AUTOMOTIVE Serial Communication Controllers 81

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Maximum Data Transfer Rate	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Data Encoding or Decoding Method	Communication Protocol	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of Serial I/Os	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Low Power Mode	JESD-609 Code	No. of I/O Lines
MCP2518FDT-E/SL	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V					SMALL OUTLINE	SOP14,.24	2.7 V	125 Cel	1 MBps	-40 Cel	MATTE TIN	DUAL	1.75 mm		3.9 mm		NO			SYNC; BIT ;BYTE	40 MHz	30	260	8.65 mm	CMOS	20 mA	3.3 V	1		SPI	1.27 mm	R-PDSO-G14			YES	e3
MCP2518FDT-E/QBB	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	AUTOMOTIVE	NO LEAD	14	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		TS 16949			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,25	2.7 V	125 Cel	1 MBps	-40 Cel	MATTE TIN	DUAL	.9 mm		3 mm		NO			SYNC; BIT ;BYTE	40 MHz	30	260	4.5 mm	CMOS	20 mA	3.3 V	1		SPI	.65 mm	R-PDSO-N14			YES	e3
MCP2518FDT-H/QBB	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	AUTOMOTIVE	NO LEAD	14	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,25	2.7 V	150 Cel	1 MBps	-40 Cel	MATTE TIN	DUAL	.9 mm		3 mm		NO			SYNC; BIT ;BYTE	40 MHz	30	260	4.5 mm	CMOS	20 mA	3.3 V	1		SPI	.65 mm	R-PDSO-N14			YES	e3
MCP2515-E/SO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	AUTOMOTIVE	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8		0		SMALL OUTLINE	SOP18,.4	4.5 V	125 Cel	.125 MBps	-40 Cel	MATTE TIN	DUAL	2.65 mm	14	7.5 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			11.55 mm	CMOS	10 mA	5 V	1		SPI	1.27 mm	R-PDSO-G18	1		YES	e3	0
MCP2518FDT-E/QBBVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	AUTOMOTIVE	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		AEC-Q100; TS 16949	0		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	LCC14,.18X.12,30	2.7 V	125 Cel	1 MBps	-40 Cel	MATTE TIN	DUAL	.9 mm		3 mm		NO	0		SYNC; BIT ;BYTE	40 MHz	30	260	4.5 mm	CMOS	20 mA	3.3 V	1		SPI	.65 mm	R-PDSO-N14			YES	e3
MCP2518FDT-H/SL	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V					SMALL OUTLINE	SOP14,.24	2.7 V	150 Cel	1 MBps	-40 Cel	MATTE TIN	DUAL	1.75 mm		3.9 mm		NO			SYNC; BIT ;BYTE	40 MHz	30	260	8.65 mm	CMOS	20 mA	3.3 V	1		SPI	1.27 mm	R-PDSO-G14			YES	e3
MCP2518FDT-E/SLVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		AEC-Q100; TS 16949	0		SMALL OUTLINE	SOP14,.24	2.7 V	125 Cel	1 MBps	-40 Cel	MATTE TIN	DUAL	1.75 mm		3.9 mm		NO	0		SYNC; BIT ;BYTE	40 MHz	30	260	8.65 mm	CMOS	20 mA	3.3 V	1		SPI	1.27 mm	R-PDSO-G14			YES	e3
MCP2515-E/ST	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	AUTOMOTIVE	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V			0		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	4.5 V	125 Cel	.125 MBps	-40 Cel	Matte Tin (Sn)	DUAL	1.2 mm		4.4 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz	40	260	6.5 mm	CMOS		5 V	1		CAN, SPI	.65 mm	R-PDSO-G20	1	Not Qualified	YES	e3
MCP2518FDT-H/SLVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		AEC-Q100; TS 16949			SMALL OUTLINE	SOP14,.24	2.7 V	150 Cel	1 MBps	-40 Cel	MATTE TIN	DUAL	1.75 mm		3.9 mm		NO			SYNC; BIT ;BYTE	40 MHz	30	260	8.65 mm	CMOS	20 mA	3.3 V	1		SPI	1.27 mm	R-PDSO-G14			YES	e3
MCP2518FDT-H/QBBVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	AUTOMOTIVE	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		AEC-Q100; TS 16949	0		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	LCC14,.18X.12,30	2.7 V	150 Cel	1 MBps	-40 Cel	MATTE TIN	DUAL	.9 mm		3 mm		NO	0		SYNC; BIT ;BYTE	40 MHz	30	260	4.5 mm	CMOS	20 mA	3.3 V	1		SPI	.65 mm	R-PDSO-N14			YES	e3
