G Field Programmable Gate Arrays (FPGA) 38

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	No. of CLBs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Package Style (Meter)	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Length
XC2S400E-7PQGG208C	Xilinx	FPGA	Commercial Extended	G	208	FQFP	Square	Plastic/Epoxy	Yes	1.89 V	864	52000	1.8	Flatpack, Fine Pitch	1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin	Quad	S-PQFP-G208	4.1 mm	28 mm	No	Maximum usable gates = 150000	e3	357 MHz	28 mm
XC2S300E-6PQGG208I	Xilinx	FPGA		G	208	FQFP	Square	Plastic/Epoxy	Yes	1.89 V	1536	93000	1.8	Flatpack, Fine Pitch	1.71 V	.5 mm		0.47 ns	1536 CLBS, 93000 Gates		Tin	Quad	S-PQFP-G208	4.1 mm	28 mm	No	Maximum usable gates = 300000	e3	357 MHz	28 mm
XC2S600E-7PQGG208C	Xilinx	FPGA	Commercial Extended	G	208	FQFP	Square	Plastic/Epoxy	Yes	1.89 V	864	52000	1.8	Flatpack, Fine Pitch	1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin	Quad	S-PQFP-G208	4.1 mm	28 mm	No	Maximum usable gates = 150000	e3	357 MHz	28 mm
XC2S100E-6TGGQGG144I	Xilinx	FPGA		G	144	FQFP	Square	Plastic/Epoxy	Yes	1.89 V	864	52000	1.8	Flatpack, Fine Pitch	1.71 V	.5 mm		0.47 ns	864 CLBS, 52000 Gates			Quad	S-PQFP-G144	1.6 mm	20 mm	No	Maximum usable gates = 150000		357 MHz	20 mm
XC2S50E-6PQGG208C	Xilinx	FPGA	Commercial Extended	G	208	FQFP	Square	Plastic/Epoxy	Yes	1.89 V	864	52000	1.8	Flatpack, Fine Pitch	1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin	Quad	S-PQFP-G208	4.1 mm	28 mm	No	Maximum usable gates = 150000	e3	357 MHz	28 mm
XC2S400E-6PQGG208I	Xilinx	FPGA		G	208	FQFP	Square	Plastic/Epoxy	Yes	1.89 V	864	52000	1.8	Flatpack, Fine Pitch	1.71 V	.5 mm		0.47 ns	864 CLBS, 52000 Gates		Tin	Quad	S-PQFP-G208	4.1 mm	28 mm	No	Maximum usable gates = 150000	e3	357 MHz	28 mm
XC2S150E-6TGGQGG144I	Xilinx	FPGA	Industrial	G	144	FQFP	Square	Plastic/Epoxy	Yes	1.89 V	864	52000	1.8	Flatpack, Fine Pitch	1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	-40 °C (-40 °F)		Quad	S-PQFP-G144	1.6 mm	20 mm	No	Maximum usable gates = 150000		357 MHz	20 mm
XC2S600E-7TGGQGG144C	Xilinx	FPGA	Commercial Extended	G	144	FQFP	Square	Plastic/Epoxy	Yes	1.89 V	864	52000	1.8	Flatpack, Fine Pitch	1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)		Quad	S-PQFP-G144	1.6 mm	20 mm	No	Maximum usable gates = 150000		357 MHz	20 mm
XC2S150E-7PQGG208C	Xilinx	FPGA	Commercial Extended	G	208	FQFP	Square	Plastic/Epoxy	Yes	1.89 V	864	52000	1.8	Flatpack, Fine Pitch	1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin	Quad	S-PQFP-G208	4.1 mm	28 mm	No	Maximum usable gates = 150000	e3	357 MHz	28 mm
