SERIAL IO/COMMUNICATION CONTROLLER, SERIAL Serial Communication Controllers 2,400+

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Maximum Data Transfer Rate Minimum Operating Temperature Terminal Finish ADC Channels Terminal Position DMA Channels Maximum Seated Height ROM Words RAM Words Width Additional Features Boundary Scan Peripherals External Data Bus Width Data Encoding or Decoding Method Communication Protocol Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) No. of Timers RAM Bytes Technology Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Drive Interface Standard Low Power Mode JESD-609 Code On Chip Program ROM Width No. of I/O Lines

FT4232HL-REEL

FTDI

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1.98 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

1.62 V

85 Cel

1.5 MBps

-40 Cel

QUAD

1.6 mm

10 mm

YES

ASYNC, BIT; SYNC, BYTE

12 MHz

40

260

10 mm

CMOS

1.8 V

4

I2C; RS-232; RS-422; RS-485; SPI; UART; USB

.5 mm

S-PQFP-G64

3

Not Qualified

YES

8

FT4232HL-TRAY

FTDI

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1.98 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

1.62 V

85 Cel

1.5 MBps

-40 Cel

QUAD

1.6 mm

10 mm

YES

ASYNC, BIT; SYNC, BYTE

12 MHz

40

260

10 mm

CMOS

1.8 V

4

I2C; RS-232; RS-422; RS-485; SPI; UART; USB

.5 mm

S-PQFP-G64

3

Not Qualified

YES

8

MCP2518FDT-E/QBBVAO

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

AUTOMOTIVE

NO LEAD

14

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

AEC-Q100; TS 16949

0

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

LCC14,.18X.12,30

2.7 V

125 Cel

1 MBps

-40 Cel

MATTE TIN

DUAL

.9 mm

3 mm

NO

0

SYNC; BIT ;BYTE

40 MHz

30

260

4.5 mm

CMOS

20 mA

3.3 V

1

SPI

.65 mm

R-PDSO-N14

YES

e3

FT4232HQ-REEL

FTDI

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

INDUSTRIAL

NO LEAD

64

HQCCN

SQUARE

UNSPECIFIED

YES

1.98 V

CHIP CARRIER, HEAT SINK/SLUG

LCC64,.35SQ,20

1.62 V

85 Cel

1.5 MBps

-40 Cel

QUAD

1 mm

9 mm

YES

ASYNC, BIT; SYNC, BYTE

12 MHz

40

260

9 mm

CMOS

1.8 V

4

I2C; RS-232; RS-422; RS-485; SPI; UART; USB

.5 mm

S-XQCC-N64

3

Not Qualified

YES

8

MCP2518FDT-E/SLVAO

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

AUTOMOTIVE

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

AEC-Q100; TS 16949

0

SMALL OUTLINE

SOP14,.24

2.7 V

125 Cel

1 MBps

-40 Cel

MATTE TIN

DUAL

1.75 mm

3.9 mm

NO

0

SYNC; BIT ;BYTE

40 MHz

30

260

8.65 mm

CMOS

20 mA

3.3 V

1

SPI

1.27 mm

R-PDSO-G14

YES

e3

MCP2515-E/ST

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

AUTOMOTIVE

GULL WING

20

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

0

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP20,.25

4.5 V

125 Cel

.125 MBps

-40 Cel

Matte Tin (Sn)

