Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of CLBs | Technology Used | Screening Level | No. of Inputs | No. of Equivalent Gates | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Pitch Of Terminal | Maximum Operating Temperature | Maximum Combinatorial Delay of a CLB | Organization | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Xilinx |
FPGA |
Other |
Gull Wing |
304 |
HFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
1296 |
CMOS |
22000 |
3.3 |
Flatpack, Heat Sink/Slug, Fine Pitch |
3 V |
.5 mm |
85 °C (185 °F) |
1.5 ns |
1296 CLBS, 22000 Gates |
0 °C (32 °F) |
Quad |
S-PQFP-G304 |
4.5 mm |
40 mm |
No |
Max usable 36000 Logic gates |
179 MHz |
40 mm |
|||||||||||||||
|
Xilinx |
FPGA |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
196 |
CMOS |
6000 |
3.3 |
Flatpack |
3 V |
.65 mm |
85 °C (185 °F) |
196 CLBS, 6000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G160 |
3 |
4.1 mm |
28 mm |
No |
Typical gates = 6000-10000 |
e3 |
28 mm |
|||||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
304 |
HFQFP |
Square |
Plastic/Epoxy |
1024 |
Yes |
1024 |
CMOS |
256 |
18000 |
5 |
5 V |
Flatpack, Heat Sink/Slug, Fine Pitch |
HQFP304,1.7SQ,20 |
Field Programmable Gate Arrays |
.5 mm |
85 °C (185 °F) |
1024 CLBS, 18000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G304 |
3 |
4.5 mm |
40 mm |
No |
Max usable 28000 Logic gates |
e0 |
166 MHz |
30 s |
256 |
225 °C (437 °F) |
40 mm |
||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
5508 |
Yes |
1.26 V |
612 |
CMOS |
108 |
250000 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 °C (185 °F) |
0.76 ns |
612 CLBS, 250000 Gates |
0 °C (32 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e4 |
572 MHz |
80 |
20 mm |
|||||||
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
64 |
Yes |
5.5 V |
64 |
CMOS |
84 |
2000 |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
4.5 V |
.5 mm |
3.8 ns |
64 CLBS, 2000 Gates |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Typical gates = 2000-3000 |
e0 |
83 MHz |
30 s |
84 |
225 °C (437 °F) |
20 mm |
||||||||
Xilinx |
FPGA |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
324 |
Yes |
5.5 V |
324 |
CMOS |
196 |
10000 |
5 |
5 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
4.5 V |
.5 mm |
3 ns |
324 CLBS, 10000 Gates |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
Typical gates = 10000-16000 |
e0 |
83 MHz |
30 s |
196 |
225 °C (437 °F) |
32 mm |
||||||||
|
Xilinx |
FPGA |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
4320 |
Yes |
1.26 V |
480 |
AEC-Q100 |
173 |
200000 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
100 °C (212 °F) |
480 CLBS, 200000 Gates |
-40 °C (-40 °F) |
Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
125 MHz |
30 s |
173 |
245 °C (473 °F) |
28 mm |
||||||
Xilinx |
FPGA |
Commercial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
484 |
Yes |
5.25 V |
484 |
CMOS |
138 |
6500 |
5 |
5 V |
Flatpack |
QFP160,1.2SQ |
Field Programmable Gate Arrays |
4.75 V |
.65 mm |
70 °C (158 °F) |
3.3 ns |
484 CLBS, 6500 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G160 |
3 |
3.94 mm |
28 mm |
No |
MAX 176 I/OS; 1320 flip-flops; typical gates = 6500 - 9000 |
e0 |
230 MHz |
30 s |
138 |
225 °C (437 °F) |
28 mm |
|||||
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
1.26 V |
1472 |
CMOS |
700000 |
1.2 |
Flatpack, Low Profile, Fine Pitch |
1.14 V |
.5 mm |
4.88 ns |
1472 CLBS, 700000 Gates |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