XC2S150E-6PQGG208C	Xilinx	FPGA	Commercial Extended	G	208	FQFP	Square	Plastic/Epoxy	Yes	1.89 V	864	52000	1.8	Flatpack, Fine Pitch	1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin	Quad	S-PQFP-G208	4.1 mm	28 mm	No	Maximum usable gates = 150000	e3	357 MHz	28 mm
XC2S300E-7TGGQGG144C	Xilinx	FPGA	Commercial Extended	G	144	FQFP	Square	Plastic/Epoxy	Yes	1.89 V	1536	93000	1.8	Flatpack, Fine Pitch	1.71 V	.5 mm	85 °C (185 °F)	0.42 ns	1536 CLBS, 93000 Gates	0 °C (32 °F)		Quad	S-PQFP-G144	1.6 mm	20 mm	No	Maximum usable gates = 300000		400 MHz	20 mm
XC2S300E-6TGGQGG144C	Xilinx	FPGA	Commercial Extended	G	144	FQFP	Square	Plastic/Epoxy	Yes	1.89 V	1536	93000	1.8	Flatpack, Fine Pitch	1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	1536 CLBS, 93000 Gates	0 °C (32 °F)		Quad	S-PQFP-G144	1.6 mm	20 mm	No	Maximum usable gates = 300000		357 MHz	20 mm
XC2S100E-6PQGG208I	Xilinx	FPGA		G	208	FQFP	Square	Plastic/Epoxy	Yes	1.89 V	864	52000	1.8	Flatpack, Fine Pitch	1.71 V	.5 mm		0.47 ns	864 CLBS, 52000 Gates		Tin	Quad	S-PQFP-G208	4.1 mm	28 mm	No	Maximum usable gates = 150000	e3	357 MHz	28 mm
XC2S150E-6PQGG208I	Xilinx	FPGA		G	208	FQFP	Square	Plastic/Epoxy	Yes	1.89 V	864	52000	1.8	Flatpack, Fine Pitch	1.71 V	.5 mm		0.47 ns	864 CLBS, 52000 Gates		Tin	Quad	S-PQFP-G208	4.1 mm	28 mm	No	Maximum usable gates = 150000	e3	357 MHz	28 mm
XC2S200E-6PQGG208I	Xilinx	FPGA		G	208	FQFP	Square	Plastic/Epoxy	Yes	1.89 V	864	52000	1.8	Flatpack, Fine Pitch	1.71 V	.5 mm		0.47 ns	864 CLBS, 52000 Gates		Tin	Quad	S-PQFP-G208	4.1 mm	28 mm	No	Maximum usable gates = 150000	e3	357 MHz	28 mm
XC2S200E-6TGGQGG144I	Xilinx	FPGA	Industrial	G	144	FQFP	Square	Plastic/Epoxy	Yes	1.89 V	864	52000	1.8	Flatpack, Fine Pitch	1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	-40 °C (-40 °F)		Quad	S-PQFP-G144	1.6 mm	20 mm	No	Maximum usable gates = 150000		357 MHz	20 mm
XC2S50E-6PQGG208I	Xilinx	FPGA		G	208	FQFP	Square	Plastic/Epoxy	Yes	1.89 V	864	52000	1.8	Flatpack, Fine Pitch	1.71 V	.5 mm		0.47 ns	864 CLBS, 52000 Gates		Tin	Quad	S-PQFP-G208	4.1 mm	28 mm	No	Maximum usable gates = 150000	e3	357 MHz	28 mm
XC2S50E-6TGGQGG144I	Xilinx	FPGA		G	144	FQFP	Square	Plastic/Epoxy	Yes	1.89 V	864	52000	1.8	Flatpack, Fine Pitch	1.71 V	.5 mm		0.47 ns	864 CLBS, 52000 Gates			Quad	S-PQFP-G144	1.6 mm	20 mm	No	Maximum usable gates = 150000		357 MHz	20 mm
XC2S300E-6TGGQGG144I	Xilinx	FPGA	Industrial	G	144	FQFP	Square	Plastic/Epoxy	Yes	1.89 V	1536	93000	1.8	Flatpack, Fine Pitch	1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	1536 CLBS, 93000 Gates	-40 °C (-40 °F)		Quad	S-PQFP-G144	1.6 mm	20 mm	No	Maximum usable gates = 300000		357 MHz	20 mm