DUAL

1.2 mm

4.4 mm

NO

0

NRZ

SYNC; BIT ;BYTE

40 MHz

40

260

6.5 mm

CMOS

5 V

1

CAN, SPI

.65 mm

R-PDSO-G20

1

Not Qualified

YES

e3

LAN9514-JZX

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

COMMERCIAL

NO LEAD

64

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

TS 16949

0

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.35SQ,20

3 V

70 Cel

60 MBps

0 Cel

MATTE TIN

QUAD

1 mm

9 mm

YES

0

SYNC; BIT ;BYTE

25 MHz

40

260

9 mm

CMOS

1.8 V

1

Serial IO/Communication Controllers

USB

.5 mm

S-PQCC-N64

1

Not Qualified

YES

e3

8

FT4232HL

FTDI

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1.98 V

0

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

1.62 V

85 Cel

1.5 MBps

-40 Cel

QUAD

1.6 mm

10 mm

YES

0

ASYNC, BIT; SYNC, BYTE

12 MHz

40

260

10 mm

CMOS

1.8 V

4

I2C; RS-232; RS-422; RS-485; SPI; UART; USB

.5 mm

S-PQFP-G64

3

YES

8

MCP2518FDT-H/SLVAO

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

AUTOMOTIVE

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

AEC-Q100; TS 16949

SMALL OUTLINE

SOP14,.24

2.7 V

150 Cel

1 MBps

-40 Cel

MATTE TIN

DUAL

1.75 mm

3.9 mm

NO

SYNC; BIT ;BYTE

40 MHz

30

260

8.65 mm

CMOS

20 mA

3.3 V

1

SPI

1.27 mm

R-PDSO-G14

YES

e3

LAN9514I-JZX

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

INDUSTRIAL

NO LEAD

64

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

TS 16949

0

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.35SQ,20

3 V

85 Cel

60 MBps

-40 Cel

MATTE TIN

QUAD

1 mm

9 mm

YES

0

SYNC; BIT ;BYTE

25 MHz

40

260

9 mm

CMOS

1.8 V

1

Serial IO/Communication Controllers

USB

.5 mm

S-PQCC-N64

1

Not Qualified

YES

e3

8

FT4232H-56Q-REEL

FTDI

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

INDUSTRIAL

NO LEAD

56

HQCCN

SQUARE

UNSPECIFIED

YES

1.98 V

CHIP CARRIER, HEAT SINK/SLUG

LCC56,.31SQ,20

1.62 V

85 Cel

1.5 MBps

-40 Cel

QUAD

1 mm

8 mm

YES

ASYNC, BIT; SYNC, BYTE

12 MHz

40

260

8 mm

CMOS

1.8 V

4

I2C; RS-232; RS-422; RS-485; SPI; UART; USB

.5 mm

S-XQCC-N56

3

YES

8

LAN9512I-JZX

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

INDUSTRIAL

NO LEAD

64

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

TS 16949

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.35SQ,20

3 V

85 Cel

60 MBps

-40 Cel

MATTE TIN

QUAD

1 mm

9 mm

YES

0

SYNC; BIT ;BYTE

25 MHz

9 mm

CMOS

1.8 V

1

USB

.5 mm

S-PQCC-N64

3

Not Qualified

YES

e3

8

FT4232HQ-TRAY

FTDI

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

INDUSTRIAL

NO LEAD

64

HQCCN

SQUARE

UNSPECIFIED

YES

1.98 V

CHIP CARRIER, HEAT SINK/SLUG

LCC64,.35SQ,20

1.62 V

85 Cel

1.5 MBps

-40 Cel

QUAD

1 mm

9 mm

YES

ASYNC, BIT; SYNC, BYTE

12 MHz

40

260

9 mm

CMOS

1.8 V

4

I2C; RS-232; RS-422; RS-485; SPI; UART; USB

.5 mm

S-XQCC-N64

3

Not Qualified

YES

8

LAN7500I-ABZJ

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1.26 V

TS 16949

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC56,.31SQ,20

1.14 V

85 Cel

125 MBps

-40 Cel

MATTE TIN

QUAD

1 mm

8 mm

YES

0

SYNC; BIT ;BYTE

25 MHz

260

8 mm

CMOS

1.2 V

4

USB

.5 mm

S-PQCC-N56

3

YES

e3

FT4232H-56Q-TRAY

FTDI

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

INDUSTRIAL

NO LEAD

56

HQCCN

SQUARE

UNSPECIFIED

YES

1.98 V

CHIP CARRIER, HEAT SINK/SLUG

LCC56,.31SQ,20

1.62 V

85 Cel

1.5 MBps

-40 Cel

QUAD

1 mm

8 mm

YES

ASYNC, BIT; SYNC, BYTE

12 MHz

40

260

8 mm

CMOS

1.8 V

4

I2C; RS-232; RS-422; RS-485; SPI; UART; USB

.5 mm

S-XQCC-N56

3

YES

8

MC68360AI25L

NXP Semiconductors

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

INDUSTRIAL

GULL WING

240

QFP

SQUARE

PLASTIC/EPOXY

YES

32

FLATPACK

85 Cel

1.25 MBps

-40 Cel

TIN

QUAD

YES

32

ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC

25 MHz

40

260

CMOS

68000

S-PQFP-G240

3

YES

e3

LAN9512-JZX

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

COMMERCIAL

NO LEAD

64

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

TS 16949

0

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.35SQ,20

3 V

70 Cel

60 MBps

0 Cel

MATTE TIN

QUAD

1 mm

9 mm

YES

0

SYNC; BIT ;BYTE

25 MHz

260

9 mm

CMOS

1.8 V

1

Serial IO/Communication Controllers

USB

.5 mm

S-PQCC-N64

1

Not Qualified

YES

e3

8

FT4232HAQ-TRAY

FTDI

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

NO LEAD

64

HVQCCN

SQUARE

UNSPECIFIED

YES

1.32 V

AEC-Q100

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.35SQ,20

1.08 V

105 Cel

60 MBps

-40 Cel

QUAD

.8 mm

9 mm

YES

ASYNC, BIT; SYNC, BYTE

12 MHz

40

260

9 mm

CMOS

1.2 V

4

I2C; RS-232; RS-422; RS-485; SPI; UART; USB

.5 mm

S-XQCC-N64

3

YES

8

MCP2515-I/STRB4

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

INDUSTRIAL

GULL WING

20

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

TS 16949

0

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP20,.25

4.5 V

85 Cel

.125 MBps

-40 Cel

MATTE TIN

DUAL

1.2 mm

4.4 mm

NO

0

NRZ

SYNC; BIT ;BYTE

40 MHz

6.5 mm

CMOS

10 mA

5 V

1

SPI

.65 mm

R-PDSO-G20

YES

e3

MCP2515-I/STG

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

INDUSTRIAL

GULL WING

20

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

0

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

2.7 V

85 Cel

.125 MBps

-40 Cel

MATTE TIN

DUAL

1.2 mm

4.4 mm

NO

0

NRZ

25 MHz

260

6.5 mm

CMOS

1

.65 mm

R-PDSO-G20

1

Not Qualified

YES

e3

MCP2515-I/STRB2

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

INDUSTRIAL

GULL WING

20

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

TS 16949

0

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP20,.25

4.5 V

85 Cel

.125 MBps

-40 Cel

MATTE TIN

DUAL

1.2 mm

4.4 mm

NO

0

NRZ

SYNC; BIT ;BYTE

40 MHz

6.5 mm

CMOS

10 mA

5 V

1

SPI

.65 mm

R-PDSO-G20

YES

e3

TL16C754BPNR

Texas Instruments

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

INDUSTRIAL

GULL WING

80

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

3

3.3/5

FLATPACK, LOW PROFILE, FINE PITCH

QFP80,.55SQ,20

4.5 V

85 Cel

.375 MBps

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1.6 mm

12 mm

ALSO OPERATES AT 3.3V SUPPLY

NO

8

NRZ

ASYNC, BIT

50 MHz

30

260

12 mm

CMOS

5 V

4

Serial IO/Communication Controllers

.5 mm

S-PQFP-G80

3

Not Qualified

YES

e4

MCP2515-I/SOGRB2

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

INDUSTRIAL

GULL WING

18

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

TS 16949

0

SMALL OUTLINE

SOP18,.4

4.5 V

85 Cel

.125 MBps

-40 Cel

MATTE TIN

DUAL

2.65 mm

7.5 mm

NO

0

NRZ

SYNC; BIT ;BYTE

40 MHz

11.55 mm

CMOS

10 mA

5 V

1

SPI

1.27 mm

R-PDSO-G18

YES

e3

XR17V358IB176-F

Exar

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

INDUSTRIAL

BALL

176

LFBGA

SQUARE

PLASTIC/EPOXY

YES

0

3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA176,15X15,32

85 Cel

3.125 MBps

-40 Cel

TIN SILVER COPPER

BOTTOM

1.5 mm

13 mm

YES

8

NRZ

ASYNC, BIT

245

13 mm

CMOS

1.2 V

8

Serial IO/Communication Controllers

PCI

.8 mm

S-PBGA-B176

4

Not Qualified

YES

e1

LAN7430-I/Y9X

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1.32 V

TS 16949

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.28SQ,20

1.14 V

85 Cel

250 MBps

-40 Cel

QUAD

1 mm

7 mm

ALSO HAVING NETWORK PROTOCOLS IEEE 802.3AZ; IEEE 802.1Q; IEEE 802.3X

YES

0

SYNC, BIT, BYTE, ETHERNET

25 MHz

NOT SPECIFIED

NOT SPECIFIED

7 mm

CMOS

90 mA

1.2 V

8

PCI

.5 mm

S-PQCC-N48

YES

MCP2515-I/SORB2

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

