Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Maximum Data Transfer Rate | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | RAM Words | Width | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Data Encoding or Decoding Method | Communication Protocol | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | No. of Timers | RAM Bytes | Technology | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Drive Interface Standard | Low Power Mode | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Broadcom |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
BALL |
169 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
55 Cel |
0 Cel |
BOTTOM |
3.3V to 1.2V Voltage Regulator Control available |
YES |
SYNC, BIT, BYTE, ETHERNET |
24 MHz |
260 |
CMOS |
PCI, SMBUS |
S-PBGA-B169 |
3 |
YES |
||||||||||||||||||||||||||||||||||||||||||||||
Broadcom |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Broadcom |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
GULL WING |
128 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
32 |
FLATPACK, LOW PROFILE, FINE PITCH |
4.5 V |
70 Cel |
7.5 MBps |
0 Cel |
QUAD |
1.6 mm |
24 mm |
NO |
32 |
ASYNC, BIT |
40 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
24 mm |
CMOS |
5 V |
2 |
PCI |
.5 mm |
S-PQFP-G128 |
YES |
|||||||||||||||||||||||||||||||||||
Broadcom |
MILITARY |
PIN/PEG |
180 |
PGA |
SQUARE |
CERAMIC |
NO |
38535Q/M;38534H;883B |
5 |
GRID ARRAY |
PGA180M,15X15 |
125 Cel |
-55 Cel |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
5 V |
Serial IO/Communication Controllers |
2.54 mm |
S-XPGA-P180 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||||
Broadcom |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
COMMERCIAL |
GULL WING |
160 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
FLATPACK |
QFP160,1.2SQ |
70 Cel |
0 Cel |
QUAD |
CMOS |
130 mA |
5 V |
Serial IO/Communication Controllers |
.635 mm |
S-PQFP-G160 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||
Broadcom |
COMMERCIAL |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5 |
IN-LINE |
DIP24,.3 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
CMOS |
5 V |
Serial IO/Communication Controllers |
2.54 mm |
R-PDIP-T24 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||||
Broadcom |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
GULL WING |
120 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
32 |
FLATPACK, LOW PROFILE, FINE PITCH |
3 V |
50 MBps |
TIN LEAD |
QUAD |
1.6 mm |
14 mm |
NO |
32 |
24.576 MHz |
30 |
240 |
14 mm |
CMOS |
3.3 V |
2 |
PCI |
.4 mm |
S-PQFP-G120 |
Not Qualified |
YES |
e0 |
|||||||||||||||||||||||||||||||||||||
|
Broadcom |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
BALL |
129 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
32 |
3.3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA129,13X13,20 |
3 V |
70 Cel |
50 MBps |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
.98 mm |
7 mm |
NO |
32 |
24.5785 MHz |
7 mm |
CMOS |
3.3 V |
2 |
Bus Controllers |
.5 mm |
S-PBGA-B129 |
Not Qualified |
YES |
e1 |
|||||||||||||||||||||||||||||||||
Broadcom |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
32 |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
3 V |
70 Cel |
50 MBps |
0 Cel |
MATTE TIN |
QUAD |
1.6 mm |
14 mm |
NO |
32 |
24.5785 MHz |
40 |
250 |
14 mm |
CMOS |
3.3 V |
3 |
Bus Controllers |
PCI |
.5 mm |
S-PQFP-G100 |
Not Qualified |
YES |
e3 |
|||||||||||||||||||||||||||||||
Broadcom |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
CHIP CARRIER |
LDCC44,.7SQ |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
5 V |
Serial IO/Communication Controllers |
1.27 mm |
S-PQCC-J44 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||||
Broadcom |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5 |
IN-LINE |
DIP40,.6 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
200 mA |
5 V |
Serial IO/Communication Controllers |
2.54 mm |
R-PDIP-T40 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||||
Broadcom |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
CERAMIC |
YES |
5 |
CHIP CARRIER |
LDCC28,.5SQ |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
5 V |
Serial IO/Communication Controllers |
1.27 mm |
S-XQCC-J28 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||||
Broadcom |
COMMERCIAL |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
5 |
IN-LINE |
DIP24,.3 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
CMOS |
5 V |
Serial IO/Communication Controllers |
2.54 mm |
R-XDIP-T24 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||||
Broadcom |
COMMERCIAL |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
5 |
IN-LINE |
DIP24,.3 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
CMOS |
5 V |
Serial IO/Communication Controllers |
2.54 mm |
R-XDIP-T24 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||||
Broadcom |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
GULL WING |
144 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5 |
FLATPACK |
QUAD |
YES |
16 |
NRZ |
CMOS |
5 V |
0 |
R-PQFP-G144 |
Not Qualified |
NO |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
Broadcom |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
BALL |
100 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA100,12X12,32 |
3 V |
70 Cel |
50 MBps |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.46 mm |
10 mm |
NO |
0 |
ASYNC, BIT |
24.5785 MHz |
10 mm |
CMOS |
3.3 V |
2 |
Bus Controllers |
.8 mm |
S-PBGA-B100 |
Not Qualified |
YES |
e1 |
||||||||||||||||||||||||||||||||
|
Broadcom |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Broadcom |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
