Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Maximum Data Transfer Rate | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | RAM Words | Width | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Data Encoding or Decoding Method | Communication Protocol | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | No. of Timers | RAM Bytes | Technology | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Drive Interface Standard | Low Power Mode | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Wiznet |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.63 V |
8 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
2.97 V |
85 Cel |
12.5 MBps |
-40 Cel |
QUAD |
1.6 mm |
7 mm |
NO |
8 |
SYNC, BYTE; ETHERNET |
70 MHz |
7 mm |
CMOS |
3.3 V |
SPI |
.5 mm |
S-PQFP-G48 |
YES |
|||||||||||||||||||||||||||||||||||||||
Wiznet |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.63 V |
8 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
2.97 V |
85 Cel |
12.5 MBps |
-40 Cel |
QUAD |
1.6 mm |
7 mm |
NO |
8 |
SYNC, BYTE; ETHERNET |
70 MHz |
7 mm |
CMOS |
3.3 V |
SPI |
.5 mm |
S-PQFP-G48 |
YES |
|||||||||||||||||||||||||||||||||||||||
|
IXYS Corporation |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
INDUSTRIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
16 |
CHIP CARRIER |
4.5 V |
85 Cel |
1.25 MBps |
-40 Cel |
MATTE TIN |
QUAD |
4.57 mm |
24.23 mm |
NO |
16 |
NRZ; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL |
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC; EXT SYNC; BISYNC TRANSPARENT; NBIP |
20 MHz |
24.23 mm |
CMOS |
5 V |
2 |
8X86; 680X0 |
1.27 mm |
S-PQCC-J68 |
Not Qualified |
NO |
e3 |
|||||||||||||||||||||||||||||||||
|
IXYS Corporation |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.5 V |
0 |
1 |
5 |
IN-LINE |
DIP40,.6 |
4.5 V |
70 Cel |
.5125 MBps |
0 Cel |
MATTE TIN |
DUAL |
4.24 mm |
0 |
15.24 mm |
TWO MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS; 10 X 19 FRAME STATUS FIFO |
NO |
8 |
NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) |
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC |
8 MHz |
52.325 mm |
CMOS |
12 mA |
5 V |
0 |
2 |
Other Microprocessor ICs |
Z80 |
2.54 mm |
R-PDIP-T40 |
Not Qualified |
NO |
e3 |
0 |
||||||||||||||||||||||||
IXYS Corporation |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
INDUSTRIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
16 |
5 |
FLATPACK, LOW PROFILE, FINE PITCH |
LDCC68,1.0SQ |
4.5 V |
85 Cel |
1.25 MBps |
-40 Cel |
TIN |
QUAD |
1.6 mm |
14 mm |
NO |
16 |
NRZ; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL |
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC; EXT SYNC; BISYNC TRANSPARENT; NBIP |
20 MHz |
14 mm |
CMOS |
50 mA |
5 V |
2 |
Other uPs/uCs/Peripheral ICs |
8X86; 680X0 |
.5 mm |
S-PQFP-G100 |
Not Qualified |
NO |
e3 |
||||||||||||||||||||||||||||||
|
IXYS Corporation |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.5 V |
0 |
1 |
5 |
IN-LINE |
DIP40,.6 |
4.5 V |
70 Cel |
.5125 MBps |
0 Cel |
MATTE TIN |
DUAL |
4.24 mm |
0 |
15.24 mm |
TWO MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS; 10 X 19 FRAME STATUS FIFO |
NO |
8 |
NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) |
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC |
10 MHz |
52.325 mm |
CMOS |
12 mA |
5 V |
0 |
2 |
Other Microprocessor ICs |
Z80 |
2.54 mm |
R-PDIP-T40 |
Not Qualified |
NO |
e3 |
0 |