INDUSTRIAL

GULL WING

18

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

TS 16949

0

SMALL OUTLINE

SOP18,.4

4.5 V

85 Cel

.125 MBps

-40 Cel

MATTE TIN

DUAL

2.65 mm

7.5 mm

NO

0

NRZ

SYNC; BIT ;BYTE

40 MHz

11.55 mm

CMOS

10 mA

5 V

1

SPI

1.27 mm

R-PDSO-G18

YES

e3

TL16C550CIPTR

Texas Instruments

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.25 V

3

3.3/5

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

4.75 V

85 Cel

.125 MBps

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1.6 mm

7 mm

ALSO OPERATES AT 3.3V SUPPLY AT 14.9 MHZ

NO

8

NRZ

ASYNC, BIT

16 MHz

30

260

7 mm

CMOS

10 mA

5 V

1

Serial IO/Communication Controllers

.5 mm

S-PQFP-G48

3

Not Qualified

NO

e4

SC16IS752IPW,128

NXP Semiconductors

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

INDUSTRIAL

GULL WING

28

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

2

2.5/3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP28,.25

3 V

95 Cel

.625 MBps

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

1.1 mm

4.4 mm

ALSO OPERATES AT 2.5V SUPPLY

NO

0

ASYNC, BIT

80 MHz

30

260

9.7 mm

CMOS

3.3 V

2

Serial IO/Communication Controllers

.65 mm

R-PDSO-G28

1

Not Qualified

YES

e4

SC16IS752IPW,112

NXP Semiconductors

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

INDUSTRIAL

GULL WING

28

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

2

2.5/3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP28,.25

3 V

95 Cel

.625 MBps

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

1.1 mm

4.4 mm

ALSO OPERATES AT 2.5V SUPPLY

NO

0

ASYNC, BIT

80 MHz

30

260

9.7 mm

CMOS

3.3 V

2

Serial IO/Communication Controllers

.65 mm

R-PDSO-G28

1

Not Qualified

YES

e4

SC16IS740IPW,128

NXP Semiconductors

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

INDUSTRIAL

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

2

2.5/3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

3 V

85 Cel

.625 MBps

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

1.1 mm

4.4 mm

ALSO OPERATES AT 2.5V SUPPLY

NO

ASYNC, BIT

80 MHz

30

260

5 mm

CMOS

3.3 V

1

Serial IO/Communication Controllers

.65 mm

R-PDSO-G16

1

Not Qualified

YES

e4

LAN7430T-I/Y9X

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1.32 V

TS 16949

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.28SQ,20

1.14 V

85 Cel

250 MBps

-40 Cel

QUAD

1 mm

7 mm

ALSO HAVING NETWORK PROTOCOLS IEEE 802.3AZ; IEEE 802.1Q; IEEE 802.3X

YES

0

SYNC, BIT, BYTE, ETHERNET

25 MHz

NOT SPECIFIED

NOT SPECIFIED

7 mm

CMOS

90 mA

1.2 V

8

PCI

.5 mm

S-PQCC-N48

YES

LAN7500I-ABZJ-TR

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1.26 V

0

1.2,2.5,3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC56,.31SQ,20

1.14 V

85 Cel

125 MBps

-40 Cel

MATTE TIN

QUAD

1 mm

8 mm

25MHZ NOMINAL FREQUENCY AVAILABLE; IEEE802.3AB NETWORK PROTOCOL

YES

0

SYNC; BIT ;BYTE

25 MHz

260

8 mm

CMOS

453 mA

1.2 V

0

Serial IO/Communication Controllers

USB

.5 mm

S-PQCC-N56

3

Not Qualified

YES

e3

MCP2515T-I/STG

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

INDUSTRIAL

GULL WING

20

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

TS 16949

0

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP20,.25

4.5 V

85 Cel

.125 MBps

-40 Cel

MATTE TIN

DUAL

1.2 mm

4.4 mm

NO

0

NRZ

SYNC; BIT ;BYTE

40 MHz

6.5 mm

CMOS

10 mA

5 V

1

SPI

.65 mm

R-PDSO-G20

YES

e3

MCP2515T-I/STRB2

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

INDUSTRIAL

GULL WING

20

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

TS 16949

0

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP20,.25

4.5 V

85 Cel

.125 MBps

-40 Cel

MATTE TIN

DUAL

1.2 mm

4.4 mm

NO

0

NRZ