XC2S150E-7TGGQGG144C	Xilinx	FPGA	Commercial Extended	G	144	FQFP	Square	Plastic/Epoxy	Yes	1.89 V	864	52000	1.8	Flatpack, Fine Pitch	1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)		Quad	S-PQFP-G144	1.6 mm	20 mm	No	Maximum usable gates = 150000		357 MHz	20 mm
XC2S50E-7PQGG208C	Xilinx	FPGA	Commercial Extended	G	208	FQFP	Square	Plastic/Epoxy	Yes	1.89 V	864	52000	1.8	Flatpack, Fine Pitch	1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin	Quad	S-PQFP-G208	4.1 mm	28 mm	No	Maximum usable gates = 150000	e3	357 MHz	28 mm
XC2S100E-7PQGG208C	Xilinx	FPGA	Commercial Extended	G	208	FQFP	Square	Plastic/Epoxy	Yes	1.89 V	864	52000	1.8	Flatpack, Fine Pitch	1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin	Quad	S-PQFP-G208	4.1 mm	28 mm	No	Maximum usable gates = 150000	e3	357 MHz	28 mm
XC2S300E-6PQGG208C	Xilinx	FPGA	Commercial Extended	G	208	FQFP	Square	Plastic/Epoxy	Yes	1.89 V	1536	93000	1.8	Flatpack, Fine Pitch	1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	1536 CLBS, 93000 Gates	0 °C (32 °F)	Tin	Quad	S-PQFP-G208	4.1 mm	28 mm	No	Maximum usable gates = 300000	e3	357 MHz	28 mm
XC2S600E-6PQGG208I	Xilinx	FPGA		G	208	FQFP	Square	Plastic/Epoxy	Yes	1.89 V	864	52000	1.8	Flatpack, Fine Pitch	1.71 V	.5 mm		0.47 ns	864 CLBS, 52000 Gates		Tin	Quad	S-PQFP-G208	4.1 mm	28 mm	No	Maximum usable gates = 150000	e3	357 MHz	28 mm
XC2S100E-6TGGQGG144C	Xilinx	FPGA	Commercial Extended	G	144	FQFP	Square	Plastic/Epoxy	Yes	1.89 V	864	52000	1.8	Flatpack, Fine Pitch	1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)		Quad	S-PQFP-G144	1.6 mm	20 mm	No	Maximum usable gates = 150000		357 MHz	20 mm
XC2S100E-6PQGG208C	Xilinx	FPGA	Commercial Extended	G	208	FQFP	Square	Plastic/Epoxy	Yes	1.89 V	864	52000	1.8	Flatpack, Fine Pitch	1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin	Quad	S-PQFP-G208	4.1 mm	28 mm	No	Maximum usable gates = 150000	e3	357 MHz	28 mm
XC2S50E-6TGGQGG144C	Xilinx	FPGA	Commercial Extended	G	144	FQFP	Square	Plastic/Epoxy	Yes	1.89 V	864	52000	1.8	Flatpack, Fine Pitch	1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)		Quad	S-PQFP-G144	1.6 mm	20 mm	No	Maximum usable gates = 150000		357 MHz	20 mm
XC2S200E-6TGGQGG144C	Xilinx	FPGA	Commercial Extended	G	144	FQFP	Square	Plastic/Epoxy	Yes	1.89 V	864	52000	1.8	Flatpack, Fine Pitch	1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)		Quad	S-PQFP-G144	1.6 mm	20 mm	No	Maximum usable gates = 150000		357 MHz	20 mm
XC2S200E-7PQGG208C	Xilinx	FPGA	Commercial Extended	G	208	FQFP	Square	Plastic/Epoxy	Yes	1.89 V	864	52000	1.8	Flatpack, Fine Pitch	1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin	Quad	S-PQFP-G208	4.1 mm	28 mm	No	Maximum usable gates = 150000	e3	357 MHz	28 mm