667 MHz |
20 mm |
|||||||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
1600 |
CMOS |
27000 |
3.3 |
Flatpack, Heat Sink/Slug, Fine Pitch |
3 V |
.5 mm |
85 °C (185 °F) |
1 ns |
1600 CLBS, 27000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e0 |
263 MHz |
28 mm |
||||||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
1.26 V |
192 |
50000 |
1.2 |
Flatpack, Fine Pitch |
1.14 V |
.5 mm |
85 °C (185 °F) |
192 CLBS, 50000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
28 mm |
||||||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
784 |
Yes |
5.25 V |
196 |
CMOS |
133 |
6000 |
5 |
5 V |
Flatpack |
QFP160,1.2SQ |
Field Programmable Gate Arrays |
4.75 V |
.65 mm |
85 °C (185 °F) |
3 ns |
196 CLBS, 6000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G160 |
3 |
4.1 mm |
28 mm |
No |
MAX available 10000 Logic gates |
e0 |
83 MHz |
30 s |
133 |
225 °C (437 °F) |
28 mm |
|||||
Xilinx |
FPGA |
Gull Wing |
64 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
CMOS |
5 |
Flatpack, Thin Profile, Fine Pitch |
.5 mm |
Quad |
S-PQFP-G64 |
1.2 mm |
10 mm |
No |
10 mm |
|||||||||||||||||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
64 |
Yes |
3.6 V |
64 |
CMOS |
64 |
1000 |
3.3 |
3.3 V |
Flatpack |
QFP100,.7X.9 |
Field Programmable Gate Arrays |
3 V |
.65 mm |
85 °C (185 °F) |
1.6 ns |
64 CLBS, 1000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
R-PQFP-G100 |
3 |
3.4 mm |
14 mm |
No |
Max usable 1600 Logic gates |
e0 |
166 MHz |
30 s |
64 |
225 °C (437 °F) |
20 mm |
|||||
Xilinx |
FPGA |
Other |
Gull Wing |
240 |
HFQFP |
Square |
Plastic/Epoxy |
1296 |
Yes |
1296 |
CMOS |
288 |
22000 |
5 |
5 V |
Flatpack, Heat Sink/Slug, Fine Pitch |
HQFP240,1.37SQ,20 |
Field Programmable Gate Arrays |
.5 mm |
85 °C (185 °F) |
1296 CLBS, 22000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
Max usable 36000 Logic gates |
e0 |
143 MHz |
30 s |
288 |
225 °C (437 °F) |
32 mm |
||||||||
Xilinx |
FPGA |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
608 |
Yes |
5.5 V |
256 |
CMOS |
128 |
4000 |
5 |
5 V |
Flatpack |
QFP160,1.2SQ |
Field Programmable Gate Arrays |
4.5 V |
.65 mm |
2 ns |
256 CLBS, 4000 Gates |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G160 |
3 |
4.1 mm |
28 mm |
No |
Max usable 6000 Logic gates |
e0 |
125 MHz |
30 s |
128 |
225 °C (437 °F) |
28 mm |
||||||||
Xilinx |
FPGA |
Gull Wing |
208 |
HLFQFP |
Square |
Plastic/Epoxy |
1296 |
Yes |
CMOS |
288 |
3.3 |
3.3 V |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
HQFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
.5 mm |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G208 |
3 |
No |
e0 |
217 MHz |
30 s |
288 |
225 °C (437 °F) |
||||||||||||||||||
Xilinx |
FPGA |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
320 |
Yes |
5.5 V |
320 |
CMOS |
144 |
5000 |
5 |
5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
4.5 V |
.5 mm |
85 °C (185 °F) |
3.3 ns |
320 CLBS, 5000 Gates |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
3.92 mm |
28 mm |
No |
MAX 144 I/OS; 928 flip-flops; typical gates = 5000 - 7500 |
e0 |
230 MHz |
30 s |
144 |
225 °C (437 °F) |
28 mm |
|||||
|
Xilinx |
FPGA |
Gull Wing |
160 |
HQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
1296 |
CMOS |
22000 |
3.3 |
Flatpack, Heat Sink/Slug |
3 V |
.65 mm |
1.3 ns |
1296 CLBS, 22000 Gates |
Quad |
S-PQFP-G160 |
4.1 mm |
28 mm |
No |
Max usable 36000 Logic gates |
200 MHz |
28 mm |