||||||||||||||||||||||||
|
IXYS Corporation |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
0 |
1 |
5 |
CHIP CARRIER |
LDCC44,.7SQ |
4.5 V |
70 Cel |
.5125 MBps |
0 Cel |
MATTE TIN |
QUAD |
4.57 mm |
0 |
16.5862 mm |
TWO MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS; 10 X 19 FRAME STATUS FIFO |
NO |
8 |
NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) |
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC |
16 MHz |
16.5862 mm |
CMOS |
15 mA |
5 V |
0 |
2 |
Other Microprocessor ICs |
Z80 |
1.27 mm |
S-PQCC-J44 |
3 |
Not Qualified |
NO |
e3 |
0 |
|||||||||||||||||||||||
Motorola |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
J BEND |
84 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
0 |
24 |
CHIP CARRIER |
.256 MBps |
QUAD |
4.57 mm |
0 |
29.285 mm |
NO |
16 |
NRZ |
SYNC, HDLC; LAPD |
16.67 MHz |
29.285 mm |
CMOS |
5 V |
1 |
1 |
M68000; IAPX 86 |
1.27 mm |
S-PQCC-J84 |
Not Qualified |
NO |
0 |
|||||||||||||||||||||||||||||||||||||
Texas Instruments |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
COMMERCIAL |
THROUGH-HOLE |
48 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5 |
IN-LINE |
DIP48,.6 |
70 Cel |
0 Cel |
DUAL |
MOS |
175 mA |
5 V |
Serial IO/Communication Controllers |
2.54 mm |
R-PDIP-T48 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
COMMERCIAL |
THROUGH-HOLE |
48 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
5 |
IN-LINE |
DIP48,.6 |
70 Cel |
0 Cel |
DUAL |
MOS |
175 mA |
5 V |
Serial IO/Communication Controllers |
2.54 mm |
R-XDIP-T48 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
INDUSTRIAL |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
32 |
3.3,5 |
FLATPACK, FINE PITCH |
QFP208,1.2SQ,20 |
3 V |
85 Cel |
1.25 MBps |
-40 Cel |
QUAD |
4.1 mm |
28 mm |
ALSO REQUIRES 4.5 TO 5.5 VOLTS |
YES |
32 |
SYNC, HDLC |
33 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
28 mm |
CMOS |
3.3 V |
8 |
Serial IO/Communication Controllers |
PCI |
.5 mm |
S-PQFP-G208 |
Not Qualified |
NO |
|||||||||||||||||||||||||||||||
Texas Instruments |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
GULL WING |
208 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
FLATPACK |
QFP208,1.2SQ,20 |
QUAD |
BICMOS |
Serial IO/Communication Controllers |
.5 mm |
S-PQFP-G208 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
INDUSTRIAL |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
32 |
3.3,5 |
FLATPACK, FINE PITCH |
QFP208,1.2SQ,20 |
3 V |
85 Cel |
.256 MBps |
-40 Cel |
QUAD |
4.1 mm |
28 mm |
ALSO REQUIRES 4.5 TO 5.5 VOLTS |
YES |
32 |
SYNC, HDLC; X.25; LAPB; LAPD |
33 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
28 mm |
CMOS |
3.3 V |
4 |
Serial IO/Communication Controllers |
PCI |
.5 mm |
S-PQFP-G208 |
Not Qualified |
NO |
|||||||||||||||||||||||||||||||
STMicroelectronics |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
INDUSTRIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
5 |
IN-LINE |
DIP28,.6 |
85 Cel |
-40 Cel |
DUAL |
MOS |
5 V |
Serial IO/Communication Controllers |
2.54 mm |
R-XDIP-T28 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
MILITARY |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
5 |
IN-LINE |
DIP28,.6 |
125 Cel |
-55 Cel |
DUAL |
MOS |
5 V |
Serial IO/Communication Controllers |
2.54 mm |
R-XDIP-T28 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
INDUSTRIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
5 |