SJA1000T/N1,118	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, LAN	AUTOMOTIVE	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V			8		SMALL OUTLINE		4.5 V	125 Cel	.125 MBps	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2.65 mm		7.5 mm		NO	8	NRZ		24 MHz	30	260	17.9 mm	CMOS		5 V	2			1.27 mm	R-PDSO-G28	1	Not Qualified	YES	e4
SJA1000T/N1,112	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, LAN	AUTOMOTIVE	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V			8		SMALL OUTLINE		4.5 V	125 Cel	.125 MBps	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2.65 mm		7.5 mm		NO	8	NRZ		24 MHz	30	260	17.9 mm	CMOS		5 V	2			1.27 mm	R-PDSO-G28	1	Not Qualified	YES	e4
SJA1000T/N1	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, LAN	AUTOMOTIVE	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V			8	5	SMALL OUTLINE	SOP28,.4	4.5 V	125 Cel	.125 MBps	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2.65 mm		7.5 mm		NO	8	NRZ		24 MHz	30	260	17.9 mm	CMOS	15 mA	5 V	2	Serial IO/Communication Controllers		1.27 mm	R-PDSO-G28	1	Not Qualified	YES	e4
SJA1000T/N,118	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, LAN	AUTOMOTIVE	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V			8		SMALL OUTLINE		4.5 V	125 Cel	.125 MBps	-40 Cel	MATTE TIN	DUAL	2.65 mm		7.5 mm		NO	8	NRZ		24 MHz			17.9 mm	CMOS		5 V	2			1.27 mm	R-PDSO-G28		Not Qualified	YES	e3
SJA1000T/N,112	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, LAN	AUTOMOTIVE	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V			8		SMALL OUTLINE		4.5 V	125 Cel	.125 MBps	-40 Cel	MATTE TIN	DUAL	2.65 mm		7.5 mm		NO	8	NRZ		24 MHz			17.9 mm	CMOS		5 V	2			1.27 mm	R-PDSO-G28		Not Qualified	YES	e3
MCP2515-E/ML	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	AUTOMOTIVE	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	5.5 V	8		0		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	4.5 V	125 Cel	.125 MBps	-40 Cel	MATTE TIN	QUAD	1 mm	14	4 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz	40	260	4 mm	CMOS	10 mA	5 V	1		SPI	.5 mm	S-PQCC-N20	1		YES	e3	0
MCP2515-E/SOVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	AUTOMOTIVE	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8	AEC-Q100	0		SMALL OUTLINE	SOP18,.4	4.5 V	125 Cel	.125 MBps	-40 Cel	MATTE TIN	DUAL	2.65 mm	14	7.5 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			11.55 mm	CMOS	10 mA	5 V	1		SPI	1.27 mm	R-PDSO-G18			YES	e3	0
MCP2515-E/SORB4	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	AUTOMOTIVE	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		TS 16949	0		SMALL OUTLINE	SOP18,.4	4.5 V	125 Cel	.125 MBps	-40 Cel	MATTE TIN	DUAL	2.65 mm		7.5 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			11.55 mm	CMOS	10 mA	5 V	1		SPI	1.27 mm	R-PDSO-G18			YES	e3
BQ79600PWRQ1	Texas Instruments	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	24 V		AEC-Q100			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	5.5 V	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	1.2 mm		4.4 mm		NO				32.48 MHz	30	260	5 mm	CMOS					SPI, UART	.65 mm	R-PDSO-G16	2		YES	e4
MCP2515-E/STVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	AUTOMOTIVE	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		AEC-Q100; TS 16949	0		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	4.5 V	125 Cel	.125 MBps	-40 Cel	MATTE TIN	DUAL	1.2 mm		4.4 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			6.5 mm	CMOS	10 mA	5 V	1		SPI	.65 mm	R-PDSO-G20			YES	e3