CERAMIC |
YES |
5 |
CHIP CARRIER |
LDCC28,.5SQ |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
5 V |
Serial IO/Communication Controllers |
1.27 mm |
S-XQCC-J28 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||||
Broadcom |
COMMERCIAL |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
5 |
IN-LINE |
DIP24,.3 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
CMOS |
5 V |
Serial IO/Communication Controllers |
2.54 mm |
R-XDIP-T24 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||||
Broadcom |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
CERAMIC |
YES |
5 |
CHIP CARRIER |
LDCC28,.5SQ |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
5 V |
Serial IO/Communication Controllers |
1.27 mm |
S-XQCC-J28 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||||
|
Broadcom |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
BALL |
129 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
32 |
3.3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA129,13X13,20 |
3 V |
70 Cel |
50 MBps |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
.98 mm |
7 mm |
NO |
32 |
24.5785 MHz |
7 mm |
CMOS |
3.3 V |
1 |
Bus Controllers |
.5 mm |
S-PBGA-B129 |
Not Qualified |
YES |
e1 |
|||||||||||||||||||||||||||||||||
Broadcom |
COMMERCIAL |
PIN/PEG |
180 |
PGA |
SQUARE |
CERAMIC |
NO |
5 |
GRID ARRAY |
PGA180M,15X15 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
5 V |
Serial IO/Communication Controllers |
2.54 mm |
S-XPGA-P180 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||||
Broadcom |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
COMMERCIAL |
GULL WING |
128 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5 |
FLATPACK |
QFP128,.67X.93,20 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
130 mA |
5 V |
Serial IO/Communication Controllers |
.5 mm |
R-PQFP-G128 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||
Broadcom |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
COMMERCIAL |
NO LEAD |
68 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
2.62 V |
CHIP CARRIER |
2.38 V |
70 Cel |
125 MBps |
0 Cel |
MATTE TIN |
QUAD |
10 mm |
YES |
BIPH-LEVEL(MANCHESTER) |
25 MHz |
40 |
260 |
10 mm |
CMOS |
2.5 V |
1 |
.5 mm |
S-XQCC-N68 |
Not Qualified |
YES |
e3 |
|||||||||||||||||||||||||||||||||||||
Broadcom |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
5.25 V |
3 |
5 |
IN-LINE |
DIP40,.6 |
4.75 V |
70 Cel |
2.5 MBps |
0 Cel |
TIN LEAD |
DUAL |
5.72 mm |
15.24 mm |
NO |
8 |
BIPH-LEVEL(MANCHESTER) |
52.325 mm |
CMOS |
40 mA |
5 V |
1 |
Serial IO/Communication Controllers |
2.54 mm |
R-GDIP-T40 |
Not Qualified |
NO |
e0 |
|||||||||||||||||||||||||||||||||
Broadcom |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
COMMERCIAL |
GULL WING |
128 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.3/5 |
FLATPACK |
QFP128,.67X.93,20 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
Serial IO/Communication Controllers |
.5 mm |
R-PQFP-G128 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||||
Broadcom |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
GULL WING |
120 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
32 |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP120,.63SQ,16 |
3 V |
70 Cel |
50 MBps |
0 Cel |
TIN LEAD |
QUAD |
1.6 mm |
14 mm |
NO |
32 |
24.5785 MHz |
30 |
225 |
14 mm |
CMOS |
3.3 V |
2 |
Bus Controllers |
PCI |
.4 mm |
S-PQFP-G120 |
Not Qualified |
YES |
e0 |
|||||||||||||||||||||||||||||||
Broadcom |
MILITARY |
J BEND |
196 |
QCCJ |
CERAMIC |
YES |
38535Q/M;38534H;883B |
5 |
CHIP CARRIER |
LDCC196(UNSPEC) |
125 Cel |
-55 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
5 V |
Serial IO/Communication Controllers |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||||||
Broadcom |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
CERAMIC |
YES |
5 |
CHIP CARRIER |
LDCC28,.5SQ |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
5 V |
Serial IO/Communication Controllers |
1.27 mm |
S-XQCC-J28 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||||
Broadcom |
COMMERCIAL |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5 |
IN-LINE |
DIP24,.3 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
CMOS |
5 V |
Serial IO/Communication Controllers |
2.54 mm |
R-PDIP-T24 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||||
Broadcom |
COMMERCIAL |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
5 |
IN-LINE |
DIP24,.3 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
CMOS |
5 V |
Serial IO/Communication Controllers |
2.54 mm |
R-XDIP-T24 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||||
Broadcom |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5 |
IN-LINE |
DIP40,.6 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
CMOS |
40 mA |
5 V |
Serial IO/Communication Controllers |
2.54 mm |
R-PDIP-T40 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||
Broadcom |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
BALL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
125 MBps |
BOTTOM |
IT ALSO OPERATES AT 2.5V AND 3.3V |
NO |
CMOS |
1.2 V |
PCI |
S-PBGA-B484 |
Not Qualified |
YES |
||||||||||||||||||||||||||||||||||||||||||||||||||
Broadcom |
COMMERCIAL |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5 |
IN-LINE |
DIP24,.3 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
CMOS |
5 V |
Serial IO/Communication Controllers |
2.54 mm |
R-PDIP-T24 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||||
Broadcom |
COMMERCIAL |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
5 |
IN-LINE |