IN-LINE |
DIP28,.6 |
85 Cel |
-40 Cel |
DUAL |
MOS |
5 V |
Serial IO/Communication Controllers |
2.54 mm |
R-XDIP-T28 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
COMMERCIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
IN-LINE |
DIP28,.6 |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
MOS |
Serial IO/Communication Controllers |
2.54 mm |
R-PDIP-T28 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
COMMERCIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
IN-LINE |
DIP28,.6 |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
MOS |
Serial IO/Communication Controllers |
2.54 mm |
R-PDIP-T28 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
INDUSTRIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
5 |
IN-LINE |
DIP28,.6 |
85 Cel |
-40 Cel |
DUAL |
MOS |
5 V |
Serial IO/Communication Controllers |
2.54 mm |
R-XDIP-T28 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
MILITARY |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
5 |
IN-LINE |
DIP28,.6 |
125 Cel |
-55 Cel |
DUAL |
MOS |
5 V |
Serial IO/Communication Controllers |
2.54 mm |
R-XDIP-T28 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
CHIP CARRIER |
LDCC28,.5SQ |
70 Cel |
0 Cel |
QUAD |
MOS |
5 V |
Serial IO/Communication Controllers |
1.27 mm |
S-PQCC-J28 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
COMMERCIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
IN-LINE |
DIP28,.6 |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
MOS |
Serial IO/Communication Controllers |
2.54 mm |
R-PDIP-T28 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
MILITARY |
NO LEAD |
28 |
QCCN |
SQUARE |
CERAMIC |
YES |
5 |
CHIP CARRIER |
LCC28,.45SQ |
125 Cel |
-55 Cel |
QUAD |
MOS |
5 V |
Serial IO/Communication Controllers |
1.27 mm |
S-XQCC-N28 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
INDUSTRIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
5 |
IN-LINE |
DIP28,.6 |
85 Cel |
-40 Cel |
DUAL |
MOS |
5 V |
Serial IO/Communication Controllers |
2.54 mm |
R-XDIP-T28 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
MILITARY |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
5 |
IN-LINE |
DIP28,.6 |
125 Cel |
-55 Cel |
DUAL |
MOS |
5 V |
Serial IO/Communication Controllers |
2.54 mm |
R-XDIP-T28 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
MILITARY |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
5 |
IN-LINE |
DIP28,.6 |
125 Cel |
-55 Cel |
DUAL |
MOS |
5 V |
Serial IO/Communication Controllers |
2.54 mm |
R-XDIP-T28 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
MILITARY |
NO LEAD |
28 |
QCCN |
SQUARE |
CERAMIC |
YES |
5 |
CHIP CARRIER |
LCC28,.45SQ |
125 Cel |
-55 Cel |
QUAD |
MOS |
5 V |
Serial IO/Communication Controllers |
1.27 mm |
S-XQCC-N28 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
COMMERCIAL |
J BEND |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
0 |
6 |
CHIP CARRIER |
4.75 V |
70 Cel |
.5 MBps |
0 Cel |
QUAD |
4.57 mm |
0 |
19.1262 mm |
NO |
8 |
NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) |
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; X.75; BISYNC; EXT SYNC; ADCCP; DDCMP |
16 MHz |
19.1262 mm |
NMOS |
275 mA |
5 V |
0 |
2 |
68000 |
1.27 mm |
S-PQCC-J52 |
Not Qualified |
NO |
8 |
|||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
INDUSTRIAL |
J BEND |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
0 |
6 |
5 |
CHIP CARRIER |