||||||||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
240 |
HFQFP |
Square |
Plastic/Epoxy |
Yes |
2.625 V |
600 |
108904 |
2.5 |
Flatpack, Heat Sink/Slug, Fine Pitch |
2.375 V |
.5 mm |
85 °C (185 °F) |
0.6 ns |
600 CLBS, 108904 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
e0 |
333 MHz |
30 s |
225 °C (437 °F) |
32 mm |
|||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
100 |
Yes |
5.25 V |
100 |
CMOS |
80 |
1500 |
5 |
5 V |
Flatpack |
QFP100,.7X.9 |
Field Programmable Gate Arrays |
4.75 V |
.65 mm |
85 °C (185 °F) |
4.1 ns |
100 CLBS, 1500 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
R-PQFP-G100 |
3 |
3.4 mm |
14 mm |
No |
Typical gates = 1500-2000 |
e0 |
188 MHz |
30 s |
80 |
225 °C (437 °F) |
20 mm |
|||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
304 |
HFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
1024 |
CMOS |
18000 |
3.3 |
Flatpack, Heat Sink/Slug, Fine Pitch |
3 V |
.5 mm |
85 °C (185 °F) |
1.2 ns |
1024 CLBS, 18000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G304 |
3 |
4.5 mm |
40 mm |
No |
Max usable 28000 Logic gates |
e3 |
217 MHz |
40 mm |
||||||||||||
Xilinx |
FPGA |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
576 |
CMOS |
10000 |
3.3 |
Flatpack, Heat Sink/Slug, Fine Pitch |
3 V |
.5 mm |
576 CLBS, 10000 Gates |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e0 |
200 MHz |
28 mm |
||||||||||||||||||
|
Xilinx |
FPGA |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
400 |
CMOS |
7000 |
3.3 |
Flatpack, Fine Pitch |
3 V |
.5 mm |
1.6 ns |
400 CLBS, 7000 Gates |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
Max usable 10000 Logic gates |
e3 |
166 MHz |
30 s |
245 °C (473 °F) |
28 mm |
|||||||||||||
Xilinx |
FPGA |
Industrial |
Gull Wing |
144 |
QFP |
Square |
Plastic/Epoxy |
1728 |
Yes |
1.89 V |
CMOS |
182 |
1.8 |
1.8,2.5,3.3 V |
Flatpack |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.71 V |
.5 mm |
100 °C (212 °F) |
0.47 ns |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
20 mm |
No |
e0 |
357 MHz |
30 s |
182 |
225 °C (437 °F) |
20 mm |
||||||||||
|
Xilinx |
FPGA |
Gull Wing |
160 |
HQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
1296 |
CMOS |
22000 |
3.3 |
Flatpack, Heat Sink/Slug |
3 V |
.65 mm |
1.1 ns |
1296 CLBS, 22000 Gates |
Matte Tin |
Quad |
S-PQFP-G160 |
4.1 mm |
28 mm |
No |
e3 |
227 MHz |
28 mm |
|||||||||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
1.26 V |
192 |
50000 |
1.2 |
Flatpack, Fine Pitch |
1.14 V |
.5 mm |
85 °C (185 °F) |
192 CLBS, 50000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
28 mm |
||||||||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
Yes |
5.25 V |
100 |
CMOS |
2000 |
5 |
Flatpack |
4.75 V |
.65 mm |
85 °C (185 °F) |
2 ns |
100 CLBS, 2000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
R-PQFP-G100 |
3 |
3.4 mm |
14 mm |
No |
Max usable 3000 Logic gates |
e3 |
125 MHz |
30 s |
245 °C (473 °F) |
20 mm |
||||||||||
Xilinx |
FPGA |
Gull Wing |
304 |
HFQFP |
Square |
Plastic/Epoxy |
1024 |
Yes |
1024 |
CMOS |
256 |
18000 |
5 |
5 V |
Flatpack, Heat Sink/Slug, Fine Pitch |
HQFP304,1.7SQ,20 |
Field Programmable Gate Arrays |
.5 mm |
1024 CLBS, 18000 Gates |
Tin Lead |
Quad |
S-PQFP-G304 |
3 |
4.5 mm |
40 mm |
No |
Max usable 28000 Logic gates |
e0 |
143 MHz |
30 s |
256 |
225 °C (437 °F) |
40 mm |
|||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
304 |
HFQFP |
Square |
Plastic/Epoxy |
1936 |
Yes |
3.6 V |
1936 |
CMOS |
352 |
33000 |
3.3 |
3.3 V |