SJA1000TD	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, LAN	AUTOMOTIVE	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V			8	5	SMALL OUTLINE	SOP28,.4	4.5 V	125 Cel	.125 MBps	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	2.65 mm		7.5 mm		NO	8	NRZ		24 MHz	40	260	17.9 mm	CMOS	15 mA	5 V	2	Serial IO/Communication Controllers		1.27 mm	R-PDSO-G28		Not Qualified	YES	e4
MCP2515-E/SORB2	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	AUTOMOTIVE	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		TS 16949	0		SMALL OUTLINE	SOP18,.4	4.5 V	125 Cel	.125 MBps	-40 Cel	MATTE TIN	DUAL	2.65 mm		7.5 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			11.55 mm	CMOS	10 mA	5 V	1		SPI	1.27 mm	R-PDSO-G18			YES	e3
MCP2515-E/STRB4	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	AUTOMOTIVE	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		TS 16949	0		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	4.5 V	125 Cel	.125 MBps	-40 Cel	MATTE TIN	DUAL	1.2 mm		4.4 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			6.5 mm	CMOS	10 mA	5 V	1		SPI	.65 mm	R-PDSO-G20			YES	e3
MCP2515-E/STRB2	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	AUTOMOTIVE	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		TS 16949	0		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	4.5 V	125 Cel	.125 MBps	-40 Cel	MATTE TIN	DUAL	1.2 mm		4.4 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			6.5 mm	CMOS	10 mA	5 V	1		SPI	.65 mm	R-PDSO-G20			YES	e3
MCP2515T-E/ST	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	AUTOMOTIVE	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V			0		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	4.5 V	125 Cel	.125 MBps	-40 Cel	MATTE TIN	DUAL	1.2 mm		4.4 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			6.5 mm	CMOS		5 V	1		CAN, SPI	.65 mm	R-PDSO-G20	1	Not Qualified	YES	e3
MCP2515T-E/SO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	AUTOMOTIVE	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V			0		SMALL OUTLINE	SOP18,.4	4.5 V	125 Cel	.125 MBps	-40 Cel	MATTE TIN	DUAL	2.65 mm		7.5 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz		260	11.55 mm	CMOS		5 V	1		CAN, SPI	1.27 mm	R-PDSO-G18	1	Not Qualified	YES	e3
SJA1000T	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, LAN	AUTOMOTIVE	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V			8	5	SMALL OUTLINE	SOP28,.4	4.5 V	125 Cel	.125 MBps	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2.65 mm		7.5 mm		NO	8	NRZ		24 MHz	40	260	17.9 mm	CMOS	15 mA	5 V	2	Serial IO/Communication Controllers		1.27 mm	R-PDSO-G28		Not Qualified	YES	e4
CC770ELQFP44	Robert Bosch	SERIAL IO/COMMUNICATION CONTROLLER, LAN	AUTOMOTIVE	GULL WING	44	QFP	UNSPECIFIED	PLASTIC/EPOXY	YES	5.5 V			16		FLATPACK		4.5 V	125 Cel		-40 Cel		QUAD					NO	16		ASYNC, BIT; SYNC, BYTE; SDLC	20 MHz	NOT SPECIFIED	NOT SPECIFIED		CMOS		5 V	2				X-PQFP-G44			YES
MCP2515-E/MLVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	AUTOMOTIVE	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	5.5 V	8	AEC-Q100	0		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	4.5 V	125 Cel	.125 MBps	-40 Cel	MATTE TIN	QUAD	1 mm	14	4 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			4 mm	CMOS	10 mA	5 V	1		SPI	.5 mm	S-PQCC-N20			YES	e3	0
CC770EPLCC44	Robert Bosch	SERIAL IO/COMMUNICATION CONTROLLER, LAN	AUTOMOTIVE	NO LEAD	44	QCCN	UNSPECIFIED	PLASTIC/EPOXY	YES	5.5 V			16		CHIP CARRIER		4.5 V	125 Cel		-40 Cel		QUAD					NO	16		ASYNC, BIT; SYNC, BYTE; SDLC	20 MHz	NOT SPECIFIED	NOT SPECIFIED		CMOS		5 V	2				X-PQCC-N44			YES