LDCC52,.8SQ |
4.5 V |
85 Cel |
1 MBps |
-40 Cel |
QUAD |
4.57 mm |
0 |
19.1262 mm |
NO |
8 |
NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) |
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; X.75; BISYNC; EXT SYNC; ADCCP; DDCMP |
16 MHz |
19.1262 mm |
CMOS |
95 mA |
5 V |
0 |
2 |
Other Microprocessor ICs |
68000 |
1.27 mm |
S-PQCC-J52 |
Not Qualified |
NO |
0 |
||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
COMMERCIAL |
THROUGH-HOLE |
48 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.25 V |
0 |
6 |
IN-LINE |
4.75 V |
70 Cel |
.3125 MBps |
0 Cel |
DUAL |
4.9 mm |
0 |
15.24 mm |
NO |
8 |
NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) |
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; X.75; BISYNC; EXT SYNC; ADCCP; DDCMP |
16 MHz |
62.1 mm |
NMOS |
275 mA |
5 V |
2 |
2 |
2.54 mm |
R-PDIP-T48 |
Not Qualified |
NO |
0 |
||||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.25 V |
0 |
3 |
5 |
IN-LINE |
DIP40,.6 |
4.75 V |
70 Cel |
.25 MBps |
0 Cel |
DUAL |
4.7 mm |
0 |
15.24 mm |
NO |
16 |
NRZ |
SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC; ADCCP; DDCMP |
2 MHz |
52 mm |
NMOS |
150 mA |
5 V |
0 |
1 |
Serial IO/Communication Controllers |
2.54 mm |
R-PDIP-T40 |
Not Qualified |
NO |
0 |
|||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
0 |
3 |
CHIP CARRIER |
4.75 V |
70 Cel |
.25 MBps |
0 Cel |
QUAD |
4.57 mm |
0 |
16.5862 mm |
NO |
16 |
NRZ |
SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC; ADCCP; DDCMP |
2 MHz |
16.5862 mm |
NMOS |
150 mA |
5 V |
0 |
1 |
1.27 mm |
S-PQCC-J44 |
Not Qualified |
NO |
0 |
||||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
COMMERCIAL |
J BEND |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
0 |
6 |
5 |
CHIP CARRIER |
LDCC52,.8SQ |
4.75 V |
70 Cel |
.5 MBps |
0 Cel |
QUAD |
4.57 mm |
0 |
19.1262 mm |
NO |
8 |
NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) |
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; X.75; BISYNC; EXT SYNC; ADCCP; DDCMP |
16 MHz |
19.1262 mm |
NMOS |
275 mA |
5 V |
0 |
2 |
Other Microprocessor ICs |
1.27 mm |
S-PQCC-J52 |
Not Qualified |
NO |
8 |
|||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.25 V |
0 |
3 |
IN-LINE |
4.75 V |
70 Cel |
.25 MBps |
0 Cel |
DUAL |
4.7 mm |
0 |
15.24 mm |
NO |
16 |
NRZ |
SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC; ADCCP; DDCMP |
2 MHz |
52 mm |
NMOS |
150 mA |
5 V |
0 |
1 |
2.54 mm |
R-PDIP-T40 |
Not Qualified |
NO |
0 |
||||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
COMMERCIAL |
THROUGH-HOLE |
48 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.25 V |
0 |
6 |
5 |
IN-LINE |
DIP48,.6 |
4.75 V |
70 Cel |
.5 MBps |
0 Cel |
DUAL |
4.9 mm |
0 |
15.24 mm |
NO |
8 |
NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) |
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; X.75; BISYNC; EXT SYNC; ADCCP; DDCMP |
16 MHz |
62.1 mm |
NMOS |
275 mA |
5 V |
0 |
2 |
Other Microprocessor ICs |
2.54 mm |
R-PDIP-T48 |
Not Qualified |
NO |
8 |
|||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
COMMERCIAL |
J BEND |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
0 |
6 |
CHIP CARRIER |
4.75 V |
70 Cel |
.3125 MBps |
0 Cel |
QUAD |
4.57 mm |
0 |
19.1262 mm |
NO |
8 |
NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) |
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; X.75; BISYNC; EXT SYNC; ADCCP; DDCMP |
16 MHz |
19.1262 mm |