Flatpack, Heat Sink/Slug, Fine Pitch |
HQFP304,1.7SQ,20 |
Field Programmable Gate Arrays |
3 V |
.5 mm |
85 °C (185 °F) |
1.6 ns |
1936 CLBS, 33000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G304 |
3 |
4.5 mm |
40 mm |
No |
Max usable 52000 Logic gates |
e0 |
166 MHz |
30 s |
352 |
225 °C (437 °F) |
40 mm |
|||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
1728 |
Yes |
1.26 V |
192 |
CMOS |
124 |
50000 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 °C (185 °F) |
0.61 ns |
192 CLBS, 50000 Gates |
0 °C (32 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e4 |
630 MHz |
124 |
28 mm |
|||||||
Xilinx |
FPGA |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
972 |
Yes |
2.625 V |
216 |
CMOS |
136 |
30000 |
2.5 |
1.5/3.3,2.5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
0.7 ns |
216 CLBS, 30000 Gates |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e0 |
263 MHz |
30 s |
132 |
225 °C (437 °F) |
28 mm |
|||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
224 |
Yes |
5.25 V |
224 |
CMOS |
120 |
3500 |
5 |
5 V |
Flatpack |
QFP160,1.2SQ |
Field Programmable Gate Arrays |
4.75 V |
.65 mm |
85 °C (185 °F) |
1.5 ns |
224 CLBS, 3500 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G160 |
3 |
4.1 mm |
28 mm |
No |
Max usable 4500 Logic gates |
e0 |
370 MHz |
30 s |
120 |
225 °C (437 °F) |
28 mm |
|||||
Xilinx |
FPGA |
Other |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
1024 |
Yes |
3.6 V |
1024 |
CMOS |
256 |
18000 |
3.3 |
3.3 V |
Flatpack, Heat Sink/Slug, Fine Pitch |
HQFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
3 V |
.5 mm |
85 °C (185 °F) |
1.2 ns |
1024 CLBS, 18000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
Typical gates = 18000-50000 |
e0 |
217 MHz |
30 s |
256 |
225 °C (437 °F) |
28 mm |
|||||
Xilinx |
FPGA |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
576 |
Yes |
5.25 V |
576 |
CMOS |
192 |
10000 |
5 |
5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
4.75 V |
.5 mm |
85 °C (185 °F) |
4 ns |
576 CLBS, 10000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G208 |
3 |
3.92 mm |
28 mm |
No |
1536 flip-flops; typical gates = 10000-13000 |
e0 |
133.3 MHz |
30 s |
192 |
225 °C (437 °F) |
28 mm |
|||||
Xilinx |
FPGA |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
100 |
Yes |
5.5 V |
100 |
CMOS |
80 |
1500 |
5 |
5 V |
Flatpack |
QFP100,.7X.9 |
Field Programmable Gate Arrays |
4.5 V |
.65 mm |
2.7 ns |
100 CLBS, 1500 Gates |
Tin/Lead (Sn85Pb15) |
Quad |
R-PQFP-G100 |
3 |
3.4 mm |
14 mm |
No |
Max usable 2000 Logic gates |
e0 |
270 MHz |
30 s |
80 |
225 °C (437 °F) |
20 mm |
||||||||
Xilinx |
FPGA |
Industrial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
144 |
Yes |
5.5 V |
144 |
CMOS |
82 |
2000 |
5 |
5 V |
Flatpack |
QFP100,.7X.9 |
Field Programmable Gate Arrays |
4.5 V |
.65 mm |
85 °C (185 °F) |
5.1 ns |
144 CLBS, 2000 Gates |
-40 °C (-40 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
R-PQFP-G100 |
3 |
3.4 mm |
14 mm |
No |
Max usable 3000 Logic gates |
e0 |
113 MHz |
30 s |
82 |
225 °C (437 °F) |
20 mm |
|||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
256 |
CMOS |
4000 |
5 |
Flatpack, Low Profile, Fine Pitch |
4.75 V |
.5 mm |
85 °C (185 °F) |
2 ns |
256 CLBS, 4000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Max usable 6000 Logic gates |
e3 |
125 MHz |
30 s |
260 °C (500 °F) |
20 mm |
||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
160 |
HQFP |
Square |
Plastic/Epoxy |
1296 |
