IXYS Corporation Serial Communication Controllers 13

Reset All

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Maximum Data Transfer Rate	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Data Encoding or Decoding Method	Communication Protocol	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Low Power Mode	JESD-609 Code	No. of I/O Lines
Z84C4006PEG	IXYS Corporation	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V	0	1		IN-LINE		4.5 V	100 Cel		-40 Cel	MATTE TIN	DUAL	4.75 mm	0	15.24 mm		NO	8	NRZ	ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC	6.17 MHz			52.325 mm	CMOS	10 mA	5 V	0	2		Z80	2.54 mm	R-PDIP-T40		Not Qualified	YES	e3	0
Z0847006PSG	IXYS Corporation	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.25 V	0	0		IN-LINE		4.75 V	70 Cel	.15 MBps	0 Cel	MATTE TIN	DUAL	4.75 mm	0	15.24 mm		NO	8	NRZ	ASYNC, BIT	6 MHz			52.325 mm	NMOS	100 mA	5 V	0	2		Z80	2.54 mm	R-PDIP-T40		Not Qualified	NO	e3	0
Z16C3010VEG	IXYS Corporation	SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL	INDUSTRIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES	5.5 V		16		CHIP CARRIER		4.5 V	85 Cel	1.25 MBps	-40 Cel	MATTE TIN	QUAD	4.57 mm		24.23 mm		NO	16	NRZ; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL	ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC; EXT SYNC; BISYNC TRANSPARENT; NBIP	20 MHz			24.23 mm	CMOS		5 V		2		8X86; 680X0	1.27 mm	S-PQCC-J68		Not Qualified	NO	e3
Z84C4206PEG	IXYS Corporation	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V	0	1		IN-LINE		4.5 V	100 Cel		-40 Cel	MATTE TIN	DUAL	4.75 mm	0	15.24 mm		NO	8	NRZ	ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC	6.17 MHz			52.325 mm	CMOS	10 mA	5 V	0	2		Z80	2.54 mm	R-PDIP-T40		Not Qualified	YES	e3	0
Z85C3008PSG	IXYS Corporation	SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL	COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V	0	1	5	IN-LINE	DIP40,.6	4.5 V	70 Cel	.5125 MBps	0 Cel	MATTE TIN	DUAL	4.24 mm	0	15.24 mm	TWO MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS; 10 X 19 FRAME STATUS FIFO	NO	8	NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER)	ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC	8 MHz			52.325 mm	CMOS	12 mA	5 V	0	2	Other Microprocessor ICs	Z80	2.54 mm	R-PDIP-T40		Not Qualified	NO	e3	0
Z84C4010PEG	IXYS Corporation	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V	0	1		IN-LINE		4.5 V	100 Cel	.25 MBps	-40 Cel	MATTE TIN	DUAL	4.75 mm	0	15.24 mm		NO	8	NRZ	ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC	10 MHz			52.325 mm	CMOS	15 mA	5 V	0	2		Z80	2.54 mm	R-PDIP-T40		Not Qualified	YES	e3	0
Z0853008PSG	IXYS Corporation	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.25 V			5	IN-LINE	DIP40,.6	4.75 V	70 Cel	.25 MBps	0 Cel	MATTE TIN	DUAL	4.75 mm		15.24 mm		NO	8	NRZ; NRZI; BIPH-MARK(FM1); BIPH-SPACE(FM0)	ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC	8 MHz			52.325 mm	CMOS	230 mA	5 V		2	Other uPs/uCs/Peripheral ICs		2.54 mm	R-PDIP-T40		Not Qualified	NO	e3
Z16C3010VSC	IXYS Corporation	SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		16	5	FLATPACK, LOW PROFILE, FINE PITCH	LDCC68,1.0SQ	4.5 V	85 Cel	1.25 MBps	-40 Cel	TIN	QUAD	1.6 mm		14 mm		NO	16	NRZ; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL	ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC; EXT SYNC; BISYNC TRANSPARENT; NBIP	20 MHz			14 mm	CMOS	50 mA	5 V		2	Other uPs/uCs/Peripheral ICs	8X86; 680X0	.5 mm	S-PQFP-G100		Not Qualified	NO	e3