NMOS |
275 mA |
5 V |
2 |
2 |
68000 |
1.27 mm |
S-PQCC-J52 |
Not Qualified |
NO |
0 |
|||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
COMMERCIAL |
J BEND |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
0 |
6 |
CHIP CARRIER |
4.5 V |
70 Cel |
1.25 MBps |
0 Cel |
QUAD |
4.57 mm |
0 |
19.1262 mm |
NO |
8 |
NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) |
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; X.75; BISYNC; EXT SYNC; ADCCP; DDCMP |
16 MHz |
19.1262 mm |
CMOS |
80 mA |
5 V |
0 |
2 |
68000 |
1.27 mm |
S-PQCC-J52 |
Not Qualified |
NO |
0 |
|||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
INDUSTRIAL |
J BEND |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
0 |
6 |
CHIP CARRIER |
4.5 V |
85 Cel |
1 MBps |
-40 Cel |
QUAD |
4.57 mm |
0 |
19.1262 mm |
NO |
8 |
NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) |
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; X.75; BISYNC; EXT SYNC; ADCCP; DDCMP |
16 MHz |
19.1262 mm |
CMOS |
95 mA |
5 V |
0 |
2 |
68000 |
1.27 mm |
S-PQCC-J52 |
Not Qualified |
NO |
0 |
|||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
COMMERCIAL |
THROUGH-HOLE |
48 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.25 V |
0 |
6 |
IN-LINE |
4.75 V |
70 Cel |
.3125 MBps |
0 Cel |
DUAL |
4.9 mm |
0 |
15.24 mm |
NO |
8 |
NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) |
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; X.75; BISYNC; EXT SYNC; ADCCP; DDCMP |
16 MHz |
62.1 mm |
NMOS |
275 mA |
5 V |
2 |
2 |
68000 |
2.54 mm |
R-PDIP-T48 |
Not Qualified |
NO |
0 |
|||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
5.25 V |
0 |
3 |
5 |
IN-LINE |
DIP40,.6 |
4.75 V |
70 Cel |
.25 MBps |
0 Cel |
DUAL |
5.72 mm |
0 |
15.24 mm |
NO |
16 |
NRZ |
SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC; ADCCP; DDCMP |
2 MHz |
52.39 mm |
NMOS |
150 mA |
5 V |
0 |
1 |
Serial IO/Communication Controllers |
2.54 mm |
R-GDIP-T40 |
Not Qualified |
NO |
0 |
|||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
COMMERCIAL |
THROUGH-HOLE |
48 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.25 V |
0 |
6 |
IN-LINE |
4.75 V |
70 Cel |
.5 MBps |
0 Cel |
DUAL |
4.9 mm |
0 |
15.24 mm |
NO |
8 |
NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) |
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; X.75; BISYNC; EXT SYNC; ADCCP; DDCMP |
16 MHz |
62.1 mm |
NMOS |
275 mA |
5 V |
0 |
2 |
68000 |
2.54 mm |
R-PDIP-T48 |
Not Qualified |
NO |
8 |
|||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
COMMERCIAL |
J BEND |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
0 |
6 |
CHIP CARRIER |
4.75 V |
70 Cel |
.3125 MBps |
0 Cel |
QUAD |
4.57 mm |
0 |
19.1262 mm |
NO |
8 |
NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) |
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; X.75; BISYNC; EXT SYNC; ADCCP; DDCMP |
16 MHz |
19.1262 mm |
NMOS |
275 mA |
5 V |
2 |
2 |
68000 |
1.27 mm |
S-PQCC-J52 |
Not Qualified |
NO |
0 |
|||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
COMMERCIAL |
J BEND |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
0 |
6 |
CHIP CARRIER |
4.75 V |
70 Cel |
.3125 MBps |
0 Cel |
QUAD |
4.57 mm |
0 |
19.1262 mm |
NO |
8 |
NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) |
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; X.75; BISYNC; EXT SYNC; ADCCP; DDCMP |
16 MHz |
19.1262 mm |
NMOS |
275 mA |
5 V |
2 |
2 |