SYNC; BIT ;BYTE

40 MHz

6.5 mm

CMOS

10 mA

5 V

1

SPI

.65 mm

R-PDSO-G20

YES

e3

SC16IS740IPW,112

NXP Semiconductors

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

INDUSTRIAL

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

2

2.5/3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

3 V

85 Cel

.625 MBps

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

1.1 mm

4.4 mm

CAN ALSO OPERATES AT 2.5 V SUPPLY

NO

0

NRZ

ASYNC, BIT

80 MHz

30

260

5 mm

CMOS

3.3 V

1

Serial IO/Communication Controllers

.65 mm

R-PDSO-G16

1

Not Qualified

YES

e4

TL16C754BPNRG4

Texas Instruments

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

INDUSTRIAL

GULL WING

80

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

3

3.3/5

FLATPACK, LOW PROFILE, FINE PITCH

QFP80,.55SQ,20

4.5 V

85 Cel

.375 MBps

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1.6 mm

12 mm

ALSO OPERATES AT 3.3V SUPPLY

NO

8

NRZ

ASYNC, BIT

50 MHz

30

260

12 mm

CMOS

5 V

4

Serial IO/Communication Controllers

.5 mm

S-PQFP-G80

3

Not Qualified

YES

e4

8

SC16IS750IPW,112

NXP Semiconductors

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

INDUSTRIAL

GULL WING

24

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

2

2.5/3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP24,.25

3 V

85 Cel

.625 MBps

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

1.1 mm

4.4 mm

CAN ALSO OPERATES AT 2.5 V SUPPLY

NO

0

NRZ

ASYNC, BIT

80 MHz

30

260

7.8 mm

CMOS

3.3 V

1

Serial IO/Communication Controllers

.65 mm

R-PDSO-G24

1

Not Qualified

YES

e4

MAX14830ETM+T

Analog Devices

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

1.95 V

0

1.8,2.5/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

1.65 V

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

QUAD

.8 mm

7 mm

NO

0

ASYNC, BIT

4 MHz

30

260

7 mm

BICMOS

1.8 V

4

Serial IO/Communication Controllers

I2C; IRDA; MICROWIRE; RS232; RS485; SPI

.5 mm

S-XQCC-N48

1

Not Qualified

YES

e3

SC16IS762IPW,112

NXP Semiconductors

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

INDUSTRIAL

GULL WING

28

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

2

2.5/3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP28,.25

3 V

95 Cel

.625 MBps

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

1.1 mm

4.4 mm

ALSO OPERATES AT 2.5V SUPPLY

NO

0

ASYNC, BIT

80 MHz

30

260

9.7 mm

CMOS

3.3 V

2

Serial IO/Communication Controllers

.65 mm

R-PDSO-G28

1

Not Qualified

YES

e4

TL16C754BPN

Texas Instruments

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

INDUSTRIAL

GULL WING

80

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

3

3.3/5

FLATPACK, LOW PROFILE, FINE PITCH

QFP80,.55SQ,20

4.5 V

85 Cel

.375 MBps

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1.6 mm

12 mm

ALSO OPERATES AT 3.3V SUPPLY

NO

8

NRZ

ASYNC, BIT

50 MHz

30

260

12 mm

CMOS

5 V

4

Serial IO/Communication Controllers

.5 mm

S-PQFP-G80

3

Not Qualified

YES

e4

SC16IS750IPW,128

NXP Semiconductors

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

INDUSTRIAL

GULL WING

24

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

2

2.5/3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP24,.25

3 V

85 Cel

.625 MBps

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

1.1 mm

4.4 mm

ALSO OPERATES AT 2.5V SUPPLY

NO

ASYNC, BIT

80 MHz

30

260

7.8 mm

CMOS

3.3 V

1

Serial IO/Communication Controllers

.65 mm

R-PDSO-G24

1

Not Qualified

YES

e4

MCP2515-E/SORB4

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

AUTOMOTIVE

GULL WING

18

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

TS 16949

0

SMALL OUTLINE

SOP18,.4

4.5 V

125 Cel

.125 MBps

-40 Cel

MATTE TIN

DUAL

2.65 mm

7.5 mm