DIP24,.3 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
CMOS |
5 V |
Serial IO/Communication Controllers |
2.54 mm |
R-XDIP-T24 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||||
Broadcom |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
NO LEAD |
48 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
CHIP CARRIER |
QUAD |
NO |
CMOS |
PCI |
S-XQCC-N48 |
Not Qualified |
YES |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
Broadcom |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
NO LEAD |
68 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
CHIP CARRIER |
QUAD |
NO |
CMOS |
PCI |
S-XQCC-N68 |
Not Qualified |
YES |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
Broadcom |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
CHIP CARRIER |
LDCC28,.5SQ |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
5 V |
Serial IO/Communication Controllers |
1.27 mm |
S-PQCC-J28 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||||
Broadcom |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
5 |
IN-LINE |
DIP40,.6 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
200 mA |
5 V |
Serial IO/Communication Controllers |
2.54 mm |
R-XDIP-T40 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||||
Broadcom |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
GULL WING |
120 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
32 |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP120,.63SQ,16 |
3 V |
70 Cel |
50 MBps |
0 Cel |
MATTE TIN |
QUAD |
1.6 mm |
14 mm |
NO |
32 |
24.5785 MHz |
40 |
250 |
14 mm |
CMOS |
3.3 V |
2 |
Bus Controllers |
PCI |
.4 mm |
S-PQFP-G120 |
Not Qualified |
YES |
e3 |
|||||||||||||||||||||||||||||||
Broadcom |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
CHIP CARRIER |
LDCC28,.5SQ |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
5 V |
Serial IO/Communication Controllers |
1.27 mm |
S-PQCC-J28 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||||
Broadcom |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
COMMERCIAL |
J BEND |
QCCJ |
PLASTIC/EPOXY |
YES |
5 |
CHIP CARRIER |
LDCC(UNSPEC) |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
200 mA |
5 V |
Serial IO/Communication Controllers |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||||||||
Broadcom |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
CERAMIC |
YES |
5 |
CHIP CARRIER |
LDCC28,.5SQ |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
5 V |
Serial IO/Communication Controllers |
1.27 mm |
S-XQCC-J28 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||||
Broadcom |
COMMERCIAL |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
5 |
IN-LINE |
DIP24,.3 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
CMOS |
5 V |
Serial IO/Communication Controllers |
2.54 mm |
R-XDIP-T24 |
Not Qualified |
e0 |
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|
Broadcom |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
BALL |
129 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
32 |
3.3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA129,13X13,20 |
3 V |
70 Cel |
50 MBps |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
.98 mm |
7 mm |
NO |
32 |
24.5785 MHz |
7 mm |
CMOS |
3.3 V |
1 |
Bus Controllers |
.5 mm |
S-PBGA-B129 |
Not Qualified |
YES |
e1 |
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Broadcom |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
COMMERCIAL |
GULL WING |
128 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5 |
FLATPACK |
TQFP128,.63X.87 |
70 Cel |
0 Cel |
QUAD |
CMOS |
130 mA |
5 V |
Serial IO/Communication Controllers |
.5 mm |
R-PQFP-G128 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||
Broadcom |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
COMMERCIAL |
GULL WING |
208 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.3 |
FLATPACK |
QFP208,1.2SQ,20 |
70 Cel |
0 Cel |
QUAD |
CMOS |
300 mA |
3.3 V |
Serial IO/Communication Controllers |
.5 mm |
S-PQFP-G208 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||
|
Broadcom |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
BALL |
129 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
3.3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA129,13X13,20 |
3 V |
70 Cel |
50 MBps |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
.98 mm |
7 mm |
NO |
0 |
ASYNC, BIT |
24.578 MHz |
7 mm |
CMOS |
3.3 V |
2 |
Bus Controllers |
.5 mm |
S-PBGA-B129 |
Not Qualified |
YES |
e1 |
Serial communication controllers are electronic devices that manage the input/output operations between a computer or microcontroller and other devices through serial communication protocols such as UART, SPI, I2C, and USB. These controllers provide an interface that allows the computer or microcontroller to send and receive data over a serial connection and manage the communication operations.
Serial communication controllers can be integrated into the computer or microcontroller's chipset or added as an external module. They typically include a serial interface that connects to the device and a host interface that connects to the computer or microcontroller's bus system. The serial interface can be based on various standards such as UART, SPI, or I2C, while the host interface can be based on various standards such as PCI, PCIe, or USB.
Serial communication controllers offer various benefits such as increased data transfer rates, improved reliability, and increased compatibility with a wide range of devices. They also provide advanced features such as error checking, flow control, and clock synchronization that can improve the accuracy and reliability of the communication.