MCP2515T-E/ML	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	AUTOMOTIVE	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	5.5 V	8		0		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	4.5 V	125 Cel	.125 MBps	-40 Cel	MATTE TIN	QUAD	1 mm	14	4 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz		260	4 mm	CMOS	10 mA	5 V	1		SPI	.5 mm	S-PQCC-N20	1		YES	e3	0
MCP2515T-E/SOVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	AUTOMOTIVE	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		AEC-Q100; TS 16949	0		SMALL OUTLINE	SOP18,.4	4.5 V	125 Cel	.125 MBps	-40 Cel	MATTE TIN	DUAL	2.65 mm		7.5 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			11.55 mm	CMOS	10 mA	5 V	1		SPI	1.27 mm	R-PDSO-G18			YES	e3
IA82527PQF44AR2	Analog Devices	SERIAL IO/COMMUNICATION CONTROLLER, LAN	AUTOMOTIVE	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V			16		FLATPACK		3 V	125 Cel		-40 Cel		QUAD	2.4384 mm		10.0076 mm	PITCH VALUE-0.7874	NO	16		CAN; ASYNC, BIT; SYNC, BYTE	16 MHz			10.0076 mm	CMOS		3.3 V	2		CAN	.78 mm	S-PQFP-G44			YES
MCP2515T-E/STRB4	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	AUTOMOTIVE	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		TS 16949	0		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	4.5 V	125 Cel	.125 MBps	-40 Cel	MATTE TIN	DUAL	1.2 mm		4.4 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			6.5 mm	CMOS	10 mA	5 V	1		SPI	.65 mm	R-PDSO-G20			YES	e3
0272240123	Robert Bosch	SERIAL IO/COMMUNICATION CONTROLLER, LAN	AUTOMOTIVE	NO LEAD	44	QCCN	SQUARE	PLASTIC/EPOXY	YES	5.5 V			16	5	CHIP CARRIER	LDCC44,.7SQ	4.5 V	125 Cel		-40 Cel		QUAD					NO	16		ASYNC, BIT; SYNC, BYTE; SDLC	20 MHz				CMOS	50 mA	5 V	2	Other Microprocessor ICs		1.27 mm	S-PQCC-N44		Not Qualified	YES
MCP2515T-E/STRB2	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	AUTOMOTIVE	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		TS 16949	0		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	4.5 V	125 Cel	.125 MBps	-40 Cel	MATTE TIN	DUAL	1.2 mm		4.4 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			6.5 mm	CMOS	10 mA	5 V	1		SPI	.65 mm	R-PDSO-G20			YES	e3
AN82527F8ST111	Intel	SERIAL IO/COMMUNICATION CONTROLLER, LAN	AUTOMOTIVE	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	5.5 V			16		CHIP CARRIER		4.5 V	125 Cel		-40 Cel		QUAD				IT IS ALSO AVAILABLE IN QFP-44 PACKAGE	NO	16			16 MHz				CMOS		5 V	2				S-PQCC-J44			YES
SJA1000/N1,112	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, LAN	AUTOMOTIVE	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V			8		IN-LINE		4.5 V	125 Cel	.125 MBps	-40 Cel	TIN	DUAL	5.1 mm		15.24 mm		NO	8	NRZ		24 MHz			35.5 mm	CMOS		5 V	2			2.54 mm	R-PDIP-T28		Not Qualified	YES	e3
AN82527F8ST131	Intel	SERIAL IO/COMMUNICATION CONTROLLER, LAN	AUTOMOTIVE	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	5.5 V			16		CHIP CARRIER		4.5 V	125 Cel		-40 Cel		QUAD				IT IS ALSO AVAILABLE IN QFP-44 PACKAGE	NO	16			16 MHz				CMOS		5 V	2				S-PQCC-J44			YES
MCP2515-E/P	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	AUTOMOTIVE	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V	8		0		IN-LINE	DIP18,.3	4.5 V	125 Cel	.125 MBps	-40 Cel	MATTE TIN	DUAL	5.334 mm	14	7.62 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			22.86 mm	CMOS	10 mA	5 V	1		SPI	2.54 mm	R-PDIP-T18			YES	e3	0
IA82527PLC44AR2	Analog Devices	SERIAL IO/COMMUNICATION CONTROLLER, LAN	AUTOMOTIVE	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	5.5 V			16		CHIP CARRIER		3 V	125 Cel		-40 Cel		QUAD	4.572 mm		16.5862 mm		NO	16		CAN; ASYNC, BIT; SYNC, BYTE	16 MHz			16.5862 mm	CMOS		3.3 V	2		CAN	1.27 mm	S-PQCC-J44			YES