XC2S400E-7TGGQGG144C	Xilinx	FPGA	Commercial Extended	G	144	FQFP	Square	Plastic/Epoxy	Yes	1.89 V	864	52000	1.8	Flatpack, Fine Pitch	1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)		Quad	S-PQFP-G144	1.6 mm	20 mm	No	Maximum usable gates = 150000		357 MHz	20 mm
XC2S600E-6TGGQGG144I	Xilinx	FPGA	Industrial	G	144	FQFP	Square	Plastic/Epoxy	Yes	1.89 V	864	52000	1.8	Flatpack, Fine Pitch	1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	-40 °C (-40 °F)		Quad	S-PQFP-G144	1.6 mm	20 mm	No	Maximum usable gates = 150000		357 MHz	20 mm
XC2S150E-6TGGQGG144C	Xilinx	FPGA	Commercial Extended	G	144	FQFP	Square	Plastic/Epoxy	Yes	1.89 V	864	52000	1.8	Flatpack, Fine Pitch	1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)		Quad	S-PQFP-G144	1.6 mm	20 mm	No	Maximum usable gates = 150000		357 MHz	20 mm
XC2S300E-7PQGG208C	Xilinx	FPGA	Commercial Extended	G	208	FQFP	Square	Plastic/Epoxy	Yes	1.89 V	1536	93000	1.8	Flatpack, Fine Pitch	1.71 V	.5 mm	85 °C (185 °F)	0.42 ns	1536 CLBS, 93000 Gates	0 °C (32 °F)	Tin	Quad	S-PQFP-G208	4.1 mm	28 mm	No	Maximum usable gates = 300000	e3	400 MHz	28 mm
XC2S100E-7TGGQGG144C	Xilinx	FPGA	Commercial Extended	G	144	FQFP	Square	Plastic/Epoxy	Yes	1.89 V	864	52000	1.8	Flatpack, Fine Pitch	1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)		Quad	S-PQFP-G144	1.6 mm	20 mm	No	Maximum usable gates = 150000		357 MHz	20 mm
XC2S200E-6PQGG208C	Xilinx	FPGA	Commercial Extended	G	208	FQFP	Square	Plastic/Epoxy	Yes	1.89 V	864	52000	1.8	Flatpack, Fine Pitch	1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin	Quad	S-PQFP-G208	4.1 mm	28 mm	No	Maximum usable gates = 150000	e3	357 MHz	28 mm
XC2S400E-6TGGQGG144I	Xilinx	FPGA	Industrial	G	144	FQFP	Square	Plastic/Epoxy	Yes	1.89 V	864	52000	1.8	Flatpack, Fine Pitch	1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	-40 °C (-40 °F)		Quad	S-PQFP-G144	1.6 mm	20 mm	No	Maximum usable gates = 150000		357 MHz	20 mm
XC2S50E-7TGGQGG144C	Xilinx	FPGA	Commercial Extended	G	144	FQFP	Square	Plastic/Epoxy	Yes	1.89 V	864	52000	1.8	Flatpack, Fine Pitch	1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)		Quad	S-PQFP-G144	1.6 mm	20 mm	No	Maximum usable gates = 150000		357 MHz	20 mm
XC2S200E-7TGGQGG144C	Xilinx	FPGA	Commercial Extended	G	144	FQFP	Square	Plastic/Epoxy	Yes	1.89 V	864	52000	1.8	Flatpack, Fine Pitch	1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)		Quad	S-PQFP-G144	1.6 mm	20 mm	No	Maximum usable gates = 150000		357 MHz	20 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.