH-LEVEL(MANCHESTER) |
ASYNC, BIT; SYNC, BYTE |
25 MHz |
260 |
8 mm |
CMOS |
48 mA |
1.8 V |
1 |
Serial IO/Communication Controllers |
.5 mm |
S-PQCC-N56 |
3 |
Not Qualified |
YES |
e3 |
3 |
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|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
INDUSTRIAL |
GULL WING |
18 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
0 |
SMALL OUTLINE |
4.5 V |
85 Cel |
.125 MBps |
-40 Cel |
MATTE TIN |
DUAL |
2.65 mm |
7.5 mm |
OPERATES AT 3V MINIMUM SUPPLY @ 16 MHZ |
NO |
0 |
NRZ |
25 MHz |
11.55 mm |
CMOS |
5 V |
1 |
1.27 mm |
R-PDSO-G18 |
1 |
Not Qualified |
YES |
e3 |
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|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
NO LEAD |
64 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.26 V |
16 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC64,.35SQ,20 |
1.14 V |
105 Cel |
12.5 MBps |
-40 Cel |
QUAD |
1 mm |
9 mm |
YES |
16 |
NRZI |
SYNC, BYTE |
25 MHz |
9 mm |
CMOS |
1.2 V |
4 |
I2C; SPI |
.5 mm |
S-XQCC-N64 |
YES |
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|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
GULL WING |
128 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.5 V |
15 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP128,.63SQ,16 |
3.1 V |
85 Cel |
12.5 MBps |
-40 Cel |
QUAD |
1.6 mm |
14 mm |
YES |
16 |
NRZ; NRZI; BIPH-LEVEL(MANCHESTER) |
25 MHz |
14 mm |
CMOS |
3.3 V |
.4 mm |
S-PQFP-G128 |
YES |
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|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
32 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.31SQ,20 |
3 V |
85 Cel |
60 MBps |
-40 Cel |
QUAD |
1 mm |
7168 |
8 mm |
YES |
0 |
NRZI |
25 MHz |
8 mm |
CMOS |
3.3 V |
4 |
PCI; USB |
.5 mm |
S-XQCC-N56 |
YES |
11 |
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|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
COMMERCIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
TS 16949 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.31SQ,20 |
1.1 V |
70 Cel |
125 MBps |
0 Cel |
QUAD |
1 mm |
8 mm |
YES |
0 |
ASYNC, BIT; SYNC, BYTE |
25 MHz |
8 mm |
CMOS |
183 mA |
1.2 V |
1 |
USB |
.5 mm |
S-PQCC-N56 |
IEEE 802.3; IEEE 802.3U |
YES |
12 |
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|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
INDUSTRIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
8 |
TS 16949 |
7 |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ |
85 Cel |
12.5 MBps |
-40 Cel |
MATTE TIN |
QUAD |
1.6 mm |
16384 |
14 mm |
NO |
32 |
NRZI; BIPH-LEVEL(MANCHESTER) |
ASYNC, BIT; SYNC, BYTE |
25 MHz |
260 |
14 mm |
CMOS |
69 mA |
1.8 V |
1 |
Serial IO/Communication Controllers |
.5 mm |
S-PQFP-G100 |
3 |
Not Qualified |
YES |
e3 |
3 |
||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
COMMERCIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC64,.35SQ,20 |
70 Cel |
60 MBps |
0 Cel |
MATTE TIN |
QUAD |
1 mm |
9 mm |
YES |
SYNC; BIT ;BYTE |
9 mm |
CMOS |
1.8 V |
1 |
Serial IO/Communication Controllers |
.5 mm |
S-PQCC-N64 |
Not Qualified |
YES |
e3 |
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|
Intel |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
COMMERCIAL |
BALL |
196 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
32 |
1.2,1.8,3.3 |
GRID ARRAY |
BGA196,14X14,40 |
1.14 V |
70 Cel |
125 MBps |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.75 mm |
15 mm |
YES |
32 |
NRZ; NRZI; BIPH-LEVEL(MANCHESTER) |
25 MHz |
15 mm |
CMOS |
1.2 V |
1 |
Serial IO/Communication Controllers |
PCI |
1 mm |
S-PBGA-B196 |
Not Qualified |
YES |
e1 |
|||||||||||||||||||||||||||||||
Cirrus Logic |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
INDUSTRIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.465 V |
20 |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
3.135 V |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
1.6 mm |
14 mm |
YES |
16 |
NRZ; BIPH-LEVEL(MANCHESTER) |
20 MHz |
14 mm |
CMOS |
55 mA |
3.3 V |
2 |
Serial IO/Communication Controllers |
ISA |
.5 mm |
S-PQFP-G100 |
Not Qualified |
YES |
e0 |
||||||||||||||||||||||||||||||||
Cirrus Logic |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
INDUSTRIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
20 |
5 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
4.75 V |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
1.6 mm |
14 mm |
YES |
16 |
NRZ; BIPH-LEVEL(MANCHESTER) |
20 MHz |
30 |
240 |
14 mm |
CMOS |
55 mA |
5 V |
2 |
Serial IO/Communication Controllers |
ISA |
.5 mm |
S-PQFP-G100 |
Not Qualified |
YES |
e0 |
||||||||||||||||||||||||||||||
|
Intel |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
AUTOMOTIVE |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
16 |
CHIP CARRIER |
4.5 V |
125 Cel |
-40 Cel |
QUAD |
IT IS ALSO AVAILABLE IN QFP-44 PACKAGE |
NO |
16 |
16 MHz |
CMOS |
5 V |
2 |
S-PQCC-J44 |
YES |
Serial communication controllers are electronic devices that manage the input/output operations between a computer or microcontroller and other devices through serial communication protocols such as UART, SPI, I2C, and USB. These controllers provide an interface that allows the computer or microcontroller to send and receive data over a serial connection and manage the communication operations.
Serial communication controllers can be integrated into the computer or microcontroller's chipset or added as an external module. They typically include a serial interface that connects to the device and a host interface that connects to the computer or microcontroller's bus system. The serial interface can be based on various standards such as UART, SPI, or I2C, while the host interface can be based on various standards such as PCI, PCIe, or USB.
Serial communication controllers offer various benefits such as increased data transfer rates, improved reliability, and increased compatibility with a wide range of devices. They also provide advanced features such as error checking, flow control, and clock synchronization that can improve the accuracy and reliability of the communication.