1.27 mm |
S-PQCC-J52 |
Not Qualified |
NO |
0 |
||||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
0 |
3 |
5 |
CHIP CARRIER |
LDCC44,.7SQ |
4.75 V |
70 Cel |
.25 MBps |
0 Cel |
QUAD |
4.57 mm |
0 |
16.5862 mm |
NO |
16 |
NRZ |
SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC; ADCCP; DDCMP |
2 MHz |
16.5862 mm |
NMOS |
150 mA |
5 V |
0 |
1 |
Serial IO/Communication Controllers |
1.27 mm |
S-PQCC-J44 |
Not Qualified |
NO |
0 |
|||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
COMMERCIAL |
J BEND |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
0 |
6 |
5 |
CHIP CARRIER |
LDCC52,.8SQ |
4.5 V |
70 Cel |
1.25 MBps |
0 Cel |
QUAD |
4.57 mm |
0 |
19.1262 mm |
NO |
8 |
NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) |
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; X.75; BISYNC; EXT SYNC; ADCCP; DDCMP |
16 MHz |
19.1262 mm |
CMOS |
80 mA |
5 V |
0 |
2 |
Other Microprocessor ICs |
68000 |
1.27 mm |
S-PQCC-J52 |
1 |
Not Qualified |
NO |
0 |
|||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
5.25 V |
0 |
3 |
5 |
IN-LINE |
DIP40,.6 |
4.75 V |
70 Cel |
.25 MBps |
0 Cel |
DUAL |
5.72 mm |
0 |
15.24 mm |
NO |
16 |
NRZ |
SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC; ADCCP; DDCMP |
2 MHz |
52.39 mm |
NMOS |
150 mA |
5 V |
0 |
1 |
Serial IO/Communication Controllers |
2.54 mm |
R-GDIP-T40 |
Not Qualified |
NO |
0 |
|||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
COMMERCIAL |
THROUGH-HOLE |
48 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.5 V |
0 |
6 |
IN-LINE |
4.5 V |
70 Cel |
1.25 MBps |
0 Cel |
DUAL |
4.9 mm |
0 |
15.24 mm |
NO |
8 |
NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) |
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; X.75; BISYNC; EXT SYNC; ADCCP; DDCMP |
16 MHz |
62.1 mm |
CMOS |
80 mA |
5 V |
0 |
2 |
68000 |
2.54 mm |
R-PDIP-T48 |
Not Qualified |
NO |
0 |
|||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
0 |
3 |
CHIP CARRIER |
4.75 V |
70 Cel |
.25 MBps |
0 Cel |
QUAD |
4.57 mm |
0 |
16.5862 mm |
NO |
16 |
NRZ |
SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC; ADCCP; DDCMP |
2 MHz |
16.5862 mm |
NMOS |
150 mA |
5 V |
0 |
1 |
1.27 mm |
S-PQCC-J44 |
Not Qualified |
NO |
0 |
Serial communication controllers are electronic devices that manage the input/output operations between a computer or microcontroller and other devices through serial communication protocols such as UART, SPI, I2C, and USB. These controllers provide an interface that allows the computer or microcontroller to send and receive data over a serial connection and manage the communication operations.
Serial communication controllers can be integrated into the computer or microcontroller's chipset or added as an external module. They typically include a serial interface that connects to the device and a host interface that connects to the computer or microcontroller's bus system. The serial interface can be based on various standards such as UART, SPI, or I2C, while the host interface can be based on various standards such as PCI, PCIe, or USB.
Serial communication controllers offer various benefits such as increased data transfer rates, improved reliability, and increased compatibility with a wide range of devices. They also provide advanced features such as error checking, flow control, and clock synchronization that can improve the accuracy and reliability of the communication.