Z8523016VEG	IXYS Corporation	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	5.5 V	0	0	5	CHIP CARRIER	LDCC44,.7SQ	4.5 V	100 Cel	.512 MBps	-40 Cel	MATTE TIN	QUAD	4.57 mm	0	16.585 mm	MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS; 10 X 19 FRAME STATUS FIFO	NO	8	NRZ; NRZI; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER)	ASYNC, BIT; SYNC, HDLC; SYNC, SDLC; BISYNC	16.384 MHz	20	260	16.585 mm	CMOS	15 mA	5 V	0	2	Other Microprocessor ICs	Z-BUS	1.27 mm	S-PQCC-J44	3	Not Qualified	NO	e3	0
Z0847006PSC	IXYS Corporation	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.25 V	0	0	5	IN-LINE	DIP40,.6	4.75 V	70 Cel	.15 MBps	0 Cel	TIN LEAD	DUAL	4.75 mm	0	15.24 mm		NO	8	NRZ	ASYNC, BIT	6 MHz		240	52.325 mm	NMOS	100 mA	5 V	0	2	Serial IO/Communication Controllers	Z80	2.54 mm	R-PDIP-T40		Not Qualified	NO	e0	0
Z85C3010PSG	IXYS Corporation	SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL	COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V	0	1	5	IN-LINE	DIP40,.6	4.5 V	70 Cel	.5125 MBps	0 Cel	MATTE TIN	DUAL	4.24 mm	0	15.24 mm	TWO MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS; 10 X 19 FRAME STATUS FIFO	NO	8	NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER)	ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC	10 MHz			52.325 mm	CMOS	12 mA	5 V	0	2	Other Microprocessor ICs	Z80	2.54 mm	R-PDIP-T40		Not Qualified	NO	e3	0
Z85C3016VSG	IXYS Corporation	SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	5.5 V	0	1	5	CHIP CARRIER	LDCC44,.7SQ	4.5 V	70 Cel	.5125 MBps	0 Cel	MATTE TIN	QUAD	4.57 mm	0	16.5862 mm	TWO MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS; 10 X 19 FRAME STATUS FIFO	NO	8	NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER)	ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC	16 MHz			16.5862 mm	CMOS	15 mA	5 V	0	2	Other Microprocessor ICs	Z80	1.27 mm	S-PQCC-J44	3	Not Qualified	NO	e3	0
Z8523L10VEG	IXYS Corporation	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	3.6 V		0	3.3	CHIP CARRIER	LDCC44,.7SQ	3 V	100 Cel		-40 Cel		QUAD	4.57 mm		16.585 mm		NO	8	NRZ; NRZI; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER)	ASYNC, BIT; SYNC, HDLC; SYNC, SDLC; BISYNC				16.585 mm	CMOS	4 mA	3.3 V		2	Other Microprocessor ICs	Z-BUS	1.27 mm	S-PQCC-J44		Not Qualified	NO

Serial Communication Controllers

Serial communication controllers are electronic devices that manage the input/output operations between a computer or microcontroller and other devices through serial communication protocols such as UART, SPI, I2C, and USB. These controllers provide an interface that allows the computer or microcontroller to send and receive data over a serial connection and manage the communication operations.

Serial communication controllers can be integrated into the computer or microcontroller's chipset or added as an external module. They typically include a serial interface that connects to the device and a host interface that connects to the computer or microcontroller's bus system. The serial interface can be based on various standards such as UART, SPI, or I2C, while the host interface can be based on various standards such as PCI, PCIe, or USB.

Serial communication controllers offer various benefits such as increased data transfer rates, improved reliability, and increased compatibility with a wide range of devices. They also provide advanced features such as error checking, flow control, and clock synchronization that can improve the accuracy and reliability of the communication.