NO

0

NRZ

SYNC; BIT ;BYTE

40 MHz

11.55 mm

CMOS

10 mA

5 V

1

SPI

1.27 mm

R-PDSO-G18

YES

e3

LAN7430T/Y9X

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

COMMERCIAL

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1.32 V

TS 16949

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.28SQ,20

1.14 V

70 Cel

250 MBps

0 Cel

QUAD

1 mm

7 mm

ALSO HAVING NETWORK PROTOCOLS IEEE 802.3AZ; IEEE 802.1Q; IEEE 802.3X

YES

0

SYNC, BIT, BYTE, ETHERNET

25 MHz

NOT SPECIFIED

NOT SPECIFIED

7 mm

CMOS

90 mA

1.2 V

8

PCI

.5 mm

S-PQCC-N48

YES

BQ79600PWRQ1

Texas Instruments

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

AUTOMOTIVE

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

24 V

AEC-Q100

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

5.5 V

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

1.2 mm

4.4 mm

NO

32.48 MHz

30

260

5 mm

CMOS

SPI, UART

.65 mm

R-PDSO-G16

2

YES

e4

SC16IS750IBS,128

NXP Semiconductors

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

2

2.5/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.16SQ,20

3 V

85 Cel

.625 MBps

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1 mm

4 mm

ALSO OPERATES AT 2.5V SUPPLY

NO

ASYNC, BIT

80 MHz

30

260

4 mm

CMOS

3.3 V

1

Serial IO/Communication Controllers

.5 mm

S-PQCC-N24

1

Not Qualified

YES

e4

TL16C754BPNG4

Texas Instruments

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

INDUSTRIAL

GULL WING

80

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

3

3.3/5

FLATPACK, LOW PROFILE, FINE PITCH

QFP80,.55SQ,20

4.5 V

85 Cel

.375 MBps

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1.6 mm

12 mm

ALSO OPERATES AT 3.3V SUPPLY

NO

8

NRZ

ASYNC, BIT

50 MHz

30

260

12 mm

CMOS

5 V

4

Serial IO/Communication Controllers

.5 mm

S-PQFP-G80

3

Not Qualified

YES

e4

LAN9512-JZX-TR

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

COMMERCIAL

NO LEAD

64

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.35SQ,20

3 V

70 Cel

60 MBps

0 Cel

MATTE TIN

QUAD

1 mm

9 mm

YES

0

BIT, BYTE, ETHERNET

25 MHz

260

9 mm

CMOS

3.3 V

2

USB

.5 mm

S-PQCC-N64

1

YES

e3

MCP2515-E/STVAO

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

AUTOMOTIVE

GULL WING

20

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

AEC-Q100; TS 16949

0

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP20,.25

4.5 V

125 Cel

.125 MBps

-40 Cel

MATTE TIN

DUAL

1.2 mm

4.4 mm

NO

0

NRZ

SYNC; BIT ;BYTE

40 MHz

6.5 mm

CMOS

10 mA

5 V

1

SPI

.65 mm

R-PDSO-G20

YES

e3

Serial Communication Controllers

Serial communication controllers are electronic devices that manage the input/output operations between a computer or microcontroller and other devices through serial communication protocols such as UART, SPI, I2C, and USB. These controllers provide an interface that allows the computer or microcontroller to send and receive data over a serial connection and manage the communication operations.

Serial communication controllers can be integrated into the computer or microcontroller's chipset or added as an external module. They typically include a serial interface that connects to the device and a host interface that connects to the computer or microcontroller's bus system. The serial interface can be based on various standards such as UART, SPI, or I2C, while the host interface can be based on various standards such as PCI, PCIe, or USB.

Serial communication controllers offer various benefits such as increased data transfer rates, improved reliability, and increased compatibility with a wide range of devices. They also provide advanced features such as error checking, flow control, and clock synchronization that can improve the accuracy and reliability of the communication.