MCP2515T-E/STVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	AUTOMOTIVE	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		AEC-Q100; TS 16949	0		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	4.5 V	125 Cel	.125 MBps	-40 Cel	MATTE TIN	DUAL	1.2 mm		4.4 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			6.5 mm	CMOS	10 mA	5 V	1		SPI	.65 mm	R-PDSO-G20			YES	e3
MB88121CPMC1-GSE2	Fujitsu	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	AUTOMOTIVE	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V					FLATPACK	QFP64(UNSPEC)	3 V	125 Cel	1 MBps	-40 Cel		QUAD					NO			ASYNC, BIT	16 MHz				CMOS					SPI		S-PQFP-G64			NO
MCP2515T-E/MLVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	AUTOMOTIVE	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	5.5 V	8	AEC-Q100	0		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	4.5 V	125 Cel	.125 MBps	-40 Cel	MATTE TIN	QUAD	1 mm	14	4 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			4 mm	CMOS	10 mA	5 V	1		SPI	.5 mm	S-PQCC-N20			YES	e3	0
SJA1000N	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, LAN	AUTOMOTIVE	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V			8		IN-LINE		4.5 V	125 Cel	.125 MBps	-40 Cel		DUAL	5.1 mm		15.24 mm		NO	8	NRZ		24 MHz	40	245	35.5 mm	CMOS		5 V	2			2.54 mm	R-PDIP-T28		Not Qualified	YES
AN82527	Rochester Electronics	SERIAL IO/COMMUNICATION CONTROLLER, LAN	AUTOMOTIVE	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	5.5 V			16		CHIP CARRIER		4.5 V	125 Cel		-40 Cel		QUAD	4.57 mm		16.5862 mm		NO	16	NRZ		16 MHz	NOT SPECIFIED	NOT SPECIFIED	16.5862 mm	CMOS		5 V	2			1.27 mm	S-PQCC-J44			YES
MFR4310E1MAE40	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	AUTOMOTIVE	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	2.75 V			16	2.5,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	2.25 V	125 Cel	1.25 MBps	-40 Cel	TIN	QUAD	1.6 mm		10 mm	IT ALSO REQUIRES 3.3V I/O SUPPLY	NO	16	NRZ		40 MHz	40	260	10 mm	CMOS		2.5 V	2	Other uPs/uCs/Peripheral ICs		.5 mm	S-PQFP-G64	3	Not Qualified	YES	e3
P82C150AHT	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, LAN	AUTOMOTIVE	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.2 V			0	5	SMALL OUTLINE	SOP28,.4	4.8 V	125 Cel	.0152587890625 MBps	-40 Cel		DUAL	2.65 mm		7.5 mm		NO	0						17.9 mm	CMOS	22 mA	5 V	1	Serial IO/Communication Controllers		1.27 mm	R-PDSO-G28		Not Qualified	YES

Serial Communication Controllers

Serial communication controllers are electronic devices that manage the input/output operations between a computer or microcontroller and other devices through serial communication protocols such as UART, SPI, I2C, and USB. These controllers provide an interface that allows the computer or microcontroller to send and receive data over a serial connection and manage the communication operations.

Serial communication controllers can be integrated into the computer or microcontroller's chipset or added as an external module. They typically include a serial interface that connects to the device and a host interface that connects to the computer or microcontroller's bus system. The serial interface can be based on various standards such as UART, SPI, or I2C, while the host interface can be based on various standards such as PCI, PCIe, or USB.

Serial communication controllers offer various benefits such as increased data transfer rates, improved reliability, and increased compatibility with a wide range of devices. They also provide advanced features such as error checking, flow control, and clock synchronization that can improve the accuracy and reliability of the communication.