Yes |
3.6 V |
1296 |
CMOS |
288 |
22000 |
3.3 |
3.3 V |
Flatpack, Heat Sink/Slug |
HQFP160,1.2SQ |
Field Programmable Gate Arrays |
3 V |
.65 mm |
85 °C (185 °F) |
1.1 ns |
1296 CLBS, 22000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G160 |
3 |
4.1 mm |
28 mm |
No |
Can also use 65000 gates |
e0 |
227 MHz |
288 |
28 mm |
|||||||
Xilinx |
FPGA |
Other |
Gull Wing |
160 |
HQFP |
Square |
Plastic/Epoxy |
1600 |
Yes |
3.6 V |
1600 |
CMOS |
320 |
27000 |
3.3 |
3.3 V |
Flatpack, Heat Sink/Slug |
HQFP160,1.2SQ |
Field Programmable Gate Arrays |
3 V |
.65 mm |
85 °C (185 °F) |
1 ns |
1600 CLBS, 27000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G160 |
3 |
4.1 mm |
28 mm |
No |
Can also use 80000 gates |
e0 |
263 MHz |
320 |
28 mm |
|||||||
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
100 |
Yes |
5.25 V |
100 |
CMOS |
80 |
1500 |
5 |
5 V |
Flatpack |
QFP100,.7X.9 |
Field Programmable Gate Arrays |
4.75 V |
.65 mm |
85 °C (185 °F) |
2.2 ns |
100 CLBS, 1500 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
R-PQFP-G100 |
3 |
3.4 mm |
14 mm |
No |
Max usable 2000 Logic gates |
e0 |
323 MHz |
30 s |
80 |
225 °C (437 °F) |
20 mm |
|||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
576 |
CMOS |
10000 |
3.3 |
Flatpack, Fine Pitch |
3 V |
.5 mm |
85 °C (185 °F) |
1.1 ns |
576 CLBS, 10000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
Can also use 30000 gates |
e3 |
227 MHz |
30 s |
245 °C (473 °F) |
28 mm |
||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
304 |
HFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
3136 |
CMOS |
55000 |
3.3 |
Flatpack, Heat Sink/Slug, Fine Pitch |
3 V |
.5 mm |
85 °C (185 °F) |
1 ns |
3136 CLBS, 55000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G304 |
3 |
4.5 mm |
40 mm |
No |
e0 |
263 MHz |
40 mm |
||||||||||||||
Xilinx |
FPGA |
Gull Wing |
208 |
HLFQFP |
Square |
Plastic/Epoxy |
484 |
Yes |
CMOS |
244 |
5 |
5 V |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
HQFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
.5 mm |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
No |
e0 |
83 MHz |
30 s |
244 |
225 °C (437 °F) |
||||||||||||||||||
Xilinx |
FPGA |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
196 |
Yes |
196 |
CMOS |
112 |
3.3 |
3.3 V |
Flatpack |
QFP100,.7X.9 |
Field Programmable Gate Arrays |
.65 mm |
100 °C (212 °F) |
-40 °C (-40 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
R-PQFP-G100 |
3 |
14 mm |
No |
e0 |
217 MHz |
30 s |
112 |
225 °C (437 °F) |
20 mm |
|||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
2160 |
Yes |
1.26 V |
240 |
CMOS |
108 |
100000 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 °C (185 °F) |
0.76 ns |
240 CLBS, 100000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
572 MHz |
30 s |
80 |
225 °C (437 °F) |
20 mm |
||||||
Xilinx |
FPGA |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
100 |
Yes |
3.6 V |
100 |
CMOS |
77 |
2000 |
3.3 |
3.3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
3 V |
.5 mm |
1.1 ns |
100 CLBS, 2000 Gates |
Tin/Lead |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
Maximum usable gates 5000 |
e0 |
217 MHz |
30 s |
77 |
225 °C (437 °F) |
14 mm |
||||||||
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
CMOS |
3.3 |
Flatpack, Low Profile, Fine Pitch |
.5 mm |
Quad |
S-PQFP-G144 |
1.6 mm |
20 mm |
No |
20 mm |
Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.
FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.